STPS140A [STMICROELECTRONICS]
POWER SCHOTTKY RECTIFIER; 功率肖特基整流器
| 型号： | STPS140A |
| 厂家： | 
ST |
| 描述： | POWER SCHOTTKY RECTIFIER |
| 文件： | 总6页 (文件大小：78K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS140A/U
®
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
VRRM
1 A
40 V
0.5 V
VF (max)
FEATURES AND BENEFITS
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNTED DEVICE
SMB
STPS140U
SMA
STPS140A
DESCRIPTION
Single chip Schottky rectifier suited for Switch-
mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB(*), this device is in-
tended for surface mounting and used in low volt-
age, high frequency inverters, free wheeling and
polarity protection applications.
(*) in accordance with DO214AAand DO21AC JEDEC
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Repetitive peak reverse voltage
Value
Unit
V
VRRM
40
7
IF(RMS) RMS forward current
A
IF(AV)
Average forward current δ = 0.5
SMA
SMB
TL = 130°C
1
A
TL = 135°C
IFSM
IRRM
Surge non repetitive forward current
Repetitive peak reverse current
tp = 10 ms
Sinusoidal
60
1
A
A
µ
tp = 2 s
F = 1kHz
µ
IRSM
Tstg
Tj
Non repetitive peak reverse current
Storage temperature range
tp = 100 s square
1
- 65 to + 150
150
A
°C
Maximum junction temperature
Critical rate of rise of reverse voltage
µ
V/ s
dV/dt
10000
July 1998 - Ed: 6B
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STPS140A/U
THERMAL RESISTANCES
Symbol
Parameter
Value
30
Unit
°
Rth (j-l)
Junction to lead
SMA
SMB
C/W
25
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
Tests Conditions
Min. Typ. Max.
Unit
°
µ
A
IR *
Reverse leakage current Tj = 25 C
VR = 40V
12
Tj = 100°C
0.25
0.43
0.53
2
mA
V
°
VF **
Forward voltage drop
Tj = 25 C
IF = 1 A
0.55
0.5
°
= 1 A
Tj = 125 C
IF
IF = 2 A
= 2 A
°
Tj = 25 C
0.65
0.6
°
Tj = 125 C
IF
Pulse test : * tp = 5 ms, δ < 2 %
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
2
P = 0.4 x IF(AV) + 0.10 x IF (RMS)
Fig. 1:
average forward current.
Fig. 2:
Average forward current versus ambient
Average forward power dissipation versus
δ
temperature ( =0.5).
IF(av)(A)
PF(av)(W)
1.2
0.7
δ = 0.1
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-l)
0.6
1.0
0.8
0.6
δ = 0.05
SMA
Rth(j-a)=100°C/W
S(Cu)=1.5cm²
0.5
0.4
0.3
0.2
0.1
δ = 1
SMB
Rth(j-a)=80°C/W
S(Cu)=1.5cm²
0.4
T
T
0.2
tp
=tp/T
δ
IF(av) (A)
tp
Tamb(°C)
75
=tp/T
δ
0.0
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
25
50
100
125
150
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STPS140A/U
Fig. 3-1:
Fig. 3-2:
Non repetivesurge peak forward current
versus overload duration (maximum values) (SMA).
Non repetivesurge peak forward current
versus overload duration (maximum values) (SMB).
IM(A)
IM(A)
8
7
6
8
7
6
Ta=25°C
Ta=25°C
5
5
4
4
Ta=50°C
Ta=50°C
3
3
Ta=100°C
Ta=100°C
2
2
IM
IM
t
t
1
1
0
δ
=0.5
t(s)
t(s)
δ
=0.5
0
1E-3
1E-2
1E-1
1E+0
1E-3
1E-2
1E-1
1E+0
Fig. 4-1:
Fig. 4-2:
Relative variation of thermal impedance
junction to ambient versus pulse duration (SMA).
Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB).
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Printed circuit board: SCu=1.5cm2 (e=35µm)
Printed circuit board: SCu=1.5cm2 (e=35µm)
0.9
0.8
0.7
0.6
0.5
0.4
δ = 0.5
δ = 0.5
T
T
0.3
δ = 0.2
δ = 0.2
δ = 0.1
0.2
0.1
0.0
δ = 0.1
tp
=tp/T
tp(s)
δ
tp(s)
tp
=tp/T
Single pulse
δ
Single pulse
1E+0
1E+3
1E-2
1E-1
1E+1
1E+2
1E-2
1E-1
1E+0
1E+1
1E+2
Fig. 5:
Fig. 6:
Reverse leakage current versus reverse
Junction capacitance versus reverse
voltage applied (typical values).
voltage applied (typical values)
IR(µA)
C(pF)
1E+3
200
Tj=125°C
F=1MHz
Tj=25°C
1E+2
100
50
Tj=75°C
1E+1
1E+0
Tj=25°C
20
1E-1
VR(V)
VR(V)
10
1E-2
1
2
5
10
20
50
0
5
10
15
20
25
30
35
40
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STPS140A/U
Fig. 7:
current (maximum values).
Fig. 8-1:
Thermal resistance junction to ambient
Forward voltage drop versus forward
versus copper surface under each lead (Epoxy
µ
printed circuit board, copper thickness: 35 m)(SMB).
IFM(A)
Rth(j-a) (°C/W)
1E+1
120
Tj=125°C
P=1.5W
100
1E+0
1E-1
80
60
40
20
S(Cu) (cm²)
VFM(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
1E-2
0
0
1
2
3
4
5
Fig. 8-2:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35 m)(SMA).
µ
Rth(j-a) (°C/W)
140
P=1.5W
120
100
80
60
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
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STPS140A/U
PACKAGE MECHANICAL DATA
SMA
DIMENSIONS
Millimeters Inches
REF.
E1
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
1.25
0.15
4.80
3.95
2.25
0.75
2.70
0.20
1.65
0.41
5.60
4.60
2.95
1.60
0.075
0.002
0.049
0.006
0.189
0.156
0.089
0.030
0.106
0.008
0.065
0.016
0.220
0.181
0.116
0.063
D
c
E
E
A1
E1
D
A2
C
L
b
L
FOOT PRINT
(in millimeters)
Marking:
S140
1.65
1.45
2.40
1.45
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STPS140A/U
PACKAGE MECHANICAL DATA
SMB Plastic
DIMENSIONS
Millimeters Inches
REF.
E1
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
2.45
0.20
2.20
0.41
5.60
4.60
3.95
1.60
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.063
D
c
E
E
A1
E1
D
A2
C
L
b
L
Marking:
G14
FOOT PRINT
(in millimeters)
2.3
1.52
2.75
1.52
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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