STPS1L30AFN [STMICROELECTRONICS]
Rectifier Diode;
ST 
STPS1L30
Datasheet
30 V, 1 A low drop power Schottky rectifier
Features
•
•
•
•
Very low forward voltage drop for less power dissipation
Surface mount miniature packages
Avalanche rated
ECOPACK2 compliant
Applications
•
•
•
•
•
Cordless appliance
SSD
Battery charger
Telecom power
DC / DC converter
Description
Schottky rectifiers designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat Notch or SMB, the STPS1L30 is ideal for use in parallel
with MOSFETs in synchronous rectification.
Product status
STPS1L30
Product summary
Symbol
Value
1 A
I
F(AV)
V
30 V
RRM
T
V
150 °C
0.26 V
j(max.)
F(typ.)
DS1243 - Rev 8 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS1L30
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
Value
30
Unit
V
V
Repetitive peak reverse voltage
Forward rms current
RRM
I
10
A
F(RMS)
T = 135 °C
L
SMA
I
T = 140 °C
Average forward current, δ = 0.5, square wave
Surge non repetitive forward current
SMA Flat Notch
1
A
A
F(AV)
L
T = 140 °C
L
SMB
SMA
75
90
I
t = 10 ms sinusoidal
p
SMA Flat Notch
SMB
FSM
75
P
t = 10 µs, T = 125 °C
Repetitive peak avalanche power
Storage temperature range
110
W
°C
°C
ARM
p
j
T
-65 to +150
+150
stg
Maximum operating junction temperature(1)
T
j
1. (dP /dT ) < (1/R ) condition to avoid thermal runaway for a diode on its own heatsink.
th(j-a)
tot
j
Table 2. Thermal resistance parameter
Symbol
Parameter
Max. value
Unit
SMA
30
20
25
R
th(j-l)
Junction to lead
SMA Flat Notch
SMB
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
6
Max.
200
Unit
T = 25 °C
-
-
-
-
-
-
µA
j
(1)
V
= V
RRM
I
Reverse leakage current
R
R
T = 100 °C
15
mA
j
T = 25 °C
0.395
0.300
0.445
0.375
j
I = 1 A
F
T = 125 °C
0.260
0.325
j
(1)
V
Forward voltage drop
V
F
T = 25 °C
j
I = 2 A
F
T = 125 °C
j
1. Pulse test: t = 380 µs, δ < 2%
p
To evaluate the conduction losses, use the following equation:
2
P = 0.225x IF(AV) + 0.075 x IF (RMS)
DS1243 - Rev 8
page 2/15
STPS1L30
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
•
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
Figure 1. Average forward power dissipation versus
average forward current
I
(A)
F(AV)
P
(W)
F(AV)
6
5
4
3
2
1
0
0.50
Rth(j-a)=Rth(j-l)
δ = 0.1
δ = 0.05
δ = 0.2
0.45
δ = 0.5
0.40
0.35
0.30
0.25
SMB
SMA
δ = 1
0.20
0.15
0.10
T
T
T
(°C)
amb
tp
=tp/T
0.05
0.00
δ
I
F(AV)(A)
0.6
tp
=tp/T
δ
0
25
50
75
100
125
150
0.0
0.2
0.4
0.8
1.2
1.0
Figure 3. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
PARM(t )
p
Z
/R
PARM(10 µs)
th(j-a) th(j-a)
1.00
0.10
0.01
1
0.1
SMB
Single pulse
0.01
0.001
t (s)
p
tp(µs)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1
10
100
1000
DS1243 - Rev 8
page 3/15
STPS1L30
Characteristics (curves)
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
I (mA)
R
Z
/R
th(j-a) th(j-a)
1.E+2
1.E+1
1.00
0.10
0.01
Tj=150°C
SMA
Tj=125°C
Tj=100°C
1.E+0
1.E-1
Tj=25°C
Single pulse
1.E-2
1.E-3
t (s)
p
V
R
(V)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0
5
10
15
20
25
30
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
Figure 8. Forward voltage drop versus forward current
(typical values, high level)
I (A)
F
C(pF)
500
10.00
F=1MHz
V
OSC=30mVRMS
Tj=25°C
Tj=150°C
100
Tj=25°C
Tj=100°C
1.00
V
(V)
R
V (V)
F
10
0.10
1
2
5
10
50
20
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Figure 9. Forward voltage drop versus forward current
(maximum values, low level)
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
I (A)
F
R
th(j-a)
(°C/W)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
200
150
100
50
T
=150°C
Epoxy p rinted circuit board FR4, copper t hickness: 35 µm
j
SMB
Tj=100°C
Tj=125°C
Tj=25°C
S(Cu)(cm²)
V
(V)
F
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
DS1243 - Rev 8
page 4/15
STPS1L30
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
copper surface under each lead (SMA Flat Notch)
R
th(j-a)
(°C/W)
R
th(j-a)
(°C/W)
200
150
100
50
200
150
100
50
Epoxy printed circuit board FR4,copper thickness: 35 µm
Epoxy printed circuit board FR4,copper thickness: 35 µm
SMA
SMA Flat Notch
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DS1243 - Rev 8
page 5/15
STPS1L30
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DS1243 - Rev 8
page 6/15
STPS1L30
SMA package information
2.1
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 13. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 4. SMA package mechanical data
Dimensions
Millimeters
Ref.
Inches (for reference only)
Min.
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
Max.
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
Min.
0.074
0.001
0.049
0.005
0.088
0.188
0.155
0.029
Max.
0.097
0.008
0.065
0.016
0.115
0.211
0.182
0.060
A1
A2
b
c
D
E
E1
L
DS1243 - Rev 8
page 7/15
STPS1L30
SMA package information
Figure 14. SMA recommended footprint in mm (inches)
2.63
1.4
1.4
(0.055)
(0.055)
(0.104)
1.64
(0.065)
5.43
(0.214)
DS1243 - Rev 8
page 8/15
STPS1L30
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 15. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches (for reference only)
Min.
Max.
Min.
Typ.
Max.
A1
A1
b
0.90
1.10
0.035
0.044
0.05
0.002
1.25
0.15
2.25
5.00
3.95
1.65
0.40
2.90
5.35
4.60
0.049
0.005
0.088
0.196
0.155
0.065
0.016
0.115
0.211
0.182
C
D
E
E1
G
2.00
0.85
0.079
0.033
G1
L
0.75
1.20
0.029
L1
L2
L3
V
0.45
0.45
0.05
0.018
0.018
0.002
8°
8°
8°
8°
V1
DS1243 - Rev 8
page 9/15
STPS1L30
SMA Flat Notch package information
Figure 16. SMA Flat Notch recommended footprint in mm (inches)
3.12
1.20
1.20
(0.047)
(0.047)
(0.123)
1.52
(0.060)
5.52
(0.217)
DS1243 - Rev 8
page 10/15
STPS1L30
SMB package information
2.3
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 17. SMB package outline
E1
D
E
A1
C
A2
L
b
Table 6. SMB package mechanical data
Dimensions
Millimeters
Ref.
Inches (for reference only)
Min.
1.90
0.05
1.95
0.15
3.30
5.10
4.05
0.75
Max.
2.45
0.20
2.20
0.40
3.95
5.60
4.60
1.50
Min.
0.074
0.001
0.076
0.005
0.129
0.200
0.159
0.029
Max.
0.097
0.008
0.087
0.016
0.156
0.221
0.182
0.060
A1
A2
b
c
D
E
E1
L
DS1243 - Rev 8
page 11/15
STPS1L30
SMB package information
Figure 18. SMB recommended footprint
2.60
1.62
1.62
(0.064)
(0.064)
(0.102)
2.18
(0.086)
5.84
(0.230)
DS1243 - Rev 8
page 12/15
STPS1L30
Ordering Information
3
Ordering Information
Table 7. Ordering information
Order code
STPS1L30A
STPS1L30AFN
STPS1L30U
Marking
GB3
Package
SMA
Weight
0.068 g
0.039 g
0.107 g
Base qty.
5000
Delivery mode
Tape and reel
Tape and reel
Tape and reel
A13
SMA Flat Notch
SMB
10 000
2500
G23
DS1243 - Rev 8
page 13/15
STPS1L30
Revision history
Table 8. Document revision history
Changes
Date
Version
Jul-2003
5A
Last update.
SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm
(0.080 inc).
Aug-2004
6
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and
17-Sep-2018
26-Sep-2019
7
8
Figure 3. Normalized avalanche power derating versus junction temperature (T = 125 °C).
j
Added Section 2.2 SMA Flat Notch package information.
DS1243 - Rev 8
page 14/15
STPS1L30
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DS1243 - Rev 8
page 15/15
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