TLV1112CKTT [STMICROELECTRONICS]
1.2-V, 0.8-A LOW-DROPOUT VOLTAGE REGULATOR; 1.2 -V , 0.8 -A低压差稳压器型号: | TLV1112CKTT |
厂家: | ST |
描述: | 1.2-V, 0.8-A LOW-DROPOUT VOLTAGE REGULATOR |
文件: | 总12页 (文件大小:323K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢃ ꢅꢄ ꢆꢂꢇ ꢈ ꢅꢉ ꢆꢊ ꢁ ꢋꢌꢆꢍꢎꢋ ꢏ ꢋꢐꢀ ꢂꢋ ꢁꢀꢊꢑ ꢒ ꢎꢒꢑ ꢐ ꢁꢊꢀꢋ ꢎ
SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
D
D
D
Output Current of Up to 800 mA
Operates Down to 1.1-V Dropout
D
D
0.2% Line Regulation Maximum
0.5% Load Regulation Maximum
Specified Dropout Voltage at Multiple
Current Levels
KTP (PowerFLEXE) PACKAGE
KCS (TO-220) PACKAGE
(TOP VIEW)
(TOP VIEW)
INPUT
OUTPUT
GND
INPUT
OUTPUT
GND
DCY (SOT-223) PACKAGE
(TOP VIEW)
KTT (TO-263) PACKAGE
(TOP VIEW)
INPUT
INPUT
OUTPUT
OUTPUT
GND
GND
description/ordering information
The TLV1112 is a low-dropout voltage regulator, designed to provide up to 800 mA of output current at 1.2 V
(typ). All internal circuitry is designed to operate down to 1.1-V input-to-output differential. Dropout voltage is
specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents.
ORDERING INFORMATION
V
TYP
(V)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
O
†
PACKAGE
T
J
PowerFLEXt (KTP)
Reel of 2000
TLV1112IKTPR
TLV1112IDCY
TLV1112IDCYR
TLV1112IKCS
TLV1112IKTT
Tube of 80
Reel of 2500
Tube of 50
Tube of 50
Reel of 1000
Reel of 2000
Tube of 80
Reel of 2500
Tube of 50
Tube of 50
Reel of 1000
SOT-223 (DCY)
−40°C to 125°C
1.2 V
TO-220 (KCS)
TO-263 (KTT)
TLV1112IKTTR
TLV1112CKTPR
TLV1112CDCY
TLV1112CDCYR
TLV1112CKCS
TLV1112CKTT
TLV1112CKTTR
PowerFLEX (KTP)
SOT-223 (DCY)
TO-220 (KCS)
0°C to 125°C
1.2 V
TO-263 (KTT)
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerFLEX is a trademark of Texas Instruments.
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Copyright 2005, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢃꢃ ꢄ
ꢃꢅ ꢄꢆꢂꢇ ꢈ ꢅ ꢉꢆꢊ ꢁ ꢋꢌꢆꢍꢎ ꢋꢏ ꢋ ꢐꢀ ꢂ ꢋꢁꢀꢊꢑ ꢒ ꢎꢒ ꢑꢐꢁ ꢊꢀꢋ ꢎ
SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
description/ordering information (continued)
The low-profile surface-mount KTP package allows the device to be used in applications where space is limited.
The TLV1112 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or
larger normally are included in most regulator designs.
Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent
current of the TLV1112 flows into the load, increasing efficiency.
The TLV1112C is characterized for operation over the virtual junction temperature range of 0°C to 125°C. The
TLV1112I is characterized for operation over the virtual junction temperature range of −40°C to 125°C.
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Continuous input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
‡
θ
JP
PACKAGE
BOARD
θ
JC
θ
JA
PowerFLEXt/TO-252 (KTP)
High K, JESD 51-5
1.4°C/W
19°C/W
28°C/W
SOT (DCY)
High K, JESD 51-7
High K, JESD 51-5
High K, JESD 51-5
4°C/W
53°C/W
19°C/W
TBD
TO-220 (KCS)
TO-263 (KTT)
3°C/W
17°C/W
TBD
NOTE 1: Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable ambient
JA
J
A
temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
‡
For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θ is defined as the thermal resistance between the die
JP
junction and the bottom of the exposed pad.
recommended operating conditions
MIN
MAX
15
UNIT
V
V
IN
Input voltage
2.7
I
Output current
800
125
125
mA
OUT
TLV1112I
−40
0
T
Operating virtual junction temperature range
°C
J
TLV1112C
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
electrical characteristics, T = 0°C to 125°C, all typical values are at T = 25°C
J
J
(unless otherwise noted)
TLV1112C
TYP
1.2
†
PARAMETER
TEST CONDITIONS
UNIT
MIN
1.17
1.14
MAX
1.23
1.26
0.2
V
− V
OUT
= 2 V, I = 10 mA, T = 25°C
IN
OUT
J
Output voltage, V
V
OUT
10 mA ≤ I
OUT
≤ 800 mA, 1.4 V ≤ V − V
IN OUT
≤ 10 V
1.2
Line regulation
Load regulation
I
= 10 mA, 1.5 ≤ V − V
IN OUT
≤ 13.8 V
= 3 V
0.035
0.1
%
%
OUT
10 mA ≤ I
≤ 800 mA, V − V
IN OUT
0.5
OUT
I
I
I
= 100 mA
= 500 mA
= 800 mA
1.1
1.2
OUT
OUT
OUT
1.15
1.2
1.25
1.3
Dropout voltage (see Note 4)
V
‡
Current limit
V
− V
OUT
= 5 V , T = 25°C
0.8
60
1.2
1.5
A
mA
%/W
dB
mA
%
IN
IN
J
Quiescent current
Thermal regulation
Ripple rejection
V
≤ 15 V
5
10
30 ms pulse, T = 25°C
0.01
75
0.1
A
V
V
− V
OUT
= 3 V, V
ripple
= 1 V , f = 120 Hz
pp
IN
Minimum load current
Temperature stability
Long-term stability
= 15 V
1.7
5
IN
T = 0°C to 125°C
J
0.5
1000 hrs, No load, T = 125°C
0.3
%
A
Output noise voltage (% of V
)
f = 10 Hz to 100 kHz
0.003
%
OUT
†
‡
All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible.
Current limit test specified under recommended operating conditions
NOTE 2: Dropout is defined as the input-to-output differential at which V
drops 100 mV below the value of V , measured at
OUT
OUT
V
IN
= V + 1.5 V.
OUT(nom)
electrical characteristics, T = −40°C to 125°C, all typical values are at T = 25°C
J
J
(unless otherwise noted)
TLV1112I
TYP
1.2
†
PARAMETER
TEST CONDITIONS
UNIT
MIN
MAX
1.23
1.26
0.3
V
− V
OUT
= 2 V, I = 10 mA, T = 25°C
1.17
1.14
IN
OUT
J
Output voltage, V
V
OUT
10 mA ≤ I
OUT
≤ 800 mA, 1.4 V ≤ V − V
IN OUT
≤ 10 V
1.2
Line regulation
Load regulation
I
= 10 mA, 1.5 ≤ V − V
IN OUT
≤ 13.8 V
= 3 V
0.035
0.2
%
%
OUT
10 mA ≤ I
≤ 800 mA, V − V
IN OUT
0.5
OUT
I
I
I
= 100 mA
= 500 mA
= 800 mA
1.1
1.3
OUT
OUT
OUT
1.15
1.2
1.35
1.4
Dropout voltage (see Note 4)
V
‡
Current limit
V
− V
OUT
= 5 V , T = 25°C
0.8
60
1.2
1.5
A
mA
%/W
dB
mA
%
IN
IN
J
Quiescent current
Thermal regulation
Ripple rejection
V
≤ 15 V
5
15
30 ms pulse, T = 25°C
0.01
75
0.1
A
V
− V
OUT
= 3 V, V
ripple
= 1 V , f = 120 Hz
pp
IN
IN
Minimum load current
Temperature stability
Long-term stability
V
= 15 V
1.7
5
T = −40°C to 125°C
0.5
J
1000 hrs, No load, T = 125°C
0.3
%
A
Output noise voltage (% of V
)
f = 10 Hz to 100 kHz
0.003
%
OUT
†
‡
All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible.
Current limit test specified under recommended operating conditions
NOTE 4: Dropout is defined as the input-to-output differential at which V
drops 100 mV below the value of V , measured at
OUT
OUT
V
IN
= V + 1.5 V.
OUT(nom)
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
TYPICAL CHARACTERISTICS
Figure 1. Short-Circuit Current vs (V − V )
I
O
Figure 2. Load Regulation vs Temperature
Figure 4. Ripple Rejection vs Current
Figure 6. GND Pin Current vs Temperature
Figure 3. Ripple Rejection vs Frequency
Figure 5. Temperature Stability
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
TYPICAL CHARACTERISTICS
Figure 7. Load-Transient Response
Figure 8. Line-Transient Response
5
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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005
APPLICATION INFORMATION
1N4002 (See Note C)
TLV1112
INPUT
OUTPUT
GND
V
O
V
I
10 µF
(see Note B)
100 µF
(see Note A)
NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-µF tantalum or 50-µF aluminum
electrolytic, with either one having an ESR between the range of 0.3 Ω to 22 Ω. Larger C
values benefit the regulator by
OUT
improving transient response and loop stability.
B.
C
is recommended if TLV1112 is not located near the power-supply filter.
IN
C. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND.
Figure 9. Typical Application Circuit
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SOT-223
SOT-223
TO-220
PFM
Drawing
TLV1112IDCY
TLV1112IDCYR
TLV1112IKCS
TLV1112IKTPR
TLV1112IKTT
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
DCY
4
4
3
2
3
80
2500
50
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
DCY
KCS
KTP
3000
50
DDPAK/
TO-263
KTT
TLV1112IKTTR
PREVIEW
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004)
M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
3
0,25 (0.010)
0,84 (0.033)
0,66 (0.026)
0°–10°
2,30 (0.091)
0,10 (0.004)
M
4,60 (0.181)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
1,80 (0.071) MAX
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPSF001F – JANUARY 1996 – REVISED JANUARY 2002
KTP (R-PSFM-G2)
PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE
0.080 (2,03)
0.070 (1,78)
0.243 (6,17)
0.233 (5,91)
0.228 (5,79)
0.218 (5,54)
0.050 (1,27)
0.040 (1,02)
0.130 (3,30) NOM
0.010 (0,25) NOM
Thermal Tab
(See Note C)
0.215 (5,46)
0.287 (7,29)
0.277 (7,03)
NOM
0.247 (6,27)
0.237 (6,02)
0.381 (9,68)
0.371 (9,42)
0.100 (2,54)
0.090 (2,29)
0.032 (0,81) MAX
Seating Plane
0.004 (0,10)
0.090 (2,29)
0.180 (4,57)
0.005 (0,13)
0.001 (0,02)
0.031 (0,79)
0.025 (0,63)
0.010 (0,25)
M
0.047 (1,19)
0.037 (0,94)
0.010 (0,25) NOM
Gage Plane
0.010 (0,25)
2°–ā6°
4073388/M 01/02
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the thermal tab.
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
E. Falls within JEDEC TO-252 variation AC.
PowerFLEX is a trademark of Texas Instruments.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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