TSI220B1 [STMICROELECTRONICS]

TERMINAL SET INTERFACE PROTECTION AND DIODE BRIDGE; 终端设定接口保护二极管桥
TSI220B1
型号: TSI220B1
厂家: ST    ST
描述:

TERMINAL SET INTERFACE PROTECTION AND DIODE BRIDGE
终端设定接口保护二极管桥

二极管 电信集成电路 电信电路 电信保护电路 光电二极管
文件: 总9页 (文件大小:176K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TSIxxB1  
TERMINAL SET INTERFACE  
®
Application Specific Discretes  
A.S.D.  
PROTECTION AND DIODE BRIDGE  
MAIN APPLICATION  
Telecom equipment requiring combined  
protection against transient overvoltages and  
rectification by diode bridge :  
Telephone set  
Base station for cordless set  
Fax machine  
Modem  
SO8  
Caller Id equipment  
Set top box  
DESCRIPTION  
SCHEMATIC DIAGRAM  
The TSIxxB1 provides the diode bridge and the  
crowbar protection function that can be found in  
most of telecom terminal equipment.  
Integrated monolithically within a SO8 package,  
this ASD device allows space saving on the  
board and greater reliability.  
8
7
6
5
1
2
3
4
FEATURES  
STAND-OFF VOLTAGE FROM 62V TO 265V  
PEAK PULSE CURRENT : 30 A (10/1000 µs)  
MAXIMUM DC CURRENT : IF = 0.2 A  
HOLDING CURRENT :150 mA  
IN ACCORDANCE WITH THE FOLLOWING  
STANDARDS :  
CCITT K17 - K20 10/700  
s
1.5 kV  
38A  
µ
BENEFITS  
5/310 µs  
VDE 0433  
CNET  
10/700  
5/310  
s
s
s
2 kV  
µ
µ
µ
Diode bridge for polarity guard and crowbar  
protection within one device.  
Single chip for greater reliability  
Reduces component count versus discrete  
solution  
Saves space on the board  
40A(*)  
1.5 kV  
38A  
0.5/700  
0.2/310 µs  
Bellcore  
TR-NWT-000974: 10/1000  
µ
s
1 kV  
30A(*)  
10/1000 µs  
FCC Part 68  
2/10  
2/10  
s
2.5 kV  
75A (*)  
µ
µs  
MIL STD883C Method 3015-6  
(*) with series resistor or PTC.  
TM: ASD is trademarks of SGS-THOMSON Microelectronics.  
January 1998 - Ed: 3  
1/9  
TSIxxB1  
TYPICAL APPLICATION  
PTC  
Telecom terminals have a diode bridge for polarity  
guard, located at the line interface stage. They also  
have above this diode bridge one crowbar  
protection device that is mandatory to prevent  
atmospheric effects and AC mains disturbances  
from damaging the electronic circuitry that follows  
the diode bridge.  
SGS-THOMSON proposes a one chip device that  
includes both protection and diode bridge. This is  
the concept of the TSIxxB1 devices.  
Fig. 1 : The various uses of the TSIxxB1 in a conventional telecom network  
2/9  
TSIxxB1  
ELECTRICAL PARAMETERS  
The VRM value corresponds to the maximum  
voltage of the application in normal operation. For  
instance, if the maximum line voltage is ranging  
between ±100VRMS of ringing plus 48V of battery  
voltage, then the protection chosen for this applica-  
tion shall have a VRM close to 200V.  
TSIxxB1 BEHAVIOUR WITH REGARD TO  
SURGE STANDARD :  
The TSIxxB1 is able to replace both diode bridge  
and usual discrete protection on telecom  
terminals. Furthermore it complies with the CCITT  
K17 recommendations :  
10/700 µs waveform surge test, ± 1.5kV  
AC power induction test  
The VBO is the triggering voltage. This indicates the  
voltage limit for which the component  
short-circuits. Passing this VBO makes the device  
turn on.  
AC power contact test  
The IBO is the current that makes the device turn  
on. Indeed, if we want a Trisil to be turned on not  
only the voltage across it shall pass the VBO value  
but the current through it shall also pass the IBO  
value.  
In other words, if a voltage surge occurring on the  
line is higher than the VBO value of a Trisil, whereas  
the line surge current is limited to a value that does  
not exceed the Trisil’s IBO value, then the Trisil will  
never turn into short circuit. At this time the surge  
will be clamped by the Trisil.  
Anyhow the electronic circuitry located after the  
Trisil will always be protected whatever the Trisil  
state is (crowbar or clamping mode).  
The IH stands for the holding current. When the  
Trisil is turned on, as soon as the crossing current  
surge gets lower than this IH value, the Trisil  
protection device turns back in its idle state.  
Remark : for this reason the Trisil ’s IH value shall  
be chosen higher than what the maximum telecom  
line current can be.  
Fig. 2 : Test circuit for the CCITT K17 recommendations  
3/9  
TSIxxB1  
TEST # 1  
LIGHTNING SIMULATION  
This test concerns the 10/700 µs waveform surge,  
± 1.5 kV.  
The surge generator used for the test has the  
following circuitry (fig.2).  
Fig. 2 : 10/700 µs waveform surge generator circuit  
The behaviour of the TSI200B1 to this lightning surge is given below (fig. 3).  
Fig. 3 : Voltage across the TSI200B1 at the + and - terminations and current throught it  
for a 1.5 kV positive surge (fig.3a) and negative surge (fig. 3b)  
These curves show the peak voltage the surge  
generates across the TSI200B1  
+
and  
-
terminations. This lasts a short time (2 µs) and  
after, as the internal protection gehaves like a short  
circuit. The voltage drop across the TSIxxB1  
becomes a few volts. In the meanwhile all the  
surge current flows in the protection.  
As far as the 10/700 µs waveform surge test is  
concerned,the TSIxxB1 withstand the ± 1.5 kV  
test.  
4/9  
TSIxxB1  
TEST # 2  
AC POWER INDUCTION TEST  
TEST #3  
AC POWER CONTACT TEST  
This test simulates the induction phenomena that  
can happen between telecom lines and AC mains  
lines (fig. 4).  
This test simulates the direct contact between the  
telecom lines and the AC mains lines.  
The AC power contact test consists in applying  
240VRMS through a 10PTC during 15 minutes  
long on the device under test. The CCITT K17  
recommendation specifies an internal generator  
impedance allowing 10 ARMS when in short circuit.  
Fig. 4 : AC power induction test circuit  
The behavior of the TSI200B1 with respect to this  
surge is given in figure 6.  
Fig. 6 : Voltage at the TSI200B1 + & - terminations  
and the current through it.  
Part #1  
test conditions :  
test conditions :  
VRMS = 240 V  
R = 600 Ω  
t = 0.2 s  
Part #2  
VRMS = 600 V  
R = 600 Ω  
t = 0.2 s  
Fig. 5 : Voltage at the + and - terminations of the  
TSI200B1, and current through it  
while test part 1 is applied.  
The figure 6 shows that after 250ms there is no  
current anymore flowing through the TSI200B1  
device. This is due to the action of the serial PTC  
that limits the current through the line. This PTC is  
mandatory for this test. It can also be replaced by a  
fuse or any other serial protection that "opens" the  
line loop under AC contact test.  
The TSIxxB1 withstand the AC power induction  
test in both cases.  
5/9  
TSIxxB1  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)  
Symbol  
Parameter  
Value  
Unit  
Non repetitive peak on-sate current (see note 1)  
10/1000 µs (open circuit voltage wave shape 10/100 µs)  
5/310 µs (open circuit voltage wave shape 10/700 µs)  
2/10 µs (open circuit voltage wave shape 2/10 µs)  
IPP  
30  
40  
75  
A
Maximum DC current  
IF  
0.2  
A
A
ITSM  
Non repetitive surge peak on-state current  
tp = 20 ms  
5
3.5  
t = 1s  
Tstg  
Tj  
Storage temperature range  
- 55 to +150  
150  
°C  
°C  
Maximum junction temperature  
TL  
Maximum lead temperature for soldering during 10 s  
260  
Note 1 : Pulse waveform :  
% I  
PP  
10/1000µs  
5/310µs  
2/10µs  
t =10µs  
t =1000µs  
r
p
t =5µs  
t =310µs  
r
p
100  
t =2µs  
t =10µs  
r
p
50  
0
t
t
t
p
r
THERMAL RESISTANCE  
Symbol  
Parameter  
Value  
Unit  
Rth(j-a)  
Junction to ambient  
170  
°C/W  
ELECTRICAL CHARACTERISTICS (Tamb=25°C)  
I
Symbol  
VRM  
VBO  
VBR  
IH  
Parameter  
Stand-off voltage  
IPP  
Breakover voltage  
Breakdown voltage  
Holding current  
IBO  
I
H
IRM  
V
IBO  
Breakover current  
Leakage current at VRM  
Peak pulse current  
Capacitance  
VRM  
V
BO  
IRM  
IPP  
C
αT  
Temperature coefficient  
6/9  
TSIxxB1  
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C)  
1 - PROTECTION DEVICES PARAMETERS  
I
RM @ VRM  
VBO @ IBO  
note1  
V
IH  
IBO  
C
note3  
pF  
note2  
mA  
note1  
Type  
µA  
V
mA  
min.  
50  
mA  
max.  
max.  
90  
min.  
150  
max.  
400  
typ.  
200  
1
5
50  
62  
TSI62B1  
TSI180B1  
TSI200B1  
TSI220B1  
TSI265B1  
1
5
50  
180  
250  
290  
330  
380  
150  
150  
150  
150  
50  
50  
50  
50  
400  
400  
400  
400  
200  
200  
200  
200  
1
5
50  
200  
1
5
50  
220  
1
5
50  
265  
Note 1 : Measured at 50 Hz, one cycle  
Note 2 : See test cricuit  
Note 3 : V = 0V, F = 1MHz, between pins 1 and 8.  
R
2 - DIODE BRIDGE PARAMETERS  
Symbol  
Test condition  
Value  
Unit  
IF = 20 mA  
IF = 100 mA  
VF  
0.9  
1.1  
V
V
(for one diode)  
FUNCTIONAL HOLDING CURRENT (IH) TEST CIRCUIT : GO - NO GO TEST  
R
- V  
P
D.U.T.  
V
= - 48 V  
BAT  
Surge generator  
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in a functional  
test circuit.  
TEST PROCEDURE :  
1) Adjust the current level at the IH value by short circuiting the D.U.T.  
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.  
3) The D.U.T will come back off-state within a duration of 50 ms max.  
7/9  
TSIxxB1  
MARKING  
Type  
Marking  
TSI62  
TSI62B1  
TSI180B1  
TSI200B1  
TSI220B1  
TSI265B1  
TSI180  
TSI200  
TSI220  
TSI265  
ORDER CODE  
TSI 265 B 1 RL  
RL = tape& reel (2500 pcs).  
= tube (100 pcs).  
Terminal  
Set  
Interface  
SO8 Package  
VBR min.  
8/9  
TSIxxB1  
PACKAGE MECHANICAL DATA  
SO8  
REF. DIMENSIONS  
Millimetres  
Inches  
Min. Typ. Max. Min. Typ. Max.  
A
a1  
a2  
b
1.75  
0.069  
0.010  
0.065  
0.019  
0.010  
0.1  
0.25 0.004  
1.65  
0.35  
0.19  
0.48 0.014  
0.25 0.007  
b1  
C
0.50  
0.020  
c1  
D
45° (typ)  
4.8  
5.8  
5.0 0.189  
6.2 0.228  
0.197  
0.244  
E
e
1.27  
3.81  
0.050  
0.150  
e3  
F
3.8  
4.0 0.15  
0.157  
Packaging : product supplied in tape and reel or antistatic tubes.  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
© 1998 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The  
Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
9/9  

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