TYN812RG [STMICROELECTRONICS]
SENSITIVE & STANDARD(12A SCRs); 敏感及标准（ 12A可控硅）
| 型号： | TYN812RG |
| 厂家： | 
ST |
| 描述： | SENSITIVE & STANDARD(12A SCRs) |
| 文件： | 总11页 (文件大小：125K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TN12, TS12 and TYNx12 Series
®
12A SCRS
SENSITIVE & STANDARD
Table 1: Main Features
Symbol
A
Value
Unit
IT(RMS)
12
A
G
K
VDRM/VRRM
IGT
600 to 1000
0.2 to 15
V
A
mA
A
K
A
G
K
A
DESCRIPTION
G
Available either in sensitive (TS12) or standard
(TN12 / TYN) gate triggering levels, the 12A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
D2PAK
(TN12-G)
DPAK
(TN12-B / TS12-B)
A
A
K
K
A
G
A
G
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
IPAK
(TN12-H / TS12-H)
TO-220AB
(TYNx12RG)
Table 2: Order Codes
Part Numbers
Marking
TN1215x00
TN1215x00
TN1215x00G
TN1215x00G
TN1215x00
TS1220x00
TS1220x00
TS1220x00
TYNx12
TN1215-x00B
TN1215-x00B-TR
TN1215-x00G
TN1215-x00G-TR
TN1215-x00H
TS1220-x00B
TS1220-x00B-TR
TS1220-x00H
TYNx12RG
TYNx12TRG
TYNx12T
October 2005
REV. 5
1/11
TN12, TS12 and TYNx12 Series
Table 3: Absolute Ratings (limiting values)
Value
Symbol
Parameter
Unit
TN12-G TN12-B/H
TYN12 TS12-B/H
IT(RMS)
IT(AV)
Tc = 105°C
Tc = 105°C
RMS on-state current (180° conduction angle)
12
8
A
A
Average on-state current (180° conduction
angle)
tp = 8.3 ms
145
140
98
115
110
60
Non repetitive surge peak on-
ITSM
Tj = 25°C
state current
A
tp = 10 ms
²
²
I t
I t Value for fusing
A2S
A/µs
tp = 10 ms
Tj = 25°C
Critical rate of rise of on-state
current IG = 2 x IGT , tr ≤ 100 ns
Tj = 125°C
dI/dt
F = 60 Hz
50
IGM
tp = 20 µs
Tj = 125°C
Tj = 125°C
Peak gate current
4
1
A
PG(AV)
Average gate power dissipation
W
Tstg
Tj
- 40 to + 150
- 40 to + 125
Storage junction temperature range
Operating junction temperature range
°C
V
VRGM
Maximum peak reverse gate voltage (for TN12 & TYN12 only)
5
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
SENSITIVE
Symbol
■
Test Conditions
TS1220
Unit
µA
V
IGT
VGT
VGD
VRG
IH
MAX.
MAX.
MIN.
200
0.8
0.1
8
VD = 12 V
RL = 140 Ω
VD = VDRM RL = 3.3 kΩ RGK = 1 kΩ
IRG = 10 µA
Tj = 125°C
V
MIN.
V
IT = 50 mA RGK = 1 kΩ
IG = 1 mA RGK = 1 kΩ
VD = 65 % VDRM RGK = 220 Ω
ITM = 24 A tp = 380 µs
Threshold voltage
MAX.
MAX.
MIN.
5
mA
mA
V/µs
V
IL
6
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
dV/dt
VTM
Vt0
5
MAX.
MAX.
MAX.
1.6
0.85
30
5
V
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
RGK = 220 Ω
MAX.
2
2/11
TN12, TS12 and TYNx12 Series
■
STANDARD
TN1215
TYN
Symbol
Test Conditions
Unit
B / H
G
x12T x12
MIN.
MAX.
MAX.
2
0.5
5
2
IGT
mA
VD = 12 V
RL = 33 Ω
15
15
VGT
VGD
IH
1.3
0.2
V
V
VD = VDRM RL = 3.3 kΩ
IT = 500 mA Gate open
IG = 1.2 IGT
Tj = 125°C
MIN.
MAX.
MAX.
MIN.
40
80
30
60
15
30
40
30
60
mA
mA
V/µs
V
IL
VD = 67 % VDRM Gate open Tj =125°C
dV/dt
VTM
Vt0
200
200
ITM = 24 A tp = 380 µs
Threshold voltage
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
MAX.
MAX.
MAX.
1.6
0.85
30
5
V
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
MAX.
2
Table 6: Thermal resistance
Symbol
Parameter
Value Unit
Rth(j-c)
Junction to case (DC)
1.3
70
°C/W
²
DPAK
S = 0.5 cm
²
45
100
60
S = 1 cm
D2PAK
IPAK
Rth(j-a)
Junction to ambient (DC)
°C/W
TO-220AB
S = Copper surface under tab.
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Average and D.C. on-state current
versus case temperature
P(W)
I
(A)
T(AV)
12
14
12
10
8
D.C.
11
10
9
α = 180°
8
α = 180°
7
6
6
5
4
4
3
360°
2
2
1
T (°C)
case
I (A)
T(AV)
α
0
0
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
9
3/11
TN12, TS12 and TYNx12 Series
Figure 3: Average and D.C. on-state current
versus ambient temperature (device mounted
on FR4 with recommended pad layout) (DPAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration
I
(A)
T(AV)
K=[Z
/R
]
th(j-c) th(j-c)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
0.5
D.C.
D2PAK
α = 180°
DPAK
0.2
0.1
t (s)
p
T
amb
(°C)
1E-3
1E-2
1E-1
1E+0
0
25
50
75
100
125
Figure 5: Relative variation of thermal
impedance junction to ambient versus pulse
duration (recommended pad layout, FR4 PC
board for DPAK)
Figure 6: Relative variation of gate trigger
current and holding current versus junction
temperature for TS8 series
K=[Z
/R
]
th(j-a) th(j-a)
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT H L j GT H L j
1.00
0.10
0.01
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IGT
DPAK
D2PAK
TO-220AB / IPAK
IH & IL
RGK = 1kΩ
T (°C)
j
t (s)
p
-40
-20
0
20
40
60
80
100
120
140
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 7: Relative variation of gate trigger
current and holding current versus junction
temperature for TN8 & TYN08 series
Figure 8: Relative variation of holding current
versus gate-cathode resistance (typical
values) for TS8 series
I [R ] / I [R =1kΩ]
H
GK
H
GK
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT
H
L
j
GT
H
L
j
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Tj = 25°C
IGT
IH & IL
T (°C)
j
R (kΩ)
GK
-40
-20
0
20
40
60
80
100
120
140
1E-2
1E-1
1E+0
1E+1
4/11
TN12, TS12 and TYNx12 Series
Figure 9: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical
values) for TS8 series
Figure 10: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical
values) for TS8 series
dV/dt[C ] / dV/dt[R =220Ω]
GK
GK
dV/dt[R ] / dV/dt[R =220Ω]
GK
GK
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
10.0
VD = 0.67 x VDRM
Tj = 125°C
RGK = 220Ω
Tj = 125°C
VD = 0.67 x VDRM
1.0
R (kΩ)
GK
C
(nF)
GK
0.1
0
200
400
600
800
1000
1200
0
25
50
75
100
125
150
Figure 11: Surge peak on-state current versus
number of cycles
Figure 12: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
I
(A)
TSM
I
(A), I2t (A2s)
TSM
150
140
130
120
110
100
90
2000
1000
Tj initial = 25°C
ITSM
tp=10ms
One cycle
TN12 / TYN12
TN12 / TYN12
Non repetitive
Tj initial=25°C
TS12
dI/dt limitation
80
70
TS12
TN12 / TYN12
100
10
60
50
40
I2t
TS12
30
20
10
Repetitive
TC=105°C
Number of cycles
t (ms)
p
0
1
10
100
1000
0.01
0.10
1.00
10.00
Figure 13: On-state characteristics (maximum
values)
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35µm) (DPAK and D2PAK)
R
(°C/W)
th(j-a)
I
(A)
TM
100
80
60
40
20
0
200
100
Tj max.:
Vt0=0.85V
Rd=30mΩ
Tj=max
DPAK
10
Tj=25°C
D2PAK
S(cm²)
V
(V)
TM
1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
2
4
6
8
10
12
14
16
18
20
5/11
TN12, TS12 and TYNx12 Series
Figure 15: Ordering Information Scheme (TN8 series)
TN 12 15 - 600 B (-TR)
Standard SCR series
Current
12 = 12A
Sensitivity
15 = 15mA
Voltage
600 = 600V
800 = 800V
1000 = 1000V
Package
B = DPAK
2
G = D PAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape & Reel (DPAK and D PAK)
2
Figure 16: Ordering Information Scheme (TS8 series)
TS 12 20 - 600 B (-TR)
Sensitive SCR series
Current
12 = 12A
Sensitivity
20 = 200µA
Voltage
600 = 600V
700 = 700V
Package
B = DPAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Figure 17: Ordering Information Scheme (TYN08 series)
TYN
6
12
T
RG
Standard SCR series
Voltage
6 = 600V
8 = 800V
10 = 100V
Current
12 = 12A
Sensitivity
Blanck = 30mA
T = 15mA
Packing mode
RG = Tube
6/11
TN12, TS12 and TYNx12 Series
Table 7: Product Selector
Part Numbers
Voltage (xxx)
700 V 800 V
Sensitivity
Package
600 V
1000 V
TN1215-xxxB
TN1215-xxxG
TN1215-xxxH
TS1220-xxxB
TS1220-xxxH
TYNx12
X
X
X
X
15 mA
15 mA
15 mA
0.2 mA
0.2 mA
15 mA
5 mA
DPAK
D2PAK
IPAK
X
X
X
X
X
X
X
X
X
DPAK
IPAK
X
X
X
X
TO-220AB
TO-220AB
TYNx12T
Figure 18: DPAK Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Min.
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
E
A
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
B2
C2
L2
D
R
H
L4
A1
R
B
G
C
A2
0.60 MIN.
0.80 typ.
0.60
0°
0.031 typ.
0.023
0°
1.00
8°
0.039
8°
V2
Figure 19: DPAK Foot Print Dimensions
(in millimeters)
1.6
6.7
3
3
2.3
2.3
6.7
1.6
7/11
TN12, TS12 and TYNx12 Series
Figure 20: D2PAK Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
A
E
A
A1
A2
B
4.30
2.49
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
C2
L2
0.03
0.70
D
L
B2
C
C2
D
E
G
1.25 1.40
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40
0.048 0.055
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
L3
A1
B2
B
R
C
G
L
A2
L2
L3
R
2mm min.
FLAT ZONE
0.40
0.016
V2
V2
0°
8°
0°
8°
Figure 21: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
8/11
TN12, TS12 and TYNx12 Series
DIMENSIONS
Figure 22: IPAK Package Mechanical Data
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
A1
A3
B
B2
B3
B5
C
2.20
0.90
0.70
0.64
5.20
2.40 0.086
1.10 0.035
1.30 0.027
0.90 0.025
5.40 0.204
0.95
0.094
0.043
0.051
0.035
0.212
0.037
A
E
C2
B2
L2
0.30
0.035
D
0.45
0.48
6
0.60 0.017
0.60 0.019
6.20 0.236
6.60 0.252
0.023
0.023
0.244
0.260
C2
D
E
H
B3
L1
L
6.40
A1
B
e
G
H
L
L1
L2
V1
2.28
0.090
0.634
V1
4.40
4.60 0.173
0.181
16.10
B5
C
e
9
0.8
9.40 0.354
1.20 0.031
1
0.370
0.047
A3
G
0.80
10°
0.031 0.039
10°
Figure 23: TO-220AB Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
C
Min. Typ. Max. Min. Typ. Max.
B
Ø I
A
15.20
15.90 0.598
0.625
b2
a1
3.75
0.147
L
a2 13.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
F
B
b1
b2
C
c1
c2
e
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
A
I4
l3
l2
c2
M
a1
a2
F
ØI
c1
b1
I4 15.80 16.40 16.80 0.622 0.646 0.661
e
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
9/11
TN12, TS12 and TYNx12 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
TN1215-x00B
Marking
TN1215x00
TN1215x00
TN1215x00G
Package
DPAK
Weight Base qty Delivery mode
0.3 g
0.3 g
1.5 g
75
2500
50
Tube
Tape & reel
Tube
TN1215-x00B-TR
TN1215-x00G
DPAK
D2PAK
D2PAK
IPAK
TN1215-x00G-TR
TN1215-x00H
TS1220-x00B
TS1220-x00B-TR
TS1220-x00H
TYNx12RG
TN1215x00G
TN1215x00
TS1220x00
TS1220x00
TS1220x00
TYNx12
1.5 g
0.3 g
0.3 g
0.3 g
0.3 g
2.3 g
2.3 g
1000
75
Tape & reel
Tube
DPAK
75
Tube
DPAK
2500
75
Tape & reel
Tube
IPAK
TO-220AB
TO-220AB
50
Tube
TYNx12TRG
TYNx12T
50
Tube
Note: x = voltage
Table 9: Revision History
Date
Revision
Description of Changes
Sep-2000
25-Mar-2005
3
4
Last update.
TO-220AB delivery mode changed from bulk to tube.
Changed sensitivity values in Table 7 for TYNx12 (30 to
15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK
statement
14-Oct-2005
5
10/11
TN12, TS12 and TYNx12 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
11/11
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