VN330SP(8932)TR [STMICROELECTRONICS]
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| 型号： | VN330SP(8932)TR |
| 厂家： | 
ST |
| 描述： | 暂无描述 驱动器 接口集成电路 继电器 固态继电器 光电二极管 |
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VN330SP(8932)
QUAD HIGH SIDE SMART
POWER SOLID STATE RELAY
Table 1. General Features
Figure 1. Package
Type
V
(*)
R
(*)
I
(*)
V
cc
demag
DSon
out
VN330SP(8932)
V
-55V 0.32Ω (**)
1A
36V
CC
(*) Per channel
(**) at Tj=85°C
■ OUTPUT CURRENT: 1A PER CHANNEL
■ DIGITAL INPUTS CLAMPED AT 32V MINIMUM
VOLTAGE
10
■ SHORTED LOAD AND OVERTEMPERATURE
PROTECTIONS
1
■ BUILT-IN CURRENT LIMITER
PowerSO-10™
■ UNDERVOLTAGE SHUTDOWN
■ OPEN DRAIN DIAGNOSTIC OUTPUT
■ FAST DEMAGNETIZATION OF INDUCTIVE LOADS
DESCRIPTION
The VN330SP(8932) is a monolithic device made
Active current limitation avoids dropping the
system power supply in case of shorted load.
using
STMicroelectronics
VIPower
M0-3
Built-in thermal shut-down protects the chip from
overtemperature and short-circuit. The open drain
diagnostic output indicates short-circuit and
overtemperature conditions.
Technology, intended for driving four indipendent
resistive or inductive loads with one side
connected to ground.
Table 2. Order Codes
Package
Tube
VN330SP(8932)
Tape and Reel
VN330SP(8932)TR
PowerSO-10
Rev. 1
September 2004
1/12
VN330SP(8932)
Figure 2. Block Diagram
Table 3. Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
V
V
CC
Power Supply Voltage
45
- 0.3
- V
Reverse Supply Voltage
V
CC
I
Output Current (cont.)
Internally Limited
- 6
A
OUT
I
R
Reverse Output Current (per channel)
Input Current (per channel)
DIAG Pin Current
A
I
IN
+/- 10
mA
mA
I
+/- 10
DIAG
Electrostatic Discharge
V
2000
400
V
ESD
(Human Body Model: R=1.5KΩ; C=100pF)
Single Pulse Avalanche Energy per Channel Not
Simultaneously (see figure 5)
E
mJ
AS
P
Power Dissipation T ≤25°C
Internally Limited
Internally limited
- 55 to 150
W
°C
°C
tot
C
T
Junction Operating Temperature
Storage Temperature
j
T
STG
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
2/12
VN330SP(8932)
Figure 4. Current and Voltage Conventions
Table 4. Thermal Data
Symbol
Parameter
Value
2
Unit
°C/W
°C/W
(1)
R
Thermal Resistance Junction-case
Max
Max
thj-case
(2)
R
Thermal Resistance Junction-ambient
50
thj-amb
(1)
(2)
All channels ON.
When mounted using minimum recommended pad size on FR-4 board.
ELECTRICAL CHARACTERISTICS (10V<V <36V; -25°C<T <125°C unless otherwise specified)
CC
j
Table 5. Power
Symbol
Parameter
Test Conditions
Min
Typ
Max
36
Unit
V
V
CC
Supply Voltage
10
I
I
=0.5A; T =125°C
0.4
0.32
1
Ω
OUT
j
R
On State Resistance
ON
=10A
Ω
OUT
All channels Off; V =30V
mA
mA
V
IN
I
Supply Current
S
OnState; T =125°C; I
I =0
OUT1... OUT4
10
j
V
demag
Output Voltage at Turn-Off
I
=0.5A; L
=1mH
V
-65 V -55 V -45
CC CC CC
OUT
LOAD
Table 6. Logic Input (each channel)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
V
V
Input Low Level Voltage
Input High Level Voltage
Input Hysteresis Voltage
2
IL
V
IH
(See note 1)
3.5
V
V
I(hyst)
0.5
V
V =0 to 30V
600
25
µA
µA
IN
I
Input Current
IN
25
32
V =0 to 2V
IN
Output Current in Ground
Disconnection
I
V
CC
=V =GND=DIAG=24V; T =25°C
mA
LGND
INX
j
Input Clamp Voltage
(See note 1)
I = 1mA
IN
36
V
V
V
ICL
I = - 1mA
IN
-0.7
Note: 1. The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external
resistor calculate to not exceed 10 mA.
3/12
VN330SP(8932)
ELECTRICAL CHARACTERISTICS (continued)
Table 7. Switching (V =24V)
CC
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
I
=0.5A; Resistive Load
OUT
Input Rise Time < 0.1µs
T =25°C
Turn-on Delay Time of
Output Current
t
d(on)
30
40
60
µs
µs
j
T =125°C
j
I
=0.5A; Resistive Load
OUT
Input Rise Time < 0.1µs
T =25°C
Rise Time of Output
Current
t
r
50
20
8
100
115
µs
µs
j
T =125°C
j
I
=0.5A; Resistive Load
OUT
Input Rise Time < 0.1µs
T =25°C
Turn-off Delay Time of
Output Current
t
d(off)
30
40
µs
µs
j
T =125°C
j
I
=0.5A; Resistive Load
OUT
Input Rise Time < 0.1µs
t
Fall Time of Output Current
f
T =25°C
j
15
20
0.5
2
µs
T =125°C
j
µs
I
I
I
I
=0.5A
A/µs
A/µs
A/µs
A/µs
OUT
(di/dt)
(di/dt)
Turn-on Current Slope
Turn-off Current Slope
on
off
=I ; T =25°C
OUT lim
j
=0.5A
2
OUT
=I ; T =25°C
OUT lim
4
j
Table 8. Protections
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
V
(3)
V
Status Voltage Output Low
I
=5mA (Fault condition)
= 1mA
1
STAT
STAT
STAT
STAT
I
I
32
36
V
(3)
V
SCL
Status Clamp Voltage
= - 1mA
0.7
V
V
Undervoltage Shut-down
DC Short Circuit Current
5
1
8
V
USD
I
V
V
=24V; R < 10mΩ
LOAD
2.5
A
lim
CC
=24V; V =30V;
CC
IN
I
Peak Short Circuit Current
4
A
OVPK
R
< 10mΩ (See figure 6)
LOAD
Leakage on Diag Pin in
High State
I
V
=24V
DIAG
100
25
µA
µA
µs
DIAGH
V
CC
=10 to 36V; V =0V;
IN
I
Output Leakage Current
LOAD
4 Channels In Parallel
Delay Time of Current
Limiter
t
100
SC
Thermal Shut-Down
Temperature
T
150
135
170
155
°C
°C
TSD
T
Reset Temperature
R
(3)
Note:
Status determination > 100 ms after the switching edge.
Note: If INPUTn pin is left floating the corresponding channel will automatically switch off. If GND pin is disconnetted, all channels will switch
off provided VCC does not exceed 36V
4/12
VN330SP(8932)
Figure 5. Avalanche Energy Test Circuit
Figure 6. Peak Short Circuit Current Test Circuit
5/12
VN330SP(8932)
Table 9. Truth Table
CONDITIONS
INPUTn
OUTPUTn
DIAGNOSTIC
L
H
L
L
H
L
L
L
L
L
H
H
H
Normal operation
Overtemperature
Undervoltage
H
L
H
L
H
H
H
H
H
L
Shorted Load
(Current Limitation)
H
Figure 7. Switching Waveforms
6/12
VN330SP(8932)
Figure 8. Switching Parameters Test Conditions
Figure 9. Driving Circuit
7/12
VN330SP(8932)
PowerSO-10™ Thermal Data
Figure 10. PowerSO-10™ PC Board
Layout condition of R and Z measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
th
th
2
Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm ).
Figure 11. R
Vs PCB copper area in open box free air condition
thj-amb
RTHj_amb (°C/W)
55
Tj-Tamb=50°C
50
45
40
35
30
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
8/12
VN330SP(8932)
PACKAGE MECHANICAL
Table 10. PowerSO-10™ Mechanical Data
millimeters
Typ
Symbol
Min
Max
A
A (*)
A1
B
B (*)
C
C (*)
D
D1
E
E2
E2 (*)
E4
E4 (*)
e
F
F (*)
H
3.35
3.4
3.65
3.6
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30
1.27
0.50
1.25
1.20
13.80
13.85
1.35
1.40
14.40
14.35
H (*)
h
L
L (*)
a
1.20
0.80
0º
1.80
1.10
8º
α (*)
2º
8º
Note: (*) Muar only POA P013P
Figure 12. PowerSO-10™ Package Dimensions
B
0.10
A B
10
H
E
E2
E4
1
SEATING
PLANE
DETAIL "A"
e
B
A
C
0.25
D
=
=
=
=
h
D1
SEATING
PLANE
A
F
A1
L
A1
DETAIL "A"
P095A
α
9/12
VN330SP(8932)
Figure 13. PowerSO-10™ Suggested Pad Layout And Tube Shipment (No Suffix)
CASABLANCA
MUAR
14.6 - 14.9
B
10.8 - 11
C
6.30
C
A
A
B
0.67 - 0.73
1
2
3
4
5
10
9
0.54 - 0.6
8
9.5
All dimensions are in mm.
Base Q.ty Bulk Q.ty Tube length (± 0.5)
7
1.27
6
A
B
C (± 0.1)
Casablanca
Muar
50
50
1000
1000
532
532
10.4 16.4
4.9 17.2
0.8
0.8
Figure 14. Tape And Reel Shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
600
600
330
1.5
13
20.2
24.4
60
G (+ 2 / -0)
N (min)
T (max)
30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
W
P0 (± 0.1)
P
24
4
Tape Hole Spacing
Component Spacing
Hole Diameter
24
D (± 0.1/-0) 1.5
Hole Diameter
D1 (min)
F (± 0.05)
K (max)
1.5
11.5
6.5
2
Hole Position
Compartment Depth
Hole Spacing
P1 (± 0.1)
End
All dimensions are in mm.
Start
Top
No components
500mm min
Components
No components
cover
tape
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
10/12
VN330SP(8932)
REVISION HISTORY
Table 11. Revision History
Date
Revision
Description of Changes
Sep-2004
1
- First Issue
11/12
VN330SP(8932)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics GROUP OF COMPANIES
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12/12
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