VNH7013XP-E [STMICROELECTRONICS]
Automotive integrated H-bridge; 汽车集成H桥
| 型号： | VNH7013XP-E |
| 厂家： | 
ST |
| 描述： | Automotive integrated H-bridge |
| 文件： | 总24页 (文件大小：768K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VNH7013XP-E
Automotive integrated H-bridge
Features
Type
RDS(on)
Iout
Vccmax
13 mΩ typ
(per leg)
VNH7013XP-E
40 A
72 V(1)
1. Per leg: sum of the two BV
(HSD + LSD);
dss
V
> 36 V whole bridge must be switched off;
CC
■ Maximum VCC voltage: 72 V
PowerSSO-36 TP
■ 10 V compatible inputs
■ RDS(on) per leg: 13 mΩ typical
■ Embedded thermal sensor: -8.1 mV/°K
■ Very low stray inductance in power line
Description
The VNH7013XP-E is an automotive integrated
H-bridge intended for a wide range of automotive
applications driving DC motors. The device
incorporates a dual channel and two single
channel MOSFETs. All the devices are designed
using STMicroelectronics® well known and
proven proprietary VIPower® M0-S7 technology
that allows to integrate in a package four different
channels in H-bridge topology.
This package, specifically designed for the harsh
automotive environment offers improved thermal
performance thanks to exposed die pads.
Moreover, its fully symmetrical mechanical design
allows superior manufacturability at board level.
Table 1.
Device summary
Package
Order codes
Tape and reel
Tube
PowerSSO-36 TP
VNH7013XP-E
VNH7013XPTR-E
January 2012
Doc ID 022370 Rev 3
1/24
www.st.com
1
Contents
VNH7013XP-E
Contents
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
PowerSSO-36 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1.1
Thermal calculation in clockwise and anti-clockwise operation in steady-
state mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.2
Thermal resistances definition (values according to the PCB heatsink
area) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1.3
3.1.4
Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Single pulse thermal impedance definition (values according to the PCB
heatsink area) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4
5
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
®
4.1
4.2
4.3
ECOPACK packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSSO-36 TP package information . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSSO-36 TP packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
Doc ID 022370 Rev 3
VNH7013XP-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin definitions and functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power on. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Gate resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching on HSD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching on LSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching off HSD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching off LSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal calculation in clockwise and anti-clockwise operation in steady-state mode . . . . 16
Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PowerSSO-36 TP mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Doc ID 022370 Rev 3
3/24
List of figures
VNH7013XP-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Single pulse maximum current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Gate charge vs gate-source voltage HS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Gate charge vs gate-source voltage LS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Capacitance variations HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Capacitance variations LS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal sensor voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Gate charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Test circuit for inductive load switching and diode recovery times . . . . . . . . . . . . . . . . . . . 13
Figure 11. Switching times test circuit for resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. PowerSSO-36 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . 16
Figure 15. PowerSSO-36 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 18
Figure 16. PowerSSO-36 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 18
Figure 17. Thermal fitting model of an H-bridge in PowerSSO-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 18. PowerSSO-36 TP package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 19. PowerSSO-36 TP tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 20. PowerSSO-36 TP tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4/24
Doc ID 022370 Rev 3
VNH7013XP-E
Block diagram and pin description
1
Block diagram and pin description
Figure 1.
Block diagram
Figure 2.
Configuration diagram
Gate 4
Gate 3
Drain3
Drain4
Source4
Source3
Source3
Source3
Source3
Source3
Drain3
Source4
Source4
Source4
Source4
Drain4
Source3
Source4
TSK-
TSA+
Source1
Source1
Drain1
Source2
Source2
Drain2
Source1
Source1
Source1
Source1
Gate 1
Source2
Source2
Source2
Drain M1,M2
Source2
Gate 2
Doc ID 022370 Rev 3
5/24
Block diagram and pin description
VNH7013XP-E
Table 2.
Pin definitions and functions
Pin number
Symbol
Function
1
2, 8
Gate 4
Drain 4
Source 4
TSA+
Gate of the LSD 4
Drain of the LSD 4
Source of the LSD 4
Thermal sensor anode
3, 4, 5, 6, 7, 9
10
11, 12, 14, 15,
16, 17
Source 2
Source of the HSD 2
13
18
19
Drain 2
Gate 2
Gate 1
Drain of the HSD 2
Gate of the HSD 2
Gate of the HSD 1
20, 21, 22, 23,
25, 26
Source 1
Source of the HSD 1
24
27
Drain 1
TSK-
Drain of the HSD 1
Thermal sensor cathode
28, 30, 31, 32,
33, 34
Source 3
Source of the LSD 3
29, 35
36
Drain 3
Gate 3
Drain of the LSD 3
Gate of the LSD 3
6/24
Doc ID 022370 Rev 3
VNH7013XP-E
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum rating
Table 3.
Symbol
VCC
Imax
Absolute maximum rating
Parameter
Value
Unit
Supply voltage (whole bridge switched off)
Maximum output current (continuous)
Maximum gate source voltage
Maximum Single Pulse output current
Junction operating temperature
Case operating temperature
72
40
V
A
VGS_max
IPulse_max
Tj
18
V
80(1)
A
175
°C
°C
°C
A
Tc
-40 to 150
-55 to 150
40
TSTG
IS
Storage temperature
Diode continuous forward current
1. Pulse duration = 20 ms (seeFigure 3).
Figure 3.
Single pulse maximum current
Doc ID 022370 Rev 3
7/24
Electrical specifications
VNH7013XP-E
2.2
Electrical characteristics
Tj = 25 °C, unless otherwise specified.
Table 4.
Symbol
Power off
Parameter
Test conditions
Min. Typ. Max. Unit
Drain-source breakdown
voltage
V(BR)DSS
ID = 10 mA, VGS = 0 V
36
—
V
VDS = 28 V;
-40 °C < Tj < 150 °C
—
—
—
100
10
µA
µA
Zero gate voltage drain
current (VGS=0V)
IDSS
VDS = 28 V; Tj = 25 °C
VGS = 10 V
Gate-source leakage current
(VDS=0V)
IGSS
100 nA
Table 5.
Symbol
Power on
Parameter
Test conditions
Min. Typ. Max. Unit
VGS(th)
Gate threshold voltage VDS = VGS; ID = 1 mA
2
4
V
Gate threshold voltage
VDS = VGS; ID = 1 mA
temperature derating
dVGS(th)/dT
7.5
5.7
mV/°C
V
GS = 10 V; ID = 5 A; Tj = 25 °C
mΩ
mΩ
mΩ
mΩ
Static drain-source on
resistance
RDS(on) HS
VGS = 10 V; ID = 5 A; Tj = 150 °C
VGS = 10 V; ID = 5 A; Tj = 25 °C
11.9
15.1
7.3
Static drain-source on
resistance
RDS(on) LS
VGS = 10 V; ID = 5 A; Tj = 150 °C
Table 6.
Symbol
Dynamic
Parameter
Test condition
Min. Typ. Max. Unit
(1)
Gfs_HS
Forward transconductance
Forward transconductance
—
—
—
—
—
—
—
—
20
17.5
1836
426
55
—
—
—
—
—
—
—
—
S
V
DS = 15 V; ID = 20 A;
(1)
Tj = 25 °C
Gfs_LS
S
Ciss_HS Input capacitance
pF
pF
pF
pF
pF
pF
VDS = 25 V; f = 1 MHz;
Coss_HS Output capacitance
Crss_HS Reverse transfer capacitance
Ciss_LS Input capacitance
VGS = 0 V (see Figure 6)
1250
311
49
VDS = 25 V; f = 1 MHz;
VGS = 0 V (see Figure 7)
Coss_LS Output capacitance
Crss_LS Reverse transfer capacitance
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%.
8/24
Doc ID 022370 Rev 3
VNH7013XP-E
Electrical specifications
Min. Typ. Max. Unit
Table 7.
Symbol
Gate resistance
Parameter
Test condition
RG_HS Gate resistance HS
—
—
20
13
—
—
Ω
Ω
VDD = 15 V; fgate = 1 MHz
RG_LS
Gate resistance LS
Table 8.
Symbol
Source drain diode
Parameter
Test conditions
Min.
Typ.
Max. Unit
ISD = 20 A; VGS = 0 V;
Tj = 25 °C
(1)
VSD
Forward on voltage
—
0.9
1.1
V
trr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
—
—
—
50
28
ns
nC
A
ISD = 20 A; di/dt = 100 A/µs;
Qrr
VDD = 20 V; Tj = 150 °C
(see Figure 10)
IRRM
0.8
1. Pulse width limited by safe operating area.
Table 9.
Symbol
Switching on HSD
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
tr
Turn on delay time
Rise time
—
—
—
—
—
53
319
36
8.5
5
—
—
—
—
—
ns
ns
V
DD = 15 V; ID = 20 A;
RG = 4.7 Ω; VGS = 10 V
Qg
Total gate charge
Gate-source charge
Gate-drain charge
nC
nC
nC
VDD = 15 V; ID = 20 A;
VGS = 10 V
(see Figure 4 and Figure 9)
Qgs
Qgd
Table 10. Switching on LSD
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
tr
Turn on delay time
Rise time
—
—
—
—
—
53
430
23
6
—
—
—
—
—
ns
ns
V
R
DD = 15 V; ID = 20 A;
G = 4.7 Ω; VGS = 10 V
Qg
Total gate charge
Gate-source charge
Gate-drain charge
nC
nC
nC
VDD = 15 V; ID = 20 A;
VGS = 10 V
(see Figure 5 and Figure 9)
Qgs
Qgd
2.5
Table 11. Switching off HSD
Symbol
td(off)
tf
Parameter
Turn-off delay time
Fall time
Test conditions
Min.
—
Typ.
253
169
Max. Unit
VDD = 15 V; ID = 20 A;
RG = 4.7 Ω; VGS = 10 V
(see Figure 11)
—
—
ns
ns
—
Doc ID 022370 Rev 3
9/24
Electrical specifications
VNH7013XP-E
Max. Unit
Table 12. Switching off LSD
Symbol
td(off)
tf
Parameter
Turn-off delay time
Fall time
Test conditions
Min.
—
Typ.
124
293
VDD = 15 V; ID = 20 A;
G = 4.7 Ω; VGS = 10 V
(see Figure 11)
—
—
ns
ns
R
—
Table 13. Thermal sensor(1)
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
Chain diode forward
voltage
Tj = 25 °C; IF = 250 µA
(see Figure 8)
VF
3.72
3.88
4.04
V
Chain temperature
coefficient
SF
-40 °C < Tj < 175 °C; IF = 250 µA
-8.1
mV/°K
1. See Figure 8.
Figure 4.
Gate charge vs gate-source voltage HS
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ꢄ
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$ ꢊ ꢁꢀ
)
ꢃ
ꢂ
ꢁ
ꢀ
ꢀ
ꢅꢀ
ꢁꢀ
1GꢇN#ꢈ
ꢆꢀ
ꢂꢀ
'!0'#&4ꢀꢀꢉꢀꢆ
10/24
Doc ID 022370 Rev 3
VNH7013XP-E
Figure 5.
Electrical specifications
Gate charge vs gate-source voltage LS
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ꢅꢀ
ꢄ
6$3 ꢊ ꢅꢉ6
$ ꢊ ꢁꢀ
)
ꢃ
ꢂ
ꢁ
ꢀ
ꢀ
ꢅꢀ
ꢁꢀ
ꢆꢀ
1GꢇN#ꢈ
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Figure 6.
Capacitance variations HS
ꢉꢀꢀꢀ
ꢂꢉꢀꢀ
ꢂꢀꢀꢀ
ꢆꢉꢀꢀ
ꢆꢀꢀꢀ
ꢁꢉꢀꢀ
ꢁꢀꢀꢀ
ꢅꢉꢀꢀ
ꢅꢀꢀꢀ
ꢉꢀꢀ
F ꢊꢅ-HZ
6GS ꢊ ꢀ
#ISS
#OSS
#RSS
ꢀ
ꢀ
ꢅꢀ
ꢁꢀ
ꢆꢀ
6DSꢇ6ꢈ
'!0'#&4ꢀꢀꢉꢀꢉ
Doc ID 022370 Rev 3
11/24
Electrical specifications
Figure 7.
VNH7013XP-E
Capacitance variations LS
ꢆꢉꢀꢀ
ꢆꢀꢀꢀ
ꢁꢉꢀꢀ
ꢁꢀꢀꢀ
ꢅꢉꢀꢀ
ꢅꢀꢀꢀ
ꢉꢀꢀ
F ꢊꢅ-HZ
6GS ꢊ ꢀ
#ISS
#OSS
#RSS
ꢀ
ꢀ
ꢅꢀ
ꢁꢀ
ꢆꢀ
6DSꢇ6ꢈ
'!0'#&4ꢀꢀꢉꢀꢃ
Figure 8.
Thermal sensor voltage vs temperature
ꢃꢋꢀꢀꢀ
ꢉꢋꢉꢀꢀ
ꢉꢋꢀꢀꢀ
ꢂꢋꢉꢀꢀ
ꢅꢀꢀU!
ꢁꢀꢀU!
ꢆꢀꢀU!
ꢂꢀꢀU!
ꢉꢀꢀU!
ꢂꢋꢀꢀꢀ
ꢆꢋꢉꢀꢀ
ꢆꢋꢀꢀꢀ
ꢁꢋꢉꢀꢀ
ꢁꢋꢀꢀꢀ
6F?TH?6
ꢌꢂꢀ #
ꢁꢉ #
ꢄꢉ #
ꢅꢁꢉ #
ꢅꢉꢀ #
'!0'#&4ꢀꢀꢉꢁꢅ
12/24
Doc ID 022370 Rev 3
VNH7013XP-E
Figure 9.
Electrical specifications
Gate charge test circuit
Figure 10. Test circuit for inductive load switching and diode recovery times
Doc ID 022370 Rev 3
13/24
Electrical specifications
Figure 11. Switching times test circuit for resistive load
VNH7013XP-E
14/24
Doc ID 022370 Rev 3
VNH7013XP-E
Package and PCB thermal data
3
Package and PCB thermal data
3.1
PowerSSO-36 thermal data
Figure 12. PowerSSO-36 PC board
Double layers: footprint
2
Double layers: 2cm of Cu
2
Double layers: 8cm of Cu
2
2
Four layers: Cu on top layer: 16 cm ; Cu on bottom layer: 32 cm ; Cu on middle layer: total coverage
Doc ID 022370 Rev 3
15/24
Package and PCB thermal data
Figure 13. Chipset configuration
VNH7013XP-E
5WK$
$IJQꢄꢅ
5WK$%
5WK$&
$IJQꢄꢆ $IJQꢄꢇ
5WK%
5WK&
5WK%&
("1($'5ꢀꢀꢁꢂꢃ
Figure 14. Auto and mutual Rthj-amb vs PCB copper area in open box free air
condition
ꢄꢀ
2TH!
2TH" ꢊ 2TH#
ꢍꢀ
2TH!" ꢊ 2TH!#
ꢃꢀ
ꢉꢀ
ꢂꢀ
ꢆꢀ
ꢁꢀ
ꢅꢀ
ꢀ
2TH"#
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅꢀ
ꢅꢁ
CMꢁ OF #U !REA ꢇREFER TO 0#" LAYOUTꢈ
'!0'#&4ꢀꢀꢂꢄꢄ
Note: Referred to double layer PCB
3.1.1
Thermal calculation in clockwise and anti-clockwise operation in
steady-state mode
Table 14. Thermal calculation in clockwise and anti-clockwise operation in steady-
state mode
HSA HSB LSA LSB
TjHSAB
TjLSA
TjLSB
PdHSA x RthHS + PdLSB PdHSA x RthHSLS
+
PdHSA x RthHSLS + PdLSB
ON OFF OFF ON
x RthHSLS + Tamb
PdLSB x RthLSLS + Tamb x RthLS + Tamb
PdHSB x RthHS + PdLSA PdHSB x RthHSLS
+
PdHSB x RthHSLS + PdLSA
x RthLSLS + Tamb
OFF ON ON OFF
x RthHSLS + Tamb
PdLSA x RthLS + Tamb
16/24
Doc ID 022370 Rev 3
VNH7013XP-E
Package and PCB thermal data
3.1.2
Thermal resistances definition (values according to the PCB heatsink
area)
R
thHS = RthHSA = RthHSB = High Side Chip Thermal Resistance Junction to Ambient (HSA or
HSB in ON state)
R
R
thLS = RthLSA = RthLSB = Low Side Chip Thermal Resistance Junction to Ambient
thHSLS = RthHSALSB = RthHSBLSA = Mutual Thermal Resistance Junction to Ambient
between High Side and Low Side Chips
R
thLSLS = RthLSALSB = Mutual Thermal Resistance Junction to Ambient between Low Side
Chips
(a)
3.1.3
3.1.4
Thermal calculation in transient mode
T
T
T
jHSAB = ZthHS x PdHSAB + ZthHSLS x (PdLSA + PdLSB) + Tamb
jLSA = ZthHSLS x PdHSAB + ZthLS x PdLSA + ZthLSLS x PdLSB + Tamb
jLSB = ZthHSLS x PdHSAB + ZthLSLS x PdLSA + ZthLS x PdLSB + Tamb
Single pulse thermal impedance definition (values according to the
PCB heatsink area)
Z
Z
Z
thHS = High Side Chip Thermal Impedance Junction to Ambient
thLS = ZthLSA = ZthLSB = Low Side Chip Thermal Impedance Junction to Ambient
thHSLS = ZthHSABLSA = ZthHSABLSB = Mutual Thermal Impedance Junction to Ambient
between High Side and Low Side Chips
Z
thLSLS = ZthLSALSB = Mutual Thermal Impedance Junction to Ambient between Low Side
Chips
Equation 1: pulse calculation formula
Z
= R
Þ δ + Z
(1 – δ)
THtp
THδ
where
TH
δ = t ⁄ T
p
a. Calculation is valid in any dynamic operating condition. P values set by user.
d
Doc ID 022370 Rev 3
17/24
Package and PCB thermal data
VNH7013XP-E
Figure 15. PowerSSO-36 HSD thermal impedance junction ambient single pulse
:4( ꢌ(3$ CU AREA
ꢅꢀꢀ
ꢅꢀ
ꢅ
(3$ꢌFOOTPRINT
(3$ꢌꢁ CM>ꢁ #U
(3$ꢌꢄ CM>ꢁ #U
(3$ꢌꢂ ,AYE R
(S,S$ ꢌFOOTPRINT
(S,S$ ꢌꢁ CM>ꢁ #U
(S,S$ ꢌꢄ CM>ꢁ #U
(S,S$ ꢌꢂ ,AYE R
:
HS
:
HSLS
ꢀꢋꢅ
ꢀꢋꢀꢅ
ꢀꢋꢅ
ꢅ
ꢅꢀ
ꢅꢀꢀ
ꢅꢀꢀꢀ
TIME ꢇSECꢈ
'!0'#&4ꢀꢀꢂꢄꢏ
Figure 16. PowerSSO-36 LSD thermal impedance junction ambient single pulse
:4( ꢌ,3$ CU AREA
ꢅꢀꢀ
,3$ꢌFOOTPRINT
,3$ꢌꢁ CM>ꢁ #U
,3$ꢌꢄ CM>ꢁ #U
,3$ꢌꢂ ,AYE R
,S,S$ ꢌFOOTPRINT
,S,S$ ꢌꢁ CM>ꢁ #U
,S,S$ ꢌꢄ CM>ꢁ #U
,S,S$ ꢌꢂ ,AYE R
ꢅꢀ
:
LS
:
LSLS
ꢅ
ꢀꢋꢅ
ꢀꢋꢀꢅ
ꢀꢋꢅ
ꢅ
ꢅꢀ
ꢅꢀꢀ
ꢅꢀꢀꢀ
TIME ꢇSECꢈ
'!0'#&4ꢀꢀꢂꢏꢀ
18/24
Doc ID 022370 Rev 3
VNH7013XP-E
Package and PCB thermal data
Figure 17. Thermal fitting model of an H-bridge in PowerSSO-36
Table 15. Thermal parameters(1)
Area/island (cm2)
Footprint
2
8
4L
R1 = R7 (°C/W)
R2 = R8 (°C/W)
R3 (°C/W)
0.2
1.6
8
R4 (°C/W)
30
16
22
28
16
12
10
10
5
R5 (°C/W)
40
R6 (°C/W)
36
6
R9 = R15 (°C/W)
R10 = R16 (°C/W)
R11 = R17 (°C/W)
R12 = R18 (°C/W)
R13 = R19 (°C/W)
R14 = R20 (°C/W)
R21 = R22 (°C/W)
R23 (°C/W)
0.1
2.8
22
14
30
36
32
60
50
14
30
28
26
50
45
14
20
16
18
40
30
49
52
50
80
80
C1 = C7 = C9 = C15 (W.s/°C)
C2 = C8 (W.s/°C)
C3 (W.s/°C)
0.001
0.009
0.09
0.5
0.8
5
C4 (W.s/°C)
0.8
1.4
6
0.8
2
0.8
3
C5 (W.s/°C)
C6 (W.s/°C)
8
10
C10 = C16 (W.s/°C)
C11 = C17 (W.s/°C)
C12 = C18 (W.s/°C)
C13 = C19 (W.s/°C)
C14 = C20 (W.s/°C)
C21 = C22 = C23 (W.s/°C)
0.1
0.07
0.45
0.8
4
0.45
1
0.45
1.2
0.6
2.5
5
6
8
0.01
0.006
0.005
0.005
1. The blank space means that the value is the same as the previous one.
Doc ID 022370 Rev 3
19/24
Package and packing information
VNH7013XP-E
4
Package and packing information
®
4.1
ECOPACK packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.2
PowerSSO-36 TP package information
Figure 18. PowerSSO-36 TP package dimensions
20/24
Doc ID 022370 Rev 3
VNH7013XP-E
Package and packing information
Table 16. PowerSSO-36 TP mechanical data
Millimeters
Typ.
Symbol
Min.
2.15
2.15
0
Max.
2.47
2.40
0.1
A
A2
a1
b
0.18
0.23
10.10
7.4
0.36
0.32
10.50
7.6
c
D
E
e
0.5
8.5
2.3
e3
F
G
0.1
10.5
0.4
H
10.1
h
k
0 deg
0.6
8 deg
1
L
M
N
4.3
10 deg
O
1.2
0.8
Q
S
2.9
T
3.65
1.0
U
X1
Y1
X2
Y2
X3
Y3
Z1
Z2
1.85
3
2.35
3.5
1.85
3
2.35
3.5
4.7
3
5.2
3.5
0.4
0.4
Doc ID 022370 Rev 3
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Package and packing information
VNH7013XP-E
4.3
PowerSSO-36 TP packing information
Figure 19. PowerSSO-36 TP tube shipment (no suffix)
Base Qty
Bulk Qty
Tube length ( 0.5)
49
1225
532
3.5
C
B
A
B
13.8
0.6
C ( 0.1)
All dimensions are in mm.
A
Figure 20. PowerSSO-36 TP tape and reel shipment (suffix “TR”)
Reel dimensions
Base Qty
Bulk Qty
A (max)
B (min)
C ( 0.2)
F
1000
1000
330
1.5
13
20.2
24.4
100
30.4
G (+2 / -0)
N (min)
T (max)
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
W
24
4
Tape Hole Spacing
Component Spacing
Hole Diameter
P0 ( 0.1)
P
12
D ( 0.05)
D1 (min)
F ( 0.1)
K (max)
P1 ( 0.1)
1.55
1.5
11.5
2.85
2
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
End
All dimensions are in mm.
Start
Top
cover
tape
No components Components
500mm min
No components
500mm min
Empty components pockets
sealed with cover tape.
User direction of feed
22/24
Doc ID 022370 Rev 3
VNH7013XP-E
Revision history
5
Revision history
Table 17. Document revision history
Date
Revision
Changes
07-Nov-2011
18-Jan-2012
20-Jan-2012
1
2
3
Initial release
Changed document status from preliminary data to datasheet.
Updated features list.
Doc ID 022370 Rev 3
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VNH7013XP-E
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Doc ID 022370 Rev 3
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