TN2640N3-GP005 [SUPERTEX]

Small Signal Field-Effect Transistor;
TN2640N3-GP005
型号: TN2640N3-GP005
厂家: Supertex, Inc    Supertex, Inc
描述:

Small Signal Field-Effect Transistor

输入元件 开关 晶体管
文件: 总8页 (文件大小:815K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Supertex inc.  
TN2640  
N-Channel Enhancement-Mode  
Vertical DMOS FETs  
Features  
General Description  
This low threshold enhancement-mode (normally-off)  
transistor utilizes a vertical DMOS structure and Supertex’s  
well-proven silicon-gate manufacturing process. This  
combination produces a device with the power handling  
capabilities of bipolar transistors and with the high input  
impedance and positive temperature coefficient inherent  
in MOS devices. Characteristic of all MOS structures, this  
device is free from thermal runaway and thermally induced  
secondary breakdown.  
Low threshold (2.0V max.)  
High input impedance  
Low input capacitance  
Fast switching speeds  
Low on-resistance  
Free from secondary breakdown  
Low input and output leakage  
Applications  
Logic level interfaces - ideal for TTL and CMOS  
Supertex’s vertical DMOS FETs are ideally suited to a  
wide range of switching and amplifying applications where  
very low threshold voltage, high breakdown voltage, high  
input impedance, low input capacitance, and fast switching  
speeds are desired.  
Solid state relays  
Battery operated systems  
Photo voltaic drives  
Analog switches  
General purpose line drivers  
Telecom switches  
Ordering Information  
Product Summary  
RDS(ON)  
ID(ON)  
VGS(th)  
(max)  
Part Number  
Package Option  
Packing  
BVDSS/BVDGS  
(max)  
(min)  
TN2640K4-G  
TO-252 (D-PAK)  
8-Lead SOIC  
2000/Reel  
2500/Reel  
1000/Bag  
400V  
5.0Ω  
2.0A  
2.0V  
TN2640LG-G  
TN2640N3-G  
3-Lead TO-92  
Pin Configuration  
TN2640N3-G P002  
TN2640N3-G P003  
DRAIN  
DRAIN  
DRAIN  
DRAIN  
DRAIN  
TN2640N3-G P005 3-Lead TO-92  
TN2640N3-G P013  
2000/Reel  
GATE  
SOURCE  
N/C  
N/C  
SOURCE  
GATE  
TN2640N3-G P015  
TO-252 (D-PAK)  
8-Lead SOIC  
For packaged products, -G indicates package is RoHS compliant (‘Green’).  
TO-92 taping specifications and winding styles per EIA-468 Standard.  
Devices in Wafer / Die form are RoHS compliant (‘Green’).  
Refer to Die Specification VF57 for layout and dimensions.  
DRAIN  
GATE  
Absolute Maximum Ratings  
Parameter  
SOURCE  
Value  
Drain-to-source voltage  
Drain-to-gate voltage  
Gate-to-source voltage  
Operating and storage temperature  
BVDSS  
BVDGS  
TO-92  
Typical Thermal Resistance  
±20V  
Package  
θja  
-55°C to +150°C  
TO-252 (D-PAK)  
8-Lead SOIC  
TO-92  
81OC/W  
101OC/W  
132OC/W  
Absolute Maximum Ratings are those values beyond which damage to the device  
may occur. Functional operation under these conditions is not implied. Continuous  
operation of the device at the absolute rating level may affect device reliability. All  
voltages are referenced to device ground.  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
TN2640  
Product Marking  
YY = Year Sealed  
YY = Year Sealed  
WW = Week Sealed  
L = Lot Number  
Si YYWW  
TN2640  
LLLLLLL  
YYWW  
WW = Week Sealed  
L = Lot Number  
N2640  
LLLL  
= “Green” Packaging  
= “Green” Packaging  
Package may or may not include the following marks: Si or  
Package may or may not include the following marks: Si or  
TO-252 (D-PAK)  
8-Lead SOIC  
YY = Year Sealed  
WW = Week Sealed  
= “Green” Packaging  
SiTN  
2 6 4 0  
YYWW  
Package may or may not include the following marks: Si or  
TO-92  
Thermal Characteristics  
ID  
ID  
Power Dissipation  
Package  
IDR  
IDRM  
(continuous)†  
500mA  
(pulsed)  
@TA = 25OC  
TO-252 (D-PAK)  
8-Lead SOIC  
3.0A  
2.0A  
2.0A  
2.5W‡  
1.3W‡  
0.74W  
500mA  
260mA  
220mA  
3.0A  
2.0A  
2.0A  
260mA  
TO-92  
220mA  
Notes:  
ID (continuous) is limited by max rated Tj.  
Mounted on FR4 board, 25mm x 25mm x 1.57mm  
Electrical Characteristics (TA = 25°C unless otherwise specified)  
Sym  
BVDSS  
VGS(th)  
Parameter  
Min  
Typ  
Max  
-
Units Conditions  
Drain-to-source breakdown voltage  
Gate threshold voltage  
400  
-
-
V
V
VGS = 0V, ID = 1.0mA  
VGS = VDS, ID = 2.0mA  
0.8  
2.0  
-4.0  
100  
10  
ΔVGS(th) Change in VGS(th) with temperature  
-
-
-
-2.5  
mV/OC VGS = VDS, ID = 2.0mA  
IGSS  
Gate body leakage  
nA  
µA  
VGS = ±20V, VDS = 0V  
-
-
VGS = 0V, VDS = Max rating  
IDSS  
Zero gate voltage drain current  
VDS = 0.8 Max Rating,  
VGS = 0V, TA = 125OC  
-
1.0  
mA  
A
1.5  
3.5  
4.0  
3.2  
3.0  
-
-
-
VGS = 5.0V, VDS = 25V  
VGS = 10V, VDS = 25V  
VGS = 4.5V, ID = 500mA  
VGS = 10V, ID = 500mA  
VGS = 10V, ID = 500mA  
ID(ON)  
On-state drain current  
2.0  
-
5.0  
5.0  
0.75  
-
Static drain-to-source  
on-state resistance  
RDS(ON)  
Ω
-
ΔRDS(ON) Change in RDS(ON) with temperature  
-
%/OC  
GFS  
CISS  
COSS  
CRSS  
Forward transconductance  
Input capacitance  
200  
330  
210  
30  
mmho VDS = 25V, ID = 100mA  
-
-
-
225  
50  
15  
VGS = 0V,  
Common source output capacitance  
Reverse transfer capacitance  
pF  
VDS = 25V,  
f = 1.0MHz  
8.0  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
2
TN2640  
Electrical Characteristics (TA = 25°C unless otherwise specified)  
Sym  
td(ON)  
tr  
Parameter  
Min  
Typ  
4.0  
15  
20  
22  
-
Max  
15  
20  
25  
27  
0.9  
-
Units Conditions  
Turn-on delay time  
Rise time  
-
-
-
-
-
-
VDD = 25V,  
ns  
ID = 2.0A,  
td(OFF)  
tf  
Turn-off delay time  
Fall time  
RGEN = 25Ω  
VSD  
Diode forward voltage drop  
Reverse recovery time  
V
VGS = 0V, ISD = 200mA  
VGS = 0V, ISD = 1.0A  
trr  
300  
ns  
Notes:  
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)  
2. All A.C. parameters sample tested.  
N- Channel Switching Waveforms and Test Circuit  
10V  
VDD  
90%  
INPUT  
0V  
Pulse  
RL  
10%  
Generator  
OUTPUT  
t(ON)  
td(ON)  
t(OFF)  
td(OFF)  
RGEN  
tf  
tr  
VDD  
OUTPUT  
0V  
INPUT  
D.U.T.  
10%  
10%  
90%  
90%  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
3
TN2640  
Typical Performance Curves  
BVDSS Variation with Temperature  
On-Resistance vs. Drain Current  
10  
8
1.15  
VGS = 5.0V  
1.10  
1.05  
1.00  
0.95  
0.90  
V
GS = 10V  
6
4
2
0
-50  
0
50  
100  
150  
0
1.0  
2.0  
3.0  
4.0  
5.0  
Tj (OC)  
ID (amperes)  
V(th) and RDS Variation with Temperature  
Transfer Characteristics  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
2.2  
1.8  
1.4  
-1.0  
0.6  
0.2  
3.0  
2.4  
1.8  
1.2  
0.6  
0
25OC  
V(th) @ 2.0mA  
125OC  
TA = -55OC  
VDS = -25V  
RDS(ON) @ 10V, 0.5A  
0
2
4
6
8
10  
-50  
0
50  
100  
150  
VGS (volts)  
Tj (OC)  
Capacitance vs. Drain-to-Source Voltage  
Gate Drive Dynamic Characteristics  
10  
8
400  
f = 1MHz  
300  
653pF  
6
VDS = 10V  
200  
4
CISS  
VDS = 40V  
100  
2
COSS  
253pF  
CRSS  
0
0
0
10  
20  
30  
40  
0
1
2
3
4
5
QG (nanocoulombs)  
VDS (volts)  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
4
TN2640  
Typical Performance Curves (cont.)  
Output Characteristics  
Saturation Characteristics  
5.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
VGS = 10V  
8V  
6V  
4V  
4.0  
VGS = 10V  
8V  
6V  
4V  
3.0  
2.0  
1.0  
0
3V  
3V  
2V  
2V  
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
VDS (volts)  
VDS (volts)  
Transconductance vs. Drain Current  
Power Dissipation vs. Temperature  
2.0  
1.6  
1.2  
0.8  
0.4  
0
3.0  
2.4  
1.8  
1.2  
0.6  
0
VDS = 25V  
DPAK  
SO-8  
TA = -55OC  
25OC  
TO-92  
125OC  
0
1.0  
2.0  
3.0  
4.0  
5.0  
0
25  
50  
75  
100  
125  
150  
TC (OC)  
ID (amperes)  
Maximum Rated Safe Operating Area  
Thermal Response Characteristics  
10  
1.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0
TO-92 (pulsed)  
DPAK (DC)  
SO-8 (pulsed)  
TO-92 (DC)  
0.1  
SO-8 (DC)  
0.01  
0.001  
TO-92  
PD = 1W  
TC = 25OC  
TC = 25OC  
0
1.0  
100  
1000  
0.001  
0.01  
0.1  
1.0  
10  
VDS (volts)  
tP (seconds)  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
5
TN2640  
3-Lead TO-252 D-PAK Package Outline (K4)  
b3  
A
E
c2  
E1  
L3  
4
θ1  
D1  
H
D
L4  
1
2
3
L5  
Note 1  
View B  
b2  
b
e
Front View  
Rear View  
Side View  
Gauge  
Plane  
A1 Seating  
Plane  
L2  
θ
L
L1  
View B  
Note:  
1. Although 4 terminal locations are shown, only 3 are functional. Lead number 2 was removed.  
θ
0O  
-
Symbol  
A
A1  
.086 .000* .025 .030 .195 .018 .235 .205 .250 .170  
.240  
b
b2  
b3  
c2  
D
D1  
E
E1  
e
H
L
L1  
L2  
L3  
L4  
L5  
θ1  
0O  
-
MIN  
.370 .055  
.060  
.410 .070  
.035 .025* .045  
Dimen-  
sion  
(inches)  
.090  
BSC  
.108 .020  
REF BSC  
NOM  
-
-
-
-
-
-
-
-
-
-
-
-
-
MAX .094 .005 .035 .045 .215 .035 .245 .217* .265 .182*  
.050 .040 .060 10O 15O  
JEDEC Registration TO-252, Variation AA, Issue E, June 2004.  
* This dimension is not specified in the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc. #: DSPD-3TO252K4, Version E041309.  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
6
TN2640  
8-Lead SOIC (Narrow Body) Package Outline (LG)  
4.90x3.90mm body, 1.75mm height (max), 1.27mm pitch  
θ1  
D
8
Note 1  
(Index Area  
D/2 x E1/2)  
E1  
E
Gauge  
Plane  
L2  
Seating  
Plane  
L
θ
1
L1  
Top View  
View B  
View B  
Note 1  
h
A
h
A2  
A
Seating  
Plane  
A1  
e
b
A
Side View  
View A-A  
Note:  
1. This chamfer feature is optional. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier;  
an embedded metal marker; or a printed indicator.  
Symbol  
A
A1  
A2  
b
D
E
E1  
e
h
L
L1  
L2  
θ
0O  
-
θ1  
5O  
-
MIN 1.35* 0.10 1.25 0.31 4.80* 5.80* 3.80*  
NOM 4.90 6.00 3.90  
MAX 1.75 0.25 1.65* 0.51 5.00* 6.20* 4.00*  
0.25 0.40  
Dimension  
(mm)  
1.27  
BSC  
1.04 0.25  
REF BSC  
-
-
-
-
-
-
0.50 1.27  
8O  
15O  
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.  
* This dimension is not specified in the JEDEC drawing.  
Drawings are not to scale.  
Supertex Doc. #: DSPD-8SOLGTG, Version I041309.  
Doc.# DSFP-TN2640  
C071913  
Supertex inc.  
www.supertex.com  
7
TN2640  
3-Lead TO-92 Package Outline (N3)  
D
A
Seating  
Plane  
1
2
3
L
c
b
e1  
e
Side View  
Front View  
E
E1  
1
3
2
Bottom View  
Symbol  
A
.170  
-
b
.014†  
-
c
D
.175  
-
E
.125  
-
E1  
.080  
-
e
e1  
.045  
-
L
.500  
-
MIN  
NOM  
MAX  
.014†  
-
.095  
-
Dimensions  
(inches)  
.210  
.022†  
.022†  
.205  
.165  
.105  
.105  
.055  
.610*  
JEDEC Registration TO-92.  
* This dimension is not specified in the JEDEC drawing.  
† This dimension differs from the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc.#: DSPD-3TO92N3, Version E041009.  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline  
information go to http://www.supertex.com/packaging.html.)  
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives  
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability  
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and  
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)  
©2013 Supertex inc.All rights reserved. Unauthorized use or reproduction is prohibited.  
Supertex inc.  
1235 Bordeaux Drive, Sunnyvale, CA 94089  
Tel: 408-222-8888  
www.supertex.com  
Doc.# DSFP-TN2640  
C071913  
8

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