C1-6N2S-10 [SUPERWORLD]

CERAMIC CHIP INDUCTORS;


型号：	C1-6N2S-10
厂家：	SUPERWORLD ELECTRONICS
描述：	CERAMIC CHIP INDUCTORS
文件：	总8页 (文件大小：384K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CERAMIC CHIP INDUCTORS

C1 SERIES

1. PART NO. EXPRESSION :

(a) Series code

(d) 10: Standard

C 1 - 1 N 0 S - □□

(c)

(a)

(b)

(d)

(b) Inductance code : 1N0 = 1.0nH

11 ~ 99 : Internal control number

2. C0NFIGURATION & DIMENSIONS :

Recommended PC Board Pattern

Unit:m/m

1.00± 0.05 0.50± 0.05 0.50± 0.05 0.25± 0.10 0.45~0.55 0.45~0.55

1.50

3. SCHEMATIC :

4. MATERIALS :

Ag(100%)

(a) Body : ceramic ( Pb Free )

(b) Termination : ( Pb Free )

Ni(100%)-1.5um(min.)

Sn(100%)-3.0um(min.)

5. GENERAL SPECIFICATION :

a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )

b) Storage condition (component in its packaging)

i) Temperature : -10 to 40° C

ii) Humidity : 60%

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 1

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

6. ELECTRICAL CHARACTERISTICS :

SRF

DC Resistance

Rated Current

(mA) Max

Inductance

(nH)

Test Frequency

( MHz )

Q(Typ.) Frequency(MHz)

( Ω )

( MHz )

Min

Part Number

Min

100 300 500 800 1000

Typ.

0.04

Max.

Typ.

10000 >13000

6000 >13000

0.08

0.09

0.10

0.12

0.13

0.16

0.20

0.21

0.20

0.21

0.23

0.25

0.28

0.30

0.31

0.40

0.46

0.55

0.60

0.70

0.80

0.90

1.00

1.20

1.30

1.50

300

C1-1N0S-10

C1-1N2S-10

C1-1N5S-10

C1-1N8S-10

C1-2N0S-10

C1-2N2S-10

C1-2N4S-10

C1-2N7S-10

C1-3N0S-10

C1-3N3S-10

C1-3N6S-10

C1-3N9S-10

C1-4N3S-10

C1-4N7S-10

C1-5N1S-10

C1-5N6S-10

C1-6N2S-10

C1-6N8□-10

C1-7N5□-10

C1-8N2□-10

C1-9N1□-10

C1-10N□-10

C1-12N□-10

C1-15N□-10

C1-18N□-10

C1-22N□-10

C1-27N□-10

C1-33N□-10

C1-39N□-10

C1-47N□-10

C1-56N□-10

C1-68N□-10

C1-82N□-10

C1-R10□-10

1.0

1.2

1.5

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

100

0.04

0.05

0.06

0.07

0.08

0.09

0.10

0.11

0.12

0.13

0.15

0.16

0.17

0.18

0.21

0.22

0.23

0.28

0.31

0.35

0.42

0.47

0.50

0.52

0.58

0.61

0.70

0.81

0.94

6000

5000

4000

11000

10500

10000

9500

9000

8500

8000

7500

7000

6500

6000

300

4000

3900

5800

5700

5600

300

200

180

150

3900

3700

3600

3400

3200

2700

2300

2100

1900

1600

1300

1200

1000

750

5500

5200

4900

4500

4300

3900

3500

3100

2800

2300

1900

1700

1500

1300

1200

1100

1000

750

600

100

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 2

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

SRF

DC Resistance

Rated Current

(mA) Max

Inductance

(nH)

Test Frequency

( MHz )

Q(Typ.) Frequency(MHz)

( Ω )

( MHz )

Part Number

Min

100 300 500 800 1000

Max.

Typ.

1.10

2.57

2.97

3.29

3.92

Min

Typ.

800

150

140

130

120

110

600

550

500

450

400

1.60

3.20

3.70

4.20

4.80

C1-R12□-10

C1-R15□-10

C1-R18□-10

C1-R22□-10

C1-R27□-10

120

150

180

220

270

100

920

810

700

600

Inductance Tolerence : □

J=± 5%

K=± 10%

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 3

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

7. CHARACTERISTICS CURVES :

Impedance v.s. Frequency Characteristics

HCI100 5F Z VS Freq.

10000

1000

100n

100

47n

22n

10n

6.8n

0. 1

100

1 000

10000

FREQUENCY(MHz)

Inductance v.s. Frequency Characteristics

HCI1005F L VS Freq.

1000

100n

100

47n

22n

10n

6.8n

100

1000

1 0000

FREQUENCY(MHz)

Q v.s. Frequency Characteristics

HCI1005F Q VS Freq.

100

6.8n

10n

22n

47n

100n

100

1000

10000

FREQUENCY(MHz)

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

CERAMIC CHIP INDUCTORS

C1 SERIES

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

Unit:m/m

1.50

0.45~0.55

PC board should be designed so that products can prevent damage from

mechanical stress when warping the board.

8-2. Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering

cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Note.

If wave soldering is used ,there will be some risk.

Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

8-2.1 Lead Free Solder Re-flow :

Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)

8-2.2 Soldering Iron :

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a

soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Note :

d) 1.0mm tip diameter (max)

a) Preheat circuit and products to 150° C.

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

b) 350° C tip temperature for Ferrite chip bead (max)

c) Never contact the ceramic with the iron tip

Preheating

Soldering

20~40s

Natural

cooling

Preheating

Soldering

Natural

cooling

350

150

TP(260° C/40s max.)

217

200

150

60~150s

60~180s

480s max.

Gradual

Cooling

Time(sec.)

Over 60s.

Figure 1. Re-flow Soldering:3 times max

Within4~5s

Figure 2. Wave Soldering:1 times max

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 5

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

8-3. Solder Volume

Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume

may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.

Minimum fillet height = soldering thickness + 25% product height

Upper limit

ReC0mmendable

Figure 3

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 6

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

9. PACKAGING INFORMATION :

9-1. Reel Dimension

2± 0.5

R1.9

120°

13.5± 0.5

R10.5

R0.5

7" x 8mm

Type

A(mm)

B(mm)

60± 2

C(mm)

D(mm)

7" x 8mm

9.0± 0.5

13.5± 0.5 178.0± 2.0

9-2 Tape Dimension / 8mm

Material : Paper

D:1.56+0.1-0.05

Po:4± 0.1

P2:2± 0.10

Size

Bo(mm)

Ao(mm)

Ko(mm)

P(mm)

t(mm)

1.15± 0.10 0.65± 0.10 0.80 max

2.0± 0.05

0.80 max

9-3. Packaging Quantity

Chip Size

Chip / Reel

Inner Box

Middle Box

Carton

10000

50000

250000

500000

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 7

SUPERWORLD ELECTRONICS (S) PTE LTD

CERAMIC CHIP INDUCTORS

C1 SERIES

9-4. Tearing Off Force

The force for tearing off cover tape is 15 to 60 grams

in the arrow direction under the following conditions.

165° C to 180° C

Room Temp.

(° C)

Room Humidity

(%)

Room atm Tearing Speed

Top cover tape

(hPa)

(mm/min)

5~35

45~85

860~1060

300

Base tape

Application Notice

1. Storage Conditions :

To maintain the solderabililty of terminal electrodes :

a) Recommended products should be used within 12 months from the time of delivery.

b) The packaging material should be kept where no chlorine or sulfur exists in the air.

2. Transportation :

a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.

b) The use of tweezers or vacuum pick up is strongly recommended for individual components.

c) Bulk handling should ensure that abrasion and mechanical shock are minimized.

NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.

26.01.2015

PG. 8

SUPERWORLD ELECTRONICS (S) PTE LTD

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