C2-56NJ-10 [SUPERWORLD]

CERAMIC CHIP INDUCTORS; 陶瓷片式电感器
C2-56NJ-10
型号: C2-56NJ-10
厂家: SUPERWORLD ELECTRONICS    SUPERWORLD ELECTRONICS
描述:

CERAMIC CHIP INDUCTORS
陶瓷片式电感器

电感器
文件: 总7页 (文件大小:378K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CERAMIC CHIP INDUCTORS  
C2 SERIES  
1. PART NO. EXPRESSION :  
(a) Series code  
(d) 10 : Lead Free  
C 2 - 1 N 0 S - 1 0  
(b) Inductance code : 1N0 = 1.0nH  
(c) Tolerance code : S = ±0.3nH, J = ±5%  
(a)  
(b) (c) (d)  
2. CONFIGURATION & DIMENSIONS :  
A
D
B
Unit:m/m  
D
A
B
C
1.6±0.15 0.8±0.15 0.8±0.15 0.2 ~ 0.6  
3. GENERAL SPECIFICATION :  
a) Operating temp. : -40°C to +85°C  
b) Storage temp. : -10°C to +40°C  
c) Humdity range : 70% RH Max.  
d) Resistance to solder heat : 265°C.6secs  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 1  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
6. ELECTRICAL CHARACTERISTICS :  
Test  
Frequency  
( MHz )  
SRF  
( GHz )  
Min.  
DCR  
( ȍ )  
Max.  
Rated Current  
( mA )  
EIA  
Size  
Inductance  
( nH )  
Q
Min.  
Part Number  
Max.  
C2-1N0S-10  
C2-1N2S-10  
C2-1N5S-10  
C2-1N8S-10  
C2-2N2S-10  
C2-2N7S-10  
C2-3N3S-10  
C2-3N9S-10  
C2-4N7S-10  
C2-5N6S-10  
C2-6N8J-10  
C2-8N2J-10  
C2-10NJ-10  
C2-12NJ-10  
C2-15NJ-10  
C2-18NJ-10  
C2-22NJ-10  
C2-27NJ-10  
C2-33NJ-10  
C2-39NJ-10  
C2-47NJ-10  
C2-56NJ-10  
C2-68NJ-10  
C2-82NJ-10  
C2-R10J-10  
C2-R12J-10  
C2-R15J-10  
C2-R18J-10  
C2-R22J-10  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
0603  
1.0  
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
10  
8
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
50  
10  
10  
6
0.05  
0.05  
0.10  
0.10  
0.10  
0.10  
0.12  
0.14  
0.16  
0.18  
0.22  
0.24  
0.26  
0.28  
0.32  
0.35  
0.40  
0.45  
0.55  
0.60  
0.70  
0.75  
0.85  
0.95  
1.00  
1.20  
1.20  
1.30  
1.50  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
8
8
8
6
8
6
10  
10  
10  
10  
10  
10  
10  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
8
6
6
6
4
4
4
3.5  
3.4  
2.6  
2.3  
2.0  
1.6  
1.4  
1.2  
1.1  
0.9  
0.9  
0.7  
0.6  
0.6  
0.5  
0.5  
0.4  
0.4  
12  
15  
18  
22  
27  
33  
39  
47  
56  
68  
82  
100  
120  
150  
180  
220  
8
50  
8
50  
8
50  
Tolerance code :  
S : ±0.3nH  
J : ±5%  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 2  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
7. CHARACTERISTICS CURVES :  
Inductance vs. Frequency  
Q vs. Frequency  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 3  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
8. RELIABILITY & TEST CONDITION :  
ITEM  
PERFORMANCE  
TEST CONDITION  
Preheat : 100~150°C, 60sec.  
Solder Heat Resistance  
Appearance : Cracks should not be allowed.  
More than 75% of the terminal electrode  
should be covered with new solder.  
Solder : Sn-Ag3.0-Cu0.5  
Solder Temperature : 265±3°C  
Flux : Rosin  
Preheating Dipping Natural  
cooling  
Dip Time : 6±1sec.  
265°C  
150°C  
60  
6±1  
seconds  
seconds  
Preheat : 150°C, 60sec.  
Solder : Sn-Ag3.0-Cu0.5  
Solder Temperature : 240±5°C  
Flux : Rosin  
Solderability  
More than 90% of the terminal electrode  
should be covered with new solder.  
Preheating Dipping Natural  
cooling  
Dip Time : 3±1sec.  
240°C  
150°C  
60  
seconds  
3±1.0  
seconds  
Terminal Strength  
The terminal electrode & the dielectric must  
not be damaged by the forces applied on the  
right conditions.  
For C Series :  
Size  
1
Force (Kfg)  
0.2  
Time (sec)  
2
0.5  
3
0.6  
W
4
1.0  
> 25  
5
1.0  
6
1.0  
7
1.5  
W
8
2.0  
Flexture Strength  
The terminal electrode & the dielectric must  
not be damaged by the forces applied on the  
right conditions.  
Solder a chip on a test substrate, bend the substrate  
by 3mm (0.118in) for 10secs and return.  
20(.787)  
Bending  
45(1.772) 45(1.772)  
100(3.937)  
40(1.575)  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 4  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
8. RELIABILITY & TEST CONDITION :  
ITEM  
PERFORMANCE  
TEST CONDITION  
Bending Strength  
The ferrite should not be damaged by forces  
applied on the right condition.  
1.0(0.039)  
R0.5(0.02)  
Chip  
A
High Temperature Resistance Appearance : No damage.  
Temperature : 85±5°C  
Applied Current : rated current  
Duration : 1008±12hrs  
Inductance : Within ±20% of initial value.  
Measurement : After placing for at least 24hrs.  
Humidity Resistance  
Thermal Shock  
Humidity : 90~95% RH.  
Temperature : 60±2°C  
Applied Current : rated current (max.)  
Duration : 1008±12hrs  
Measurement : After placing for at least 24hrs.  
For C Series :  
Appearance : Cracking, chipping or any other  
defects that are harmful to the characteristics  
shall not be allowed.  
Condition for 1 cycle  
Step1 : -40±2°C 30 min.  
Step2 : +85±5°C 30 min.  
Number of cycles : 100  
Inductance : Within ±20% of initial value.  
Phase  
1
2
Temperature (°C)  
-40±2°C  
Times (min.)  
Measurement : After placing for at least 24hrs.  
30  
30  
+85±5°C  
Low temperature storage test  
Temperature : -40±2°C  
Duration : 1008±12hrs  
Measurement : After placing for at least 24hrs.  
Measured : 100 times  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 5  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
9. SOLDERING :  
9-1. Reflow soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.  
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.  
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions  
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.  
A
B
Slope of temp. rise  
Heat time  
1 to 5  
50 to 150  
120 to 180  
1 to 5  
°C/sec  
sec  
main heating  
230°C  
E
Heat temperature  
Slope of temp. rise  
Time over 230°C  
Peak temperature  
°C  
180°C  
120°C  
C
D
°C/sec  
sec  
pre-heating  
90 ~ 120  
255 ~ 260  
normal  
temperature  
°C  
E
A
B
C
D
Peak hold time  
No. of mounting  
10 max.  
3
sec  
times  
TIME(sec.)  
(Melting area of solder)  
9-2. Soldering Iron  
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that  
a soldering iron must be employed the following precautions are recommended.  
Note :  
a) Preheat circuit and products to 150°C.  
b) 280°C tip temperature (max)  
c) Never contact the ceramic with the iron tip  
d) 3.0mm tip diameter (max)  
e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm  
f) Limit soldering time to 3 secs.  
Upper limit  
9-3. Solder Volume :  
Recommendable  
Accordingly increasing the solder volume, the mechanical stress to product is also  
increased. Exceeding solder volume may cause the failure of mechanical or electrical  
performance. Solder shall be used not to be exceed as shown in right side.  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 6  
CERAMIC CHIP INDUCTORS  
C2 SERIES  
10. PACKAGING INFORMATION :  
10-1. Carrier Tape Packaging  
P2  
P0  
D0  
t
P1  
A
Ko  
Unreeling direction  
A(mm)  
B(mm)  
W(mm)  
8±0.2  
F(mm)  
E(mm)  
P1(mm)  
4±0.1  
P2(mm)  
2±0.05  
P0(mm)  
4±0.1  
D0(mm)  
Ko(mm)  
t(mm)  
1.1±0.1  
1.9±0.1  
3.5±0.05 1.75±0.1  
1.5 +0.1  
1.1±0.05 0.2±0.05  
-0  
10-2. Leader And Trailer Tape  
500 to 560mm  
Leader  
Blank  
Blank  
Components  
10 to 20 pitches  
440mm Min.  
End  
110mm or more  
Unreeling direction  
10-3. Configuration  
W
t
2±0.5  
A(mm)  
178±2.0  
N(mm)  
Ø60±2  
W(mm)  
10±1.5  
t(mm)  
2±0.5  
Qty (pcs)  
4000/Reel  
R1.0  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 7  

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