HPC6045NF-220 [TAI-TECH]

SMD Power Inductor;


型号：	HPC6045NF-220
厂家：	TAI-TECH
描述：	SMD Power Inductor
文件：	总4页 (文件大小：319K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TAI-TECH

HPC6045NF-SERIES

SMD Power Inductor

1. Features

1.This specification applies Low Profile Power Inductors

2.100%Lead(Pb)&Halogen-Free and RoHS compliant.

Halogen

3. Operating temperature-40~+125℃ (Including self - temperature rise)

Halogen-free

2. Dimension

Recommended Land pattern

2R2

Series

A(mm) B(mm) B’(mm) C(mm) D(mm) E(mm) F(mm)

L(mm)

G(mm)

G1(mm)

H(mm)

4.25±

6.5

HPC6045NF 6.0±0.3 6.0±0.3 4.8±0.2 4.2±0.3 1.7±0.3 4.5±0.3

4.25

1.80min

4.8

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness at

0.15mm and above.

3. Part Numbering

HPC

6045

2R2

A: Series

B: Dimension

C: Type

A/B*C

D: Inductance

2R2=2.20uH 100=10uH,101=100uH

E: Inductance Tolerance

M=±20%,Y=±30%.

marking direction cannot decide polarity. Color: Black, unidirectional.

magnetic shielding

TAI-TECH

4. Specification

Rated current

Inductance

L0 (uH)

@ 0 A

Tolerance

DCR

(mΩ) @25℃

±20%.

Temperature current Saturation current

Part Number

I rms (A)

I sat (A)

Typ

Max

Typ

Max

HPC6045NF-1R0

HPC6045NF-1R2

HPC6045NF-1R5

HPC6045NF-1R8

HPC6045NF-2R0

HPC6045NF-2R2

HPC6045NF-2R3

HPC6045NF-3R3

HPC6045NF-3R6

HPC6045NF-4R7

HPC6045NF-5R6

HPC6045NF-6R3

HPC6045NF-6R8

HPC6045NF-100

HPC6045NF-150

HPC6045NF-220

HPC6045NF-330

HPC6045NF-470

HPC6045NF-680

HPC6045NF-101

HPC6045NF-151

HPC6045NF-331

HPC6045NF-471

Note:

1.00

1.20

1.50

1.80

2.00

2.20

2.30

3.30

3.60

4.70

5.60

6.30

6.80

10.0

15.0

22.0

33.0

47.0

68.0

100

±20% ±30%

8.00

7.50

7.00

6.80

6.50

6.00

5.80

5.00

4.90

4.50

4.10

3.80

3.60

3.20

2.80

2.30

1.80

1.60

1.10

0.92

0.75

0.55

0.40

7.30

7.00

6.60

6.20

5.80

5.30

5.00

4.50

4.30

4.00

3.70

3.50

3.30

2.60

2.20

1.90

1.50

1.20

0.92

0.82

0.70

0.45

0.35

13.50

12.50

12.00

11.00

10.50

9.50

9.30

7.80

7.40

6.80

6.40

5.90

5.70

4.60

3.80

3.30

2.50

2.00

1.60

1.33

1.10

0.60

0.50

12.50

11.50

11.00

10.00

9.50

8.55

8.20

7.30

6.90

6.20

5.70

5.30

5.15

4.20

3.30

2.70

2.10

1.75

1.52

1.25

1.00

0.55

0.45

10.0

10.5

11.7

12.0

13.5

15.0

16.0

21.0

22.5

26.0

31.0

33.0

34.0

52.0

71.0

96.0

145

±15% ±20% ±30%

±10% ±15% ±20% ±30%

200

305

456

150

626

330

1400

2050

470

1. All test data referenced to 25℃ ambient , Ls/Q:1MHz/1V.

2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.

3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃

4. Saturation Current (Isat) will cause L0 to drop approximately 30%

5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

6. Special inquiries besides the above common used types can be met on your requirement.

TAI-TECH

(4) Tearing Off Force

The force for tearing off cover tape is 10 to 130 grams in the arrow

direction under the following conditions(referenced

ANSI/EIA-481-D-2008 of 4.11 standard).

165° to180°

Top cover tape

Room Temp.

Room Humidity

(%)

Room atm

(hPa)

Tearing Speed

mm/min

(℃)

Base tape

5~35

45~85

860~1060

300

Application Notice

‧Storage Conditions (component level)

To maintain the solderability of terminal electrodes:

1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.

2. Temperature and humidity conditions: Less than 40℃ and 60% RH.

3. Recommended products should be used within 12 months form the time of delivery.

4. The packaging material should be kept where no chlorine or sulfur exists in the air.

‧Transportation

1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.

2. The use of tweezers or vacuum pick up is strongly recommended for individual components.

3. Bulk handling should ensure that abrasion and mechanical shock are minimized.

9. Typical Performance Curves

HPC6045NF-1R0

HPC6045NF-1R2

HPC6045NF-1R5

1.5

1.2

0.9

0.6

0.3

1.5

1.2

0.9

0.6

0.3

2.5

1.5

0.5

2.8

5.6

8.4

11.2

2.6

5.2

7.8

10.4

2.4

4.8

7.2

9.6

DC CURRENT(A)

HPC6045NF-1R8

HPC6045NF-2R0

HPC6045NF-2R2

2.4

1.8

1.2

0.6

3.5

2.8

2.1

1.4

0.7

3.5

2.8

2.1

1.4

0.7

2.6

5.2

7.8

10.4

2.4

4.8

7.2

9.6

DC CURRENT(A)

HPC6045NF-2R3

HPC6045NF-3R3

HPC6045NF-3R6

3.5

2.8

2.1

1.4

0.7

1.6

3.2

4.8

6.4

1.6

3.2

4.8

6.4

DC CURRENT(A)

TAI-TECH

HPC6045NF-5R6

HPC6045NF-6R3

HPC6045NF-4R7

5.6

4.2

2.8

1.4

5.6

4.2

2.8

1.4

2.8

4.2

5.6

1.4

2.8

4.2

5.6

1.3

2.6

3.9

5.2

6.5

DC CURRENT(A)

HPC6045NF-6R8

HPC6045NF-100

HPC6045NF-150

1.2

2.4

3.6

4.8

0.8

1.6

2.4

3.2

DC CURRENT(A)

HPC6045NF-220

HPC6045NF-330

HPC6045NF-470

0.7

1.4

2.1

2.8

3.5

0.6

0.32

0.1

1.2

1.8

2.4

0.44

0.88

1.32

1.76

2.2

DC CURRENT(A)

HPC6045NF-680

HPC6045NF-101

HPC6045NF-151

110

150

120

250

200

150

100

0.4

0.8

1.2

1.6

0.64

0.96

1.28

1.6

0.26

0.52

0.78

1.04

1.3

DC CURRENT(A)

HPC6045NF-331

HPC6045NF-471

500

400

300

200

100

700

560

420

280

140

0.14

0.28

0.42

0.56

0.7

0.2

0.3

0.4

0.5

DC CURRENT(A)

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