TMPA1205SP [TAI-TECH]
SMD Power Inductor;TAI-TECH
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
Halogen
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
Halogen-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
A
D
100
1919
leadframe
Recommend PC Board Pattern
C
A
D
L
1R0
1919
G
non-leadframe
L(mm) G(mm) H(mm)
Series
A
B
C
D
E
14.5
8.0
5.0
See Spec
table
TMPA1205
13.5±0.5 12.6±0.2 4.7±0.3 2.3±0.3
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Unit:mm
4. Part Numbering
TMPA
1205
SP
-
100
MN
-
D
A
B
C
D
E
F
A: Series
B: Dimension
C: Type
BxC.
Standard.
D: Inductance
R10=0.1uh,1R0=1.0uh,100=10uh,101=100uh,102=1000uh.
K=±10%,L=±15%,M=±20%,N=±25%,Y=±30%
E: Inductance Tolerance
F: Code
Marking: Black.100 and 1919(19 YY, 19 WW,follow production date).
TAI-TECH
5. Specification
Heat Rating
Current DC
Irms( A )
Saturation
Current DC
I sat ( A )
Inductance
L0 A(uH)
±20%
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
E(mm)
±0.3
Part Number
Type
Typ
Max
Typ
Max
TMPA1205SP-R47MN-D
TMPA1205SP-R68MN-D
TMPA1205SP-1R0MN-D
TMPA1205SP-1R5MN-D
TMPA1205SP-2R2MN-D
TMPA1205SP-3R3MN-D
TMPA1205SP-4R7MN-D
TMPA1205SP-6R8MN-D
TMPA1205SP-100MN-D
TMPA1205SP-150MN-D
TMPA1205SP-220MN-D
TMPA1205SP-330MN-D
Note:
0.47
0.68
1.00
1.50
2.20
3.30
4.70
6.80
10.0
15.0
22.0
33.0
38
34
65
58
0.77
1.3
1.6
3.2
4.1
6.0
8.8
13
0.9
1.55
1.9
3.8
4.8
7.0
10.2
16
4.0
4.0
4.0
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
non-leadframe
non-leadframe
non-leadframe
leadframe
34
30
31
27
50
40
42
34
25
22
31
28
17
15.5
14
26
23
leadframe
15.5
14
23
20.5
16
leadframe
12.5
11
18.5
16.5
13
leadframe
12
15
leadframe
10
9.0
8.2
7.0
5.2
10.5
9.2
7.5
6.5
19.2
30
22
leadframe
9.4
8.0
6.0
11
36
leadframe
8.5
7.3
42
52
leadframe
66
80
leadframe
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
11. Typical Performance Curves
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