SGP.1575.18.4.C.02 [TAOGLAS]
patent pending;
| 型号： | SGP.1575.18.4.C.02 |
| 厂家： | 
Taoglas |
| 描述： | patent pending |
| 文件： | 总12页 (文件大小：931K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPECIFICATION
Model No.
Part No.
:
:
:
SGP.18C
SGP.1575.18.4.C.02
GPS SMT Patch Antenna
Product Name
Features
18mm*18mm*4.5mm
1575MHz Centre Frequency
Patent Pending
RoHS
Photo
:
SPE-11-8-138/E/SS
Page 1 of 12
1. Introduction
This ceramic GPS patch antenna is based on smart XtremeGain™ technology. It is
mounted via SMT process and has been selected as optimal solution for the
45*45mm ground plane.
2. Specification
Original Patch Specification tested on 45mm ground plane
No
1
Parameter
Range of Receiving
Frequency
Specification
Notes
1575.42 MHz ± 1.023 MHz
With 45*45mm
Center Frequency
1575.42 ± 3MHz
2
ground plane
Return Loss ≤-10
dB
3
4
5
6
7
8
9
Bandwidth
VSWR
5MHz min
1.5 max
Gain at Zenith
Gain at 10°elevation
Axial Ratio
+1.0 dBic typ.
-3.0 dBic typ.
4.0 dB max
RHCP
Polarization
Impedance
50 Ohms
Frequency Temperature
Coefficient（τf）
Operating Temperature
10
11
0 ± 20ppm / oC
-40°C to +85°C
-40ºC to +85ºC
**Changes in user groundplane and environment will offset centre frequency
SPE-11-8-138/E/SS
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3. Electrical Specifications
3.1 Return Loss, SWR, Impedance, measured on the test
fixture
SPE-11-8-138/E/SS
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4. Mechanical Specifications
4.1 Antenna Dimensions and Drawing
SPE-11-8-138/E/SS
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4.2 Antenna Footprint
4.2.1 Top Copper
SPE-11-8-138/E/SS
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4.2.2 Top Paste
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4.2.3 Top Mask
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4.2.4 Composite
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4.3 Test Jig and Dimension
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4.4 Test Fixture set up and measurements
SPE-11-8-138/E/SS
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5. Recommended Reflow Soldering Profile
SGP.18C can be assembled following Pb-free assembly. According to the Standard
IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:
Phase
Profile Features
Pb-Free Assembly (SnAgCu)
PREHEAT
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
150°C
200°C
60-120 seconds
RAMP-UP
REFLOW
Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max)
Temperature(TL)
Total Time above TL (tL)
Temperature(TP)
Time(tp)
217°C
30-100 seconds
260°C
PEAK
2-5 seconds
RAMP-DOWN
Rate
3°C/second(max)
8 minutes max.
96.5Sn/3Ag/0.5Cu
SHENMAO PF606-P26
Time from 25°C to Peak Temperature
Composition of solder paste
Solder Paste Model
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron
temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-11-8-138/E/SS
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6. Packaging
200pcs/reel/inner carton
5 reels in an outer carton(1000)
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