AVRF161Q861LT201 [TDK]

带ESD保护功能的陷波滤波器;


型号：	AVRF161Q861LT201
厂家：	TDK ELECTRONICS
描述：	带ESD保护功能的陷波滤波器
文件：	总10页 (文件大小：268K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

E M C C o m p o n e n t s

ESD Notch Filters

For wireless audio equipment

REACH Halogen

Free

Lead

Free

RoHS

SVHC-Free

AVRF series

FEATURES

This is an electronic component that achieves both ESD protection and noise protection.

TDMA noises generated by radio communication can be suppressed.

The high-attenuation characteristics of the Bluetooth band and the WiFi band are highly effective in preventing degradation of the recep-

tion sensitivity of radio equipment.

It is ideal for audio equipment with low sound distortion and high sound quality.

APPLICATION

ESD protection such as sound lines

Sound lines for devices such as smartphones, tablets, headsets, hearing aids, smart speakers and wearable equipments

ꢀ(earphones, microphones, and speakers)

CIRCUIT EXAMPLE

EQUIVALENT CIRCUIT

Microphone line

2 Zener Diodes

Noise Suppression Filter

Audio

Codec

A capacitance content

Microphone

ESD Notch Filters

Speaker or Receiver line

Noise Suppression Filter

Audio

Codec

Speaker or

Receiver

ESD Notch Filters

INTERNAL CONSTRUCTION

①

No.

(1)

(2)

(3)

(4)

(5)

Name

Semiconductor ceramics

Internal electrode(Pd)

Terminal electrode

②

③

⑤

④

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

PART NUMBER CONSTRUCTION

AVRF

6R8

242

Capacitance

tolerance

(%)

Insertion loss

frequency

(MHz)

L x W dimensions

(mm)

Rated voltage

(V)

Capacitance

(pF)

Series name

Packaging style

0.6×0.3

1.0×0.5

3.5

5.5

6R8

6.8

Taping

Bulk

242=24×10²

8R2

8.2

102

212

242

272

1000

2100

2400

2700

100 100=10x10⁰

160

600

650

Shape symbol (JIS)

0603

1005

0.6 0.03

1.00 0.05

0.30 0.03

0.50 0.05

0.30 0.03

0.50 0.05

0.1min.

OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT

Temperature range

Package quantity

Individual weight

Type





Operating temperature

Storage temperature

(°C)

(pieces/reel)

15,000

（mg）

0.2

1.2

AVRF06

AVRF10

–40 to +85

10,000



Operating temperature range includes self-temperature rise.

The storage temperature range is for after the assembly.



TERMINOLOGY

Item

Unit

(dB)

Description

Insertion loss

Power loss when measured by shunt-through connection of a product in a 50 measurement system

DC voltage that is continuously applied between product terminals

Terminal products leakage current-value: 50µA max.

(Rated voltage range)

Vdc

(V)

Rated voltage

Capacitance

Oscillator frequency 1kHz or 1MHz, capacitance between product terminal in oscillator voltage 1Vrms

Product terminal voltage when DC1mA was flowed

(pF)

Vbr

(V)

Breakdown voltage

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

PRODUCT CHARACTERISTICS LIST

Insertion loss

Rated voltage Breakdown voltage Capacitance

ESD voltage amount

I=1mA

Vbr

(V)

6.8typ.

8typ.

20typ.

12.8typ.

39typ.

f=1MHz, osc=1Vrms IEC61000-4-2

Item

Application

(dB)

20min.(1GHz)

Vdc

(V)

3.5

5.5

(pF)

150pF/330

8kV

AVRF060V600MT102

AVRF060W650MT102 20min.(1GHz)

AVRF061P160MT212

AVRF060X100LT242

AVRF060X8R2LT272

AVRF101U6R8KT242

60 (48 to 72)

65 (52 to 78)

16 (12.8 to 19.2)

10 (8.5 to 11.5)

8.2 (6.97 to 9.43)

6.8 (6.12 to 7.48)

Cellular

Cellular/WiFi/Bluetooth

WiFi/Bluetooth

20min.(2.1GHz) 12

20min.(2.4GHz)

20min.(2.7GHz)

8kV

20min.(2.4GHz) 28

ELECTRICAL CHARACTERISTICS

INSERTION LOSS VS. FREQUENCY CHARACTERISTICS

ꢀApplication: WiFi / Bluetooth

AVRF101U6R8KT242

AVRF060V600MT102

AVRF060X8R2LT272

AVRF060X100LT242

AVRF061P160MT212

AVRF060W650MT102

1000

100

10000

1000

10000

(MHz)

Frequency

(MHz)

Frequency

CURRENT VS. VOLTAGE CHARACTERISTICS

10^–2

AVRF060V600MT102

10^–3

AVRF060W650MT102

10^–4

AVRF060X100LT242

10^–5

AVRF060X8R2LT272

10^–6

AVRF061P160MT212

10^–7

AVRF101U6R8KT242

10^–8

10^–9

10^–10

(V)

Voltage

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

DISCHARGE VOLTAGE WAVEFORM (EXAMPLE)

DISCHARGE WAVEFORM WITHOUT ESD NOTCH FILTERS AND WITH ESD NOTCH FILTERS INSTALLED

1800

1600

Without Filter

AVRF101U6R8KT242

1400

AVRF060X100LT242

1200

AVRF060X8R2LT272

1000

AVRF061P160MT212

800

AVRF060W650MT102

600

AVRF060V600MT102

400

200

–200

–50

100

Time ns

150

200

250

300

(

)

Test conditions

150pF/330 (IEC61000-4-2)

Contact discharge, Charged voltage 8kV

TEST CIRCUIT DIAGRAM

Discharge gun

Test

Shield

sample

Discharge

Point

SMA

Connector

60dB attenuator

50

Oscilloscope

ESD

simulator

PCB

I/O impedance: 50

ESD Simulator

ESD

Coaxial

Notch Filters Cable

Attenuator(60dB)

50

Oscilloscope

50

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

Attention on a circuit board design

(2) When peak levels panning-at soldering is excessive, by solder

contraction stress, mechanical-thermal stress causes a Yasuku

chip crack. In addition, when the peak level is underestimated, ter-

minal electrode fixed strength is insufficient. This causes chip

dropouts and may affect circuit reliability. Representative example

of the panning of peak levels is shown in the following.

Board design

When attached to products, amount of silver used (fillet size) has

direct impact on products after mounting. Thus, sufficient consider-

ation is necessary.

Set of land dimensions

(1) As the stress rises in the products owing to the increase in sil-

ver, breakage and cracks will occur. Cause including crack, as cau-

tion on board land design, configure the shape and dimensions so

that the amount of silver is appropriate. If you installed 2 or more

parts in the Common Land, separated by a solder resist and spe-

cial land of each component.

Recommended silver dose

Solder stress is increased,

Solder volume

and it is easy for a crack to

form.

overload

Most large serving amount

Minimum prime amount

Decent solder

volume

Fixed strength is weak, and

there is connection a prob-

lem and risk of loss.

Solder volume

deficit

Case and suggested protocol want to avoid

Symbol

Improvement example

(land division)

Dimensions shape

Example

Cases to avoid

0603

1005

0.25 to 0.35

0.30 to 0.50

0.20 to 0.30

0.35 to 0.45

0.25 to 0.35

0.40 to 0.60

Leads

Solder

Leads

Chip

Solder resist

Lead wire and land

of part discrete

doubles up

PCB

Chassis

Solder

(ground solder)

Solder resist

Arrangements in

the vicinity

L2>L1

Land

Arrangements of

chip component's

companion

Excess solder

Solder resist

Land

Missing solder

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

Attention on a circuit board design

Arrangements of components

(2) In payment near by board, depending on mount position of

products, as mechanical stress varies, please refer to the following

diagram.

(1) I was based on camber of substrate and suggested protocol of

products arrangement, as stress does not join to the utmost is

shown in following.

Substrate for flexural stress Substrate for flexural stress

Adverse events

Good example

Perforation

Perforation or slit

Direction of

surface solder

Slit

Solder the mountain fold as a Solder the mountain fold as a

top.

bottom. [Please review the

italicized portion, as I am

unsure what you mean to con-

vey here.]

The order of A > B = C > D > E eases the stress.

Perforation or slit

Chip

arrangements

(direction)

Mounted vertically to the per- Mounted horizontally to the

foration and slit.

perforation and slit.

Distance from

perforation

and slit

(L1<L2)

portion

Close location is disadvanta- It is an advantage so distant

geous of perforation and slit. location away places the perfo-

ration and slit.

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

Local precautions

Reflow temperature profile

Application to board

Preheating

Soldering

Natural

cooling

Mounting head pressure

Under suction nozzle if dead point too, during implementation,

excessive force joins of products low, as cause causes of crack,

please use with reference to something about following.

1) Being set to top surface of substrate so that under suction nozzle

as for dead center, substrate does not bend back, and adjust,

please.

Peak

2) Nozzle pressure at implementation is 1 to 3N in static load,

please.

3) Substrate fixes up back surface of substrate with support pin in

impact of suction nozzle to wely deflection to the utmost, and

substrate hold deflection, please. A representative example is

shown in the following.

t: Time

Specification

for eutectic mixture Use of lead-free

Cases to avoid

Recommended case

Item

solder

Crack

Preheating temperature

Solder melting temperature

Maximum temperature

Preheating time

Time to reach higher than the

solder melting temperature

160 to 180°C

200°C

150 to 180°C

230°C

260°C max.

120s max.

Single-sided

mounting

240°C max．

100s max.

Support pin

30s max.

40s max.

2 max.

number of possible reflow cycles 2 max.

Double-sided

mounting

Soldering iron

Solder peeling

Support pin

Crack

The tip temperature and also by (1) types of soldering irons, the size

of the substrate, and the geometry of the land pattern. Being earlier,

but when as there is possibility that crack occurs in the heat ander-

son impaction, point soldering iron temperature is high, please do

solder work within the following conditions.

Mechanical shock that, if positioning your nail to wear, ragged edge

of positionings, participates in products are locally, and products, as

there is possibility of crack generated, cut the closed positioning,

and maintenance and inspection, and, exchange of manage dimen-

sions and position nail periodically, please.

Wattage

Temperature

of iron tips

(°C)

Pallet point Soldering time

shape

Frequency

(mm)

(Second)

（W）

Within each

terminal once

(Within total of

twice)

Soldering

30max.

ø3.0max.

5 max.

350max.

Significant impact is possible on the performance of products, flux

checks something about follow, please use.

Direct iron tip is in contact with the (2) products body, and the strain

owing to thermal shock in particular grows even if a crack is gener-

ated. Therefore, please do not touch it directly to the terminal elec-

trodes.

(1) Flux uses one with 0.1wt % (Cl conversion) or less halide sub-

stance contains amounts, please. In addition, do not do this with

strongly acidic objects.

Flux during is soldered (2) Products is applied the smalleset amount

necessary, please.

(3) If Used soluble flux, perform thorough wash particularly, please.

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

AVRF series

Attention after implementation

(2) During each substrate operational check, push pressure with

contact failure of check pin of boards checkers of check pin may be

toned up to be prevented. As substrate is bent under loading, prod-

ucts is broken owing to stress. There is also the possibility that sol-

der on the terminal electrode will peel off. Follow the diagram for

reference, and check that the substrate bends, please.

Cleaning

(1) If cleaning liquid is inappropriate, residues and other foreign

body of fluxes builds up on products, and can degrade the perfor-

mance of products (particularly the insulation resistance).

(2) Wash conditions may compromise performance of products if

they are improper (wash due, wash excess).

Item

Cases to avoid

Recommended case

2-1) For wash due

Peeling

Support pin

(a) By substance of a system in flux residue halide, metal including

terminal electrodes may experience corrosion.

Substrate sags

(b) Substance of a system in flux residue halide builds up on prod-

ucts, and reduces the insulation resistance.

Check pin

there is event with trends of significant (1) and(2).

Single-part component handling

To drop impact, as there is possibility that breakage and crack is

entered, do not products that(1) products falls.

2-2) For excess wash

(1) Owing to lavage, products deteriorates, and reduces perfor-

mance of products.

(2) In ultrasonography, when output is passed, substrate resonates

size, and crack occurs in body and sprang of products in vibra-

tion of substrate. Since this may reduce the strength of the termi-

nal electrode, please note the following conditions. [Please review

the italicized portion, as I am unsure what you mean to convey

here.]

Crack

Floor

(2) At stacking storage after implementation and treatment of sub-

strate, corner of boards is regarded as products. Please be careful,

as there is the possibility that breakage and cracks will occur on

impact.

Ultrasound output

Ultrasonic frequency

Ultrasound cleaning time

2-3) Concentration including halogen that when cleaning liquid to

pollution, when you released is higher, and may cause similar of

results into wash due.

Crack

Board

Substrate handling after component mounting

(1) When substrate is divided, a flexible so that show in following dia-

gram to substrate, and is given by stress including twist, as there is

possibility that crack occurs of products, please check that stress is

within acceptable limits.

Bends

Twist

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

(8/10)

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E M C C o m p o n e n t s

AVRF series

PACKAGING STYLE

REEL DIMENSIONS

2.0 0.5

PACKAGE QUANTITY / INDIVIDUAL WEIGHT

Package quantity

(pieces/reel)

15,000

Individual weight

Type

（mg）

0.2

AVRF06

AVRF10

10,000

1.2

0.8

ø13 0.2

ø21 0.8

9.0max.

14.0max.

ø180 2.0

Dimensions in mm

TAPE DIMENSIONS

1.5₀^+0.1

2.0 0.05

4.0 0.1

Dimensions in mm

P1 T

Type

0603

1005

0.38 0.05

0.65+0.05/-0.1

0.68 0.05

1.15+0.05/-0.1

2.0 0.05

0.45max.

0.65max.

160min.

Taping

200min.

300min.

Dimensions in mm

Drawing direction

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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E M C C o m p o n e n t s

REMINDERS FOR USING THESE PRODUCTS

Before using these products, be sure to request the delivery specifications.

SAFETY REMINDERS

Please pay sufficient attention to the warnings for safe designing when using this products.

REMINDERS

Please pay careful attention to the precautions and follow safe designing practices when using these products.

Please observe the following precautions in order to avoid problems with products such as characteristic degradation and element

destruction

Please store these products in an environment with a temperature of 5 to 40°C and humidity level of 20 to 70%RH, and use them

within six months.

Poor storage conditions may lead to the deterioration of the solderability of the edge electrodes, so please be careful to avoid contact

with humidity, dew condensation, dust, toxic gas (hydrogen, hydrogen sulfide, sulfurous acid, chlorine, ammonia, etc.), direct sunlight,

and so on.

Please do not use products that have been dropped or detached when mounting.

Please solder with the reflow soldering method, and not the flow (dip) soldering method.

Please observe the following precautions to avoid problems with products such as characteristic degradation and element destruction,

which ultimately lead to the generation of heat and smoke with the elements.

Do not use in locations where the temperatures exceed the operating temperature range such as under direct sunlight or near

sources of heat.

Do not use in locations where there are high levels of humidity such as under direct exposure to weather and areas where steam is

released.

Do not use in locations such as dusty areas, high-saline environments, places where the atmosphere is contaminated with corrosive

gas, etc.

Avoid powerful vibrations, impact (such as by dropping), pressure, etc. that may lead to splitting in the products.

Do not use with a voltage that exceeds the rated voltage.

When resin coating (including modular) a product, do not use a resin that will cause deterioration of the product. Be sure never to use

resin that generates hydrogen as palladium is used for the inner electrode.

Avoid attachment near combustible materials.

Please contact our sales offices when considering the use of the products listed on this catalog for applications, whose performance

and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage

to society, person or property ('specific uses' such as automobiles, airplanes,medical instruments, nuclear devices, etc.) as well as

when considering the use for applications that exceed the range and conditions of this catalog.

Please also contact us when using these products for automotive applications.

As range of catalog, conditions are transcended, or for damage that generated by was used in application specific, etc, accept no the

responsibility, wish.

Please take appropriate measures such as acquiring protective circuits and devices that meet the uses, applications, and conditions of

the instruments and keeping backup circuits.

Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

(10/10)

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AVRF161Q861LT201 [TDK]

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