首页 |元器件品牌

B57560G1234000 [TDK]

NTC thermistors for temperature measurement;
B57560G1234000
型号： B57560G1234000
厂家： TDK ELECTRONICS    TDK ELECTRONICS
描述：

NTC thermistors for temperature measurement
文件： 总25页 (文件大小：427K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
NTC thermistors for  
temperature measurement  
Glass-encapsulated sensors,  
standard type  
Series/Type:  
B57560G1  
Date:  
January 2016  
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the  
information contained therein without EPCOS' prior express consent is prohibited.  
EPCOS AG is a TDK Group Company.  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Applications  
Dimensional drawing  
Temperature measurement  
Features  
Glass-encapsulated, heat-resistive and  
highly stable  
For temperature measurement up to  
300 °C  
Leads: dumet wires (copper-clad FeNi)  
Options  
Leads: nickel-plated dumet wires  
Alternative dimensions available on request  
Delivery mode  
Bulk  
Dimensions in mm  
Approx. weight 120 mg  
General technical data  
Climatic category  
Max. power  
(IEC 60068-1)  
(at 25 °C)  
55/300/56  
50  
∆RR/RR ±1, ±2, ±3  
P25  
mW  
%
°C  
mW/K  
s
mJ/K  
Resistance tolerance  
Rated temperature  
Dissipation factor  
Thermal cooling time constant  
Heat capacity  
TR  
δth  
τc  
25  
(in air)  
(in air)  
approx. 1.3  
approx. 15  
approx. 20  
Cth  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 2 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Electrical specification and ordering codes  
R25  
Ω
No. of R/T  
characteristic K  
B25/85  
B0/100  
K
B25/100  
K
Ordering code  
2 k  
2.056 k  
5 k  
10 k  
10 k  
20 k  
50 k  
100 k  
230 k  
8322  
7007  
8328  
7003  
8307  
8334  
8346  
8304  
8352  
3405  
3378  
3516  
3456  
3586  
3450  
3965  
3965  
4036  
4216  
3420 ±1%  
3560 ±1%  
3497 ±1%  
3625 ±1%  
3492 ±1%  
4006 ±1%  
4006 ±1%  
4092 ±1%  
4280 ±1%  
B57560G1202+000  
B57560G1212+000  
B57560G1502+000  
B57560G1103+005  
B57560G1103+000  
B57560G1203+000  
B57560G1503+000  
B57560G1104+000  
B57560G1234+000  
3545  
3483  
3612  
3478  
3991  
3991  
4072  
4257  
+ = Resistance tolerance  
F = ±1%  
G = ±2%  
H = ±3%  
Note  
For ordering code B57560G1202+000 the R/T curve is defined for short wire length (5 mm). In  
dependence of the real wire length of the glass-encapsulated sensor the wire resistance can be  
considered for temperatures higher than 100 °C additionally with following equation:  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 3 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Reliability data  
Test  
Standard  
Test conditions  
∆R25/R25  
Remarks  
(typical)  
Storage in  
dry heat  
IEC  
60068-2-2  
Storage at upper  
category temperature  
T: 300 °C  
< 3%  
No visible  
damage  
t: 1000 h  
Storage in damp  
heat, steady state  
IEC  
Temperature of air: 85 °C  
< 2%  
No visible  
damage  
60068-2-67 Relative humidity of air: 85%  
Duration: 1000 h  
Rapid temperature IEC  
Lower test temperature: ꢀ55 °C < 2%  
No visible  
damage  
cycling  
60068-2-14 Upper test temperature: 200 °C  
Number of cycles: 1000  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 4 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Reliability data according to AEC-Q200, Rev. D  
Test  
Standard  
Test conditions  
∆R25/R25  
(typical)  
< 2%  
Remarks  
High temperature  
exposure (storage) method 108  
Operational life  
MIL-STD-202, Storage at T = +125 °C  
t = 1000 h  
MIL-STD-202, 1000 h / +125 °C  
No visible  
damage  
< 2%  
No visible  
damage  
method 108  
Test voltage max. 0.3 V DC on  
NTC1)  
Lower test temperature: ꢀ55 °C < 2%  
Temperature  
cycling  
JESD 22,  
No visible  
damage  
method JA-104 Upper test temperature: 125 °C  
1000 cycles  
Dwell time: max. 30 min at each  
temperature  
Transition time in air: max. 1 min  
MIL-STD-202, Test leaded device integrity  
method 211  
Terminal strength  
(leaded)  
< 1%  
< 1%  
No visible  
damage  
Condition A: 2.27 N2)  
Mechanical shock MIL-STD-202, Acceleration: 40 g 2)  
No visible  
damage  
method 213,  
condition C  
Pulse duration: 6 ms  
Number of bumps: 3, each  
direction  
Vibration  
MIL-STD-202, Acceleration: 5 g  
< 1%  
No visible  
damage  
method 204  
t = 20 min  
12 cycles in each of 3 directions  
Frequency range: 10 to 2000 Hz  
1) Self heating of the NTC thermistor must not exceed 0.2 K, steady state. Test conditions deviating from AEC Q200, Rev. D.  
2) Deviating from AEC Q200, Rev. D.  
Note  
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be  
ensured that no water enters the NTC thermistors (e.g. through plug terminals).  
Avoid dewing and condensation unless thermistor is specified for these conditions.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 5 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
R/T characteristics  
7003  
7007  
8304  
R/T No.  
T (°C)  
B25/100 = 3625 K  
RT/R25  
B25/100 = 3560 K  
B25/100 = 4092 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
ꢀ55.0 63.225  
ꢀ50.0 45.46  
ꢀ45.0 33.07  
ꢀ40.0 24.324  
ꢀ35.0 18.081  
6.7  
6.5  
6.3  
6.0  
5.8  
55.806  
40.684  
29.967  
22.292  
16.742  
6.4  
6.2  
6.0  
5.8  
5.6  
100.11  
69.56  
48.945  
34.853  
25.102  
7.4  
7.2  
6.9  
6.7  
6.5  
ꢀ30.0 13.575  
ꢀ25.0 10.29  
5.6  
5.4  
5.3  
5.1  
4.9  
12.689  
9.7016  
7.4804  
5.8147  
4.5551  
5.5  
5.3  
5.1  
5.0  
4.8  
18.275  
13.443  
9.9853  
7.4867  
5.6636  
6.2  
6.0  
5.9  
5.7  
5.5  
ꢀ20.0  
ꢀ15.0  
ꢀ10.0  
7.8716  
6.0739  
4.7258  
ꢀ5.0  
0.0  
5.0  
10.0  
15.0  
3.7062  
2.9287  
2.3311  
1.8684  
1.5075  
4.8  
4.6  
4.5  
4.4  
4.2  
3.5950  
2.8577  
2.2872  
1.8427  
1.4941  
4.7  
4.5  
4.4  
4.3  
4.1  
4.3212  
3.324  
2.5769  
2.0127  
1.5834  
5.3  
5.2  
5.0  
4.9  
4.7  
20.0  
25.0  
30.0  
35.0  
40.0  
1.224  
4.1  
4.0  
3.9  
3.8  
3.7  
1.2188  
1.0000  
0.82513  
0.68452  
0.57082  
4.0  
3.9  
3.8  
3.7  
3.6  
1.2542  
1.0000  
0.80239  
0.64776  
0.52598  
4.6  
4.5  
4.3  
4.2  
4.1  
1.0000  
0.82176  
0.67909  
0.56422  
45.0  
50.0  
55.0  
60.0  
65.0  
0.47122  
0.3955  
0.33355  
0.2826  
3.6  
3.5  
3.4  
3.3  
3.2  
0.47839  
0.40285  
0.34081  
0.28961  
0.24716  
3.5  
3.4  
3.3  
3.2  
3.1  
0.4295  
0.35262  
0.291  
0.24136  
0.20114  
4.0  
3.9  
3.8  
3.7  
3.6  
0.24049  
70.0  
75.0  
80.0  
85.0  
90.0  
0.20553  
0.17637  
0.15195  
0.13141  
0.11406  
3.1  
3.0  
2.9  
2.9  
2.8  
0.21180  
0.18222  
0.15737  
0.13642  
0.11867  
3.0  
3.0  
2.9  
2.8  
2.8  
0.16841  
0.14164  
0.11963  
0.10147  
0.086407  
3.5  
3.4  
3.3  
3.3  
3.2  
95.0  
100.0  
105.0  
110.0  
115.0  
0.099352  
0.086837  
0.076149  
0.066989  
0.059112  
2.7  
2.7  
2.6  
2.5  
2.5  
0.10359  
2.7  
2.6  
2.6  
2.5  
2.4  
0.073867  
0.063383  
0.054584  
0.04717  
3.1  
3.0  
3.0  
2.9  
2.8  
0.090762  
0.079765  
0.070311  
0.062158  
0.040901  
120.0  
125.0  
130.0  
135.0  
140.0  
0.052316  
0.046433  
0.041327  
0.03688  
2.4  
2.4  
2.3  
2.3  
2.2  
0.055106  
0.048989  
0.043668  
0.039026  
0.034966  
2.4  
2.3  
2.3  
2.2  
2.2  
0.035581  
0.03105  
0.027179  
0.023861  
0.021008  
2.8  
2.7  
2.6  
2.6  
2.5  
0.032998  
145.0  
150.0  
155.0  
0.029598  
0.026612  
0.023984  
2.2  
2.1  
2.1  
0.031405  
0.028274  
0.025514  
2.1  
2.1  
2.0  
0.018548  
0.016419  
0.014573  
2.5  
2.4  
2.4  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 6 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
7003  
7007  
8304  
R/T No.  
T (°C)  
B25/100 = 3625 K  
RT/R25  
B25/100 = 3560 K  
B25/100 = 4092 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
160.0  
165.0  
0.021665  
0.019613  
2.0  
2.0  
0.023075  
0.020914  
2.0  
1.9  
0.012967  
0.011566  
2.3  
2.3  
170.0  
175.0  
180.0  
185.0  
190.0  
0.017793  
0.016176  
0.014735  
0.013448  
0.012297  
1.9  
1.9  
1.8  
1.8  
1.8  
0.018996  
0.017288  
0.015765  
0.014404  
0.013185  
1.9  
1.9  
1.8  
1.8  
1.8  
0.010341  
2.2  
0.0092664 2.2  
0.0083224 2.1  
0.0074907 2.1  
0.0067564 2.0  
195.0  
200.0  
205.0  
210.0  
215.0  
0.011265  
0.010338  
0.009504  
0.0087516  
0.0080718  
1.7  
1.7  
1.7  
1.6  
1.6  
0.012091  
0.011106  
0.010220  
0.0094192  
0.0086951  
1.7  
1.7  
1.6  
1.6  
1.6  
0.0061064 2.0  
0.0055299 2.0  
0.0050175 1.9  
0.0045611 1.9  
0.0041537 1.9  
220.0  
225.0  
230.0  
235.0  
240.0  
0.0074567  
0.0068989  
0.0063925  
0.0059318  
0.005512  
1.6  
1.5  
1.5  
1.5  
1.5  
0.0080391  
0.0074438  
0.0069025  
0.0064096  
0.0059601  
1.6  
1.5  
1.5  
1.5  
1.4  
0.0037895 1.8  
0.0034631 1.8  
0.0031701 1.8  
0.0029067 1.7  
0.0026693 1.7  
245.0  
250.0  
255.0  
260.0  
265.0  
0.005129  
0.004779  
0.0044586  
0.004165  
0.0038955  
1.4  
1.4  
1.4  
1.4  
1.3  
0.0055495  
0.0051738  
0.0048296  
0.0045138  
0.0042237  
1.4  
1.4  
1.4  
1.3  
1.3  
0.0024551 1.7  
0.0022615 1.6  
0.0020862 1.6  
0.0019273 1.6  
0.0017829 1.5  
270.0  
275.0  
280.0  
285.0  
290.0  
0.0036478  
0.0034199  
0.0032098  
0.003016  
0.002837  
1.3  
1.3  
1.3  
1.2  
1.2  
0.0039567  
0.0037108  
0.0034840  
0.0032745  
0.0030807  
1.3  
1.3  
1.3  
1.2  
1.2  
0.0016516 1.5  
0.0015319 1.5  
0.0014228 1.5  
0.0013231 1.4  
0.0012319 1.4  
295.0  
300.0  
0.0026714  
0.002518  
1.2  
1.2  
0.0029014  
0.0027351  
1.2  
1.2  
0.0011483 1.4  
0.0010716 1.4  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 7 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
R/T characteristics  
8307  
8322  
8328  
R/T No.  
T (°C)  
B25/100 = 3492 K  
RT/R25  
B25/100 = 3420 K  
B25/100 = 3497 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
ꢀ55.0 52.624  
ꢀ50.0 38.452  
ꢀ45.0 28.401  
ꢀ40.0 21.194  
ꢀ35.0 15.972  
6.4  
6.2  
6.0  
5.8  
5.6  
48.245  
35.532  
26.436  
19.861  
15.062  
6.2  
6.0  
5.8  
5.6  
5.4  
54.036  
39.297  
28.914  
21.509  
16.168  
6.5  
6.3  
6.0  
5.8  
5.6  
ꢀ30.0 12.149  
5.4  
5.2  
5.0  
4.9  
4.7  
11.526  
8.8971  
6.9248  
5.4327  
4.2947  
5.3  
5.1  
4.9  
4.8  
4.6  
12.272  
9.4026  
7.2677  
5.6650  
4.4511  
5.4  
5.2  
5.1  
4.9  
4.7  
ꢀ25.0  
ꢀ20.0  
ꢀ15.0  
ꢀ10.0  
9.3246  
7.2181  
5.6332  
4.4308  
ꢀ5.0  
0.0  
5.0  
10.0  
15.0  
3.5112  
2.8024  
2.252  
1.8216  
1.4827  
4.6  
4.4  
4.3  
4.2  
4.1  
3.4199  
2.7425  
2.214  
1.7988  
1.4705  
4.5  
4.3  
4.2  
4.1  
4.0  
3.5240  
2.8103  
2.2568  
1.8243  
1.4841  
4.6  
4.5  
4.3  
4.2  
4.1  
20.0  
25.0  
30.0  
35.0  
40.0  
1.2142  
1.0000  
0.82818  
0.68954  
0.57703  
3.9  
3.8  
3.7  
3.6  
3.5  
1.2092  
1.0000  
0.83147  
0.69495  
0.58374  
3.9  
3.7  
3.6  
3.5  
3.4  
1.2147  
1.0000  
0.82784  
0.68898  
0.57637  
3.9  
3.8  
3.7  
3.6  
3.5  
45.0  
50.0  
55.0  
60.0  
65.0  
0.48525  
0.41  
0.34798  
0.29663  
0.25392  
3.4  
3.3  
3.2  
3.2  
3.1  
0.49269  
0.41775  
0.35578  
0.30429  
0.26132  
3.3  
3.3  
3.2  
3.1  
3.0  
0.48454  
0.40928  
0.34728  
0.29596  
0.25330  
3.4  
3.3  
3.2  
3.2  
3.1  
70.0  
75.0  
80.0  
85.0  
90.0  
0.21824  
0.1883  
0.16307  
0.14174  
0.12362  
3.0  
2.9  
2.8  
2.8  
2.7  
0.2253  
2.9  
2.9  
2.8  
2.7  
2.6  
0.21766  
0.18777  
0.16259  
0.14130  
0.12323  
3.0  
2.9  
2.8  
2.8  
2.7  
0.19498  
0.16936  
0.14762  
0.1291  
95.0  
100.0  
105.0  
110.0  
115.0  
0.10818  
0.094973  
0.08364  
0.073881  
0.06545  
2.6  
2.6  
2.5  
2.5  
2.4  
0.11328  
0.099707  
0.08803  
0.077951  
0.069214  
2.6  
2.5  
2.5  
2.4  
2.4  
0.10783  
2.6  
2.6  
2.5  
2.5  
2.4  
0.094663  
0.083366  
0.073639  
0.065239  
120.0  
125.0  
130.0  
135.0  
140.0  
0.058144  
0.051794  
0.046259  
0.04142  
2.3  
2.3  
2.2  
2.2  
2.1  
0.061618  
0.054997  
0.04921  
0.044138  
0.039681  
2.3  
2.2  
2.2  
2.2  
2.1  
0.057960  
0.051635  
0.046121  
0.041302  
0.037079  
2.3  
2.3  
2.2  
2.2  
2.1  
0.037179  
145.0  
150.0  
155.0  
0.033451  
0.030166  
0.027264  
2.1  
2.0  
2.0  
0.035754  
0.032285  
0.029213  
2.1  
2.0  
2.0  
0.033367  
0.030096  
0.027207  
2.1  
2.0  
2.0  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 8 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
8307  
8322  
8328  
R/T No.  
T (°C)  
B25/100 = 3492 K  
RT/R25  
B25/100 = 3420 K  
B25/100 = 3497 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
160.0  
165.0  
0.024694  
0.022414  
2.0  
1.9  
0.026486  
0.024059  
1.9  
1.9  
0.024642  
0.022365  
2.0  
1.9  
170.0  
175.0  
180.0  
185.0  
190.0  
0.020385  
0.018577  
0.016961  
0.015514  
0.014216  
1.9  
1.8  
1.8  
1.8  
1.7  
0.021894  
0.019959  
0.018225  
0.016669  
0.015269  
1.9  
1.8  
1.8  
1.8  
1.7  
0.020340  
0.018536  
0.016926  
0.015484  
0.014192  
1.9  
1.8  
1.8  
1.8  
1.7  
195.0  
200.0  
205.0  
210.0  
215.0  
0.013049  
0.011999  
0.011051  
0.010194  
0.0094181  
1.7  
1.7  
1.6  
1.6  
1.6  
0.014007  
0.012868  
0.011837  
0.010902  
0.010054  
1.7  
1.7  
1.7  
1.6  
1.6  
0.013030  
0.011983  
0.011039  
0.010186  
0.0094136  
1.7  
1.7  
1.6  
1.6  
1.6  
220.0  
225.0  
230.0  
235.0  
240.0  
0.0087144  
0.0080751  
0.0074933  
0.0069631  
0.0064791  
1.5  
1.5  
1.5  
1.5  
1.4  
0.0092841  
0.0085836  
0.0079445  
0.0073603  
0.0068254  
1.6  
1.6  
1.5  
1.5  
1.5  
0.0087127  
0.0080759  
0.0074963  
0.0069679  
0.0064855  
1.5  
1.5  
1.5  
1.4  
1.4  
245.0  
250.0  
255.0  
260.0  
265.0  
0.0060366  
0.0056316  
0.0052602  
0.0049193  
0.0046059  
1.4  
1.4  
1.4  
1.3  
1.3  
0.0063349  
0.0058843  
0.0054698  
0.0050879  
0.0047354  
1.5  
1.5  
1.5  
1.4  
1.4  
0.0060444  
0.0056404  
0.0052700  
0.0049299  
0.0046171  
1.4  
1.4  
1.3  
1.3  
1.3  
270.0  
275.0  
280.0  
285.0  
290.0  
0.0043173  
0.0040514  
0.003806  
0.0035793  
0.0033696  
1.3  
1.3  
1.2  
1.2  
1.2  
0.0044099  
0.0041087  
0.0038297  
0.0035711  
0.0033311  
1.4  
1.4  
1.4  
1.4  
1.4  
0.0043292  
0.0040637  
0.0038186  
0.0035922  
0.0033827  
1.3  
1.3  
1.2  
1.2  
1.2  
295.0  
300.0  
0.0031753  
0.0029952  
1.2  
1.2  
0.0031081  
0.0029008  
1.4  
1.4  
0.0031886  
0.0030086  
1.2  
1.2  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 9 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
R/T characteristics  
8334  
8346  
8352  
R/T No.  
T (°C)  
B25/100 = 4006 K  
RT/R25  
B25/100 = 4006 K  
B25/100 = 4280 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
ꢀ55.0 99.446  
ꢀ50.0 68.925  
ꢀ45.0 48.394  
ꢀ40.0 34.400  
ꢀ35.0 24.743  
7.5  
7.2  
6.9  
6.7  
6.5  
99.149  
68.776  
48.319  
34.363  
24.725  
7.4  
7.2  
6.9  
6.7  
6.5  
117.37  
80.884  
56.404  
39.784  
28.369  
7.6  
7.3  
7.1  
6.9  
6.7  
ꢀ30.0 17.998  
ꢀ25.0 13.232  
6.3  
6
5.8  
5.7  
5.5  
17.989  
13.228  
9.8269  
7.3715  
5.5812  
6.3  
6
5.8  
5.7  
5.5  
20.444  
14.883  
10.940  
8.1167  
6.0763  
6.4  
6.3  
6.1  
5.9  
5.7  
ꢀ20.0  
ꢀ15.0  
ꢀ10.0  
9.8289  
7.3724  
5.5816  
ꢀ5.0  
0.0  
5.0  
10.0  
15.0  
4.2635  
3.2846  
2.5510  
1.9968  
1.5746  
5.3  
5.1  
5
4.8  
4.7  
4.2634  
3.2845  
2.5510  
1.9968  
1.5746  
5.3  
5.1  
5
4.8  
4.7  
4.5881  
3.4930  
2.6805  
2.0726  
1.6144  
5.5  
5.4  
5.2  
5.1  
4.9  
20.0  
25.0  
30.0  
35.0  
40.0  
1.2506  
1.0000  
0.80487  
0.65188  
0.53115  
4.5  
4.4  
4.3  
4.2  
4
1.2506  
1.0000  
0.80487  
0.65188  
0.53115  
4.5  
4.4  
4.3  
4.2  
4
1.2663  
1.0000  
0.79483  
0.63570  
0.51148  
4.8  
4.7  
4.5  
4.4  
4.3  
45.0  
50.0  
55.0  
60.0  
65.0  
0.43528  
0.35868  
0.29714  
0.24741  
0.20701  
3.9  
3.8  
3.7  
3.6  
3.5  
0.43528  
0.35868  
0.29714  
0.24741  
0.20701  
3.9  
3.8  
3.7  
3.6  
3.5  
0.41392  
0.33683  
0.27556  
0.22660  
0.18727  
4.2  
4.1  
4.0  
3.9  
3.8  
70.0  
75.0  
80.0  
85.0  
90.0  
0.17403  
0.14696  
0.12465  
0.10617  
0.090792  
3.4  
3.3  
3.3  
3.2  
3.1  
0.17403  
0.14697  
0.12465  
0.10617  
0.090793  
3.4  
3.3  
3.3  
3.2  
3.1  
0.15550  
0.12972  
0.10869  
0.091465  
0.077286  
3.7  
3.6  
3.5  
3.4  
3.3  
95.0  
100.0  
105.0  
110.0  
115.0  
0.077946  
0.067168  
0.058090  
0.050414  
0.043904  
3
0.077946  
0.067168  
0.058089  
0.050413  
0.043899  
3
0.065567  
0.055840  
0.047739  
0.040960  
0.035267  
3.2  
3.2  
3.1  
3.0  
3.0  
2.9  
2.9  
2.8  
2.7  
2.9  
2.9  
2.8  
2.7  
120.0  
125.0  
130.0  
135.0  
140.0  
0.038356  
0.033613  
0.029545  
0.026046  
0.023026  
2.7  
2.6  
2.6  
2.5  
2.4  
0.038350  
0.033608  
0.029542  
0.026043  
0.023024  
2.7  
2.6  
2.6  
2.5  
2.4  
0.030468  
0.026407  
0.022960  
0.020024  
0.017515  
2.9  
2.8  
2.8  
2.7  
2.6  
145.0  
150.0  
155.0  
0.020411  
0.018142  
0.016167  
2.4  
2.3  
2.3  
0.020411  
0.018142  
0.016166  
2.4  
2.3  
2.3  
0.015364  
0.013515  
0.011920  
2.6  
2.5  
2.5  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 10 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
8334  
8346  
8352  
R/T No.  
T (°C)  
B25/100 = 4006 K  
RT/R25  
B25/100 = 4006 K  
B25/100 = 4280 K  
α (%/K) RT/R25  
α (%/K) RT/R25  
α (%/K)  
160.0  
165.0  
0.014442  
0.012933  
2.2  
2.2  
0.014442  
0.012932  
2.2  
2.2  
0.010541  
0.0093447 2.4  
2.4  
170.0  
175.0  
180.0  
185.0  
190.0  
0.011609  
0.010444  
0.0094167  
0.0085086  
0.0077040  
2.1  
2.1  
2
2
2
0.011607  
0.010442  
0.0094136  
0.0085056  
0.0077005  
2.1  
2.1  
2.1  
2
0.0083046 2.3  
0.0073978 2.3  
0.0066052 2.2  
0.0059108 2.2  
0.0053008 2.2  
2
195.0  
200.0  
205.0  
210.0  
215.0  
0.0069895  
0.0063536  
0.0057865  
0.0052797  
0.0048258  
1.9  
1.9  
1.9  
1.8  
1.8  
0.0069856  
0.0063495  
0.0057822  
0.0052752  
0.0048212  
1.9  
1.9  
1.9  
1.8  
1.8  
0.0047638 2.1  
0.0042900 2.1  
0.0038710 2.0  
0.0034997 2.0  
0.0031700 2.0  
220.0  
225.0  
230.0  
235.0  
240.0  
0.0044186  
0.0040525  
0.0037229  
0.0034254  
0.0031566  
1.7  
1.7  
1.7  
1.6  
1.6  
0.0044138  
0.0040476  
0.0037178  
0.0034201  
0.0031511  
1.7  
1.7  
1.7  
1.7  
1.6  
0.0028766 1.9  
0.0026150 1.9  
0.0023813 1.9  
0.0021721 1.8  
0.0019846 1.8  
245.0  
250.0  
255.0  
260.0  
265.0  
0.0029132  
0.0026925  
0.0024920  
0.0023096  
0.0021434  
1.6  
1.6  
1.5  
1.5  
1.5  
0.0029076  
0.0026867  
0.0024860  
0.0023035  
0.0021371  
1.6  
1.6  
1.5  
1.5  
1.5  
0.0018161 1.8  
0.0016646 1.7  
0.0015280 1.7  
0.0014046 1.7  
0.0012931 1.6  
270.0  
275.0  
280.0  
285.0  
290.0  
0.0019917  
0.0018531  
0.0017263  
0.0016101  
0.0015034  
1.5  
1.4  
1.4  
1.4  
1.4  
0.0019853  
0.0018466  
0.0017197  
0.0016034  
0.0014966  
1.5  
1.4  
1.4  
1.4  
1.4  
0.0011921 1.6  
0.0011005 1.6  
0.0010173 1.6  
0.00094163 1.5  
0.00087267 1.5  
295.0  
300.0  
0.0014054  
0.0013153  
1.3  
1.3  
0.0013986  
0.0013083  
1.3  
1.3  
0.00080977 1.5  
0.00075230 1.5  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 11 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Mounting instructions  
1
Soldering  
1.1  
Leaded NTC thermistors  
Leaded thermistors comply with the solderability requirements specified by CECC.  
When soldering, care must be taken that the NTC thermistors are not damaged by excessive  
heat. The following maximum temperatures, maximum time spans and minimum distances have  
to be observed:  
Dip soldering  
max. 260 °C  
max. 4 s  
Iron soldering  
max. 360 °C  
max. 2 s  
Bath temperature  
Soldering time  
Distance from thermistor  
min. 6 mm  
min. 6 mm  
Under more severe soldering conditions the resistance may change.  
1.2 Leadless NTC thermistors  
In case of NTC thermistors without leads, soldering is restricted to devices which are provided  
with a solderable metallization. The temperature shock caused by the application of hot solder  
may produce fine cracks in the ceramic, resulting in changes in resistance.  
To prevent leaching of the metallization, solder with silver additives or with a low tin content  
should be used. In addition, soldering methods should be employed which permit short soldering  
times.  
1.3  
SMD NTC thermistors  
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with  
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-  
ed as well as a proper cleaning of the PCB.  
Nickel barrier termination  
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the  
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.  
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The  
nickel barrier termination is suitable for all commonly-used soldering methods.  
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.  
Figure 1  
SMD NTC thermistors, structure of nickel barrier  
termination  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 12 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
1.3.1 Solderability (test to IEC 60068-2-58)  
Preconditioning: Immersion into flux F-SW 32.  
Evaluation criterion: Wetting of soldering areas ≥95%.  
Solder  
Bath temperature (°C)  
Dwell time (s)  
SnPb 60/40  
215 ±3  
245 ±3  
3 ±0.3  
3 ±0.3  
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)  
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)  
Preconditioning: Immersion into flux F-SW 32.  
Evaluation criterion: Leaching of side edges ≤1/3.  
Solder  
Bath temperature (°C)  
Dwell time (s)  
10 ±1  
SnPb 60/40  
260 ±5  
260 ±5  
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)  
10 ±1  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 13 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Wave soldering  
Temperature characteristic at component terminal with dual wave soldering  
Solder joint profiles for silver/nickel/tin terminations  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 14 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Reflow soldering  
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D  
Profile feature  
Sn-Pb eutectic assembly Pb-free assembly  
Preheat and soak  
- Temperature min  
- Temperature max  
- Time  
Average ramp-up rate  
Liquidous temperature  
Time at liquidous  
Peak package body temperature Tp  
Time (tP)3) within 5 °C of specified  
classification temperature (Tc)  
Tsmin  
Tsmax  
100 °C  
150 °C  
150 °C  
200 °C  
tsmin to tsmax 60 ... 120 s  
Tsmax to Tp 3 °C/ s max.  
60 ... 180 s  
3 °C/ s max.  
217 °C  
60 ... 150 s  
245 °C ... 260 °C2)  
TL  
tL  
183 °C  
60 ... 150 s  
220 °C ... 235 °C2)  
1)  
20 s3)  
30 s3)  
Average ramp-down rate  
Tp to Tsmax 6 °C/ s max.  
6 °C/ s max.  
Time 25 °C to peak temperature  
max. 6 minutes  
max. 8 minutes  
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.  
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.  
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.  
Note: All temperatures refer to topside of the package, measured on the package body surface.  
Number of reflow cycles: 3  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 15 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Solder joint profiles for silver/nickel/tin terminations  
1.3.3 Recommended geometry of solder pads  
Recommended maximum dimensions (mm)  
Case size  
inch/mm  
A
B
C
0402/1005 0.6  
0603/1608 1.0  
0805/2012 1.3  
1206/3216 1.8  
0.6  
1.0  
1.2  
1.2  
1.7  
3.0  
3.4  
4.5  
1.3.4 Notes  
Iron soldering should be avoided, hot air methods are recommended for repair purposes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 16 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
2
Conductive adhesion  
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of  
this method is that it involves no thermal stress. The adhesives used must be chemically inert.  
3
Clamp contacting  
Pressure contacting by means of clamps is particularly suitable for applications involving frequent  
switching and high turn-on powers.  
4
Robustness of terminations (leaded types)  
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm  
from the solder joint on the thermistor body or from the point at which they leave the feed-  
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The  
bending radius should be at least 0.75 mm.  
Tensile strength: Test Ua1:  
Leads  
≤0.25 mm = 1.0 N  
≤0.35 mm = 2.5 N  
≤0.50 mm = 5.0 N  
≤0.80 mm = 10.0 N  
≤1.25 mm = 20.0 N  
0.25 <  
0.35 <  
0.50 <  
0.80 <  
Bending strength: Test Ub:  
Two 90°-bends in opposite directions at a weight of 0.25 kg.  
Torsional strength: Test Uc: severity 2  
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.  
The bending radius of the leads should be approx. 0.75 mm. Two torsions of  
180° each (severity 2).  
When subjecting leads to mechanical stress, the following should be observed:  
Tensile stress on leads  
During mounting and operation tensile forces on the leads are to be avoided.  
Bending of leads  
Bending of the leads directly on the thermistor body is not permissible.  
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder  
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.  
The bending radius should be at least 0.75 mm.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 17 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
5
Sealing and potting  
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused  
by thermal expansion during the production process (curing / overmolding process) and during  
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure  
that the materials used (sealing / potting compound and plastic material) are chemically neutral.  
6
Cleaning  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
7
Storage  
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.  
Humidity, temperature and container materials are critical factors.  
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-  
terial may be deformed or SMDs may stick together, causing problems during mounting. After  
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.  
The components should be left in the original packing. Touching the metallization of unsoldered  
thermistors may change their soldering properties.  
Storage temperature:  
ꢀ25 °C up to 45 °C  
Relative humidity (without condensation):  
≤75% annual mean  
<95%, maximum 30 days per annum  
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-  
fied:  
SMDs with nickel barrier termination: 12 months  
SMDs with AgPd termination:  
Leaded components:  
6 months  
24 months  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 18 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
8
Placement and orientation of SMD NTC thermistors on PCB  
a) Component placement  
It is recommended that the PC board  
should be held by means of some  
adequate supporting pins such as  
shown left to prevent the SMDs from  
being damaged or cracked.  
b) Cracks  
When placing a component near an  
area which is apt to bend or a grid  
groove on the PC board, it is advisable  
to have both electrodes subjected to  
uniform stress, or to position the  
component's electrodes at right angles  
to the grid groove or bending line (see  
c) Component orientation).  
c) Component orientation  
Choose a mounting position that  
minimizes the stress imposed on the  
chip during flexing or bending of the  
board.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 19 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Cautions and warnings  
See "Important notes".  
Storage  
Store thermistors only in original packaging. Do not open the package prior to processing.  
Storage conditions in original packaging: storage temperature ꢀ25 °C ... +45 °C, relative  
humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is  
inadmissible.  
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the  
packing material may be deformed or components may stick together, causing problems during  
mounting.  
Avoid contamination of thermistor surface during storage, handling and processing.  
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).  
Use the components as soon as possible after opening the factory seals, i.e. the  
polyvinyl-sealed packages.  
Solder thermistors within the time specified after shipment from EPCOS.  
For leaded components this is 24 months, for SMD components with nickel barrier termination  
12 months, for SMD components with AgPd termination 6 months.  
Handling  
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused  
during handling of NTCs.  
Do not touch components with bare hands. Gloves are recommended.  
Avoid contamination of thermistor surface during handling.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
Bending / twisting leads  
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from  
the component head or housing. When bending ensure the wire is mechanically relieved at the  
component head or housing. The bending radius should be at least 0.75 mm.  
Soldering  
Use resin-type flux or non-activated flux.  
Insufficient preheating may cause ceramic cracks.  
Rapid cooling by dipping in solvent is not recommended.  
Complete removal of flux is recommended.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 20 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Mounting  
Ensure that no thermo-mechanical stress occurs due to production processes (curing or  
overmolding processes) when thermistors are sealed, potted or overmolded or during their  
subsequent operation. The maximum temperature of the thermistor must not be exceeded.  
Ensure that the materials used (sealing/potting compound and plastic material) are chemically  
neutral.  
Electrodes/contacts must not be scratched or damaged before/during/after the mounting  
process.  
Contacts and housing used for assembly with the thermistor must be clean before mounting.  
Ensure that adjacent materials are designed for operation at temperatures comparable to the  
surface temperature of the thermistor. Be sure that surrounding parts and materials can  
withstand the temperature.  
Avoid contamination of the thermistor surface during processing.  
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to  
an environment with normal atmospheric conditions.  
Tensile forces on cables or leads must be avoided during mounting and operation.  
Bending or twisting of cables or leads directly on the thermistor body is not permissible.  
Avoid using chemical substances as mounting aids. It must be ensured that no water or other  
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based  
substances (e.g. soap suds) must not be used as mounting aids for sensors.  
Operation  
Use thermistors only within the specified operating temperature range.  
Use thermistors only within the specified power range.  
Environmental conditions must not harm the thermistors. Only use the thermistors under  
normal atmospheric conditions or within the specified conditions.  
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be  
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For  
measurement purposes (checking the specified resistance vs. temperature), the component  
must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).  
Avoid dewing and condensation unless thermistor is specified for these conditions.  
Bending or twisting of cables and/or wires is not permissible during operation of the sensor in  
the application.  
Be sure to provide an appropriate fail-safe function to prevent secondary product damage  
caused by malfunction.  
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.  
Display of ordering codes for EPCOS products  
The ordering code for one and the same EPCOS product can be represented differently in data  
sheets, data books, other publications, on the EPCOS website, or in order-related documents  
such as shipping notes, order confirmations and product labels. The varying representations of  
the ordering codes are due to different processes employed and do not affect the  
specifications of the respective products. Detailed information can be found on the Internet  
under www.epcos.com/orderingcodes  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 21 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Symbols and terms  
Symbol  
English  
German  
Fläche  
A
Area  
AWG  
American Wire Gauge  
Amerikanische Norm für Drahtquerschnitte  
B
B value  
B-Wert  
B25/100  
B value determined by resistance  
measurement at 25 °C and 100 °C  
B-Wert, ermittelt durch Widerstands-  
messungen bei 25 °C und 100 °C  
Cth  
I
Heat capacitance  
Current  
Wärmekapazität  
Strom  
N
Number (integer)  
Anzahl (ganzzahliger Wert)  
P25  
Pdiss  
Pel  
Maximum power at 25 °C  
Power dissipation  
Electrical power  
Maximale Leistung bei 25 °C  
Verlustleistung  
Elektrische Leistung  
Pmax  
Maximum power within stated  
temperature range  
Maximale Leistung im  
angegebenenTemperaturbereich  
∆RB/RB  
Resistance tolerance caused by  
spread of B value  
Insulation resistance  
Parallel resistance  
Widerstandstoleranz, die durch die  
Streuung des B-Wertes verursacht wird  
Isolationswiderstand  
Rins  
RP  
Parallelwiderstand  
RR  
Rated resistance  
Nennwiderstand  
∆RR/RR  
RS  
Resistance tolerance  
Series resistance  
Widerstandstoleranz  
Serienwiderstand  
RT  
Resistance at temperature T  
(e.g. R25 = resistance at 25 °C)  
Widerstand bei Temperatur T  
(z.B. R25 = Widerstand bei 25 °C)  
T
Temperature  
Temperatur  
∆T  
t
Temperature tolerance  
Time  
Temperaturtoleranz  
Zeit  
TA  
Tmax  
Ambient temperature  
Upper category temperature  
Umgebungstemperatur  
Obere Grenztemperatur  
(Kategorietemperatur)  
Untere Grenztemperatur  
(Kategorietemperatur)  
Tmin  
Lower category temperature  
Top  
TR  
Tsurf  
Operating temperature  
Rated temperature  
Surface temperature  
Betriebstemperatur  
Nenntemperatur  
Oberflächentemperatur  
V
Voltage  
Spannung  
Vins  
Vop  
Vtest  
Insulation test voltage  
Operating voltage  
Test voltage  
Isolationsprüfspannung  
Betriebsspannung  
Prüfspannung  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 22 of 25  
Temperature measurement  
Glass-encapsulated sensors  
B57560G1  
G1560  
Symbol  
English  
German  
α
Temperature coefficient  
Tolerance, change  
Dissipation factor  
Temperaturkoeffizient  
Toleranz, Änderung  
Wärmeleitwert  
∆
δth  
τc  
τa  
Thermal cooling time constant  
Thermal time constant  
Thermische Abkühlzeitkonstante  
Thermische Zeitkonstante  
Abbreviations / Notes  
Symbol  
English  
German  
Surface-mounted devices  
Oberflächenmontierbares Bauelement  
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-  
codes, type designations etc.  
code oder für die Typenbezeichnung.  
Platzhalter für einen Buchstaben.  
Alle Maße sind in mm angegeben.  
+
To be replaced by a letter.  
All dimensions are given in mm.  
The commas used in numerical values Verwendete Kommas in Zahlenwerten  
denote decimal points. bezeichnen Dezimalpunkte.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 23 of 25  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical re-  
quirements that are often placed on our products in the areas of application concerned. We  
nevertheless expressly point out that such statements cannot be regarded as binding  
statements about the suitability of our products for a particular customer application.  
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar  
with them than the customers themselves. For these reasons, it is always ultimately incum-  
bent on the customer to check and decide whether an EPCOS product with the properties de-  
scribed in the product specification is suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or  
failure before the end of their usual service life cannot be completely ruled out in the  
current state of the art, even if they are operated as specified. In customer applications  
requiring a very high level of operational safety and especially in customer applications in  
which the malfunction or failure of an electronic component could endanger human life or  
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by  
means of suitable design of the customer application or other action taken by the customer  
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by  
third parties in the event of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this  
publication may contain substances subject to restrictions in certain jurisdictions (e.g.  
because they are classed as hazardous). Useful information on this will be found in our Ma-  
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-  
tailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order. We also  
reserve the right to discontinue production and delivery of products. Consequently, we  
cannot guarantee that all products named in this publication will always be available. The  
aforementioned does not apply in the case of individual agreements deviating from the fore-  
going for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-  
sion of the "General Terms of Delivery for Products and Services in the Electrical In-  
dustry" published by the German Electrical and Electronics Industry Association  
(ZVEI).  
Page 24 of 25  
Important notes  
7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP,  
CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,  
MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine,  
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D,  
SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and  
in other countries. Further information will be found on the Internet at  
www.epcos.com/trademarks.  
Page 25 of 25  

相关型号：

SI9130DB

 5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

 Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明