B58033I5206M001 [TDK]
CeraLink®电容器;
| 型号： | B58033I5206M001 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | CeraLink®电容器 电容器 |
| 文件： | 总20页 (文件大小：541K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CeraLink
Capacitors for fast-switching semiconductors
Series/Type:
Ordering code:
Solder pin (SP) series
B58033*
Date:
Version:
2019-07-09
6.2
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Identification/Classification 1
(header 1 + top left bar):
Identification/Classification 2
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
Preliminary data (optional):
Department:
CeraLink
Capacitors for fast-switching semiconductors
B58033*
Solder pin (SP) series
PPD PI AE/IE PD
2019-07-09
Date:
Version:
6.2
Prepared by :
Dr. Hopfer
Signed by:
Modifications:
Dr. Hopfer, Dr. Paulitsch, Mr. Kastl
p3 - tolerance range added for Ceff
TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without TDK Electronics' prior express consent is prohibited.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Applications
Power converters and inverters
DC link/snubber capacitor for power converters and inverters
Features
High ripple current capability
High temperature robustness
Low equivalent serial inductance (ESL)
Low equivalent serial resistance (ESR)
Low power loss
Low dielectric absorption
Optimized for high frequencies up to several 100 kHz
Increasing capacitance with DC bias up to operating voltage
High capacitance density
Minimized dielectric loss at high temperatures
Qualification based on AEC-Q200 rev. D
Construction
RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate)
Copper inner electrodes
Silver outer electrodes
Silver coated copper pins
Silicone based casting compound according to UL 94 V-0
Plastic housing according to UL 94 V-0
General technical data
Dissipation factor
< 0.02
> 1
-40 … +150
approx. 31
tan ꢀ
Rins, typ
Tdevice
1)
Insulation resistance
Operating device temperature
Weight of device
GΩ
°C
g
1) Typical insulation resistance, measured at operating voltage Vop and measurement time > 240 s, +25 °C
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 2 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Electrical specifications and ordering codes
Type
Vpk, max VR
Vop
Cnom, typ Ceff
C0
Ordering code
V
V
V
µF
20
10
5
µF
µF
SP500
SP700
SP900
650
1000
1300
500
700
900
400
600
800
12 ± 20%
5 ± 20%
3 ± 20%
6.5 ± 20%
2.8 ± 20%
1.5 ± 20%
B58033I5206M001
B58033I7106M001
B58033I9505M001
Typical values as a design reference for CeraLink® applications
1)
1)
VR
ESR
0 VDC,
0.5 VRMS
ESR
0 VDC,
0.5 VRMS
ESL
Iop
Iop
100 kHz
Tamb = 105 °C
100 kHz
amb = 85 °C
,
,
T
25 °C, 1 kHz
25 °C, 100 kHz
V
mΩ
mΩ
nH
ARMS
ARMS
500
700
900
275
4
4
41
32
550
11
18
4
4
33
26
27
24
1000
1) Normal operating current without forced cooling at Tdevice = +150 °C. Higher values permissible at reduced lifetime.
Dimensional drawings
Dimensions in mm
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 3 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Polarity
Note that polarity is only for incoming inspection purposes and it does not affect operation. If put under reverse
rated voltage VR, CeraLink is repoled and works identically.
Equivalent circuit diagram
Marking of components
Manufacturer’s logo
CeraLink type
Nominal capacitance
Rated voltage
PPD PI AE/IE PD
2019-07-09
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Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Typical characteristics as a function of temperature and voltage VR = 500 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff and tan δ which are given on page 2 and 3 of this data sheet.
120
110
100
90
Voltage
[VDC]
0
400
500
Temperature
120
110
100
90
[°C]
-25
25
85
125
80
80
70
70
60
60
50
50
40
0
0
0
100
100
100
200
300
400
400
400
500
500
500
-50
-50
-50
0
0
0
50
100
100
100
150
150
150
Voltage [VDC]
Temperature [°C]
Temperature
Voltage
[VDC]
0
400
500
[°C]
-25
25
85
125
500
400
300
200
100
0
500
400
300
200
100
0
200
300
50
Voltage [VDC]
Temperature [°C]
500
400
300
200
100
0
600
500
400
300
200
100
0
Temperature
Voltage
[VDC]
0
400
500
[°C]
-25
25
85
125
200
300
50
Voltage [VDC]
Temperature [°C]
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 20
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 500 V
Large signal capacitance:
225
200
175
150
125
100
75
Variable
large signal
small signal
Quasistatic (slow variation of the voltage), +25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, +25 °C
50
The effective capacitance is defined as the small
signal capacitance at Vop.
0
100
200
300
400
500
Voltage [VDC]
Typical impedance and ESR as a function of frequency VR = 500 V
1000
Variable
|Z|
ESR
100
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = +25 °C
10
1
0.1
0.01
0.001
1000
10000
100000
Frequency [Hz]
1000000
Typical permissible current as a function of frequency VR = 500 V
45
40
35
30
25
20
15
Tamb
[°C]
85
Measurement performed at Vop.
The values correspond to a device temperature of
+150 °C.
No active cooling was used.
Note hat with additional cooling the typical
permissible current can be significantly higher.
105
0
20
40
60
80
100
Frequency [Hz]
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time. The typical aging
rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 6 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Typical characteristics as a function of temperature and voltage VR = 700 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The
100% values correspond to Ceff and tan δ which are given on page 2 and 3 of this data sheet.
130
120
110
100
90
140
120
100
80
T/°C
-25
25
75
125
Bias
[VDC]
0
600
700
80
70
60
60
40
50
40
20
0
0
0
100
100
100
200
200
200
300
400
500
500
500
600
600
600
700
700
700
-50
-50
-50
0
0
0
50
100
100
100
150
150
150
Voltage [VDC]
Temperature [°C]
T/°C
-25
25
75
125
Bias
[VDC]
0
600
700
600
500
400
300
200
100
0
600
500
400
300
200
100
0
300
400
50
Voltage [VDC]
Temperature [°C]
500
400
300
200
100
0
Bias
[VDC]
0
600
700
600
500
400
300
200
100
0
T/°C
-25
25
75
125
300
400
50
Voltage [VDC]
Temperature [°C]
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 20
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 700 V
Large signal capacitance:
Variable
large signal * V
small signal * Bias [V]
200
Quasistatic (slow variation of the voltage),
+25 °C
175
The nominal capacitance is defined as
the large signal capacitance at Vop.
150
125
See glossary for further information.
100
Small signal capacitance:
75
0.5 VRMS, 1 kHz, +25 °C
50
0
100
200
300
400
500
600
700
The effective capacitance is defined as
the small signal capacitance at Vop.
Voltage [VDC]
Typical impedance and ESR as a function of frequency VR = 700 V
100
Variable
|Z|
ESR
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = +25 °C
10
1
0.1
0.01
0.001
1000
10000
100000
1000000
Frequency [Hz]
Typical permissible current as a function of frequency VR = 700 V
35
30
25
20
15
10
Tamb [°C]
85 grag
105 grad
Measurement performed at Vop.
The values correspond to a device temperature
of +150 °C.
No active cooling was used.
Note hat with additional cooling the typical
permissible current can be significantly higher.
0
20
40
60
80
100
Frequency [Hz]
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time. The typical
aging rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 8 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Typical characteristics as a function of temperature and voltage VR = 900 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff and tan δ which are given on page 2 and 3 of this data sheet.
140
120
100
80
130
120
110
100
90
T/°C
-25
25
75
125
Bias [V]
0
800
900
80
70
60
60
50
40
40
0
100
200
300
400
500
600
700
800
900
-50
0
0
0
50
100
100
100
150
150
150
Voltage [VDC]
Temperature [°C]
700
600
500
400
300
200
100
0
Bias [V]
0
800
700
600
500
400
300
200
100
0
T/°C
-25
25
75
125
900
0
100
200
300
400
500
600
700
800
900
-50
50
Voltage [VDC]
Temperature [°C]
600
500
400
300
200
100
0
T/°C
-25
25
75
125
500
400
300
200
100
0
Bias [V]
0
800
900
0
100
200
300
400
500
600
700
800
900
-50
50
Voltage [VDC]
Temperature [°C]
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 20
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 900 V
Large signal capacitance:
Variable
large signal
small signal
200
175
150
125
100
75
Quasistatic (slow variation of the voltage), +25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, +25 °C
50
The effective capacitance is defined as the small
signal capacitance at Vop.
0
100
200
300
400
500
600
700
800
900
Voltage [VDC]
Typical impedance and ESR as a function of frequency VR = 900 V
Variable
Z [Ohm]
ESR [Ohm]
100
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = +25 °C
10
1
0.1
0.01
0.001
1000
10000
100000
1000000
10000000
Frequency [Hz]
Typical permissible current as a function of frequency
Tamb
26
[°C]
85.0
Measurement performed at Vop.
The values correspond to a device temperature
of +150 °C.
No forced cooling was used.
Note hat with additional cooling the typical
permissible current can be significantly higher.
24
22
20
18
16
14
12
10
105
0
20
40
60
80
100
Frequency [kHz]
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time. The typical aging rate
is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 10 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Reliability
A. Preconditioning:
Solder the capacitor on a PCB using the recommended soldering profile
Check of external appearance
Measurement of electrical parameters Rins, C0, tan δ
o
Apply Vpk,max for 60 seconds and measure Rins at room temperature:
Isolation resistance (@Vpk,max, 60 s, 25 °C)
Rins > 100 MΩ
o
Measure C0 and tan δ within 10 minutes to 1 hour afterwards:
Initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
tan δ < 0.02
B. Performance of a specific reliability test.
C. After performing a specific test:
Check the external appearance again
Repeat the measurement of the electrical parameters
o
o
o
Apply Vpk,max for 60 seconds and measure Rins at room temperature:
Isolation resistance (@Vpk,max, 60 s, 25 °C)
Rins > 10 MΩ
Measure C0 and tan δ:
Change of initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
|ΔC0 / C0| < 15%
Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C) tan δ < 0.05
Test
Standard
Test conditions
Criteria
External
appearance
Visual inspection with magnifying glass
No defects that might affect
performance
High
MIL-STD-202,
+150 °C, VR, 1000 hours
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
temperature method 108
operating life
High
MIL-STD-202,
+150 °C, unpowered, 1000 hours
+85 °C, 85% rel. hum., VR, 1000 hours
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
temperature method 108
exposure
Biased
humidity
MIL-STD-202,
method 103
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
Moisture
resistance
MIL-STD-202,
method 106
+25 °C to +65 °C
90% rel. hum. to 100% rel. hum.
10 cycles, unpowered
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
Temperature MIL-STD-202,
-55 °C to +150 °C, 20 seconds transfer time , No mechanical damage
shock
method 107
15 minutes dwell time, 1000 cycles
|ΔC0 / C0|, tan δ and Rins
within defined limits
Vibration
MIL-STD-202,
method 204
5 g/ 20 min, 12 cycles, 3 axis
10 Hz to 2000 Hz
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
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2019-07-09
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Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Test
Standard
Test conditions
Criteria
Mechanical
shock
MIL-STD-202,
method 213
Acceleration 400 m/s²
Half sine pulse duration 6 milliseconds
4000 bumps
No mechanical damage
|ΔC0 / C0|, tan δ and Rins
within defined limits
Resistance to MIL-STD-202,
Dip test of contact areas in solder bath
(+260 °C for 10 seconds)
No damage of pin silver
coating, |ΔC0 / C0|, tan δ and
Rins within defined limits
soldering
heat
method 210,
condition B
Solderability J-STD-002,
method A
Dip test of contact areas in solder bath
(+235 °C for 5 seconds)
Dipped surface is covered
with solder coating
Resistance to
solvent
Dipping and cleaning with isopropanol
Marking must be legible
|ΔC0 / C0|, tan δ and Rins
within defined limits
Geometry
Using a caliper and a gauge
Within specified values in the
chapter dimensional drawing
Packaging
The CeraLink SP type will be delivered in a tube and will be packed in a cardboard box.
The packaging unit is 20 pieces per tube. The tube is terminated with one pin and two plugs.
Dimensions in mm
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2019-07-09
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Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Recommended wave soldering profile
Temperature characteristic at component terminal with dual-wave soldering
Notes:
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB.
After the soldering process, the capacitance is lowered. Applying VR to the device will re-establish the
capacitance.
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 13 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
General technical information
Storage
Only store CeraLink capacitors in their original packaging. Do not open the package prior to
processing.
Storage conditions in original packaging: temperature −25 °C to +45 °C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraLink capacitors where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CeraLink may stick together, causing problems during
mounting.
Avoid contamination of the CeraLink surface during storage, handling and processing.
Avoid storing CeraLink devices in harmful environments where they are exposed to corrosive
gases (e.g. SOx, Cl).
Use CeraLink as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CeraLink components within 6 months after shipment.
Handling
Do not drop CeraLink components or allow them to be chipped.
Do not touch CeraLink with your bare hands - gloves are recommended.
Avoid contamination of the CeraLink surface during handling.
Mounting
Do not scratch the external electrodes before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraLink components are clean before
mounting.
The surface temperature of an operating CeraLink can be higher than the ambient temperature.
Ensure that adjacent components are placed at a sufficient distance from a CeraLink to allow
proper cooling.
Avoid contamination of the CeraLink surface during processing.
Soldering guidelines
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the CeraLink
surface and deteriorate its insulation resistance. Insufficient or improper cleaning of the CeraLink
may cause damage to the component.
PPD PI AE/IE PD
2019-07-09
Please read Cautions and warnings and
Page 14 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Glossary
Initial capacitance C0:
Is the value at the origin of the hysteresis without any applied direct
voltage.
Effective capacitance Ceff:
Occurs at Vop and is measured with an applied ripple voltage of
0.5 VRMS and 1 kHz. The CeraLink is designed to have its highest
capacitance value at the operating voltage Vop.
Nominal capacitance Cnom
:
Is the value derived by the tangent of the mean hysteresis as the
derivative of the mean hysteresis is dQ/dV ~ C.
PPD PI AE/IE PD
2019-07-09
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Page 15 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Symbols and terms
AC
Alternating current
C0
Initial capacitance @ 0 VDC, 0.5 VRMS, 1 kHz, +25 °C
Effective capacitance @ Vop, 0.5 VRMS, 1 kHz, +25 °C
Ceff,
Cnom,typ
Typical nominal capacitance @ Vop, quasistatic, +25 °C. See glossary (page 17)
for definition of the nominal capacitance
DC
Direct current
ESL
ESR
Iop
Equivalent serial inductance
Equivalent serial resistance
Operating ripple current, root mean square value of sinusoidal AC current
Printed circuit board
PCB
PLZT
Rins
Lead lanthanum zirconium titanate
Insulation resistance @ Vpk,max, measurement time t = 60 s, +25 °C
Insulation resistance @ Vop, measurement time t > 240 s, +25 °C
Ambient temperature
Rins, typ
Tamb
tan δ
Tdevice
Dissipation factor @ 0 VDC, 0.5 VRMS,1 kHz, +25°C
Device temperature. Tdevice = Tamb + ΔT (ΔT defines the self-heating of the
device due to applied current).
Vop
Operating voltage at maximum attenuation capability
Rated voltage. Reference DC voltage for reliability tests.
Root mean square value of sinusoidal AC voltage
Maximum peak operating voltage
VR
VRMS
Vpk,max
ΔT
Increase of temperature during operation
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Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Cautions and warnings
General
Not for use in resonant circuits, where a voltage of alternating polarity occurs.
Not for AC applications. Consult our sales representative for further details.
If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity.
Some parts of this publication contain statements about the suitability of our CeraLink components for
certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CeraLink devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of our
CeraLink components for a particular customer application. As a rule, TDK is either unfamiliar with
individual customer applications or less familiar with them than the customers themselves. For these
reasons, it is always incumbent on the customer to check and decide whether the CeraLink devices
with the properties described in the product specification are suitable for use in a particular customer
application.
Do not use CeraLink components for purposes not identified in our specifications.
Ensure the suitability of a CeraLink in particular by testing it for reliability during design-in.
Always evaluate a CeraLink component under worst-case conditions.
Pay special attention to the reliability of CeraLink devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Consider derating at higher operating temperatures. As a rule, lower temperatures and voltages
increase the life time of CeraLink devices.
If steep surge current edges are to be expected, make sure your design is as low-inductive as
possible.
In some cases the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage is sustained
by third parties in the event of such a malfunction or failure.
Specified values only apply to CeraLink components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CeraLink devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures such as
thermal fuses.
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CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
Operation
Use CeraLink only within the specified operating temperature range.
Use CeraLink only within specified voltage and current ranges.
The CeraLink has to be operated in a dry atmosphere, which must not contain any additional
chemical vapors or substances.
Environmental conditions must not harm the CeraLink. Use the capacitors under normal
atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not
permissible.
Prevent a CeraLink from contacting liquids and solvents.
Avoid dewing and condensation.
During operation, the CeraLink can produce audible noise due to its piezoelectric characteristic.
CeraLink components are mainly designed for encased applications. Under all circumstances
avoid exposure to:
o
o
o
o
o
direct sunlight
rain or condensation
steam, saline spray
corrosive gases
atmosphere with reduced oxygen content
This listing does not claim to be complete, but merely reflects the experience of the manufacturer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to
different processes employed and do not affect the specifications of the respective products.
Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
.
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Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than
the customers themselves. For these reasons, it is always ultimately incumbent on the customer
to check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
1. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
2. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and
customer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of
unilateral requirements, we hereby like to emphasize that only requirements mutually agreed
upon can and will be implemented in our Quality Management System. For clarification
purposes we like to point out that obligations from IATF 16949 shall only become legally binding if
individually agreed upon.
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2019-07-09
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Page 19 of 20
Important notes at the end of this document.
CeraLink
B58033*
Capacitors for fast-switching semiconductors
Solder pin (SP) series
3. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
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Page 20 of 20
Important notes at the end of this document.
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