B59535T1120A262 [TDK]

通讯保护用PTC;


型号：	B59535T1120A262
厂家：	TDK ELECTRONICS
描述：	通讯保护用PTC 过载保护电阻器
文件：	总14页 (文件大小：593K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PTC thermistors

Series/Type:

T1550, T1509, T1735, T1535

The following products presented in this data sheet are being withdrawn.

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last Last

Orders

Shipments

B59735T1150A062

B59550T1120A262

B59550T1120A062

2019-03-01

2019-06-07

2019-09-07

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last Last

Orders

Shipments

B59535T1120A262

B59535T1120A062

B59509T1120A062

2019-03-01

2019-06-07

2019-09-07

Please contact your nearest TDK sales office if you need support in selecting a suitable

substitute. The addresses of our worldwide sales network are presented at www.tdk-

electronics.tdk.com/sales.

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Applications

Internal circuit

Overcurrent protection for telecom applications

Suitable for line card applications e.g. POTS, access

networks, customer premises equipment (CPE) or integrated

voice data (IVD)

Features

Two resistance-matched PTCs in a plastic housing

Compliant with ITU-T standards

ꢀ

basic-level lightning surges (10/700 µs)

basic-level power induction (600 V, 1 A, 0.2 s)

power contact criteria A/B (230 V, 15 min.)

Compliant with GR-1089 AC power contact 120 V, 25 A, 15

min.

Suitable for continuous connection to mains voltages of

110/230 V AC in tripped (high-ohmic) condition

Housing material to UL94-V0

UL approval to UL 1434 (file number E69802) for selected

types

Tight resistance matching maintained after switching

Negligible resistance drift after reflow soldering or switching

Marked with manufacturer's logo, type designation and date

code

RoHS-compatible

Options

Alternative tolerances and resistances on request

Delivery mode

T15** and T16**: Blister tape, 330-mm reel with 16-mm tape, taping to IEC 60286-3

T17** and T18**: Blister tape, 380-mm reel with 24-mm tape, taping to IEC 60286-3

General technical data

Maximum fault voltage¹⁾

Max. operating voltage

Operating temperature range

Insulating test voltage between PTC1 and PTC2

Resistance matching in one housing

V_F,max

V_max

T_op

V_ins

245

135

V AC

(V = 0)

(V = V_max

ꢀ20/+125 °C

0/+70

> 3

)

°C

Ω

ꢁR₂ꢀ R₁ꢁ < 1.0

1) The maximum fault voltage V_F,maxis the highest voltage that is permitted to be applied across the PTC thermistor in protection mode.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 2 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Electrical specifications and ordering codes

R_R

∆R_R

I_R

I_S

I_Smax

Type

Approvals Ordering code

@ 25 °C @ 70 °C @ 25 °C

Ω

Component height max. 7.3

T1535 35

T1550 50

+15/ꢀ20 100

±15 80

210

170

2.5

ꢀ

B59535T1120A262

B59550T1120A262

Component height max. 8.3

T1509 ±10 180

+15/ꢀ20 110

±15 90

120

360

230

190

1.0

4.6

2.5

ꢀ

B59509T1120A062

B59535T1120A062

B59550T1120A062

T1535 35

T1550 50

Component height max. 9.9

T1635 35

T1650 50

+15/ꢀ20 110

±15 90

230

190

4.6

2.5

B59635T1120A062

B59650T1120A062

Component height max. 10.5

T1735 35

T1750 50

+15/ꢀ20 110

+15/ꢀ20 130

230

270

190

4.6

3.6

2.5

ꢀ

B59735T1120A062

B59735T1150A062

B59750T1120A062

±15

Component height max. 11.5

T1835 35 +15/ꢀ20 115

240

4.6

B59835T1120A062

Switching times and ordering codes

t_S(typ.)

@ I_Smax

t_S(typ.)

@ 1 A

t_S(typ.)

@ 500 mA

Type

Ordering code

Component height max. 7.3

T1535

T1550

0.07

0.05

0.4

0.3

1.7

1.2

B59535T1120A262

B59550T1120A262

Component height max. 8.3

T1509

T1535

T1550

0.04

0.1

0.8

0.6

3.4

2.4

B59509T1120A062

B59535T1120A062

B59550T1120A062

Component height max. 9.9

T1635

T1650

0.04

0.1

0.8

0.6

3.4

2.4

B59635T1120A062

B59650T1120A062

Component height max. 10.5

T1735

T1750

0.04

0.1

0.8

1.1

0.6

3.4

4.5

2.4

B59735T1120A062

B59735T1150A062

B59750T1120A062

Component height max. 11.5

T1835 0.06 1.1

4.5

B59835T1120A062

Please read Cautions and warnings and

Important notes at the end of this document.

Page 3 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Internal circuit

Dimensional drawings in mm

Maximum component height 7.3 mm

Solder pad

Maximum component height 8.3 mm

Solder pad

Please read Cautions and warnings and

Important notes at the end of this document.

Page 4 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Dimensional drawings in mm

Maximum component height 9.9 mm

Solder pad

Maximum component height 10.5 mm

Solder pad

Maximum component height 11.5 mm

Solder pad

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Reliability data

Test

Standard

Test conditions

ꢁ∆R₂₅/R₂₅ꢁ

Electrical endurance, IEC 60738-1

cycling

Room temperature, I_Smax; V_max

Number of cycles: 10

< 20%

Electrical endurance, IEC 60738-1

constant

Storage at V_maxand T_op,max(@ V_max

Test duration: 1000 h

)

< 25%

< 10%

Damp heat

IEC 60738-1

Temperature of air: 40 °C

Relative humidity of air: 93%

Duration: 56 days

Test according to IEC 60068-2-78

Rapid change

of temperature

T₁= T_op,min(0 V), T₂= T_op,max(0 V)

Number of cycles: 5

Test duration: 30 min

< 10%

< 5%

Test according to IEC 60068-2-14, test Na

Vibration

Frequency range: 10 to 55 Hz

Displacement amplitude: 0.75 mm

Test duration: 3 × 2 h

Test according to IEC 60068-2-6, test Fc

Shock

IEC 60738-1

Acceleration: 400 m/s²

Pulse duration: 6 ms; 6 × 5000 pulses

< 5%

Climatic sequence

Dry heat: T = T_op,max(0 V)

Test duration: 16 h

< 10%

Damp heat first cycle

Cold: T = T_op,min(0 V)

Test duration: 2 h

Damp heat 5 cycles

Tests performed according to

IEC 60068-2-30

Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

ITU performance overview and fault conditions

ITU K20

Test

ITU K21

Enhanced Basic

ITU K45

Enhanced Basic

Basic

Enhanced

no.

test level test level test level test level test level test level

Power induction

Power contact

Lightning surge

600 V AC, R = 600 Ω, t = 0.2 s, criteria A

Power induction

Power contact

600 V AC, R = 600 Ω, t = 1.0 s, with GDT, criteria A

1500 V AC, R = 200 Ω, t = 2.0 s, with GDT, criteria A

230 V AC, t = 15 min, R = 10 ... 1000 Ω, criteria B

230 V AC, t = 15 min, R = 10, 20, 40, 80, 1000 Ω, criteria B,

R = 160, 300, 600 Ω, criteria A

V_c(max)= 1.0 kV, R = 25 Ω, t = 10/700 µs, without GDT, criteria A

V_c(max)= 1.5 kV, R = 25 Ω, t = 10/700 µs, without GDT, criteria A

V_c(max)= 4.0 kV, R = 25 Ω, t = 10/700 µs, with GDT, criteria A

V_c(max)= 6.0 kV, R = 25 Ω, t = 10/700 µs, with GDT, criteria A

Lightning surge

Note: Use a GDT (gas discharge tube) with adequate electrical properties in order to

ensure reliable operation at enhanced test levels (power induction, lightning surge).

Criteria A: no damage, function must be fulfilled.

Criteria B: no fire hazard.

Electrical requirements according to GR-1089 standard for AC power contact

AC voltage: 120 V, 50 Hz, short circuit current 25 A, time 15 min, criteria A.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 7 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Cautions and warnings

General

EPCOS thermistors are designed for specific applications and should not be used for purposes

not identified in our specifications, application notes and data books unless otherwise agreed

with EPCOS during the design-in-phase.

Ensure suitability of thermistor through reliability testing during the design-in phase. The ther-

mistors should be evaluated taking into consideration worst-case conditions.

Storage

Store thermistors only in original packaging. Do not open the package prior to processing.

Storage conditions in original packaging: storage temperature ꢀ25 °C ... +45 °C, relative hu-

midity ≤75% annual mean, maximum 95%, dew precipitation is inadmissible.

Avoid contamination of thermistors surface during storage, handling and processing.

Avoid storage of thermistor in harmful environment with effect on function on long-term opera-

tion (examples given under operation precautions).

Use thermistor within the following period after delivery:

ꢀ

Through-hole devices (housed and leaded PTCs): 24 months

Motor protection sensors, glass-encapsulated sensors and probe assemblies: 24 months

Telecom pair and quattro protectors (TPP, TQP): 24 months

Leadless PTC thermistors for pressure contacting: 12 months

Leadless PTC thermistors for soldering: 6 months

SMDs in EIA sizes 3225 and 4032, and for PTCs with metal tags: 24 months

SMDs in EIA sizes 1210 and smaller: 12 months

Handling

PTCs must not be dropped. Chip-offs must not be caused during handling of PTCs.

The ceramic and metallization of the components must not be touched with bare hands. Gloves

are recommended.

Avoid contamination of thermistor surface during handling.

Soldering (where applicable)

Use rosin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Standard PTC heaters are not suitable for soldering.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 8 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Mounting

Electrode must not be scratched before/during/after the mounting process.

Contacts and housing used for assembly with thermistor have to be clean before mounting. Es-

pecially grease or oil must be removed.

When PTC thermistors are encapsulated with sealing material, the precautions given in chapter

"Mounting instructions", "Sealing and potting" must be observed.

When the thermistor is mounted, there must not be any foreign body between the electrode of

the thermistor and the clamping contact.

The minimum force and pressure of the clamping contacts pressing against the PTC must be

10 N and 50 kPa, respectively. In case the assembly is exposed to mechanical shock and/ or

vibration this force should be higher in order to avoid movement of the PTC during operation.

During operation, the thermistor’s surface temperature can be very high. Ensure that adjacent

components are placed at a sufficient distance from the thermistor to allow for proper cooling at

the thermistors.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of thermistor. Be sure that surrounding parts and materials can withstand

this temperature.

Avoid contamination of thermistor surface during processing.

Operation

Use thermistors only within the specified temperature operating range.

Use thermistors only within the specified voltage and current ranges.

Environmental conditions must not harm the thermistors. Use thermistors only in normal at-

mospheric conditions. Avoid use in deoxidizing gases (chlorine gas, hydrogen sulfide gas, am-

monia gas, sulfuric acid gas etc), corrosive agents, humid or salty conditions. Contact with any

liquids and solvents should be prevented.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage

caused by abnormal function (e.g. use VDR for limitation of overvoltage condition).

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Display of ordering codes for EPCOS products

The ordering code for one and the same EPCOS product can be represented differently in data

sheets, data books, other publications, on the EPCOS website, or in order-related documents

such as shipping notes, order confirmations and product labels. The varying representations of

the ordering codes are due to different processes employed and do not affect the

specifications of the respective products. Detailed information can be found on the Internet

under www.epcos.com/orderingcodes

Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Symbols and terms

Symbol

Term

Area

Capacitance

C_th

Heat capacity

Frequency

Current

I_max

I_R

Maximum current

Rated current

I_res

Residual current

I_PTC

I_r

PTC current

Residual currrent

I_r,oil

I_r,air

I_RMS

I_S

Residual currrent in oil (for level sensors)

Residual currrent in air (for level sensors)

Root-mean-square value of current

Switching current

I_Smax

LCT

Maximum switching current

Lower category temperature

Number (integer)

N_c

Operating cycles at V_max, charging of capacitor

Switching cycles at V_max, failure mode

Power

N_f

P₂₅

P_el

Maximum power at 25 °C

Electrical power

P_diss

R_G

R_min

R_R

Dissipation power

Generator internal resistance

Minimum resistance

Rated resistance @ rated temperature T_R

Tolerance of R_R

∆R_R

R_P

Parallel resistance

R_PTC

R_ref

R_S

PTC resistance

Reference resistance

Series resistance

R₂₅

R_25,match

∆R₂₅

Resistance at 25 °C

Resistance matching per reel/ packing unit at 25 °C

Tolerance of R₂₅

Please read Cautions and warnings and

Important notes at the end of this document.

Page 10 of 13

Overcurrent protection for telecom

Telecom pair protector (TPP), SMD

Temperature

Time

T_A

Ambient temperature

t_a

Thermal threshold time

T_C

Ferroelectric Curie temperature

Settling time (for level sensors)

Rated temperature @ 25 °C or otherwise specified in the data sheet

Sensing temperature

t_E

T_R

T_sense

T_op

Operating temperature

T_PTC

t_R

PTC temperature

Response time

T_ref

Reference temperature

T_Rmin

t_S

Temperature at minimum resistance

Switching time

T_surf

UCT

V or V_el

V_c(max)

V_F,max

V_RMS

V_BD

V_ins

V_link,max

V_max

V_max,dyn

V_meas

V_meas,max

V_R

Surface temperature

Upper category temperature

Voltage (with subscript only for distinction from volume)

Maximum DC charge voltage of the surge generator

Maximum voltage applied at fault conditions in protection mode

Root-mean-square value of voltage

Breakdown voltage

Insulation test voltage

Maximum link voltage

Maximum operating voltage

Maximum dynamic (short-time) operating voltage

Measuring voltage

Maximum measuring voltage

Rated voltage

V_PTC

Voltage drop across a PTC thermistor

Temperature coefficient

∆

Tolerance, change

δ_th

Dissipation factor

τ_th

Thermal cooling time constant

Failure rate

Lead spacing (in mm)

Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 13

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical

requirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application. As a

rule we are either unfamiliar with individual customer applications or less familiar with them than

the customers themselves. For these reasons, it is always ultimately incumbent on the customer

to check and decide whether a product with the properties described in the product specification is

suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure

before the end of their usual service life cannot be completely ruled out in the current state

of the art, even if they are operated as specified. In customer applications requiring a very high

level of operational safety and especially in customer applications in which the malfunction or

failure of an electronic component could endanger human life or health (e.g. in accident

prevention or life-saving systems), it must therefore be ensured by means of suitable design of the

customer application or other action taken by the customer (e.g. installation of protective circuitry

or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or

failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently,

we cannot guarantee that all products named in this publication will always be available.

The aforementioned does not apply in the case of individual agreements deviating from the

foregoing for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The IATF certifications confirm our compliance with requirements regarding the quality

management system in the automotive industry. Referring to customer requirements and

customer specific requirements (“CSR”) TDK always has and will continue to have the policy of

respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of

unilateral requirements, we hereby like to emphasize that only requirements mutually agreed

upon can and will be implemented in our Quality Management System. For clarification

purposes we like to point out that obligations from IATF 16949 shall only become legally binding if

individually agreed upon.

Page 12 of 13

Important notes

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,

MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,

SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,

WindCap are trademarks registered or pending in Europe and in other countries. Further

information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.

Release 2018-10

Page 13 of 13

B59535T1120A262 [TDK]

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