B78307A2338A003 [TDK]
IGBT/FET用变压器;
| 型号： | B78307A2338A003 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | IGBT/FET用变压器 变压器 双极性晶体管 |
| 文件： | 总9页 (文件大小：640K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMD transformers
E10 EM series
Series/Type:
B78307A*A003
Ordering code:
Date:
Version:
2020-05-06
01
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Identification/Classification 1
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Identification/Classification 2
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
Preliminary data (optional):
Department:
SMD transformers
E10 EM series
B78307A*A003
Preliminary data
MAG TF T PD
2020-05-06
01
Date:
Version:
TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without TDK Electronics' prior express consent is prohibited.
SMD transformers
E10 EM series
B78307A*A003
Construction
Ferrite core MnZn
SMD gullwing pins
Triple insulated wire
Non-conductive pick-and-place cap on top
Features
Height: 11.35 mm max
Design in compliance with IEC 61558-1; 2-161, 61800-5-11,
IEC 60664-11,2
UL1446 class 155(F) electrical insulation system
Wide temperature range up to +150 °C
Qualified to AEC-Q200
RoHS compatible
Applications
Isolated DC/DC converters (bridge and flyback topology)
Gate driver circuits (e.g.1DE020I12FA, for 650 V IGBTs)
Digital isolator ICs (e.g.Si88xx)
Insulation characteristics
N1 / N2 creepage ≥ 6 mm, clearance ≥ 5.5 mm (cumulative,
core is conductive, free floated between N1 and N2)
[N1,N2] / [core] creepage ≥ 3 mm, clearance ≥ 2.75 mm
Top surface / core creepage and clearance ≥ 2 mm
Plastic materials UL94-V0, CTI ≥175
Insulated wire UL60950-1, Annex U
Reinforced insulation1 N1 / N2 working voltage 300 V
Basic insulation2 N1 / N2 working voltage 500 V
Marking
Product brand, middle block of ordering code, date code,
pin 1 marker, production place identification code
Delivery mode
Blister tape 380 mm diameter
Packing unit 280 pcs per reel
1
2
Overvoltage category OVC II, pollution degree P2, CTI ≥ 175, altitude ≤ 2 km
Overvoltage category OVC II, pollution degree P2, CTI ≥ 175, altitude ≤ 5 km
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 2 of 9
Important notes at the end of this document.
SMD transformers
E10 EM series
B78307A*A003
Dimensional drawing and layout recommendation
Dimensions in mm
Blister tape
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 3 of 9
Important notes at the end of this document.
SMD transformers
E10 EM series
B78307A*A003
Technical data and measuring conditions
Specified @ +25 °C if not mentioned otherwise, all values without tolerance are typical values
Typical operational frequency
High voltage test AC N1 / N2
High voltage type test AC, N1 / N2
Partial discharge inception voltage N1/N2
Partial discharge extinction voltage N1/N2
Creepage distance N1 / N2
Clearance distance N1 / N2
Creepage distance [N1,N2] / core
Clearance distance [N1,N2] / core
Clearance, creepage core / top surface
Pollution degree
100 ... 500 kHz (typ.)
3000 V AC (50 Hz, 1 s)
3750 V AC (50 Hz, 60 s)
>900 V peak (type test)3
>700 V peak (type test)
>6 mm; cumulative, core floating
>5.5 mm; cumulative, core floating
>3 mm
>2.75 mm
>2 mm
P2 (to IEC 60664)
Insulation thermal class
+155 °C (F) to (IEC 60085)
40/150/56 (to IEC 60068)
−25 °C … +40 °C, humidity ≤75% RH
Climatic category
Storage conditions
Resistance to reflow soldering heat
In accordance with JEDEC J-STD-020D Tpeak= +245 °C
(Tpeak −5 °C for 30 seconds)
Operating temperature range
Weight
−40 °C … +150 °C (component)
Approx. 2 g
3
Partial discharge type test, refer to IEC 60664-1:
Extinction voltage for basic and reinforced insulation ≥ Vop peak x 1.2: 500 V x 1.2 = min. 600 Vpeak
;
Inception voltage for basic insulation ≥ Vop x 1.5 = 500 V x 1.5 = min.750 V;
Inception voltage for reinforced insulation ≥ Vop x 1.875 = 300 V x 1.875 = min. 563 Vpeak
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 4 of 9
Important notes at the end of this document.
SMD transformers
E10 EM series
B78307A*A003
Characteristics and ordering codes
4
5
Topologies
Turns ratio LN1
N1/N2
Lleak,typ,
Isat,
E*dtN1
(max,
RDC,N1
RDC,N2
Cp
N1/N2
Fig.
Ordering code
N1
N1
unipolar/
bipolar)
µVs
µH
µH
A
-
mΩ
mΩ
pF
9
0.35
B1, B2
B1, B2
B1, B2
B3,B4
B3,B4
1 : 1.08
1 : 0.76
1 : 3.67
1 : 4
≥ 100
15 / 30
350
410
F1
F1
F2
F3
F4
B78307A2276A003
B78307A9741A003
B78307A2385A003
B78307A2338A003(3
B78307A2338A003 (3
≥ 100
0.45
0.1
0.06
-
-
18 / 36
360
200
105
-
300
700
340
-
9
6
4
≥ 10
-
10 / 20
2 ±10%
25 ±10%
4
1
-
-
4 : 1
4
�
�
1) T≤150 °C, B= 200 mT, ΔB= 400 mT (bipolar mode). The maximum volt-sec rating limits the peak flux density to B= 200 mT when used in a unipolar drive
application. For bipolar drive applications, a maximum volt-sec of two times is acceptable (ΔB 400 mT).
3) B78307A2238A003 Configuration 1 : 4 use pins 8-5 for primary; Configuration 4 : 1 use pins 2-3 for primary
Circuit diagram
Fig. F1
F2
Fig. F3
F4
4
T≤150 °C, L drop ≤20%
5
�
�
T≤150 °C, B= 200 mT, ΔB= 400 mT (bipolar mode). The maximum volt-sec rating limits the peak flux density to B= 200 mT when used in a unipolar drive
application. For bipolar drive applications, a maximum volt-sec of two times is acceptable (ΔB 400 mT)
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 5 of 9
Important notes at the end of this document.
SMD transformers
E10 EM series
B78307A*A003
Topology examples
B1) Full Bridge
B2) Half Bridge
B3) Flyback
B4) Two switch flyback
A1. Reference design for chipset
A2. Reference design for chipset
Silicon Laboratory SiLab Si88xx Digital Isolator
Infineon Driver IC 1ED020I12FA
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 6 of 9
Important notes at the end of this document.
SMD transformers
E10 EM series
B78307A*A003
Cautions and warnings
- Please note the recommendations in our Inductors data book (latest edition) and in the data sheets.
- Particular attention should be paid to the derating curves given there.
- The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
- If the components are to be washed varnished it is necessary to check whether the washing varnish
agent that is used has a negative effect on the wire insulation, any plastics that are used, or on
glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect
in the long-term on wire insulation. Washing processes may damage the product due to the possible
static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the
product and its parts, which might lead to reduced reliability or lifetime.
- The following points must be observed if the components are potted in customer applications:
- Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
- It is necessary to check whether the potting material used attacks or destroys the wire insulation,
plastics or glue.
- The effect of the potting material can change the high-frequency behaviour of the components.
- Many coating materials have a negative effect (chemically and mechanically) on the winding wires,
insulation materials and connecting points. Customers are always obligated to determine whether
and to what extent their coating materials influence the component. Customers are responsible
and bear all risk for the use of the coating material. TDK Electronics does not assume any liability
for failures of our components that are caused by the coating material.
- Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
- Even for customer-specific products, conclusive validation of the component in the circuit can only
be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to different
processes employed and do not affect the specifications of the respective products. Detailed
information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
MAG TF T PD
2020-05-06
Please read Cautions and warnings and
Page 7 of 9
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than the
customers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or failure
of an electronic component could endanger human life or health (e.g. in accident prevention or life-
saving systems), it must therefore be ensured by means of suitable design of the customer
application or other action taken by the customer (e.g. installation of protective circuitry or
redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and customer
specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting
individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral
requirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we like
to point out that obligations from IATF 16949 shall only become legally binding if individually agreed
upon.
Page 8 of 9
Important notes
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other
countries.
Further
information
will
be
found
on
the
Internet
at
www.tdk-electronics.tdk.com/trademarks.
Release 2020-05
Page 9 of 9
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