B82116D1831A101 [TDK]

电源线用扼流圈;


型号：	B82116D1831A101
厂家：	TDK ELECTRONICS
描述：	电源线用扼流圈
文件：	总10页 (文件大小：1127K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Power line chokes

SMD Rod Core chokes

1.7 ... 3.3 µH / 10 kHz, 15 ... 28 A / +125 °C

Series/Type:

B82116D*A*

Ordering code:

Date:

January 2023

 TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto

and the information contained therein without TDK Electronics’ prior express consent is prohibited.

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Rated current: 15 ... 28 A / +125 °C

Rated Inductance: 1.7 ... 3.3 µH / 10 kHz

Construction

 Rod core choke

 Ferrite core

 Single layer winding

 Core and winding glued

 Self-leaded SMD terminals

Features

 High resonance frequency

 Enameled wire in accordance to EN 60317-13

 Wire class 200, UL listed

 Qualified according to AEC-Q200

 Suitable for reflow soldering

 RoHS compatible

Applications

 EMC choke

Terminals

 Ends of winding wire

 Pins hot dip tinned Sn99Cu

Delivery mode

 Tape and reel

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Dimensional drawing

B82116D1831A101

B82116D1224A001

190.5

B82116D2820A003

160.5

10.5

B82116D2820A002

16.80.5

10.5

26.10.5

1.250.5

13.7

10.5

18.2

80.3

120.3

80.3

7.60.2

200.5

310.8

13.5

240.5

200.5

12.6

17.7

11.6

1.250.2

1.80.1

2.50.2

0.1 +0.2/–0.1

1.10.5

20.1

10.8

min. 0

1.40.1

1.80.1

0.10.1

1.250.1

1.80.2

0.10.1

2.80.1

0.10.1

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Blister tape dimensional drawing

B82116D1831A101 B82116D1224A001 B82116D2820A003 B82116D2820A002

280.1

240.1

26.20.15

17.05+0.2/–0

13.8+0.15/–0.05

7.1+0.15/–0.05

31.85+0.2/–0

38.90.2

20.20.15

20.55+0.2/–0

18.4+0.15/–0.05

7.9+0.15/–0.05

24.65+0.2/–0

30.45+0.2/–0

110

20.20.15

15.22+0.2/–0

13.2+0.15/–0.05

7.9+0.15/–0.05

20.66+0.2/–0

27.45+0.2/–0

180

20.20.15

14.85+0.2/–0

12.3+0.15/–0.05

7.40.1

20.65+0.2/–0

27.45+0.2/–0

200

Parts/Reel 150

Reel

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Technical data and measuring conditions

Rated temperature T_R

Rated current I_R

+125 °C

15 ... 28 A (free-air convection cooling)¹⁾

Nominal inductance L_N

Inductance tolerance

Inductance decrease ΔL/L₀

DC resistance R_typ

Measured with Agilent 4284A, at 10 kHz, 1 V, at +20 °C

20% at +20 °C

10% at DC magnetic bias with I_R, +20 °C

Measured at +20 °C, typical value

Solderability (lead-free)

Sn96.5Ag3.0Cu0.5: (2453) °C, (30.3) s

Wetting of soldering area 90%

(to IEC 60068-2-58, test Td₁, method 1)

(+260 5) °C, (101) s

Resistance to soldering heat

(to IEC 60068-2-58, test Td₂, method 1)

–40 °C ... +150 °C

Operating temperature range

Insulation voltage

Direct contact to metal parts of the customer

application is not permissible. Insulation of winding

surface cannot be warrant due to allowed leaks in

winding wire accordance wire standard EN 60317-0-1.

Ferrit

Core material

Ferrite core surface irregularities

The standard IEC 60424-4 is the basis for the visual

inspection of surface irregularities.

These surface irregularities have no impact regarding

function, manufacture ability and reliability of the

component.

No further spalling of core material permissible.

1) Current must be reduced when operating at higher ambient temperature than rated. See “Current derating” for details.

Higher current can be applied by using an appropriate forced cooling approach. In any case, temperature of the coil is

to be monitored and must not exceed the maximum value specified by the climatic category. The effect of magnetic

saturation must be additionally considered when operated with higher current than specified.

Characteristics and ordering codes

I_R

L_R

µH

R_typ

m

Inductance decrease ΔL/L₀

Weight

approx.

Ordering code

3.3

1.7

1.8

2.5

1.8

1.2

3.0

11.0

12.0

28.5

11.0

B82116D1831A101

B82116D2820A003

B82116D1224A001

B82116D2820A002

110

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Impedance lZl versus frequency

(Typical values measured at +20 °C)

Inductance L_sversus frequency

(Typical values measured at + 20°C)

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Current derating I_op/I_Rversus ambient temperature T_A

(rated temperature T_R= +125 °C)

Recommended reflow soldering profile

Pb-free solder material (based on JEDEC J-STD 020D)

T₁

T₂

T₃

T₄

t₁

t₃

°C

+150

+200

+217

+245

<120

<90

< 30 @ T₄–5 °C

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Chokes for power lines

SMD Rod Core Choke

B82116D*A*

Cautions and warnings

 Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

 If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

 The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire, wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

– Many coating materials have a negative effect (chemically and mechanically) on the winding

wires, insulation materials and connecting points. Customers are always obligated to

determine whether and to what extent their coating materials influence the component.

Customers are responsible and bear all risk for the use of the coating material. TDK

Electronics does not assume any liability for failures of our components that are caused by the

coating material.

 Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or

lead to breakage of the core.

 Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

 Due to product design and applied manufacturing process, appearance, symmetry, and shape

of not dimensioned details could vary within same lot, as well discoloration of housing is possible.

TDK does not expect detrimental effects on product function or reliability. In case of conflicts,

TDK reference standard shall prevail.

Display of ordering codes for TDK Electronics products

The ordering code for one and the same product can be represented differently in data sheets, data

books, other publications, on the company website, or in order-related documents such as shipping

notes, order confirmations and product labels. The varying representations of the ordering

codes are due to different processes employed and do not affect the specifications of the

respective products. Detailed information can be found on the Internet under

www.tdk-electronics.tdk.com/orderingcodes.

Please read Cautions and warnings and

Important notes at the end of this document.

1/23

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical require-

ments that are often placed on our products in the areas of application concerned. We never-

theless expressly point out that such statements cannot be regarded as binding statements

about the suitability of our products for a particular customer application. As a rule, we

are either unfamiliar with individual customer applications or less familiar with them than the cus-

tomers themselves. For these reasons, it is always ultimately incumbent on the customer to

check and decide whether a product with the properties described in the product specification is

suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or fail-

ure before the end of their usual service life cannot be completely ruled out in the current

state of the art, even if they are operated as specified. In customer applications requiring a

very high level of operational safety and especially in customer applications in which the mal-

function or failure of an electronic component could endanger human life or health (e.g. in acci-

dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-

sign of the customer application or other action taken by the customer (e.g. installation of pro-

tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event

of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this pub-

lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-

cause they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequent-

ly, we cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the foregoing

for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

1/23

Important notes

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The IATF certifications confirm our compliance with requirements regarding the quality manage-

ment system in the automotive industry. Referring to customer requirements and customer spe-

cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-

dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-

quirements, we hereby like to emphasize that only requirements mutually agreed upon can

and will be implemented in our Quality Management System. For clarification purposes we

like to point out that obligations from IATF 16949 shall only become legally binding if individually

agreed upon.

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP,

CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, InsuGate, LeaXield,

MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod,

PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic,

SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or

pending in Europe and in other countries. Further information will be found on the Internet at

www.tdk-electronics.tdk.com/trademarks.

Release 2022-07

10 1/23

B82116D1831A101 [TDK]

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