B82464D6222M000 [TDK]

SMD/SMT 电感器(线圈);


型号：	B82464D6222M000
厂家：	TDK ELECTRONICS
描述：	SMD/SMT 电感器(线圈) 电感器
文件：	总9页 (文件大小：924K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMT power inductors

Size 10.4  10.4  6.3 (mm)

Series/Type:

B82464D6

Date:

July 2021

Data Sheet

TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto

and the information contained therein without TDK Electronics’ prior express consent is prohibited.

SMT power inductors

B82464D6

Size 10.4 x 10.4 x 6.3 (mm)

Rated inductance 2.2 ... 47 µH

Rated current 1.71 ... 6.17 A

Construction

■ Ferrite core

■ Magnetically shielded

■ Winding enamel copper wire

■ Winding welded to terminals

■ Special winding technology for low stray

inductance and high coupling factor

Features

■ Temperature range up to +150 °C

■ High rated current

■ Low DC resistance

■ Coupling factor typically 99% in average

■ Functional isolation up to 500 V

■ Suitable for lead-free reflow soldering

as referenced in JEDEC J-STD 020D

■ Qualified to AEC-Q200

■ RoHS-compatible

Applications

■ Common-mode chokes

■ DC/DC converters, especially for SEPIC topology

■ 1:1 transformers

Terminals

■ Base material CuSn6P

■ Lead-finish Sn (lead-free)

■ Electro-plated

Marking

■ Marking on component:

L value (µH, coded), date of manufacture (YWWD),

dot for Pin1 identification

■ Minimum data on reel:

Manufacturer, ordering code,

L value, quantity, date of packing

Delivery mode and packing unit

■ 24-mm blister tape, wound on 330-mm  reel

■ Packing unit: 600 pcs./reel

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

SMT power inductors

B82464D6

Size 10.4 x 10.4 x 6.3 (mm)

Dimensional drawing and layout recommendation

Dimensions in mm

Taping and packing

Blister tape

Reel

Dimensions in mm

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

SMT power inductors

B82464D6

Size 10.4 x 10.4 x 6.3 (mm)

Technical data and measuring conditions

Rated inductance L₁, L₂

Measured with LCR meter Agilent 4284A

at frequency f_L, 0.1 V, +20 °C

Leakage or stray inductance L_S

Test L_1-3(shorten 2 + 4)

Measured with LCR meter Agilent 4284A

at 100 kHz, 0.1 V, +20 °C

Coupling factor K_typ

Coupling test in between the 2 windings. Typical values:

Operating temperature range

Rated current I_R

–55 °C … +150 °C

Max. permissible DC with temperature increase of  40 K

(method to IEC 62024-2)

Saturation current I_sat

Max. permissible DC with inductance decrease

L/L₀of 10% and 30% per winding, typical values

DC resistance R_1,max, R_2,max

Measured at +20 °C

R_1,typ, R_2,typ

Isolation (functional)

Tested with 500 V, 0.4 s at 100%, 3 s during qualification

Solderability (lead-free)

Dip and look method Sn95.5Ag3.8Cu0.7:

+(245 ±5) °C, (3 ±0.3) s

Wetting of soldering area  90%

(based on IEC 60068-2-58)

Resistance to soldering heat

Climatic category

as referenced in JEDEC J-STD 020D

55/150/56 (to IEC 60068-1)

Storage conditions

Mounted: –55 °C … +150 °C

Packaged: –25 °C … +40 °C,  75% RH

Weight

Approx. 2.5 g

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

SMT power inductors

B82464D6

Size 10.4 x 10.4 x 6.3 (mm)

Characteristics and ordering codes

L_R

K_typTolerance f_L

I_sat

I_R

R_1,2,maxR_1,2,typOrdering code

10% drop 30% drop

µH

MHz A



2.2 95.0 20% M 0.1 11.80

13.85

11.75

9.90

7.70

6.15

5.65

5.20

4.35

3.30

2.95

6.17

5.77

5.08

4.47

3.71

3.31

3.09

0.021 0.018 B82464D6222M000

0.024 0.021 B82464D6302M000

0.031 0.027 B82464D6472M000

0.040 0.035 B82464D6682M000

0.058 0.052 B82464D6103M000

0.073 0.066 B82464D6123M000

0.084 0.076 B82464D6153M000

3.0 96.0

4.7 97.0

6.8 98.0

10 99.0

12 99.0

15 99.0

0.1

9.80

8.40

6.45

5.10

4.70

4.35

3.60

2.75

2.45

22 99.0

33 99.0

47 99.0

0.1

2.66

2.15

1.71

0.113 0.105 B82464D6223M000

0.173 0.160 B82464D6333M000

0.274 0.238 B82464D6473M000

Inductance is per winding.

When leads are connected in parallel, inductance L_Ris the same value.

When leads are connected in series, inductance L_Ris four times the value.

R1  R2

DCR = ------------------------

DCR is for each winding. When leads are connected in parallel,

When leads are connected in series, DCR is R1+R2.

R1 + R2

_satist the current flowing through one winding.

When leads are connected in parallel, I_satis the same.

When leads are connected in series, I_satis half the value.

_Ris the total current through both windings

I₁and I₂can be calculated like this: I₁²+ I₂²= I_R

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

SMT power inductors

B82464D6

Size 10.4 x 10.4 x 6.3 (mm)

Current derating I_op/I_R

Inductance L versus I_DCsuperposition

versus ambient temperature T_A

measured with LCR meter Agilent 4284A

at T_a= +20 °C

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire, wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

– Many coating materials have a negative effect (chemically and mechanically) on the winding

wires, insulation materials and connecting points. Customers are always obligated to

determine whether and to what extent their coating materials influence the component.

Customers are responsible and bear all risk for the use of the coating material. TDK

Electronics does not assume any liability for failures of our components that are caused by the

coating material.

■ Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or

lead to breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

Display of ordering codes for TDK Electronics products

The ordering code for one and the same product can be represented differently in data sheets, data

books, other publications, on the company website, or in order-related documents such as shipping

notes, order confirmations and product labels. The varying representations of the ordering

codes are due to different processes employed and do not affect the specifications of the

respective products. Detailed information can be found on the Internet under

www.tdk-electronics.tdk.com/orderingcodes.

Please read Cautions and warnings and

Important notes at the end of this document.

07/21

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical require-

ments that are often placed on our products in the areas of application concerned. We never-

theless expressly point out that such statements cannot be regarded as binding statements

about the suitability of our products for a particular customer application. As a rule, we

are either unfamiliar with individual customer applications or less familiar with them than the cus-

tomers themselves. For these reasons, it is always ultimately incumbent on the customer to

check and decide whether a product with the properties described in the product specification is

suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or fail-

ure before the end of their usual service life cannot be completely ruled out in the current

state of the art, even if they are operated as specified. In customer applications requiring a

very high level of operational safety and especially in customer applications in which the mal-

function or failure of an electronic component could endanger human life or health (e.g. in acci-

dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-

sign of the customer application or other action taken by the customer (e.g. installation of pro-

tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event

of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this pub-

lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-

cause they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequent-

ly, we cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the foregoing

for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

07/21

Important notes

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The IATF certifications confirm our compliance with requirements regarding the quality manage-

ment system in the automotive industry. Referring to customer requirements and customer spe-

cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-

dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-

quirements, we hereby like to emphasize that only requirements mutually agreed upon can

and will be implemented in our Quality Management System. For clarification purposes we

like to point out that obligations from IATF 16949 shall only become legally binding if individually

agreed upon.

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,

MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,

PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,

SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending

in Europe and in other countries. Further information will be found on the Internet at

www.tdk-electronics.tdk.com/trademarks.

Release 2020-06

07/21

B82464D6222M000 [TDK]

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