B82475A1334K000 [TDK]

SMD/SMT 电感器(线圈);


型号：	B82475A1334K000
厂家：	TDK ELECTRONICS
描述：	SMD/SMT 电感器(线圈) 测试功率感应器电感器
文件：	总7页 (文件大小：1371K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMT power inductors

Size 10.4 u 10.0 u 5.8 (mm)

Series/Type:

B82475A1

Date:

June 2012

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 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information

contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

SMT power inductors

B82475A1

Size 10.4 u 10.0 u 5.8 (mm)

Rated inductance 10 ... 680 μH

Rated current 0.28 ... 2.6 A

Construction

■ Ferrite core

■ Winding: enamel copper wire

■ Winding soldered to terminals

■ Plastic terminal carrier

Features

■ Temperature range up to +150 °C

■ High rated current

■ Low DC resistance

■ Suitable for lead-free reflow soldering

as referenced in JEDEC J-STD 020D

■ RoHS-compatible

Applications

■ Filtering of supply voltages

■ Coupling, decoupling

■ DC/DC converters

■ Automotive electronics

■ Industrial electronics

■ Consumer electronics

Terminals

■ Base material CuSn6P

■ Layer composition Ni, Sn (lead-free)

■ Electro-plated

Marking

■ Marking on component:

Manufacturer, L value (PH, coded),

manufacturing date (YWWD)

■ Minimum data on reel:

Manufacturer, ordering code, L value,

quantity, date of packing

Delivery mode and packing unit

■ 24-mm blister tape, wound on 330-mm reel

■ Packing unit: 500 pcs./reel

Please read Cautions and warnings and

Important notes at the end of this document.

06/12

SMT power inductors

B82475A1

Size 10.4 u 10.0 u 5.8 (mm)

Dimensional drawing and layout recommendation

10 max.

5.2

IND0485-F

Marking

Dimensions in mm

9.4 max.

1) Soldering area

Component tolerances r0.2 mm unless

otherwise noted.

IND0484-A-E

Taping and packing

Blister tape

Reel

21 0.5

2.5 0.5

13 0.2

4 0.1

1.5+0.1

2 0.1

Component

1.0

30.4 max.

330 1

IND0348-6

1.5 min.

6.4 max.

16 0.1

Direction of unreeling

IND0336-8-E

Dimensions in mm

Please read Cautions and warnings and

Important notes at the end of this document.

06/12

SMT power inductors

B82475A1

Size 10.4 u 10.0 u 5.8 (mm)

Technical data and measuring conditions

Rated inductance L_R

Measured with LCR meter Agilent 4284A at frequency f_L,

at 0.1 V, +20 °C

Rated temperature T_R

Rated current I_R

+85 °C

Max. permissible DC with temperature increase of d 40 K

at rated temperature

Saturation current I_sat

Max. permissible DC with inductance decrease

'L/L₀of approx. 10%

DC resistance R_max

Measured at +20 °C

Solderability (lead-free)

Dip and look method Sn95.5Ag3.8Cu0.7:

+(245 r5) °C, (5 r0.3) s

Wetting of soldering area tꢀ90%

(based on IEC 60068-2-58)

Resistance to soldering heat

Climatic category

+260 °C, 40 s (as referenced in JEDEC J-STD 020D)

55/150/56 (to IEC 60068-1)

Storage conditions

Mounted: –55 °C … +150 °C

Packaged: –25 °C … +40 °C, dꢀ75% RH

Weight

Approx. 1.6 g

Characteristics and ordering codes

L_R

Tolerance f_L

MHz

I_R

I_sat

R_max

Ordering code

r20% M 0.1

2.60

2.27

1.95

1.50

1.28

1.11

0.97

0.78

0.66

0.52

0.42

0.28

2.75

2.35

2.00

1.60

1.35

1.20

1.00

0.82

0.70

0.55

0.45

0.30

0.06

0.08

0.10

0.12

0.17

0.22

0.35

0.47

0.73

1.15

1.48

2.25

B82475A1103M000

B82475A1153M000

B82475A1223M000

B82475A1333M000

B82475A1473K000

B82475A1683K000

B82475A1104K000

B82475A1154K000

B82475A1224K000

B82475A1334K000

B82475A1474K000

B82475A1684K000

0.1

r10% K 0.1

0.1

100

150

220

330

470

680

Sample kit available. Ordering code: B8247XX001

For more information refer to chapter “Sample kits”.

Please read Cautions and warnings and

Important notes at the end of this document.

06/12

SMT power inductors

B82475A1

Size 10.4 u 10.0 u 5.8 (mm)

Impedance |Z| versus frequency f

measured with impedance analyzer

Agilent 4294A, typical values at +20 °C

Inductance L versus DC load current I_DC

measured with LCR meter Agilent 4275A,

typical values at +20 °C

IND0909-C

IND0858-R

10³

μH

10⁶

B82475A1

680 μH

10⁵

10⁴

10³

10²

10¹

|Z|

100 μH

10²

33 μH

10 μH

10¹

680 μH

100 μH

33 μH

10⁰

10 μH

10⁰

^_1

10³

^_1

10⁴

10⁵

10⁶

10⁷Hz 10⁸

10⁰

A 10¹

I_DC

Current derating I_op/I_R

versus ambient temperature T_A

(rated temperature T_R= +85 °C)

IND0602-K

1.2

I_op

I_R

1.0

0.8

0.6

0.4

0.2

20 40 60 80 100 120 C 150

T_A

06/12

Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to

breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

Please read Cautions and warnings and

Important notes at the end of this document.

06/12

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain areas

of application. These statements are based on our knowledge of typical requirements that are often placed

on our products in the areas of application concerned. We nevertheless expressly point out that such

statements cannot be regarded as binding statements about the suitability of our products for a

particular customer application. As a rule we are either unfamiliar with individual customer applications or

less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent

on the customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure before

the end of their usual service life cannot be completely ruled out in the current state of the art, even

if they are operated as specified. In customer applications requiring a very high level of operational safety

and especially in customer applications in which the malfunction or failure of an electronic component could

endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be

ensured by means of suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet

(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our

sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this publication

may change from time to time. The same is true of the corresponding product specifications. Please

check therefore to what extent product descriptions and specifications contained in this publication are still

applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The aforementioned

does not apply in the case of individual agreements deviating from the foregoing for customer-specific

products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF

certifications confirm our compliance with requirements regarding the quality management system in the

automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK

always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949

may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only

requirements mutually agreed upon can and will be implemented in our Quality Management

System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become

legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered

or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-

electronics.tdk.com/trademarks.

Release 2018-10

06/12

B82475A1334K000 [TDK]

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