B82476B1334M100 [TDK]

SMD/SMT 电感器(线圈);


型号：	B82476B1334M100
厂家：	TDK ELECTRONICS
描述：	SMD/SMT 电感器(线圈) 测试功率感应器电感器
文件：	总7页 (文件大小：994K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMT power inductors

Size 12.95 x 9.40 x 5.08

Series/Type:

B82476B1xxxM100

June 2013

Date:

Version:

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Identification/Classification 1

(header 1 + top left bar):

SMT power inductors

Size 12.95 x 9.40 x 5.08

B82476B1xxxM100

Identification/Classification 2

(header 2 + bottom left header bar):

Ordering code: (top right header bar)

Series/Type: (top right header bar)

Preliminary data (optional):

(if necessary)

Department:

MAG IN PD

 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information

Date:

June 2013

contained therein without EPCOS' prior express consent is prohibited.

Version:

EPCOS AG is a TDK Group Company.

SMT power inductors

B82476B1xxxM100

Size 12.95 x 9.40 x 5.08mm

Rated inductance 1 ... 1000 µH

Construction

■ Ferrite core

■ Winding: enamel copper wire

■ Winding soldered to terminals

■ Rugged design with plastic terminal carrier

Features

■ Temperature range up to +150 °C

■ High rated current

■ Low DC resistance

■ Suitable for lead-free reflow soldering

as referenced in JEDEC J-STD 020D

■ Qualified to AEC-Q200

■ RoHS-compatible

Applications

■ Filtering of supply voltages

■ Coupling, decoupling

■ DC/DC converters

■ Automotive electronics

■ Industrial electronics

■ Consumer electronics

Terminals

■ Base material CuSn6P

■ Layer structure Ni, Sn (lead-free)

■ Electro-plated

Marking

Marking on component:

Manufacturer, L value (in µH), date code

Minimum data on reel:

Manufacturer, part number, ordering code,

L value and tolerance

quantity, date of packing

Delivery mode and packaging unit

■ 24-mm blister tape, reel packing

■ Packaging quantity: 750 pcs./reel

MAG IN PD

June 2013

Please read Cautions and warnings and

Important notes at the end of this document.

Page 2 of 7

SMT power inductors

B82476B1xxxM100

Size 12.95 x 9.40 x 5.08mm

Dimensional drawing and layout recommendation

Dimensions in mm

Component tolerances ±0.2mm unless

otherwise noted

Taping and packing

Blister tape

Reel

Dimensions in mm

MAG IN PD

June 2013

Please read Cautions and warnings and

Important notes at the end of this document.

Page 3 of 7

SMT power inductors

B82476B1xxxM100

Size 12.95 x 9.40 x 5.08mm

Technical data and measuring conditions

Rated inductance L_R

Operating temperature range

Rated current I_R

Measured with LCR meter Agilent 4284A at frequency f_L, 0.1 V

-55 °C .. +150 °C

Max. permissible DC with temperature increase of ≤40 K at

+20 °C

Saturation current I_Sat

Max. permissible DC with inductance decrease ∆L/L₀of

approx. 10%,

DC resistance R_typ

Measured at +20 °C

Solderability (lead-free)

Dip and look method Sn95.5Ag3.8Cu0.7:

+(245 5) °C, (3 0.3) s

Wetting of soldering area 90%

(based on IEC 60068-2-58)

Resistance to soldering heat

Climatic category

Storage conditions

+260 °C, 40 s (as referenced in JEDEC J-STD 020D)

55/150/56 (to IEC 60068-1)

Mounted: –55 °C … +150 °C

Packaged: –25 °C … +40 °C, ≤75% RH

Approx. 2 g

Weight

Characteristics and ordering codes

I_sat,minI_sat,typ

L_R

µH

Tolerance

f_L

MHz A

7.50

I_R

R_max

Ω

R_typ

Ω

Ordering code

12.5

B82476B1102M100

B82476B1152M100

B82476B1222M100

B82476B1332M100

B82476B1472M100

B82476B1682M100

B82476B1103M100

B82476B1153M100

B82476B1223M100

B82476B1333M100

B82476B1473M100

B82476B1683M100

1.0

1.5

2.2

3.3

4.7

6.8

9.0

8.0

7.0

6.4

5.4

4.6

3.8

3.0

2.6

2.0

1.6

1.4

1.2

1.0

0.8

0.6

0.5

0.4

0.3

0.0080 0.0060

0.0090 0.0070

0.0105 0.0090

0.0135 0.0115

0.0165 0.0145

0.0210 0.0190

0.0270 0.0245

0.0400 0.0350

0.0500 0.0450

0.0880 0.0810

10.0

6.90

6.70

5.90

5.30

4.80

4.30

3.40

2.95

2.30

1.95

1.65

1.40

1.10

0.88

0.65

0.55

0.43

0.33

8.00

6.80

5.60

4.90

4.25

3.40

2.80

2.15

2.05

1.65

20% = M 0.1

0.120

0.160

0.110

0.150

0.215

0.305

0.480

0.730

1.010

1.500

1.950

100

150

220

330

470

680

1000

1.35 0.230

B82476B1104M100

B82476B1154M100

1.15

0.88

0.67

0.56

0.46

0.42

0.330

0.530

0.810

1.100

1.600

2.150

B82476B1224M100

B82476B1334M100

B82476B1474M100

B82476B1684M100

B82476B1105M100

MAG IN PD

June 2013

Please read Cautions and warnings and

Important notes at the end of this document.

Page 4 of 7

SMT power inductors

B82476B1xxxM100

Size 12.95 x 9.40 x 5.08mm

Typical curves:

Inductance vs. DC superposition measured with LCR meter Agilent 4284A at T_a=20 °C

10µH

1µH

1.25

1.00

0.75

0.50

0.25

0.00

12.5

10.0

7.5

5.0

2.5

0.0

2000 4000 6000 8000 10000 12000 14000 16000 18000 20000

1000

2000

3000

4000

5000

6000

7000

Idc [mA]

100µH

1000µH

1250

1000

750

500

250

125

100

200

300

400

500

600

700

250

500

750

1000

1250

1500

1750

2000

2250

2500

Idc [mA]

Current derating versus ambient temperature

MAG IN PD

June 2013

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 7

SMT power inductors

B82476B1xxxM100

Size 12.95 x 9.40 x 5.08mm

Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequecy behaviour of the components.

■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to

breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

MAG IN PD

June 2013

Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 7

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain areas

of application. These statements are based on our knowledge of typical requirements that are often placed

on our products in the areas of application concerned. We nevertheless expressly point out that such

statements cannot be regarded as binding statements about the suitability of our products for a

particular customer application. As a rule we are either unfamiliar with individual customer applications or

less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent

on the customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure before

the end of their usual service life cannot be completely ruled out in the current state of the art, even

if they are operated as specified. In customer applications requiring a very high level of operational safety

and especially in customer applications in which the malfunction or failure of an electronic component could

endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be

ensured by means of suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet

(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our

sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this publication

may change from time to time. The same is true of the corresponding product specifications. Please

check therefore to what extent product descriptions and specifications contained in this publication are still

applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The aforementioned

does not apply in the case of individual agreements deviating from the foregoing for customer-specific

products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF

certifications confirm our compliance with requirements regarding the quality management system in the

automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK

always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949

may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only

requirements mutually agreed upon can and will be implemented in our Quality Management

System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become

legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered

or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-

electronics.tdk.com/trademarks.

Release 2018-10

Page 7 of 7

B82476B1334M100 [TDK]

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