B82477C6153M603 [TDK]

SMD/SMT 电感器(线圈);
B82477C6153M603
型号: B82477C6153M603
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

SMD/SMT 电感器(线圈)

电感器
文件: 总9页 (文件大小:1542K)
中文:  中文翻译
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SMT power inductors  
Size 12.5x12.5x10.5 (mm)  
Series/Type:  
Date:  
B82477C6xxxM603  
July 2021  
02  
Version:  
TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto  
and the information contained therein without TDK Electronics’ prior express consent is prohibited.  
SMT power inductors  
B82477C6  
Size 12.5x12.5x10.5 (mm)  
Rated inductance 4.7 .. 47 µH  
Construction  
Ferrite core  
Magnetically shielded  
Winding enamel copper wire  
Winding welded to terminals  
Special winding technology for loose coupling  
of the 2 windings  
Features  
Temperature range up to +150 °C  
High rated current  
Low DC resistance  
Loose coupling, coupling factor typically 86%  
Functional isolation up to 500 V  
Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D  
Qualified acc. to AEC-Q200  
RoHS-compatible  
Applications  
Common-mode choke  
DC/DC converters, especially for SEPIC and Cuk topology  
1:1 transformers  
Terminals  
Base material CuSn6P  
Lead-finish Sn (lead-free)  
Electro-plated  
Marking  
Marking on component:  
Manufacturer logo  
Code letter “C”, L value (in µH)  
date code followed by the last 2 digits of the production order  
dot for Pin 1 identification  
Minimum data on reel:  
Manufacturer, ordering code, L value,  
quantity, date of packing  
Delivery mode and packing units  
24-mm blister tape, wound on 330-mm Ø reel  
Packing unit: 250 pcs./reel  
Please read Cautions and warnings and  
Important notes at the end of this document.  
2
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SMT power inductors  
B82477C6  
Size 12.5x12.5x10.5 (mm)  
Dimensional drawing and layout recommendation  
Dimensions in mm  
Taping an packing  
Blister tape  
Reel  
Dimensions in mm  
Please read Cautions and warnings and  
Important notes at the end of this document.  
3
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SMT power inductors  
B82477C6  
Size 12.5x12.5x10.5 (mm)  
Technical data and measuring conditions  
Rated inductance L1, L2  
Measured with LCR meter Agilent 4284A at frequency fL,  
0.1 V, 20 °C  
Coupling factor Ktyp  
Coupling in between the 2 windings.  
–55 °C to +150 °C  
Operating temperature range  
Rated current IR  
Max. permissible DC with temperature increase of ≤ 40 K  
Method as per IEC62024-2  
Saturation current ISat  
DC resistance R1,R2 , (max)  
Isolation (functional)  
DC with inductance decrease ∆L/L0 of approx. 10%  
Measured at +20 °C  
Tested with 500 V, 0.4 sec by 100%; 3 sec during qualification  
Dip and look method Sn95.5Ag3.8Cu0.7:  
(245 ±5) °C, (5 ±0.3) s  
Solderability (lead-free)  
Wetting of soldering area ≥ 90%  
(based on IEC 60068-2-58)  
Resistance to soldering heat  
Climatic category  
+245 °C, 30 s (as referenced in JEDEC J-STD-020D)  
55/150/56 (to IEC 60068-1)  
Storage conditions  
Mounted: –55 °C … +150 °C  
Packaged: –25 °C … +40 °C, ≤ 75% RH  
Approx. 5 g  
Weight  
Please read Cautions and warnings and  
Important notes at the end of this document.  
4
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SMT power inductors  
B82477C6  
Size 12.5x12.5x10.5 (mm)  
Characteristics and ordering codes  
L1, L2 K,typ  
Tolerance fL  
MHz  
0.1  
Isat/A  
typ  
IR  
A
R1, R2/m  
Ordering code  
µH  
4.7  
6.8  
10  
%
Min  
max typ  
86  
87  
87  
86  
86  
86  
86  
20%  
M
15.3 14.0 7.05 18  
11.2 10.0 6.40 21  
14.2 B82477C6472M603  
17.7 B82477C6682M603  
22.5 B82477C6103M603  
28.6 B82477C6153M603  
43.5 B82477C6223M603  
9.6  
8.3  
6.4  
5.2  
4.8  
8.4  
7.5  
5.9  
4.7  
4.0  
5.65 27  
4.92 35  
3.85 48  
3.30 69  
3.02 85  
15  
22  
33  
47  
63  
78  
B82477C6333M603  
B82477C6473M603  
Inductance is per winding.  
When leads are connected in parallel, inductance is the same value.  
When leads are connected in series, inductance is four times the value.  
R1 R2  
R1 + R2  
--------------------------  
DCR is for each winding. When leads are connected in parallel, DCR =  
.
When leads are connected in series, DCR is R1+R2.  
Isat is the current flowing through one winding.  
When leads are connected in parallel, Isat is the same.  
When leads are connected in series, Isat is half the value.  
IR is the total current through both windings.  
2
I1 and I2 can be calculated like this: I12+I22=IR  
.
Please read Cautions and warnings and  
Important notes at the end of this document.  
5
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SMT power inductors  
B82477C6  
Size 12.5x12.5x10.5 (mm)  
Current derating Iop/IR  
Inductance L versus IDC superposition  
versus ambient temperature TA  
measured with LCR meter Aglient 4284A  
at Ta = +20 °C  
Please read Cautions and warnings and  
Important notes at the end of this document.  
6
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Ferrites and accessories  
Cautions and warnings  
Cautions and warnings  
n Please note the recommendations in our Inductors data book (latest edition) and in the data  
sheets.  
– Particular attention should be paid to the derating curves given there.  
– The soldering conditions should also be observed. Temperatures quoted in relation to wave  
soldering refer to the pin, not the housing.  
n If the components are to be washed varnished it is necessary to check whether the washing  
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,  
or on glued joints. In particular, it is possible for washing varnish agent residues to have a  
negative effect in the long-term on wire insulation.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
n The following points must be observed if the components are potted in customer applications:  
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic  
housing or core. This pressure can have a deleterious effect on electrical properties, and in  
extreme cases can damage the core or plastic housing mechanically.  
– It is necessary to check whether the potting material used attacks or destroys the wire, wire  
insulation, plastics or glue.  
– The effect of the potting material can change the high-frequency behaviour of the components.  
– Many coating materials have a negative effect (chemically and mechanically) on the winding  
wires, insulation materials and connecting points. Customers are always obligated to  
determine whether and to what extent their coating materials influence the component.  
Customers are responsible and bear all risk for the use of the coating material. TDK  
Electronics does not assume any liability for failures of our components that are caused by the  
coating material.  
n Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or  
lead to breakage of the core.  
n Even for customer-specific products, conclusive validation of the component in the circuit can  
only be carried out by the customer.  
Display of ordering codes for TDK Electronics products  
The ordering code for one and the same product can be represented differently in data sheets, data  
books, other publications, on the company website or in order-related documents such as shipping  
notes, order confirmations and product labels. The varying representations of the ordering  
codes are due to different processes employed and do not affect the specifications of the  
respective products. Detailed information can be found on the Internet under  
www.tdk-electronics.tdk.com/orderingcodes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
7
12/20  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical  
requirements that are often placed on our products in the areas of application concerned. We  
nevertheless expressly point out that such statements cannot be regarded as binding  
statements about the suitability of our products for a particular customer application. As  
a rule, we are either unfamiliar with individual customer applications or less familiar with them  
than the customers themselves. For these reasons, it is always ultimately incumbent on the  
customer to check and decide whether a product with the properties described in the product  
specification is suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or  
failure before the end of their usual service life cannot be completely ruled out in the  
current state of the art, even if they are operated as specified. In customer applications  
requiring a very high level of operational safety and especially in customer applications in which  
the malfunction or failure of an electronic component could endanger human life or health (e.g.  
in accident prevention or life-saving systems), it must therefore be ensured by means of suitable  
design of the customer application or other action taken by the customer (e.g. installation of  
protective circuitry or redundancy) that no injury or damage is sustained by third parties in the  
event of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this  
publication may contain substances subject to restrictions in certain jurisdictions (e.g.  
because they are classed as hazardous). Useful information on this will be found in our  
Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have  
any more detailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order.  
We also reserve the right to discontinue production and delivery of products.  
Consequently, we cannot guarantee that all products named in this publication will always be  
available. The aforementioned does not apply in the case of individual agreements deviating  
from the foregoing for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms  
and Conditions of Supply.  
8
5/21  
Important notes  
7. Our manufacturing sites serving the automotive business apply the IATF 16949  
standard. The IATF certifications confirm our compliance with requirements regarding the  
quality management system in the automotive industry. Referring to customer requirements  
and customer specific requirements (“CSR”) TDK always has and will continue to have the  
policy of respecting individual agreements. Even if IATF 16949 may appear to support the  
acceptance of unilateral requirements, we hereby like to emphasize that only requirements  
mutually agreed upon can and will be implemented in our Quality Management System.  
For clarification purposes we like to point out that obligations from IATF 16949 shall only  
become legally binding if individually agreed upon.  
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,  
CSMP,  
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,  
MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,  
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,  
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending  
in Europe and in other countries. Further information will be found on the Internet at  
www.tdk-electronics.tdk.com/trademarks.  
Release 2020-06  
9
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