B82477C6153M603 [TDK]
SMD/SMT 电感器(线圈);型号: | B82477C6153M603 |
厂家: | TDK ELECTRONICS |
描述: | SMD/SMT 电感器(线圈) 电感器 |
文件: | 总9页 (文件大小:1542K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMT power inductors
Size 12.5x12.5x10.5 (mm)
Series/Type:
Date:
B82477C6xxxM603
July 2021
02
Version:
TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics’ prior express consent is prohibited.
SMT power inductors
B82477C6
Size 12.5x12.5x10.5 (mm)
Rated inductance 4.7 .. 47 µH
Construction
Ferrite core
Magnetically shielded
Winding enamel copper wire
Winding welded to terminals
Special winding technology for loose coupling
of the 2 windings
Features
Temperature range up to +150 °C
High rated current
Low DC resistance
Loose coupling, coupling factor typically 86%
Functional isolation up to 500 V
Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D
Qualified acc. to AEC-Q200
RoHS-compatible
Applications
Common-mode choke
DC/DC converters, especially for SEPIC and Cuk topology
1:1 transformers
Terminals
Base material CuSn6P
Lead-finish Sn (lead-free)
Electro-plated
Marking
Marking on component:
Manufacturer logo
Code letter “C”, L value (in µH)
date code followed by the last 2 digits of the production order
dot for Pin 1 identification
Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing units
24-mm blister tape, wound on 330-mm Ø reel
Packing unit: 250 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
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SMT power inductors
B82477C6
Size 12.5x12.5x10.5 (mm)
Dimensional drawing and layout recommendation
Dimensions in mm
Taping an packing
Blister tape
Reel
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
7/21
SMT power inductors
B82477C6
Size 12.5x12.5x10.5 (mm)
Technical data and measuring conditions
Rated inductance L1, L2
Measured with LCR meter Agilent 4284A at frequency fL,
0.1 V, 20 °C
Coupling factor Ktyp
Coupling in between the 2 windings.
–55 °C to +150 °C
Operating temperature range
Rated current IR
Max. permissible DC with temperature increase of ≤ 40 K
Method as per IEC62024-2
Saturation current ISat
DC resistance R1,R2 , (max)
Isolation (functional)
DC with inductance decrease ∆L/L0 of approx. 10%
Measured at +20 °C
Tested with 500 V, 0.4 sec by 100%; 3 sec during qualification
Dip and look method Sn95.5Ag3.8Cu0.7:
(245 ±5) °C, (5 ±0.3) s
Solderability (lead-free)
Wetting of soldering area ≥ 90%
(based on IEC 60068-2-58)
Resistance to soldering heat
Climatic category
+245 °C, 30 s (as referenced in JEDEC J-STD-020D)
55/150/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤ 75% RH
Approx. 5 g
Weight
Please read Cautions and warnings and
Important notes at the end of this document.
4
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SMT power inductors
B82477C6
Size 12.5x12.5x10.5 (mm)
Characteristics and ordering codes
L1, L2 K,typ
Tolerance fL
MHz
0.1
Isat/A
typ
IR
A
R1, R2/m
Ordering code
µH
4.7
6.8
10
%
Min
max typ
86
87
87
86
86
86
86
20%
M
15.3 14.0 7.05 18
11.2 10.0 6.40 21
14.2 B82477C6472M603
17.7 B82477C6682M603
22.5 B82477C6103M603
28.6 B82477C6153M603
43.5 B82477C6223M603
9.6
8.3
6.4
5.2
4.8
8.4
7.5
5.9
4.7
4.0
5.65 27
4.92 35
3.85 48
3.30 69
3.02 85
15
22
33
47
63
78
B82477C6333M603
B82477C6473M603
Inductance is per winding.
When leads are connected in parallel, inductance is the same value.
When leads are connected in series, inductance is four times the value.
R1 R2
R1 + R2
--------------------------
DCR is for each winding. When leads are connected in parallel, DCR =
.
When leads are connected in series, DCR is R1+R2.
Isat is the current flowing through one winding.
When leads are connected in parallel, Isat is the same.
When leads are connected in series, Isat is half the value.
IR is the total current through both windings.
2
I1 and I2 can be calculated like this: I12+I22=IR
.
Please read Cautions and warnings and
Important notes at the end of this document.
5
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SMT power inductors
B82477C6
Size 12.5x12.5x10.5 (mm)
Current derating Iop/IR
Inductance L versus IDC superposition
versus ambient temperature TA
measured with LCR meter Aglient 4284A
at Ta = +20 °C
Please read Cautions and warnings and
Important notes at the end of this document.
6
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Ferrites and accessories
Cautions and warnings
Cautions and warnings
n Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
n If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
n The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire, wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
– Many coating materials have a negative effect (chemically and mechanically) on the winding
wires, insulation materials and connecting points. Customers are always obligated to
determine whether and to what extent their coating materials influence the component.
Customers are responsible and bear all risk for the use of the coating material. TDK
Electronics does not assume any liability for failures of our components that are caused by the
coating material.
n Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or
lead to breakage of the core.
n Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website or in order-related documents such as shipping
notes, order confirmations and product labels. The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
7
12/20
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, we are either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of an electronic component could endanger human life or health (e.g.
in accident prevention or life-saving systems), it must therefore be ensured by means of suitable
design of the customer application or other action taken by the customer (e.g. installation of
protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have
any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available. The aforementioned does not apply in the case of individual agreements deviating
from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
8
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Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,
CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,
MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending
in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2020-06
9
5/21
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