B82477P2104M000 [TDK]

SMD/SMT 电感器(线圈);


型号：	B82477P2104M000
厂家：	TDK ELECTRONICS
描述：	SMD/SMT 电感器(线圈) 电感器
文件：	总8页 (文件大小：551K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

Series/Type:

B82477P2

Ordering code:

Date:

June 2012

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Identification/Classification 1

(header 1 + top left bar):

SMT power inductors

Identification/Classification 2

Size 12.5 x 12.5 x 6 (mm)

(header 2 + bottom left header bar):

Ordering code: (top right header bar)

Series/Type: (bottom right header bar)

B82477P2

Preliminary data (optional):

(if necessary)

Preliminary data

Department:

 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information

Date:

June 2012

contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Rated inductance 1 ... 1000 µH

Rated current 0.53 ... 9.25 A

Construction

■ Ferrite core

■ Magnetically shielded

■ Winding: enamel copper wire

■ Winding soldered to terminals

■ Injection molded base

Features

■ High mechanical stability

■ Temperature range up to +150 °C

■ High rated current

■ Low DC resistance

■ Suitable for lead-free reflow soldering

as referenced in JEDEC J-STD 020D

■ Qualification to AEC-Q200

■ RoHS-compatible

Applications

■ Filtering of supply voltages

■ Coupling, decoupling

■ DC/DC converters

■ Automotive electronics

Terminals

■ Base material

Cu (L ≤ 10µH) CuSn6P (L ≥ 15µH)

■ Layer composition Ni, Sn (lead-free)

■ Electro-plated

Marking

■ Marking on component:

Manufacturer, L value (µH, coded),

manufacturing date (YWWD)

■ Minimum data on reel:

Manufacturer, ordering code, L value,

quantity, date of packing

Delivery mode and packing unit

■ 24-mm blister tape, wound on 330-mm reel

■ Packing unit: 600 pcs./reel

June 2012

Please read Cautions and warnings and

Page 2 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Dimensional drawing and layout recommendation

Dimensions in mm

Taping and packing

Blister tape and Reel

Dimensions in mm

June 2012

Please read Cautions and warnings and

Page 3 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Technical data and measuring conditions

Measured with LCR meter Agilent 4284A at frequency f_L,

0.1 V, +20 °C

Rated inductance L_R

Rated temperature T_R

Rated current I_R

+85 °C

Max. permissible DC with temperature increase of ≤40 K

at rated temperature

Max. permissible DC with inductance decrease ∆L/L₀of

approx. 10%,

Saturation current I_Sat

DC resistance R_typ

Measured at +20 °C

Dip and look method Sn95.5Ag3.8Cu0.7:

+(245 5) °C, (3 0.3) s

Wetting of soldering area 90%

(based on IEC 60068-2-58)

Solderability (lead-free)

Resistance to soldering heat

Climatic category

+260 °C, 40 s (as referenced in JEDEC J-STD 020D)

55/150/56 (to IEC 60068-1)

Mounted: –55 °C … +150 °C

Packaged: –25 °C … +40 °C, ≤75% RH

Storage conditions

Weight

Approx. 3.3 g

June 2012

Please read Cautions and warnings and

Page 4 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Characteristics and ordering codes

L_R

µH

1.0

Tolerance f_L

MHz

20% = M

I_R

9.25

I_sat

10.0

R_max

Ω

0,008

Ordering code

0.1

B82477P2102M000

B82477P2152M000

B82477P2222M000

B82477P2332M000

B82477P2472M000

B82477P2682M000

B82477P2103M000

B82477P2153M000

B82477P2223M000

B82477P2333M000

B82477P2473M000

B82477P2683M000

B82477P2104M000

B82477P2154M000

B82477P2224M000

B82477P2334M000

B82477P2474M000

B82477P2684M000

B82477P2105M000

1.5

2.2

3.3

4.7

6.8

8.70

7.20

6.70

5.40

4.80

4.30

3.70

3.40

2.70

2.40

1.85

1.65

1.35

1.15

0.95

0.80

0.62

0.53

8.70

8.00

7.20

5.70

4.80

4.00

3.30

2.80

2.20

1.90

1.50

1.30

1.00

0.80

0.68

0.58

0.48

0.40

0,010

0,012

0,014

0,016

0,020

0,025

0,030

0,036

0,055

0,070

0,110

0,140

0,210

0,300

0,460

0,550

1,050

1,300

100

150

220

330

470

680

1000

June 2012

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 8

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Impedance versus frequency (typical curve)

1000000.0

Z/Ohm

10000.0

1000µH

100.0

100µH

10µH

1.0

0.0

1µH

0.0

0.1

1.0

10.0

100.0

f/MHz

Inductance derating

Current derating Iop/IR

versus load current (typical curve)

versus ambient temperature TA

(rated temperature TR = +85 °C)

June 2012

Please read Cautions and warnings and

Page 6 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 6 (mm)

B82477P2

Preliminary data

Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to

breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

June 2012

Please read Cautions and warnings and

Page 7 of 8

Important notes at the end of this document.

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain areas

of application. These statements are based on our knowledge of typical requirements that are often placed

on our products in the areas of application concerned. We nevertheless expressly point out that such

statements cannot be regarded as binding statements about the suitability of our products for a

particular customer application. As a rule we are either unfamiliar with individual customer applications or

less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent

on the customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure before

the end of their usual service life cannot be completely ruled out in the current state of the art, even

if they are operated as specified. In customer applications requiring a very high level of operational safety

and especially in customer applications in which the malfunction or failure of an electronic component could

endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be

ensured by means of suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet

(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our

sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this publication

may change from time to time. The same is true of the corresponding product specifications. Please

check therefore to what extent product descriptions and specifications contained in this publication are still

applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The aforementioned

does not apply in the case of individual agreements deviating from the foregoing for customer-specific

products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF

certifications confirm our compliance with requirements regarding the quality management system in the

automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK

always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949

may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only

requirements mutually agreed upon can and will be implemented in our Quality Management

System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become

legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered

or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-

electronics.tdk.com/trademarks.

Release 2018-10

Page 8 of 8

B82477P2104M000 [TDK]

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