B82477R4103M100 [TDK]

SMD/SMT 电感器(线圈);


型号：	B82477R4103M100
厂家：	TDK ELECTRONICS
描述：	SMD/SMT 电感器(线圈) PC 测试功率感应器电感器
文件：	总8页 (文件大小：1151K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

Series/Type:

B82477R4

Ordering code:

Date:

April 2015

Version:

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Identification/Classification 1

(header 1 + top left bar):

SMT power inductors

Identification/Classification 2

Size 12.5 x 12.5 x 8.5 mm

(header 2 + bottom left header bar):

Ordering code: (top right header bar)

Series/Type: (bottom right header bar)

B82477R4

Preliminary data (optional):

(if necessary)

MAG IN PD

 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information

contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Rated inductance 0.82 ...1000 µH

Construction

■

Ferrite core

Magnetically shielded

Winding: enamel copper wire

Winding soldered to terminals

Injection moulded base

Features

■

High mechanical stability

Temperature range up to +150 °C

High rated current

Increased current handling capability compared to B82477P4 series (I_sat+30%)

Qualified to AEC-Q200

Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D

RoHS-compatible

Halogen Free in the meaning of Cl ≤ 900ppm, Br ≤ 900pm, Cl+Br ≤ 1500 ppm

Applications

■

Filtering of supply voltages

Coupling, decoupling

DC/DC converters

Automotive electronics

Terminals

■

Base material

Cu (L ≤ 10 µH), CuSn6P (L > 15 µH)

Layer composition Ni, Sn (lead-free)

Electro-plated

■

Marking

Marking on component:

■

Manufacturer, L value (µH, coded),

manufacturing date (YWWD)

■

Minimum data on reel:

Manufacturer, ordering code, L value,

quantity, date of packing

Delivery mode and packing unit

■

24-mm blister tape, wound on 330-mm reel

Packing unit: 350 pcs./reel

■

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 2 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Dimensional drawing and layout recommendation

Dimensions in mm

Taping and packing

Blister tape

Dimensions in mm

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 3 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Technical data and measuring conditions

Measured with LCR meter Agilent 4284A at frequency f_L, 0.1 V.

+20°C

Rated inductance L_R

Operating temperature range

Rated current I_R

–55 °C ... +150 °C

Max. permissible DC with temperature increase of ≤ 40 K

measured at +20 °C

Max. permissible DC current with inductance decrease ∆L/L₀of

approx. 10%

Saturation current I_Sat

DC resistance R

Measured at +20 °C

Dip and look method Sn95.5Ag3.8Cu0.7:

+(245 ±5) °C, (5 ±0.3) s

Wetting of soldering area ≥ 90%

(based on IEC 60068-2-58)

Solderability (lead-free)

Resistance to soldering heat

Climatic category

+260 °C, 40 s (as referenced in JEDEC J-STD 020D)

55/150/56 (to IEC 60068-1)

Mounted: –55 °C … +150 °C

Packaged: –25 °C … +40 °C, ≤ 75% RH

Storage conditions

Weight

Approx. 4 g

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 4 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Characteristics and ordering codes

L_R

µH

Tolerance f_L

MHz

I_R

I_{sat, min}I_{sat, typ}

R_max

mΩ

R_typ

mΩ

Ordering code

0.82

1.50

2.00

3.00

3.60

4.70

5.60

6.80

12.25

10.25

9.50

8.70

8.50

7.85

7.60

6.95

6.20

27.0

20.0

18.0

15.5

13.0

12.2

11.0

10.5

38.0

27.0

24.0

18.0

16.0

14.25

12.75

12.0

5.5

3.8 B82477R4821M100

4.8 B82477R4152M100

5.9 B82477R4202M100

6.8 B82477R4302M100

7.9 B82477R4362M100

8.9 B82477R4472M100

9.9 B82477R4562M100

6.5

8.0

20% = M 0.1

9.0

10.0

11.0

11.5

15.0

18.5

11.0 B82477R4682M100

16.4 B82477R4103M100

8.75 10.25

5.00

4.45

7.25

6.10

8.75

7.25

25.0

32.0

22.8 B82477R4153M100

28.1 B82477R4223M100

3.55

3.35

2.80

2.35

1.90

1.45

1.18

1.07

0.88

0.72

5.20

4.30

3.55

2.90

2.40

2.00

1.70

1.35

1.10

0.95

6.00

4.90

3.90

3.25

2.80

2.20

1.80

1.50

1.25

1.05

50.0

60.0

85.0

46.3 B82477R4333M100

55.7 B82477R4473M100

80.1 B82477R4683M100

100

150

220

330

470

680

1000

120

112

B82477R4104M100

B82477R4154M100

B82477R4224M100

B82477R4334M100

B82477R4474M100

B82477R4684M100

B82477R4105M100

175

290

158

275

425

405

605

578

860

830

1350

1250

Current derating I_op/I_Rversus ambient temperature T_A

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 5 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Typical curves:

Inductance vs. DC superposition measured with LCR meter Agilent 4284A at T_a= +20 °C

820nH

3µH

1.2

1.0

0.8

0.6

0.4

0.2

0.0

5.0

4.0

3.0

2.0

1.0

0.0

2000 4000 6000 8000 10000 12000 14000 16000 18000 20000

5000

10000

15000

20000

25000

30000

35000

40000

Idc [mA]

10µH

33µH

15.0

12.5

10.0

7.5

5.0

2.5

0.0

2000

4000

6000

8000

Idc [mA]

10000

12000

14000

1000 2000 3000 4000 5000 6000 7000 8000 9000 10000

Idc [mA]

100µH

330µH

150

500

400

300

200

100

125

100

500 1000 1500 2000 2500 3000 3500 4000 4500 5000

500

1000

1500

2000

2500

3000

Idc [mA]

1000µH

1500

1250

1000

750

500

250

200

400

600

800

1000

1200

1400

1600

Idc [mA]

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 6 of 8

Important notes at the end of this document.

SMT power inductors

Size 12.5 x 12.5 x 8.5 mm

B82477R4

Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation. Washing processes may damage the product

due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause

cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequecy behaviour of the components.

■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to

breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

Display of ordering codes for EPCOS products

The ordering code for one and the same EPCOS product can be represented differently in data

sheets, data books, other publications, on the EPCOS website, or in order-related documents such as

shipping notes, order confirmations and product labels. The varying representations of the

ordering codes are due to different processes employed and do not affect the specifications of

the respective products. Detailed information can be found on the Internet under

www.epcos.com/orderingcodes

MAG IN PD

April 2015

Please read Cautions and warnings and

Page 7 of 8

Important notes at the end of this document.

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain areas

of application. These statements are based on our knowledge of typical requirements that are often placed

on our products in the areas of application concerned. We nevertheless expressly point out that such

statements cannot be regarded as binding statements about the suitability of our products for a

particular customer application. As a rule we are either unfamiliar with individual customer applications or

less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent

on the customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure before

the end of their usual service life cannot be completely ruled out in the current state of the art, even

if they are operated as specified. In customer applications requiring a very high level of operational safety

and especially in customer applications in which the malfunction or failure of an electronic component could

endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be

ensured by means of suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet

(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our

sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this publication

may change from time to time. The same is true of the corresponding product specifications. Please

check therefore to what extent product descriptions and specifications contained in this publication are still

applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The aforementioned

does not apply in the case of individual agreements deviating from the foregoing for customer-specific

products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF

certifications confirm our compliance with requirements regarding the quality management system in the

automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK

always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949

may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only

requirements mutually agreed upon can and will be implemented in our Quality Management

System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become

legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered

or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-

electronics.tdk.com/trademarks.

Release 2018-10

Page 8 of 8

B82477R4103M100 [TDK]

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