B82477R4153M100 [TDK]
SMD/SMT 电感器(线圈);型号: | B82477R4153M100 |
厂家: | TDK ELECTRONICS |
描述: | SMD/SMT 电感器(线圈) 电感器 |
文件: | 总8页 (文件大小:1151K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
Series/Type:
B82477R4
Ordering code:
Date:
April 2015
Version:
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Identification/Classification 1
(header 1 + top left bar):
SMT power inductors
Identification/Classification 2
Size 12.5 x 12.5 x 8.5 mm
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
B82477R4
Preliminary data (optional):
(if necessary)
MAG IN PD
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Rated inductance 0.82 ...1000 µH
Construction
■
■
■
■
■
Ferrite core
Magnetically shielded
Winding: enamel copper wire
Winding soldered to terminals
Injection moulded base
Features
■
■
■
■
■
■
■
■
High mechanical stability
Temperature range up to +150 °C
High rated current
Increased current handling capability compared to B82477P4 series (Isat +30%)
Qualified to AEC-Q200
Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D
RoHS-compatible
Halogen Free in the meaning of Cl ≤ 900ppm, Br ≤ 900pm, Cl+Br ≤ 1500 ppm
Applications
■
■
■
■
Filtering of supply voltages
Coupling, decoupling
DC/DC converters
Automotive electronics
Terminals
■
Base material
Cu (L ≤ 10 µH), CuSn6P (L > 15 µH)
Layer composition Ni, Sn (lead-free)
Electro-plated
■
■
Marking
Marking on component:
■
Manufacturer, L value (µH, coded),
manufacturing date (YWWD)
■
Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing unit
■
24-mm blister tape, wound on 330-mm reel
Packing unit: 350 pcs./reel
■
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 2 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Dimensional drawing and layout recommendation
Dimensions in mm
Taping and packing
Blister tape
Dimensions in mm
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 3 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Technical data and measuring conditions
Measured with LCR meter Agilent 4284A at frequency fL, 0.1 V.
+20°C
Rated inductance LR
Operating temperature range
Rated current IR
–55 °C ... +150 °C
Max. permissible DC with temperature increase of ≤ 40 K
measured at +20 °C
Max. permissible DC current with inductance decrease ∆L/L0 of
approx. 10%
Saturation current ISat
DC resistance R
Measured at +20 °C
Dip and look method Sn95.5Ag3.8Cu0.7:
+(245 ±5) °C, (5 ±0.3) s
Wetting of soldering area ≥ 90%
(based on IEC 60068-2-58)
Solderability (lead-free)
Resistance to soldering heat
Climatic category
+260 °C, 40 s (as referenced in JEDEC J-STD 020D)
55/150/56 (to IEC 60068-1)
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤ 75% RH
Storage conditions
Weight
Approx. 4 g
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 4 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Characteristics and ordering codes
LR
µH
Tolerance fL
MHz
IR
A
Isat, min Isat, typ
Rmax
mΩ
Rtyp
mΩ
Ordering code
A
A
0.82
1.50
2.00
3.00
3.60
4.70
5.60
6.80
12.25
10.25
9.50
8.70
8.50
7.85
7.60
6.95
6.20
27.0
20.0
18.0
15.5
13.0
12.2
11.0
10.5
38.0
27.0
24.0
18.0
16.0
14.25
12.75
12.0
5.5
3.8 B82477R4821M100
4.8 B82477R4152M100
5.9 B82477R4202M100
6.8 B82477R4302M100
7.9 B82477R4362M100
8.9 B82477R4472M100
9.9 B82477R4562M100
6.5
8.0
20% = M 0.1
9.0
10.0
11.0
11.5
15.0
18.5
11.0 B82477R4682M100
16.4 B82477R4103M100
10
8.75 10.25
15
22
5.00
4.45
7.25
6.10
8.75
7.25
25.0
32.0
22.8 B82477R4153M100
28.1 B82477R4223M100
33
47
3.55
3.35
2.80
2.35
1.90
1.45
1.18
1.07
0.88
0.72
5.20
4.30
3.55
2.90
2.40
2.00
1.70
1.35
1.10
0.95
6.00
4.90
3.90
3.25
2.80
2.20
1.80
1.50
1.25
1.05
50.0
60.0
85.0
46.3 B82477R4333M100
55.7 B82477R4473M100
80.1 B82477R4683M100
68
100
150
220
330
470
680
1000
120
112
B82477R4104M100
B82477R4154M100
B82477R4224M100
B82477R4334M100
B82477R4474M100
B82477R4684M100
B82477R4105M100
175
290
158
275
425
405
605
578
860
830
1350
1250
Current derating Iop/IR versus ambient temperature TA
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 5 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Typical curves:
Inductance vs. DC superposition measured with LCR meter Agilent 4284A at Ta= +20 °C
820nH
3µH
1.2
1.0
0.8
0.6
0.4
0.2
0.0
5.0
4.0
3.0
2.0
1.0
0.0
0
2000 4000 6000 8000 10000 12000 14000 16000 18000 20000
0
5000
10000
15000
20000
25000
30000
35000
40000
Idc [mA]
Idc [mA]
10µH
33µH
15.0
12.5
10.0
7.5
50
40
30
20
10
0
5.0
2.5
0.0
0
2000
4000
6000
8000
Idc [mA]
10000
12000
14000
0
1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
Idc [mA]
100µH
330µH
150
500
400
300
200
100
0
125
100
75
50
25
0
0
500 1000 1500 2000 2500 3000 3500 4000 4500 5000
0
500
1000
1500
2000
2500
3000
Idc [mA]
Idc [mA]
1000µH
1500
1250
1000
750
500
250
0
0
200
400
600
800
1000
1200
1400
1600
Idc [mA]
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 6 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 mm
B82477R4
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation. Washing processes may damage the product
due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause
cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequecy behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
sheets, data books, other publications, on the EPCOS website, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the
ordering codes are due to different processes employed and do not affect the specifications of
the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes
MAG IN PD
April 2015
Please read Cautions and warnings and
Page 7 of 8
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain areas
of application. These statements are based on our knowledge of typical requirements that are often placed
on our products in the areas of application concerned. We nevertheless expressly point out that such
statements cannot be regarded as binding statements about the suitability of our products for a
particular customer application. As a rule we are either unfamiliar with individual customer applications or
less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent
on the customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before
the end of their usual service life cannot be completely ruled out in the current state of the art, even
if they are operated as specified. In customer applications requiring a very high level of operational safety
and especially in customer applications in which the malfunction or failure of an electronic component could
endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be
ensured by means of suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet
(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our
sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this publication
may change from time to time. The same is true of the corresponding product specifications. Please
check therefore to what extent product descriptions and specifications contained in this publication are still
applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The aforementioned
does not apply in the case of individual agreements deviating from the foregoing for customer-specific
products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF
certifications confirm our compliance with requirements regarding the quality management system in the
automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK
always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949
may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only
requirements mutually agreed upon can and will be implemented in our Quality Management
System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered
or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-
electronics.tdk.com/trademarks.
Release 2018-10
Page 8 of 8
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