B82559B4222A019 [TDK]

大电流扁平线电感器;
B82559B4222A019
型号: B82559B4222A019
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

大电流扁平线电感器

电感器
文件: 总11页 (文件大小:654K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ERU chokes  
ERU 19, SMT flat wire high current inductors  
Series/Type:  
B82559B*A019  
Date:  
September 2020  
Data Sheet  
¤ꢀTDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto  
and the information contained therein without TDK Electronics’ prior express consent is prohibited.  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
Rated inductance 1.0 .... 30 μH  
Saturation current 11.5 ... 48.1 A  
Construction  
High temperature ferrite core  
Magnetically shielded  
Helical winding  
Self-leaded construction  
Under body termination  
3 pins for improved reliability  
Features  
High rated current  
Extremely low DC resistance  
Very low profile and extremely small footprint  
Suitable for pick-and-place processes  
RoHS-compatible  
Easily customized  
AEC-Q200 qualified  
Applications  
Energy storage chokes for  
DC-DC converters  
VRM modules  
POL converters  
Solar converters  
Terminals  
Lead-free tinned  
Marking  
Manufacturer, ordering code, date of manufacture and  
production place (YYWWD/X),  
Delivery mode and packing units  
Blister tape  
Please read Cautions and warnings and  
Important notes at the end of this document.  
2
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
Dimensional drawing and layout recommendation  
Dimensions in mm  
Circuit diagram  
Please read Cautions and warnings and  
Important notes at the end of this document.  
3
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
Taping and packing  
Tape:  
Dimensions in mm  
Reel:  
Dimensions in mm  
Height (mm)  
cavity H (blister tape)  
Packing unit  
pcs. per reel  
component h  
nom.  
max.  
7.65  
8.65  
8.0  
220  
210  
200  
180  
9.0  
9.25  
9.6  
10.25  
10.6  
Please read Cautions and warnings and  
Important notes at the end of this document.  
4
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
Technical data and measuring conditions  
Rated inductance LR  
Inductance tolerance  
Saturation current ISat  
Measured at 100 kHz, 0.1 V, +25 °C  
r10%  
Current that will result in an approximately 20% drop in  
the inductance values at the specified temperature  
Rated current IR  
Current that will cause a '40 K self-heating at room  
temperature  
DC resistance RDC  
Measured at +25 °C, tolerance r10%, typical values  
Self-resonant frequency  
High voltage: N1 - core  
! 2 MHz  
200 V DC, 1 s  
Solderability  
(245 r5) °C, (3 r0.3) s,  
(test of wettability of the pins)  
wetting of soldering area t95%  
(based on IEC 60068-2-58, solder bath method)  
Resistance to soldering heat  
Operating temperature  
To JEDEC J-STD 020D (Tc: +245 °C on pin)  
40 °C … +150 °C (component)  
Storage conditions (packaged)  
–25 °C … +40 °C, dꢀ75% RH  
Characteristics and ordering codes  
LR  
Isat, 25°C Isat, 100°C IR  
RDC (typ) Height h Approx. Ordering code  
(nom.) weight  
PH  
A
A
m:  
0.95  
mm  
7.65  
g
A
1.0  
46.6  
48.1  
43.6  
35.1  
25.5  
21.3  
15.8  
14.7  
13.5  
11.5  
41.3  
41.8  
37.6  
31.9  
22.2  
18.8  
14.6  
12.9  
11.8  
10.1  
36.3  
30.2  
27.2  
25.1  
25.1  
12.7  
11.7  
10.7  
9.5  
9.1  
B82559B2102A019  
B82559B3152A019  
B82559B4222A019  
B82559B5332A019  
B82559B5472A019  
B82559B6682A019  
B82559B7103A019  
B82559B9153A019  
B82559B0203A019  
B82559B0303A019  
1.5  
2.2  
1.35  
1.80  
8.65  
9.25  
10.3  
11.3  
12.7  
12.7  
9.1  
3.3  
2.25  
10.25  
10.25  
7.65  
4.7  
2.25  
6.8  
7.60  
10.0  
15.0  
20.0  
30.0  
8.80  
7.65  
9.3  
11.00  
13.50  
17.00  
8.65  
10.5  
11.2  
12.6  
9.25  
8.6  
10.25  
Please read Cautions and warnings and  
Important notes at the end of this document.  
5
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
Inductance L versus DC load current IDC  
The temperature rise 'T is measured at an am- B82559B2102A019  
bient temperature of +25 °C. A current is applied  
for 30 minutes and the temperature is measured  
on top of the inductor which is mounted on a  
printed circuit board. No forced air cooling is ap-  
plied.  
The inductance vs current curves are generated  
by measuring the inductors at +25 °C and  
+100 °C.  
B82559B3152A019  
B82559B4222A019  
Please read Cautions and warnings and  
Important notes at the end of this document.  
6
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
B82559B5332A019  
B82559B5472A019  
B82559B6682A019  
B82559B7103A019  
Please read Cautions and warnings and  
Important notes at the end of this document.  
7
09/20  
ERU chokes  
B82559B*A019  
ERU 19  
Helically wound  
B82559B9153A019  
B82559B0203A019  
B82559B0303A019  
Please read Cautions and warnings and  
Important notes at the end of this document.  
8
09/20  
Cautions and warnings  
Please note the recommendations in our Inductors data book (latest edition) and in the data  
sheets.  
– Particular attention should be paid to the derating curves given there.  
– The soldering conditions should also be observed. Temperatures quoted in relation to wave  
soldering refer to the pin, not the housing.  
If the components are to be washed varnished it is necessary to check whether the washing  
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,  
or on glued joints. In particular, it is possible for washing varnish agent residues to have a  
negative effect in the long-term on wire insulation.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
The following points must be observed if the components are potted in customer applications:  
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic  
housing or core. This pressure can have a deleterious effect on electrical properties, and in  
extreme cases can damage the core or plastic housing mechanically.  
– It is necessary to check whether the potting material used attacks or destroys the wire  
insulation, plastics or glue.  
– The effect of the potting material can change the high-frequency behaviour of the components.  
Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to  
breakage of the core.  
Even for customer-specific products, conclusive validation of the component in the circuit can  
only be carried out by the customer.  
Display of ordering codes for TDK Electronics products  
The ordering code for one and the same product can be represented differently in data sheets, data  
books, other publications, on the company website or in order-related documents such as shipping  
notes, order confirmations and product labels. The varying representations of the ordering  
codes are due to different processes employed and do not affect the specifications of the  
respective products. Detailed information can be found on the Internet under  
www.tdk-electronics.tdk.com/orderingcodes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
9
09/20  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical require-  
ments that are often placed on our products in the areas of application concerned. We never-  
theless expressly point out that such statements cannot be regarded as binding statements  
about the suitability of our products for a particular customer application. As a rule, we  
are either unfamiliar with individual customer applications or less familiar with them than the cus-  
tomers themselves. For these reasons, it is always ultimately incumbent on the customer to  
check and decide whether a product with the properties described in the product specification is  
suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or fail-  
ure before the end of their usual service life cannot be completely ruled out in the current  
state of the art, even if they are operated as specified. In customer applications requiring a  
very high level of operational safety and especially in customer applications in which the mal-  
function or failure of an electronic component could endanger human life or health (e.g. in acci-  
dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-  
sign of the customer application or other action taken by the customer (e.g. installation of pro-  
tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event  
of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this pub-  
lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-  
cause they are classed as hazardous). Useful information on this will be found in our Material  
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more  
detailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order.  
We also reserve the right to discontinue production and delivery of products. Consequent-  
ly, we cannot guarantee that all products named in this publication will always be available. The  
aforementioned does not apply in the case of individual agreements deviating from the foregoing  
for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms  
and Conditions of Supply.  
10 09/20  
Important notes  
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.  
The IATF certifications confirm our compliance with requirements regarding the quality manage-  
ment system in the automotive industry. Referring to customer requirements and customer spe-  
cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-  
dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-  
quirements, we hereby like to emphasize that only requirements mutually agreed upon can  
and will be implemented in our Quality Management System. For clarification purposes we  
like to point out that obligations from IATF 16949 shall only become legally binding if individually  
agreed upon.  
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,  
CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,  
MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,  
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,  
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending  
in Europe and in other countries. Further information will be found on the Internet at  
www.tdk-electronics.tdk.com/trademarks.  
Release 2020-06  
11 09/20  

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