B82791H0015A030 [TDK]

共模滤波器/扼流圈;


型号：	B82791H0015A030
厂家：	TDK ELECTRONICS
描述：	共模滤波器/扼流圈 LTE 过滤器扼流圈电感器
文件：	总6页 (文件大小：444K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data and signal line chokes

Common-mode chokes, ring core

2.2 … 47 mH, 100 mA, +60 °C

Series/Type:

B82791G15/H15

Date:

a~í~=pÜÉÉí ^{October 2008, October 2011}

information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Data and signal line chokes

B82791G15/H15

Common-mode chokes, ring core

Rated voltage 42 V AC/80 V DC

Rated inductance 2.2 mH to 47 mH

Rated current 100 mA

Construction

■ Current-compensated ring core double choke

■ Ferrite core

■ Polycarbonate case (UL 94 V-0)

B82791G15

Features

■ Without potting

■ Vertical or horizontal version

■ Suitable for wave soldering

■ RoHS-compatible

Application

Suppression of asymmetrical interference coupled in

on data lines, already effective at 10 kHz, e.g. in:

B82791H15

■ Telephone lines (analog, ISDN)

■ Interfaces with symmetrical data transmission

■ Building services automation (EIB bus)

■ Automation engineering

Terminals

■ Base material CuNi18Zn20

■ Layer composition Ni, Sn

■ Hot-dipped

■ Lead spacing 10  15 (mm) or 12.7 x 5.08/2.54 (mm)

Marking

Manufacturer, ordering code, rated inductance,

rated current, graphic symbol (for B82791G15),

date of manufacture (MMYY)

Delivery mode

Cardboard box

Please read Cautions and warnings and

Important notes at the end of this document.

06/11

Data and signal line chokes

B82791G15/H15

Common-mode chokes, ring core

Dimensional drawings and pin configurations

Horizontal version (B82791G15)

Vertical version (B82791H15)

7.4 max.

5.08±0.1

0.8^_0.1

Marking

17.6 max.

2.8+0.4

8 max.

2.8+0.5

10±0.1

17.5 max.

Marking

2.54±0.1

IND0215-W-E

IND0214-8-E

Tolerances to ISO 2768-M unless otherwise noted.

Dimensions in mm.

Technical data and measuring conditions

Rated voltage V_R

42 V AC (50/60 Hz) / 80 V DC

Rated temperature T_R

Rated current I_R

+60 °C

Referred to 50 Hz and rated temperature

Rated inductance L_R

Measured with Agilent 4284A at 10 kHz, 0.1 mA, +20 °C

Inductance is specified per winding.

Inductance tolerance

30% at +20 °C

B82791H0015A016: –25/+35% at +20 °C

Inductance decrease L/L₀

< 10% at DC magnetic bias with I_R, +20 °C

Stray inductance L_stray,typ

Measured with Agilent 4275A at 10 kHz, 5 mA, +20 °C,

typical values

DC resistance R_typ

Measured at +20 C, typ. values, specified per winding

Solderability (lead-free)

Sn96.5Ag3.0Cu0.5: (+245 5) °C, (3 0.3) s

Wetting of soldering area 95%

(to IEC 60068-2-20, test Ta)

Resistance to soldering heat

(wave soldering)

(+260 5) °C, (10 1) s

(to IEC 60068-2-20, test Tb)

Climatic category

Storage conditions (packaged)

Weight

40/125/56 (to IEC 60068-1)

–25 °C … +40 °C, 75% RH

Approx. 3 g

Please read Cautions and warnings and

Important notes at the end of this document.

06/11

Data and signal line chokes

B82791G15/H15

Common-mode chokes, ring core

Characteristics and ordering codes

L_R

L_stray,typI_R

nH mA

500

R_typ

V_test

Ordering code

m

V DC, 2 s horizontal version

vertical version

—

2.2

4.7

100

300

1200

750

B82791G0015A017

900

1200

3300

2100

850

1200

5000

5100

B82791G0015A016 B82791H0015A016

—

B82791H0015A025

—

B82791G0015A014

—

750

B82791H0015A030

Impedance |Z| versus frequency f

Current derating I_op/I_R

measured with windings in parallel at 20 °C,

typical values

versus ambient temperature

IND0681-C-E

IND0216-9

10⁶

1.4

I_op

B82791

I_R

1.2

1.0

0.8

0.6

0.4

0.2

|Z|

10⁵

T_R= 60 C

10⁴

H0015A030

G0015A014

H0015A025

G/H0015A016

10³

G0015A017

10²

10¹

10⁴

10⁵

10⁶

Hz 10⁷

80 100

T_A

140

Please read Cautions and warnings and

Important notes at the end of this document.

06/11

Cautions and warnings

Current-compensated ring core double chokes

■ Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there. Derating must be applied

in the case the ambient temperature in application exceeds the rated temperature of the

component.

– Ensure the operation temperature of the component in application, which is the sum of the

ambient temperature and the temperature rise owing to losses (”self-heating”), not to exceed

the maximum value specified in the climatic category.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

■ If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

■ The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to

breakage of the core.

■ Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

Please read Cautions and warnings and

Important notes at the end of this document.

06/11

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain

areas of application. These statements are based on our knowledge of typical requirements that are

often placed on our products in the areas of application concerned. We nevertheless expressly point

out that such statements cannot be regarded as binding statements about the suitability of our

products for a particular customer application. As a rule we are either unfamiliar with individual

customer applications or less familiar with them than the customers themselves. For these reasons, it is

always ultimately incumbent on the customer to check and decide whether a product with the properties

described in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure

before the end of their usual service life cannot be completely ruled out in the current state of the

art, even if they are operated as specified. In customer applications requiring a very high level of

operational safety and especially in customer applications in which the malfunction or failure of an

electronic component could endanger human life or health (e.g. in accident prevention or life-saving

systems), it must therefore be ensured by means of suitable design of the customer application or other

action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or

damage is sustained by third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must beobserved.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the

Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please

contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications contained

in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the foregoing for

customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The

IATF certifications confirm our compliance with requirements regarding the quality management system

in the automotive industry. Referring to customer requirements and customer specific requirements

(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even

if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to

emphasize that only requirements mutually agreed upon can and will be implemented in our

Quality Management System. For clarification purposes we like to point out that obligations from IATF

16949 shall only become legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,

SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are

trademarks registered or pending in Europe and in other countries. Further information will be found

on the Internet at www.tdk-electronics.tdk.com/trademarks.

Release 2018-10

06/11

B82791H0015A030 [TDK]

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