C1005X8R1E682M050BE_技术文档

GC110G0001

SPEC. No. C-SOFT-e

DELIVERY SPECIFICATION

D A T E : Jun, 2020

To

Non-Controlled Copy

Upon the acceptance of this spec. previous

spec. (C2011-0454) shall be abolished.

CUSTOMER’S PRODUCT NAME TDK PRODUCT NAME

MULTILAYER CERAMIC CHIP CAPACITORS(Soft Termination)

Bulk and Tape packaging【RoHS compliant】

C1005,C1608,C2012,C3216,C3225,C4532,C5750,C7563 Type

C0G,X5R,X7R,X7S,X7T,X8R,X8L Characteristics

Please return this specification to TDK representatives with your signature.

If orders are placed without returned specification, please allow us to judge that specification is

accepted by your side.

RECEIPT CONFIRMATION

DATE:

YEAR

MONTH

DAY

TDK Corporation

Sales

Engineering

Electronic Components Business Company

Ceramic Capacitors Business Group

Electronic Components

Sales & Marketing Group

APPROVED

Person in charge

APPROVED

CHECKED

Person in charge

GC110G0001

■CATALOG NUMBER CONSTRUCTION

C

7563

X7S

1C 107

M 280

L

E

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(1) Series

(2) Dimensions L x W (mm)

(6) Capacitance tolerance

Terminal

Code

J

K

M

Tolerance

±5%

±10%

±20%

Code

EIA

Length Width

width

0.10

0.20

0.30

1005

1608

2012

3216

3225

4532

5750

7563

CC0402

CC0603

CC0805

CC1206

CC1210

CC1812

CC2220

CC3025

1.00

1.60

2.00

3.20

4.50

5.70

7.50

0.50

0.80

1.25

1.60

2.50

3.20

5.00

6.30

(7) Thickness

Code

050

060

080

085

115

125

130

160

200

230

250

Thickness

0.50mm

0.60mm

0.80mm

0.85mm

1.15mm

1.25mm

1.30mm

1.60mm

2.00mm

2.30mm

2.50mm

2.80mm

(3) Temperature characteristics

Temperature

characteristics

C0G

X5R

X7R

X7S

X7T

X8R

Temperature coefficient

or capacitance change

0±30 ppm/℃

±15%

±22%

Temperature

range

-55 to +125℃

-55 to +85℃

-55 to +125℃

-55 to +150℃

280

±22,-33%

±15%

X8L

±15,-40%

-55 to +150℃

(8) Packaging style

Code

Style

(4) Rated voltage (DC)

A

B

K

L

178mm reel, 4mm pitch

178mm reel, 2mm pitch

178mm reel, 8mm pitch

330mm reel, 12mm pitch

Code

0J

Voltage (DC)

6.3V

1A

1C

10V

16V

1E

25V

(9) Special reserved code

1V

1H

2A

2E

35V

50V

Code

E

Description

Soft termination

100V

250V

450V

630V

1000V

2000V

3000V

2W

2J

3A

3D

3F

(5) Nominal capacitance (pF)

The capacitance is expressed in three digit codes and in

units of pico Farads (pF). The first and second digits

identify the first and second significant figures of the

capacitance. The third digit identifies the multiplier. R

designates a decimal point.

(Example) 0R5 = 0.5pF

101 = 100pF

225 = 2,200,000pF = 2.2μF

— 1 —

GC110G0001

SCOPE

This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to

.

PRODUCTIONPLACES

Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd

and TDK Components U.S.A.,Inc.

PRODUCT NAME

The name of the product to be defined in this specifications shall be C◇◇◇◇○○○△△□□□×◎※※※S.

REFERENCE STANDARD

JIS C 5101－1：2010

Fixed capacitors for use in electronic equipment-Part 1: Generic specification

C 5101－21：2014 Fixed capacitors for use in electronic equipment-Part 21 : Sectional specification

: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1

C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part 22 : Sectional specification

: Fixed surface mount multilayer capacitors of ceramic dielectric,Class2

C 0806－3：2014

Packaging of components for automatic handling - Part 3: Packaging of

surface mount components on continuous tapes

JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic

equipment

CONTENTS

1. CODE CONSTRUCTION

2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE

3. OPERATING TEMPERATURE RANGE

4. STORING CONDITION AND TERM

5. P.C. BOARD

6. INDUSTRIAL WASTE DISPOSAL

7. PERFORMANCE

8. INSIDE STRUCTURE AND MATERIAL

9. CAUTION FOR PRODUCTS WITH SOFT TERMINATION

10. PACKAGING

11. RECOMMENDATION

12. SOLDERING CONDITION

13. CAUTION

14. TAPE PACKAGING SPECIFICATION

When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written

spec change after conference of both posts involved.

This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or

confirmed a state of mounted on your product.

If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.

Division

Date

SPEC. No.

C-SOFT-e

Jun, 2020

Ceramic Capacitors Business Group

— 2 —

GC110G0001

1. CODE CONSTRUCTION

(Example)

C2012

X7R

1H

105

K

T

※※※S

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(1) Case size

Terminal electrode

B

L

W

G

B

T

Internal electrode

Ceramic dielectric

Type

Dimensions (Unit : mm)

T

TDK[EIA style]

L

W

B

G

+0.15

+0.10

- 0.05

+0.20

- 0.10

+0.15

- 0.10

1.00

0.50

0.80

0.50

0.80

- 0.05

C1005

[CC0402]

0.10 min.

0.30 min.

+0.25

- 0.10

+0.20

- 0.10

+0.20

- 0.10

+0.15

- 0.10

1.00

C1608

[CC0603]

1.60

0.20 min.

0.30 min.

0.50 min.

0.60±0.15

0.85±0.15

C2012

[CC0805]

+0.45

2.00

+0.25

- 0.20

1.25

1.60

- 0.20

+0.25

- 0.20

1.25

0.85±0.15

1.15±0.15

1.30±0.20

C3216

[CC1206]

+0.40

3.20

+0.30

- 0.20

0.20 min.

1.00 min.

- 0.20

+0.30

- 0.20

1.60

+0.30

- 0.20

1.60

+0.30

- 0.20

2.00

C3225

[CC1210]

+0.50

3.20

――

2.50±0.30

3.20±0.40

- 0.40

+0.30

- 0.20

2.30

2.50±0.30

+0.30

2.00

- 0.20

+0.50

4.50

C4532

[CC1812]

+0.30

2.30

0.20 min.

――

- 0.40

- 0.20

2.50±0.30

+0.30

2.30

+0.50

5.70

C5750

- 0.20

0.20 min.

0.30 min.

――

5.00±0.40

6.30±0.50

[CC2220]

- 0.40

2.50±0.30

2.50 max.

C7563

[CC3025]

7.50±0.50

3.00 max.

*As for each item, pleaserefertodetail pageonTDKWeb.

— 3 —

GC110G0001

(2) Temperature Characteristics

* Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE

(3) Rated Voltage

Symbol

2 J

Rated Voltage

DC 630 V

DC 450 V

DC 250 V

DC 100 V

DC 50 V

Symbol

1 V

Rated Voltage

DC 35 V

DC 25 V

DC 16 V

DC 10 V

DC 6.3 V

2 W

2 E

1 E

1 C

2 A

1 A

1 H

0 J

(Example)

Symbol

(4) Rated Capacitance

Rated

Capacitance

Stated in three digits and in units of pico farads (pF).

The first and Second digits identify the first and second

significant figures of the capacitance, the third digit identifies

the multiplier.

105

1,000,000 pF

Symbol

Tolerance

(5) Capacitance tolerance

J

K

± 5 %

* M tolerance shall be standard for over 10uF.

± 10 %

± 20 %

*M

Symbol

Packaging

Bulk

(6) Packaging

* C1005 type is applicable to tape packaging only.

B

T

Taping

(7) TDK internal code

※※※ S

S : Soft Termination

These TDK internal codes are subject to change without notice.

— 4 —

GC110G0001

2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE

Temperature

Characteristics

Class

1

Capacitance tolerance

J (± 5 %)

Rated capacitance

E – 12 series

C0G

X5R

X7R

X7S

X7T

X8R

X8L

K (± 10 %)

M (± 20 %)

E – 6 series

2

Capacitance Step in E series

Capacitance Step

2.2 3.3

1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2

E series

1.0

1.5

4.7

6.8

E- 6

E-12

3. OPERATING TEMPERATURE RANGE

Min. operating

Temperature

Max. operating

Temperature

Reference

Temperature

T.C.

85°C

25°C

X5R

-55°C

125°C

150°C

C0G/X7R/X7S/X7T

X8R/X8L

4. STORING CONDITION AND TERM

Storing temperature

5~40°C

Storing humidity

20~70%RH

Storing term

Within 6 months

upon receipt.

5. P.C. BOARD

When mounting on an aluminum substrate, large case sizes such as C3225[CC1210] and larger

are more likely to be affected by heat stress from the substrate.

Please inquire separate specification for the large case sizes when mounted on the substrate.

6. INDUSTRIAL WASTE DISPOSAL

Dispose this product as industrial waste in accordance with the Industrial Waste Law.

— 5 —

GC110G0001

7. PERFORMANCE

table 1

Performance

No.

1

Item

Test or inspection method

External Appearance No defects which may affect

performance.

Inspect with magnifying glass (3×)

2

Insulation Resistance

Measuring voltage：Rated voltage

(As for the capacitor of rated voltage

630V DC, apply 500V DC.)

10,000MΩ or 500MΩ·μF min.

(As for the capacitors of rated

voltage 16V DC and lower,

10,000MΩ or 100MΩ·μF min.),

whichever smaller.

Voltage application time：60s.

3

Voltage Proof

Withstand test voltage without

insulation breakdown or other

damage.

Rated

voltage(RV)

Class

1

Apply voltage

RV≦100V

3 × rated voltage

100V＜RV≦500V 1.5 × rated voltage

500V＜RV

RV≦100V

1.3 × rated voltage

2.5 × rated voltage

2

100V＜RV≦500V 1.5 × rated voltage

500V＜RV 1.3 × rated voltage

Voltage application time : 1s.

Charge / discharge current : 50mA or lower

《Class1》

4

Capacitance

Within the specified tolerance.

Measuring

frequency

Measuring

voltage

Capacitance

1000pF and

under

1MHz±10%

1kHz±10%

0.5 - 5 Vrms.

Over 1000pF

《Class2》

Capacitance

Measuring

frequency

Measuring

voltage

10uF and under 1kHz±10%

Over 10uF

1.0±0.2Vrms

120Hz±20% 0.5±0.2Vrms.

As for the capacitors of rated voltage

6.3V DC, 0.5Vrms is applied.

5

6

Q

See No.4 in this table for measuring

condition.

Please refer to detail page on TDK

Web.

(Class1)

Dissipation Factor

(Class2)

Temperature

Characteristics

of Capacitance

(Class1)

Temperature coefficient shall be calculated

based on values at 25°C and 85°C

temperature.

T.C.

Temperature Coefficient

0 ± 30 (ppm/°C)

C0G

Measuring temperature below 25°C shall be

-10°C and -25°C.

Capacitance drift within ± 0.2% or

± 0.05pF, whichever larger.

— 6 —

GC110G0001

(continued)

No.

Item

Performance

Test or inspection method

7

Temperature

Characteristics

of Capacitance

(Class2)

Capacitance shall be measured by the

steps shown in the following table after

thermal equilibrium is obtained for each

step.

Capacitance Change (%)

No voltage applied

∆C be calculated ref. STEP3 reading

X5R : ± 15

X7R : ± 15

X7S : ± 22

Step

Temperature(°C)

+22

X7T :

1

2

3

4

Reference temp. ± 2

Min. operating temp. ± 2

Reference temp. ± 2

- 33

X8R : ± 15

+15

X8L :

- 40

:

Max. operating temp. ± 2

As for Min./Max. operating temp and

Reference temp., please refer to

“3. OPERATINGTEMPERATURERANGE”

As for measuring voltage, please contact

with our sales representative.

8

Robustness of

Terminations

No sign of termination coming off,

breakage of ceramic, or other

abnormal signs.

Reflow solder the capacitors on a

P.C.Board shown in Appendix 2.

Apply a pushing force gradually at the

center of a specimen in a horizontal

direction of P.C.board.

Pushing force : 5N

(2N is applied for C1005 type.)

Holding time : 10±1s.

Pushing force

P.C.Board

Capacitor

9

Bending

No mechanical damage.

Reflow solder the capacitors on

a P.C.Board shown in Appendix 1

and bend it for 5mm. (2mm is applied

for C4532 and C5750. 1mm is applied

for C7563.)

20

50

F

R230

Bending

45

(Unit : mm)

— 7 —

GC110G0001

(continued)

No.

Item

Performance

Test or inspection method

10 Solderability

New solder to cover over 75% of

termination.

25% may have pin holes or rough

spots but not concentrated in one

spot.

Solder :

Flux :

Sn-3.0Ag-0.5Cu

Isopropyl alcohol (JIS K

8839) Rosin (JIS K 5902)

25% solid solution.

Ceramic surface of A sections

shall not be exposed due to

melting or shifting of termination

material.

Solder temp. : 245±5°C

Dwell time :

3±0.3s.(Sn-3.0Ag-0.5Cu)

Solder

position :

Until both terminations are

completely soaked.

A section

External

appearance

11 Resistance

to solder

No cracks are allowed and

terminations shall be covered at

least 60% with new solder.

Solder :

Flux :

Sn-3.0Ag-0.5Cu

heat

Isopropyl alcohol (JIS K

8839) Rosin (JIS K 5902)

25% solid solution.

Capacitance

Change from the

Characteristics

value before test

Solder temp. :

Dwell time :

260±5°C

10±1s.

Class1 C0G

± 2.5 %

X5R

X7R

X7S

Solder

position :

Class2

X7T

± 7.5 %

Until both terminations

are completely soaked.

X8R

X8L

Pre-heating :

Temp. ― 110~140°C

Time ― 30～60s.

Q

Meet the initial spec.

(Class1)

D.F.

(Class2)

Leave the capacitors in ambient

condition for

Class 1 : 6~24h

Class 2 : 24±2h before measurement.

Insulation

Resistance

Meet the initial spec.

Voltage

proof

No insulation breakdown or

other damage.

External

appearance

Capacitance

12 Vibration

No mechanical damage.

Frequency : 10~55~10Hz

Reciprocating sweep time : 1 min.

Amplitude : 1.5mm

Change from the

Characteristics

Class1 C0G

value before test

Repeat this for 2h each in 3 perpendicular

directions(Total 6h).

± 2.5 %

X5R

X7R

X7S

X7T

X8R

X8L

Reflow solder the capacitors on a

P.C.Board shown in Appendix 2 before

testing.

Class2

± 7.5 %

Q

Meet the initial spec.

(Class1)

D.F.

(Class2)

— 8 —

GC110G0001

(continued)

No.

Item

Performance

Test or inspection method

13 Temperature

No mechanical damage.

Expose the capacitors in the condition

step1 through step 4 listed in the

following table.

External

appearance

cycle

Capacitance

Change from the

value before test

Characteristics

Temp. cycle : 5 cycles

Class1 C0G

Temperature(°C)

Time (min.)

30 ± 3

2 ~ 5

Step

X5R

X7R

Please contact

with our sales

representative

Min. operating

temp.±3

1

2

3

4

X7S

X7T

Class2

X8R

X8L

Ambient Temp.

Max. operating

temp.±2

30 ± 2

2 ~ 5

Q

Meet the initial spec.

(Class1)

Ambient Temp.

Meet the initial spec.

D.F.

(Class2)

As for Min./Max. operating temp.,

please refer to “3. OPERATING

TEMPERATURE RANGE”

Insulation

Resistance

Voltage

proof

No insulation breakdown or

other damage.

Leave the capacitors in ambient

condition for

Class 1 : 6~24h

Class 2 : 24±2h before measurement.

Reflow solder the capacitors on a

P.C.Board shown in Appendix2 before

testing.

14

Moisture

No mechanical damage.

Test temp. : 40±2°C

External

appearance

Resistance

(Steady

State)

Test humidity : 90~95%RH

Test time : 500 +24,0h

Leave the capacitors in ambient

condition for

Capacitance

Change from the

value before test

Characteristics

Class1 C0G

Leave the capacitors in ambient

condition for

X5R

X7R

X7S

Please contact

with our sales

representative

Class2

X7T

Class 1 : 6~24h

X8R

X8L

Class 2 : 24±2h before measurement.

Q

350 min.

Reflow solder the capacitors on a

P.C.Board shown in Appendix2 before

testing.

(Class1)

D.F.

200% of initial spec. max.

(Class2)

1,000MΩ or 50MΩ·μF min.

(As for the capacitors of rated

voltage 16V DC and lower,

1,000MΩ or 10MΩ·μF min.),

whichever smaller.

Insulation

Resistance

— 9 —

GC110G0001

(continued)

No.

15

Item

Performance

Test or inspection method

Test temp. : 40±2°C

Test humidity : 90~95%RH

Applied voltage : Rated voltage

Test time : 500 +24,0h

Moisture

No mechanical damage.

External

appearance

Resistance

Capacitance

Change from the

value before test

Characteristics

Charge/discharge current : 50mA or lower

Leave the capacitors in ambient

condition for

Class 1 : 6~24h

Class 2 : 24±2h before measurement.

Class1 C0G

X5R

X7R

X7S

Please contact

with our sales

representative

Class2

X7T

Reflow solder the capacitors on a

P.C.Board shown in Appendix2 before

testing.

X8R

X8L

Q

200 min.

(Class1)

Initial value setting (only for class 2)

Voltage conditioning 《After voltage treat

the capacitors under testing temperature

and voltage for 1 hour,》 leave the

capacitors in ambient condition for 24±2h

before measurement.

D.F.

(Class2)

200% of initial spec. max.

500MΩ or 25MΩ·μF min.

(As for the capacitors of rated

voltage 16V DC and lower,

500MΩ or 5MΩ·μF min.),

whichever smaller.

Insulation

Resistance

Use this measurement for initial value.

No mechanical damage.

16 Life

External

Test temp. : Maximum operating

appearance

temperature±2°C

Applied voltage : Please contact with our

sales representative.

Capacitance

Change from the

Characteristics

value before test

Test time : 1,000 +48,0h

C0G

Class1

Charge/discharge current : 50mA or lower

Leave the capacitors in ambient

condition for

X5R

X7R

X7S

X7T

X8R

X8L

Please contact

with our sales

representative

Class2

Class 1 : 6~24h

Class 2 : 24±2h before measurement.

Q

350 min.

Reflow solder the capacitors on a

P.C.Board shown in Appendix2 before

testing.

(Class1)

D.F.

(Class2)

200% of initial spec. max.

Initial value setting (only for class 2)

1,000MΩ or 50MΩ·μF min.

(As for the capacitors of rated

voltage 16V DC and lower,

1,000MΩ or 10MΩ·μF min.),

whichever smaller.

Insulation

Voltage conditioning 《After voltage treat

the capacitors under testing temperature

and voltage for 1 hour,》 leave the

capacitors in ambient condition for 24±2h

before measurement.

Resistance

Use this measurement for initial value.

*As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14 leave capacitors at

150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.

— 10 —

GC110G0001

Appendix1

P.C.Board for bending test

(C1005)

(C1608,C2012,C3216,C3225,C4532,C5750,C7563)

100

b

40

a

Solder resist

1.0

c

Copper

Appendix2

P.C. Board for reliability test

100

c

40

b

a

Copper

Solder resist

*Slit

* It is recommended to provide a slit on P.C.Board for C3225,C4532,C5750 and C7563.

（Unit：mm）

Symbol

a

b

c

Case size

C1005 [CC0402]

C1608 [CC0603]

C2012 [CC0805]

C3216 [CC1206]

C3225 [CC1210]

C4532 [CC1812]

C5750 [CC2220]

C7563 [CC3025]

0.4

1.0

1.2

2.2

3.5

4.5

5.5

1.5

3.0

4.0

5.0

7.0

8.0

9.1

0.5

1.2

1.65

2.0

2.9

3.7

5.6

6.9

1. Material : Glass Epoxy(As per JIS C6484 GE4)

2. Thickness : Appendix 1 ― 0.8mm (C1005)

― 1.6mm (C1608,C2012,C3216,C3225,C4532,C5750,C7563)

: Appendix 2 ― 1.6mm

Copper(Thickness:0.035mm)

Solder resist

— 11 —

GC110G0001

8. INSIDE STRUCTURE AND MATERIAL

3

4

5

6

1

2

MATERIAL

No.

NAME

Class1

Class2

BaTiO₃

1

2

3

4

5

6

Dielectric

Electrode

CaZrO₃

Nickel (Ni)

Copper (Cu)

Conductive resin (Filler : Ag)

Nickel (Ni)

Termination

Tin (Sn)

9. CAUTION FOR PRODUCTS WITH SOFT TERMINATION

This product contains Ag (Silver) as part of the middle layer of termination.

To avoid electromigration of Ag under high temperature and humidity, and failures caused

by corrosive gas, chip capacitors on P.C boards should be protected by moisture proof-sealing.

— 12 —

GC110G0001

10. PACKAGING

Packaging shall be done to protect the components from the damage during transportation and storing,

and a label which has the following information shall be attached.

10.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for

Bulk packaging is 1000pcs.

10.2 Tape packaging is as per 14. TAPE PACKAGING SPECIFICATION

.*C1005[CC0402] type is applicable to tape packaging only.

1) Inspection No.*

2) TDK P/N

3) Customer's P/N

4) Quantity

*Composition of Inspection No.

Example

F

0

A

– 23

(d)

–

001

(e)

(a) (b) (c)

(a) Line code

(b) Last digit of the year

(c) Month and A for January and B for February and so on. (Skip I)

(d) Inspection Date of the month.

e) Serial No. of the day

*Composition of new Inspection No.

(Implemented on and after May 1, 2019 in sequence)

Example

I

F

0

E

2 3 A 0 0 1

(a) (b) (c) (d) (e)

(f)

(g)

(a) Prefix

(b) Line code

(c) Last digit of the year

(d) Month and A for January and B for February and so on. (Skip I)

(e) Inspection Date of the month.

(f) Serial No. of the day(00 ~ ZZ)

(g) Suffix(00 ~ ZZ)

*It was shifted to the new inspection No. on and after May 2019, but the implementation

timing may be different depending on shipment bases.

Until the shift is completed, either current or new composition of inspection No. will be applied.

11. RECOMMENDATION

As for C3225 [CC1210] and larger, It is recommended to provide a slit (about 1mm wide)

in the board under the components to improve washing Flux. And please make sure to dry

detergent up completely before.

12. SOLDERING CONDITION

As for C1005 [CC0402], C3225 [CC1210] and larger, reflow soldering only.

— 13 —

GC110G0001

13. CAUTION

No.

Process

Condition

1-1. Storage, Use

1

Operating

The capacitors must be stored in an ambient temperature of 5 to 40°C with a

relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be

followed for the other climatic conditions.

Condition

(Storage, Use,

Transportation)

1) High temperature and humidity environment may affect a capacitor's solder ability

because it accelerates terminal oxidization. They also deteriorate performance of

taping and packaging. Therefore, SMD capacitors shall be used within 6 months.

For capacitors with terminal electrodes consisting of silver or silver-palladium which

tend to become oxidized or sulfurized, use as soon as possible, such as within one

month after opening the bag.

2) When capacitors are stored for a period longer than specified, confirm the

solderability of the capacitors prior to use.

During storage, keep the minimum packaging unit in its original packaging without

opening it.

Do not deviate from the above temperature and humidity conditions even for a short

term.

3) Corrosive gasses in the air or atmosphere may result in deterioration of the

reliability, such as poor solderability of the terminal electrodes. Do not store

capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide, sulfur

dioxide, chlorine ammonia etc.)

4) Solderability and electrical performance may deteriorate due to photochemical

change in the terminal electrode if stored in direct sunlight, or due to condensation

from rapid changes in humidity.

The capacitors especially which use resin material must be operated and stored in

an environment free of dew condensation, as moisture absorption due to

condensation may affect the performance.

5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.

1-2. Handling in transportation

In case of the transportation of the capacitors, the performance of the capacitors

may be deteriorated depending on the transportation condition.

(Refer to JEITA RCR-2335C 9.2 Handling in transportation)

2-1. Operating temperature

2

Circuit design

! Caution

△

1) Upper category temperature (maximum operating temperature) is specified.

It is necessary to select a capacitor whose rated temperature us higher than the

operating temperature. Also, it is necessary to consider the temperature

distribution in the equipment and seasonal temperature variation.

2) Do not use capacitors above the maximum allowable operating temperature.

Surface temperature including self heating should be below maximum operating

temperature.

(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at

high frequencies around its SRF, the heat might be so extreme that it may damage

itself or the product mounted on. Please design the circuit so that the maximum

temperature of the capacitors including the self heating to be below the maximum

allowable operating temperature. Temperature rise at capacitor surface shall be

below 20°C)

3) The electrical characteristics of the capacitors will vary depending on the temperature.

The capacitors should be selected and designed in taking the temperature into

consideration.

2-2. When overvoltage is applied

Applying overvoltage to a capacitor may cause dielectric breakdown and result in a

short circuit. The duration until dielectric breakdown depends on the applied voltage

and the ambient temperature.

— 14 —

GC110G0001

No.

2

Process

Condition

2-3. Operating voltage

Circuit design

1) Operating voltage across the terminals should be below the rated voltage.

When AC and DC are super imposed, V_0-Pmust be below the rated voltage.

! Caution

△

— (1) and (2)

AC or pulse with overshooting, V_P-Pmust be below the rated voltage.

— (3), (4) and (5)

When the voltage is started to apply to the circuit or it is stopped applying, the

irregular voltage may be generated for a transit period because of resonance or

switching. Be sure to use the capacitors within rated voltage containing these

Irregular voltage.

Voltage

(1) DC voltage

(2) DC+AC voltage

(3) AC voltage

Positional

Measurement

(Rated voltage)

V_P-P

V_0-P

0

Voltage

(4) Pulse voltage (A) (5) Pulse voltage (B)

Positional

Measurement

(Rated voltage)

V_P-P

V

^P-P0

0

2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied,

the reliability of the capacitors may be reduced.

3) The effective capacitance will vary depending on applied DC and AC voltages.

The capacitors should be selected and designed in taking the voltages into

consideration.

4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not

exceed the rated voltage.

5) When capacitors are used in a series connection, it is necessary to add a balancing

circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage

applied to each capacitor.

2-4. Frequency

When the capacitors (Class 2) are used in AC and/or pulse voltages, the

capacitors may vibrate themselves and generate audible sound.

— 15 —

GC110G0001

No.

3

Process

Designing

P.C.board

Condition

The amount of solder at the terminations has a direct effect on the reliability of the

capacitors.

1) The greater the amount of solder, the higher the stress on the chip capacitors,

and the more likely that it will break. When designing a P.C.board, determine the

shape and size of the solder lands to have proper amount of solder on the

terminations.

2) Avoid using common solder land for multiple terminations and provide individual

solder land for each terminations.

3) Size and recommended land dimensions.

Chip capacitors

Solder land

C

Solder resist

A

B

Reflow soldering

Case size

(Unit : mm)

C3216

C1005

C1608

C2012

[CC0402]

[CC0603]

0.6 ~ 0.8

[CC0805]

[CC1206]

Symbol

A

B

C

0.3 ~ 0.5

0.35 ~ 0.45

0.4 ~ 0.6

0.9 ~ 1.2

0.7 ~ 0.9

0.9 ~ 1.2

2.0 ~ 2.4

1.0 ~ 1.2

1.1 ~ 1.6

Case size

C3225

C4532

C5750

C7563

[CC1210]

[CC1812]

[CC2220]

[CC3025]

Symbol

A

B

C

2.0 ~ 2.4

1.0 ~ 1.2

1.9 ~ 2.5

3.1 ~ 3.7

1.2 ~ 1.4

2.4 ~ 3.2

4.1 ~ 4.8

1.2 ~ 1.4

4.0 ~ 5.0

5.2 ~ 5.8

1.7 ~ 1.9

6.4 ~ 7.4

Flow soldering (Unrecommend)

(Unit : mm)

Case size

C1608

C2012

C3216

[CC0603]

0.7 ~ 1.0

0.8 ~ 1.0

0.6 ~ 0.8

[CC0805]

[CC1206]

Symbol

A

B

C

1.0 ~ 1.3

1.0 ~ 1.2

0.8 ~ 1.1

2.1 ~ 2.5

1.1 ~ 1.3

1.0 ~ 1.3

— 16 —

GC110G0001

No.

3

Process

Condition

Designing

P.C.board

4) Recommended chip capacitors layout is as following.

Disadvantage against

bending stress

Advantage against

bending stress

Perforation or slit

Mounting

face

Break P.C.board with

mounted side up.

Break P.C.board with

mounted side down.

Mount perpendicularly to

perforation or slit

Mount in parallel with

perforation or slit

Perforation or slit

Chip

arrangement

(Direction)

Closer to slit is higher stress

Away from slit is less stress

ℓ₁

ℓ₂

Distance from

slit

( ℓ₁< ℓ₂)

— 17 —

GC110G0001

No.

3

Process

Condition

5) Mechanical stress varies according to location of chip capacitors on the P.C.board.

Designing

P.C.board

E

D

Perforation

C

B

A

Stress force

A＞B＞E

A＞D＞E

A＞C

Slit

When dividing printed wiring boards, the intensities of mechanical stress applied to

capacitors are different according to each dividing method in the order of :

Push-back < Slit < V-groove < Perforation. Therefore consider not only position of

capacitors, but also the way of the dividing the printed wiring boards.

6) Layout recommendation

Use of common

solder land with

other SMD

Use of common

solder land

Soldering with

chassis

Example

Lead wire

Solder

land

Chassis

Excessive solder

Chip

Solder

Need to

avoid

Excessive solder

Missing

PCB

Adhesive

ℓ₁

Solder land

solder

Lead wire

Solder resist

Recommen-

dation

Solder resist

ℓ₂

ℓ₂> ℓ₁

— 18 —

GC110G0001

No.

4

Process

Condition

Mounting

4-1. Stress from mounting head

If the mounting head is adjusted too low, it may induce excessive stress in the chip

capacitors to result in cracking. Please take following precautions.

1) Adjust the bottom dead center of the mounting head to reach on the P.C.board

surface and not press it.

2) Adjust the mounting head pressure to be 1 to 3N of static weight.

3) To minimize the impact energy from mounting head, it is important to provide

support from the bottom side of the P.C.board.

See following examples.

Not recommended

Recommended

Single-sided

mounting

Crack

A support pin

is not to be

underneath the

capacitor.

Support pin

Double-sides

mounting

Solder

peeling

Crack

Support pin

When the centering jaw is worn out, it may give mechanical impact on the

capacitors to cause crack. Please control the close up dimension of the centering

jaw and provide sufficient preventive maintenance and replacement of it.

4-2. Amount of adhesive

a

b

c

Example : C2012 [CC0805], C3216 [CC1206]

a

b

c

0.2mm min.

70 ~ 100μm

Do not touch the solder land

— 19 —

GC110G0001

No.

5

Process

Condition

5-1. Flux selection

Soldering

Flux can seriously affect the performance of capacitors. Confirm the following to

select the appropriate flux.

1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).

Strong flux is not recommended.

2) Excessive flux must be avoided. Please provide proper amount of flux.

3) When water-soluble flux is used, enough washing is necessary.

5-2. Recommended soldering profile : Reflow method

Refer to the following temperature profile at Reflow soldering.

Reflow soldering

Soldering

Preheating

Natural cooling

Peak

Temp

∆T

0

Over 60 sec.

Peak Temp time

Reflow soldering is recommended for C1608,C2012,C3216 types, but only

reflow soldering is allowed for other case sizes.

5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering

Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.

Temp./Duration

Reflow soldering

Peak temp(°C)

260 max.

Duration(sec.)

10 max.

Solder

Lead Free Solder

230 max.

20 max.

Sn-Pb Solder

Recommended solder compositions

Lead Free Solder : Sn-3.0Ag-0.5Cu

— 20 —

GC110G0001

No.

5

Process

Condition

5-4. Soldering profile : Flow method (Unrecommend)

Soldering

Refer to the following temperature profile at Flow soldering.

Flow soldering

Soldering

Preheating

Natural cooling

Peak

Temp

△T

0

Over 60 sec.

Peak Temp time

Reflow soldering is recommended for C1608,C2012,C3216 types.

5-5. Recommended soldering peak temp and peak temp duration for Flow soldering

Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.

Temp./Duration

Flow soldering

Peak temp(°C)

260 max.

Duration(sec.)

5 max.

Solder

Lead Free Solder

250 max.

3 max.

Sn-Pb Solder

Recommended solder compositions

Lead Free Solder : Sn-3.0Ag-0.5Cu

5-6. Avoiding thermal shock

1)

Preheating condition

Soldering

Case size

Temp. (°C)

C1005[CC0402], C1608[CC0603],

C2012[CC0805], C3216[CC1206]

C3225[CC1210], C4532[CC1812],

C5750[CC2220], C7563[CC3025]

C1608[CC0603], C2012[CC0805],

C3216[CC1206]

∆T ≦ 150

Reflow soldering

∆T ≦ 130

∆T ≦ 150

Flow soldering

Cooling condition

2)

Natural cooling using air is recommended. If the chips are dipped into a solvent for

cleaning, the temperature difference (∆T) must be less than 100°C.

— 21 —

GC110G0001

No.

5

Process

Condition

Soldering

5-7. Amount of solder

Excessive solder will induce higher tensile force in chip capacitors when

temperature changes and it may result in chip cracking. In sufficient solder may

detach the capacitors from the P.C.board.

Higher tensile force in

chip capacitors to cause

crack

Excessive

solder

Maximum amount

Minimum amount

Adequate

Low robustness may

Insufficient

solder

cause contact failure or

chip capacitors come off

the P.C.board.

5-8. Sn-Zn solder

Sn-Zn solder affects product reliability.

Please contact TDK in advance when utilize Sn-Zn solder.

5-9. Countermeasure for tombstone

The misalignment between the mounted positions of the capacitors and the land

patterns should be minimized. The tombstone phenomenon may occur

especially the capacitors are mounted (in longitudinal direction) in the same

direction of the reflow soldering.

(Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent

the tombstone phenomenon)

— 22 —

GC110G0001

No.

6

Process

Condition

Solder repairing is unavoidable, refer to below.

6-1. Solder repair by solder iron

Solder repairing

1) Selection of the soldering iron tip

Tip temperature of solder iron varies by its type, P.C.board material and solder

land size. The higher the tip temperature, the quicker the operation.

However, heat shock may cause a crack in the chip capacitors.

Please make sure the tip temp. before soldering and keep the peak temp and

time in accordance with following recommended condition.

Manual soldering

(Solder iron)

Peak

Temp

∆T

Preheating

0

3sec. (As short as possible)

Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)

Case size

Temp. (°C) Duration (sec.) Wattage (W) Shape (mm)

C1005[CC0402]

C1608[CC0603]

C2012[CC0805]

C3216[CC1206]

C3225[CC1210]

C4532[CC1812]

C5750[CC2220]

C7563[CC3025]

350 max.

3 max.

20 max.

⌀3.0 max.

280 max.

* Please preheat the chip capacitors with the condition in 6-2 to avoid the

thermal shock.

2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may

cause crack. Do not touch the ceramic dielectric and the terminations by solder

iron.

3) It is not recommended to reuse dismounted capacitors.

6-2. Avoiding thermal shock

Preheating condition

Soldering

Case size

Temp. (°C)

C1005[CC0402], C1608[CC0603],

C2012[CC0805], C3216[CC1206]

∆T ≦ 150

Manual soldering

C3225[CC1210], C4532[CC1812]

C5750[CC2220], C7563[CC3025]

∆T ≦ 130

— 23 —

GC110G0001

No.

7

Process

Condition

Cleaning

1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may

stick to chip capacitors surface to deteriorate especially the insulation resistance.

2) If cleaning condition is not suitable, it may damage the chip capacitors.

2)-1. Insufficient washing

(1) Terminal electrodes may corrode by Halogen in the flux.

(2) Halogen in the flux may adhere on the surface of capacitors, and lower the

insulation resistance.

(3) Water soluble flux has higher tendency to have above mentioned problems

(1) and (2).

2)-2. Excessive washing

When ultrasonic cleaning is used, excessively high ultrasonic energy output

can affect the connection between the ceramic chip capacitor's body and the

terminal electrode. To avoid this, following is the recommended condition.

Power : 20 W/ℓmax.

Frequency : 40 kHz max.

Washing time : 5 minutes max.

2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may

bring the same result as insufficient cleaning.

— 24 —

GC110G0001

No.

8

Process

Condition

1) This product contains Ag (Silver) as part of the middle layer of termination.

To avoid electromigration of Ag under high temperature and humidity, and failures

caused by corrosive gas, chip capacitors on P.C boards should be protected by

moisture proof-sealing.

Coating and

molding of the

P.C.board

2) When the P.C.board is coated, please verify the quality influence on the product.

3) Please verify carefully that there is no harmful decomposing or reaction gas

emission during curing which may damage the chip capacitors.

4) Please verify the curing temperature.

9

Handling after

chip mounted

1) Please pay attention not to bend or distort the P.C.board after soldering

in handling otherwise the chip capacitors may crack.

! Caution

△

Bend

Twist

Printed circuit board cropping should not be carried out by hand, but by using the

proper tooling. Printed circuit board cropping should be carried out using a board

cropping jig as shown in the following figure or a board cropping apparatus to

2)

prevent inducing mechanical stress on the board.

(1)Example of a board cropping jig

Recommended example: The board should be pushed from the back side,

close to the cropping jig so that the board is not bent and the stress applied to

the capacitor is compressive.

Unrecommended example: If the pushing point is far from the cropping jig and

the pushing direction is from the front side of the board, large tensile stress is

applied to the capacitor, which may cause cracks.

Outline of jig

Recommended

Unrecommended

Direction

of load

Direction of

load

Printed

circuit

board

V-groove

Printed

circuit

board

Load point

Components

Load point

Printed

circuit

board

Components

V-groove

Board

cropping jig

V-groove

Slot

— 25 —

GC110G0001

No.

9

Process

Condition

(2)Example of a board cropping machine

Handling after

chip mounted

An outline of a printed circuit board cropping machine is shown below. The

top and bottom blades are aligned with one another along the lines with the

V-grooves on printed circuit board when cropping the board.

Unrecommended example: Misalignment of blade position between top and

bottom, right and left, or front and rear blades may cause a crack in the

capacitor.

! Caution

△

Outline of machine

Principle of operation

Top blade

Top

blade

Printed circuit board

Bottom blade

V-groove

Printed circuit board

Cross-section diagram

Top blade

Printed circuit board

V-groove

Bottom blade

Unrecommended

Left-right

Recommended

Top-bottom

Front-rear

misalignment

Top blade

Board

Top blade

Bottom blade

When functional check of the P.C.board is performed, check pin pressure tends

to be adjusted higher for fear of loose contact. But if the pressure is excessive

and bend the P.C.board, it may crack the chip capacitors or peel the

terminations off. Please adjust the check pins not to bend the P.C.board.

3)

Item

Not recommended

Recommended

Support pin

Termination

peeling

Board

bending

Check pin

— 26 —

GC110G0001

No.

Process

Condition

10 Handling of loose

chip capacitors

1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,

the large case sized chip capacitors are tendency to have cracks easily, so please

handle with care.

Crack

Floor

2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.

board may hit the chip capacitors of another board to cause crack.

P.C.board

Crack

The capacitors (Class 2) have aging in the capacitance. They may not be used in

precision time constant circuit. In case of the time constant circuit, the evaluation

should be done well.

11 Capacitance aging

As per the estimated life and the estimated failure rate depend on the temperature

and the voltage. This can be calculated by the equation described in JEITA

RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the

estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,

Temperature acceleration coefficient : 10°C rule)

12 Estimated life and

estimated failure

rate of capacitors

The failure rate can be decreased by reducing the temperature and the voltage but

they will not be guaranteed.

— 27 —

GC110G0001

No.

Process

Condition

1) A capacitor shall not be touched directly with bare hands during operation in

order to avoid electric shock.

13 Caution during

operation of

Electric energy held by the capacitor may be discharged through the human

body when touched with a bare hand.

equipment

Even when the equipment is off, a capacitor may stay charged. The capacitor

should be handled after being completely discharged using a resistor.

2) The terminals of a capacitor shall not be short-circuited by any accidental contact

with a conductive object. A capacitor shall not be exposed to a conductive liquid

such as an acid or alkali solution. A conductive object or liquid, such as acid and

alkali, between the terminals may lead to the breakdown of a capacitor due to

short circuit

3) Confirm that the environment to which the equipment will be exposed during

transportation and operation meets the specified conditions. Do not to use the

equipment in the following environments.

(1) Environment where a capacitor is spattered with water or oil

(2) Environment where a capacitor is exposed to direct sunlight

(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or

radiation

(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen

sulfide, sulfur dioxide, chlorine. ammonia gas etc.)

(5) Environment where a capacitor exposed to vibration or mechanical shock

exceeding the specified limits.

(6) Atmosphere change with causes condensation

The products listed on this specification sheet are intended for use in general

electronic equipment (AV equipment, telecommunications equipment, home

appliances, amusement equipment, computer equipment, personal equipment, office

equipment, measurement equipment, industrial robots) and automotive application

under a normal operation and use condition.

14 Others

! Caution

△

The products are not designed or warranted to meet the requirements of the

applications listed below, whose performance and/or quality require a more stringent

level of safety or reliability, or whose failure, malfunction or trouble could cause

serious damage to society, person or property. Please understand that we are not

responsible for any damage or liability caused by use of the products in any of the

applications below or for any other use exceeding the range or conditions set forth in

this specification sheet. If you intend to use the products in the applications listed

below or if you have special requirements exceeding the range or conditions set forth

in this specification, please contact us.

(1) Aerospace/Aviation equipment

(2) Transportation equipment (electric trains, ships, etc. except automotive application)

(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)

(4) Power-generation control equipment

(5) Atomic energy-related equipment

(6) Seabed equipment

(7) Transportation control equipment

(8) Public information-processing equipment

(9) Military equipment

(10) Electric heating apparatus, burning equipment

(11) Disaster prevention/crime prevention equipment

(12) Safety equipment

(13) Other applications that are not considered general-purpose applications

When designing your equipment even for general-purpose applications, you are kindly

requested to take into consideration securing protection circuit/device or providing

backup circuits in your equipment.

— 28 —

GC110G0001

14. TAPE PACKAGING SPECIFICATION

1. CONSTRUCTION AND DIMENSION OF TAPING

1-1. Dimensions of carrier tape

Dimensions of paper tape shall be according to Appendix 3, 4.

Dimensions of plastic tape shall be according to Appendix 5, 6.

1-2. Bulk part and leader of taping

Chips

Empty

Trailer(Empty)

160mm min.

Leader

Drawing direction

400mm min

1-3. Dimensions of reel

Dimensions of ⌀178 reel shall be according to Appendix 7, 8.

Dimensions of ⌀330 reel shall be according to Appendix 9, 10.

1-4. Structure of taping

<Paper>

Top cover tape

Pitch hole

Cavity (Chip insert)

Pitch hole

Cavity (Chip insert)

Paper carrier tape

Plastic carrier tape

Bottom cover tape

(Bottom cover tape is not always applied)

2. CHIP QUANTITY

Please refer to detail page on TDK Web.

— 29 —

GC110G0001

3. PERFORMANCE SPECIFICATIONS

3-1. Fixing peeling strength (top tape)

0.05N < Peeling strength < 0.7N

〈Paper〉

Direction of cover tape pulling

Top cover tape

Carrier tape

0～15°

Direction of pulling

Paper tape should not adhere to top

cover tape when pull the cover tape.

〈Plastic〉

Direction of pulling

Top cover tape

Carrier tape

0～15°

Direction of pulling

3-2. Carrier tape shall be flexible enough to be wound around a minimum radius

of 30mm with components in tape.

3-3. The missing of components shall be less than 0.1%

3-4. Components shall not stick to fixing tape.

3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance

gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered

by absorbing dust into the suction nozzle.

— 30 —

GC110G0001

Appendix 3

Paper Tape

Pitch hole

J

Cavity (Chip insert)

E

D

A

B

C

G

H

B

F

T

（Unit：mm）

Symbol

A

C

D

E

F

Case size

C1005

[CC0402]

( 0.65 )

( 1.15 )

H

8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05

Symbol

Case size

G

J

T

C1005

[CC0402]

+0.10

0

2.00 ± 0.05 4.00 ± 0.10 ⌀1.50

0.75 max.

(

) Reference value.

* Applied to thickness, 0.50 +0.20,-0.10mm products.

Appendix 4

Paper Tape

Cavity (Chip insert)

Pitch hole

J

E

D

A

C

B

T

H

B

G

F

（Unit：mm）

Symbol

A

C

D

E

F

Case size

C1608

( 1.10 )

( 1.90 )

( 2.30 )

( 3.50 )

[CC0603]

C2012

[CC0805]

C3216

( 1.50 )

( 1.90 )

8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10

[CC1206]

Symbol

G

H

J

T

Case size

C1608

[CC0603]

C2012

[CC0805]

C3216

+0.10

0

2.00 ± 0.05 4.00 ± 0.10 ⌀1.50

1.20 max.

[CC1206]

(

) Reference value.

— 31 —

GC110G0001

Appendix 5

Plastic Tape

Cavity (Chip insert)

Pitch hole

J

E

D

A

C

B

T

Q

F

G

H

K

(Unit : mm)

F

Symbol

A

B

C

D

E

Case size

C2012

[CC0805]

C3216

[CC1206]

( 1.50 )

( 2.30 )

( 3.50 )

8.00 ± 0.30 3.50 ± 0.05

( 1.90 )

( 2.90 )

1.75 ± 0.10 4.00 ± 0.10

3.50 ± 0.05

or

5.50 ± 0.05

8.00 ± 0.30

or

12.00 ± 0.30

C3225

[CC1210]

( 3.60 )

H

Symbol

G

J

K

T

Q

Type

C2012

[CC0805]

C3216

[CC1206]

C3225

[CC1210]

2.50 max.

3.40 max.

+0.10

0

2.00 ± 0.05 4.00 ± 0.10

0.60 max.

⌀1.50

⌀0.50 min.

(

) Reference value.

Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.

— 32 —

GC110G0001

Appendix 6

Plastic Tape

Cavity (Chip insert)

Pitch hole

J

E

D

A

C

B

T

Q

G

H

F

K

(Unit : mm)

F

Symbol

Case size

C4532

A

B

C

D

E

( 3.60 )

( 5.40 )

( 6.90 )

( 4.90 )

( 6.10 )

( 8.00 )

[CC1812]

12.00 ± 0.30 5.50 ± 0.05

16.00 ± 0.30 7.50 ± 0.05

8.00 ± 0.10

C5750

[CC2220]

1.75 ± 0.10

C7563

[CC3025]

12.00 ± 0.10

Q

Symbol

Case size

G

H

J

K

T

C4532

[CC1812]

2.00 ± 0.05

2.00 ± 0.10

6.50 max.

5.00 max.

⌀1.50 min.

C5750

[CC2220]

+0.10

0

4.00 ± 0.10 ⌀1.50

0.60 max.

C7563

[CC3025]

―

(

) Reference value.

Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.

— 33 —

GC110G0001

Appendix 7

Dimensions of reel (Material : Polystyrene)

C1005, C1608, C2012, C3216, C3225(8mm width taping type)

W₂

E

C

B

D

R

W₁

A

(Unit : mm)

Symbol

A

B

C

D

E

W₁

Dimension ⌀178 ± 2.0

⌀60 ± 2.0

⌀13 ± 0.5

⌀21 ± 0.8

2.0 ± 0.5

9.0 ± 0.3

Symbol

W₂

R

Dimension 13.0 ± 1.4

1.0

Appendix 8

Dimensions of reel (Material : Polystyrene)

C3225(12mm width taping type), C4532, C5750

W₂

E

C

B

D

R

W₁

A

(Unit : mm)

W₁

Symbol

A

B

C

D

E

Dimension ⌀178 ± 2.0

⌀60 ± 2.0

⌀13 ± 0.5

⌀21 ± 0.8

2.0 ± 0.5

13.0 ± 0.3

Symbol

W₂

R

Dimension 17.0 ± 1.4

1.0

— 34 —

GC110G0001

Appendix 9

Dimensions of reel ( Material : Polystyrene )

C1005, C1608, C2012, C3216, C3225(8mm width taping type)

E

C

B

D

R

A

W

t

(Unit : mm)

Symbol

A

B

C

D

E

W

⌀382 max.

(Nominal

⌀330)

Dimension

⌀50 min.

⌀13 ± 0.5

⌀21 ± 0.8

2.0 ± 0.5

10.0 ± 1.5

Symbol

t

R

Dimension

2.0 ± 0.5

1.0

Appendix 10

Dimensions of reel ( Material : Polystyrene )

C3225(12mm width taping type), C4532, C5750, C7563

E

C

B

D

R

W

t

A

(Unit : mm)

W

Symbol

A

B

C

D

E

⌀382 max.

(Nominal

⌀330)

14.0 ± 1.5

*17.5 ± 1.5

Dimension

⌀50 min.

⌀13 ± 0.5

⌀21 ± 0.8

2.0 ± 0.5

Symbol

t

R

Dimension

2.0 ± 0.5

1.0

* Applied to C7563.

— 35 —


型号：	C1005X8R1E682M050BE
厂家：	TDK ELECTRONICS
描述：	CAP CER 6800PF 25V X8R 0402 电容器
文件：	总36页 (文件大小：1748K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1005X8R1E682M050BE [TDK]

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