C2012C0G2A333J125AE [TDK]

Multilayer Ceramic Chip Capacitors;


型号：	C2012C0G2A333J125AE
厂家：	TDK ELECTRONICS
描述：	Multilayer Ceramic Chip Capacitors
文件：	总3页 (文件大小：169K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1 of 3

Creation Date : November 30, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012C0G2A333J125AE

TDK item description C2012C0G2A333JT***S

Commercial Grade

Applications

Please refer to Part No. CGA4J1C0G2A333J125AE for Automotive use.

Mid Mid Voltage (100 to 630V)

Soft Soft Termination

Feature

Series

Status

C2012 [EIA 0805]

Production

Size

2.00mm +0.45,-0.20mm

Length(L)

Width(W)

1.25mm +0.25,-0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

33nF ±5%

100VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

2 of 3

Creation Date : November 30, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012C0G2A333J125AE

Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)

Impedance

Capacitance

C2012C0G2A333J125AE

DC Bias Characteristic

Temperature Characteristic

C2012C0G2A333J125AE(DC Bias =

50V)

C2012C0G2A333J125AE

C2012C0G2A333J125AE(No Bias)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

3 of 3

Creation Date : November 30, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012C0G2A333J125AE

Associated Images

Land Pattern (Terminal Connection)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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