C2012CH1H222K060AA_17 [TDK]

Multilayer Ceramic Chip Capacitors;


型号：	C2012CH1H222K060AA_17
厂家：	TDK ELECTRONICS
描述：	Multilayer Ceramic Chip Capacitors
文件：	总3页 (文件大小：183K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1 of 3

Creation Date : May 08, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012CH1H222K060AA

TDK item description C2012CH1H222KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C2012 [EIA 0805]

Production (Not Recommended for New Design)

Size

Length(L)

2.00mm ±0.20mm

Width(W)

1.25mm ±0.20mm

0.60mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

2.2nF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

CH(0±60ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

2 of 3

Creation Date : May 08, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012CH1H222K060AA

Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)

Impedance

ESR

C2012CH1H222K060AA

Capacitance

DC Bias Characteristic

C2012CH1H222K060AA

Temperature Characteristic

C2012CH1H222K060AA(DC Bias =

25V )

C2012CH1H222K060AA(No Bias)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

3 of 3

Creation Date : May 08, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012CH1H222K060AA

Associated Images

Land Pattern (Terminal Connection)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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