C2012X5R1H684M125AB_17 [TDK]

Multilayer Ceramic Chip Capacitors;


型号：	C2012X5R1H684M125AB_17
厂家：	TDK ELECTRONICS
描述：	Multilayer Ceramic Chip Capacitors
文件：	总3页 (文件大小：235K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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Creation Date : May 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X5R1H684K125AB

TDK item description C2012X5R1H684KT****

Commercial Grade

Applications

Please refer to Part No. CGA4J3X5R1H684K125AB for Automotive use.

General General (Up to 50V)

C2012 [EIA 0805]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

2.00mm ±0.20mm

Length(L)

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

680nF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

735MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

2 of 3

Creation Date : May 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X5R1H684K125AB

Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)

Impedance

ESR

C2012X5R1H684K125AB

Capacitance

DC Bias Characteristic

C2012X5R1H684K125AB

Temperature Characteristic

Ripple Temperature Rising

C2012X5R1H684K125AB(100kHz) C2012X5R1H684K125AB(500kHz) C2012X5R1H684K125AB(1MHz)

C2012X5R1H684K125AB(DC Bias =

25V )

C2012X5R1H684K125AB(No Bias)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

3 of 3

Creation Date : May 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X5R1H684K125AB

Associated Images

Land Pattern (Terminal Connection)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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