C4520C0G3F330KT [TDK]

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.000033uF, Surface Mount, 1808, CHIP, ROHS COMPLIANT;


型号：	C4520C0G3F330KT
厂家：	TDK ELECTRONICS
描述：	Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.000033uF, Surface Mount, 1808, CHIP, ROHS COMPLIANT 电容器
文件：	总12页 (文件大小：893K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C Series

High Voltage Application

Type:

C4520 [EIA CC1808]

C4532 [EIA CC1812]

Issue date:

April 2011

TDK MLCC

US Catalog

Version B11

REMINDERS

Please read before using this product

SAFETY REMINDERS

REMINDERS

If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other

damage, you must contact our company’s sales window.

We may modify products or discontinue production of a product listed in this catalog without prior

notification.

We provide “Delivery Specification” that explain precautions for the specifications and safety of each

product listed in this catalog. We strongly recommend that you exchange these delivery specifications

with customers that use one of these products.

If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according

to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export

permission in harmony with this law.

Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from

our company.

We are not responsible for problems that occur related to the intellectual property rights or other rights of

our company or a third party when you use a product listed in this catalog. We do not grant license of

these rights.

This catalog only applies to products purchased through our company or one of our company’s official

agencies. This catalog does not apply to products that are purchased through other third parties.

TDK MLCC US Catalog

Page 106

Version B11

C Series

High Voltage Application

Type: C4520, C4532

• Inverter circuits with a liquid crystal

backlight

• LAN card

• General high voltage circuits.

• Noise bypass for power supply

• Transceiver for LAN

• Hub, etc.

• Advanced design provides improved withstand voltage

characteristics.

Features

Cautions

Applications

• TDK’s proprietary internal electrode structure and the

use of low-dielectric-strength material result in highly

reliable performance in high-voltage applications.

• Complies with ISO8802-3 for LAN applications.

• Designed exclusively for reflow soldering.

• This product intended solely for reflow soldering.

• A slit of about 1mm on the circuit board is

recommended to improve removal of the flux after

soldering.

Shape &

Dimensions

• Ensure that this product is completely dried following

washing.

• Because this product will be subjected to high

voltages, use only low-activity rosin flux (with 0.2% max.

of chlorine).

Body Length

Body Width

Body Height

Terminal Width

• Using this product with aluminum circuit boards must

be considered a special implementation because the

high heat stress levels are involved. In case of using

aluminum circuit boards, please contact TDK.

Dimensions in mm

Part Number

Construction

4532 X7R 3D 222 K T XXXX

Series Name

Dimensions L x W (mm)

Internal Codes

Packaging Style

Packaging Code

Case Code

Length

Width

2.00 ± 0.30

3.20 ± 0.40

Style

Tape & Reel

C4520

C4532

4.50 ± 0.40

Capacitance Tolerance

Temperature Characteristic

Tolerance Code

Tolerance

Temperature

Characteristics

Capacitance

Change

Temperature

Range

± 1pF

± 10%

C0G

X7R

0±30 ppm/ºC

±15%

-55 to +125ºC

Nominal Capacitance (pF)

The capacitance is expressed in three

digit codes and in units of pico Farads

(pF). The first and second digits identify

the first and second significant figures of

the capacitance. The third digit identifies

the multiplier. R designates a decimal

point.

Rated Voltage (DC)

Voltage Code

Voltage (DC)

1,000V

2,000V

3,000V

Capacitance Code Capacitance

0R5

010

102

105

0.5pF

1pF

1,000pF (1nF)

1,000,000pF (1µF)

TDK MLCC US Catalog

Page 107

Version B11

Capacitance

Range Chart

C4520 [EIA CC1808]

Capacitance Range Chart

Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%)

Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A)

C0G

X7R

Capacitance

(pF)

Cap

Code

Tolerance

(3000V) (2000V) (1000V)

100

120

150

180

220

270

330

390

470

560

680

820

101

471

102

F: ± 1pF

K: ± 10%

Standard Thickness

0.85 mm

1.10 mm

1.30 mm

1.60 mm

2.00 mm

100

470

1,000

Capacitance

Range Table

C4520 [EIA CC1808]

Class 1 (Temperature Compensating)

Temperature Characteristics: C0G (-55 to 125ºC, 0±30 ppm/ºC)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

Tolerance

Thickness

(mm)

(pF)

C4520C0G3F100F

C4520C0G3F120K

C4520C0G3F150K

C4520C0G3F180K

C4520C0G3F220K

C4520C0G3F270K

C4520C0G3F330K

C4520C0G3F390K

C4520C0G3F470K

C4520C0G3F560K

C4520C0G3F680K

C4520C0G3F820K

C4520C0G3F101K

C0G

3000V

100

± 1%

± 10%

0.85 ± 0.10

1.10 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

Class 2 (Temperature Stable)

Temperature Characteristics: X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C4520X7R3A471K

C4520X7R3A102K

C4520X7R3D471K

C4520X7R3D102K

X7R

1000V

2000V

470

± 10%

1.30 ± 0.15

1,000

470

1,000

TDK MLCC US Catalog

Page 108

Version B11

Capacitance

Range Chart

C4532 [EIA CC1812]

Capacitance Range Chart

Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%)

Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A)

C0G

X7R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

(3000V) (2000V) (1000V)

100

120

150

180

220

101

121

151

181

221

271

331

222

472

103

Standard Thickness

1.30 mm

270

330

1.60 mm

2.00 mm

2,200

4,700

10,000

2.30 mm

2.50 mm

Capacitance

Range Table

C4532 [EIA CC1812]

Class 1 (Temperature Compensating)

Temperature Characteristics: C0G (-55 to 125ºC, 0±30 ppm/ºC)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

Tolerance

Thickness

(mm)

(pF)

C4532C0G3F101K

C4532C0G3F121K

C4532C0G3F151K

C4532C0G3F181K

C4532C0G3F221K

C4532C0G3F271K

C4532C0G3F331K

C0G

3000V

100

120

150

180

220

270

330

± 10%

1.60 ± 0.30

2.00 ± 0.20

2.30 ± 0.20

2.50 ± 0.30

Class 2 (Temperature Stable)

Temperature Characteristics: X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C4532X7R3A472K

C4532X7R3A103K

C4532X7R3D222K

X7R

1000V

2000V

4,700

10,000

2,200

± 10%

1.60 ± 0.30

2.00 ± 0.20

1.30 ± 0.15

TDK MLCC US Catalog

Page 109

Version B11

General

Specifications

C Series – High Voltage Application

No.

Item

Performance

Test or Inspection Method

External

Appearance

No defects which may affect

performance.

Inspect with magnifying glass (3×).

Insulation

Resistance

10,000MΩ min.

Apply 500V DC for 60s.

Voltage Proof

Capacitance

Withstand test voltage without

insulation breakdown or other damage.

1.2 × rated voltage (DC) shall be applied for 1 to 5s.

Charge / discharge current shall not exceed 50mA.

Within the specified tolerance.

Measuring

Frequency

Measuring

Voltage

Class

Class 1

Class 2

1MHz±10%

1kHz±10%

0.5 - 5 V_rms

1.0±0.2V_rms

See No.4 in this table for measuring condition.

Rated Capacitance

30pF and over

Under 30pF

(Class 1)

1,000 min.

400+20×C min.

C : Rated capacitance (pF)

Dissipation

Factor

T.C.

D.F.

X7R

0.03 max.

(Class 2)

Temperature

Characteristics

T.C.

Temperature Coefficient

Temperature coefficient shall be calculated based on

values at 25ºC and 85ºC temperature.

C0G

0 ± 30 (ppm/ºC)

of Capacitance

(Class 1)

Capacitance drift within ± 0.2% or

± 0.05pF, whichever larger.

Measuring temperature below 20ºC shall be -10ºC and

-25ºC.

Temperature

Characteristics

Capacitance Change (%)

No Voltage Applied

X7R: ± 15%

Capacitance shall be measured by the steps shown in

the following table after thermal equilibrium is obtained

for each step.

of Capacitance

(Class 2)

∆C be calculated ref. STEP3 reading

Step

Temperature (ºC)

Reference temp. ± 2

Min. operating temp. ± 2

Reference temp. ± 2

Max. operating temp. ± 2

Robustness of

Terminations

No sign of termination coming off,

breakage of ceramic, or other abnormal

signs.

Reflow solder the capacitors on P.C. board (shown in

Appendix 1) and apply a pushing force of 5N with

10±1s.

Pushing force

P.C. board

Capacitor

TDK MLCC US Catalog

Page 110

Version B11

General

Specifications

C Series – High Voltage Application

No.

Item

Performance

Test or Inspection Method

Solderability

New solder to cover over 75% of

termination.

Completely soak both terminations in solder at

235±5ºC for 2±0.5s.

Solder: H63A (JIS Z 3282)

25% may have pin holes or rough spots

but not concentrated in one spot.

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.

Ceramic surface of “A sections” shall

not be exposed due to melting or

shifting of termination material.

A section

Vibration

Completely soak both terminations in solder at

260±5ºC for 5±1s.

External

No mechanical damage.

Preheating condition

Temp.: 150±10ºC

Time: 1 to 2min.

appearance

Capacitance

Change from the

Characteristics

value before test

Class 1 C0G

Class 2 X7R

±2.5 %

± 7.5 %

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.

Solder: H63A (JIS Z 3282)

Q (Class 1)

Rated Capacitance

30pF and over

Under 30pF

1,000 min.

400+20×C min.

Leave the capacitor in ambient conditions for 6 to 24h

(Class 1) or 24±2h (Class 2) before measurement.

C : Rated capacitance (pF)

Meet the initial spec.

D.F. (Class 2)

Temperature cycle

Reflow solder the capacitor on P.C. board (shown

in Appendix 1) before testing.

External

No mechanical damage.

appearance

Expose the capacitor in the conditions step1

through step 4 and repeat 5 times consecutively.

Change from the

value before test

Capacitance

Characteristics

Leave the capacitor in ambient conditions for 6 to

24h (Class 1) or 24±2h (Class 2) before

measurement.

Class 1 C0G

Class 2 X7R

±2.5 %

± 7.5 %

Q (Class 1)

Rated Capacitance

30pF and over

Under 30pF

Step

Temperature (ºC)

Time (min.)

30 ± 3

2 – 5

1,000 min.

400+20×C min.

Min. operating temp. ±3

Reference Temp.

Max. operating temp. ± 2

Reference Temp.

30 ± 2

2 - 5

C : Rated capacitance (pF)

Meet the initial spec.

D.F. (Class 2)

Insulation

Meet the initial spec.

Resistance

Voltage

Proof

No insulation breakdown or other

damage.

TDK MLCC US Catalog

Page 111

Version B11

General

Specifications

C Series – High Voltage Application

No.

Item

Performance

Test or Inspection Method

Moisture Resistance (Steady State)

Reflow solder the capacitors on P.C. board (shown in

Appendix 1) before testing.

External

No mechanical damage.

Leave at temperature 40±2ºC, 90 to 95%RH for 500

+24,0h.

appearance

Change from the

Capacitance

Characteristics

Leave the capacitors in ambient conditions for 6 to 24h

(Class 1) or 24±2h (Class 2) before measurement.

value before test

C0G ±5 %

X7R ±12.5 %

Class 1

Class 2

Q (Class 1)

Rated Capacitance

30pF and over

350 min.

10pF and over to

under 30pF

275+5/2×C min.

C : Rated capacitance (pF)

D.F. (Class 2)

Characteristics

X7R: 200% of initial spec. max.

Insulation

1,000MΩ min.

Resistance

Life

Reflow solder the capacitors on P.C. board (shown in

Appendix 1) before testing.

External

No mechanical damage.

Apply rated voltage at maximum operating temperature

appearance

±2ºC for 1,000 +48, 0h.

Capacitance

Change from the

value before test

Characteristics

Charge/discharge current shall not exceed 50mA.

Class 1

Class 2

C0G ±3 %

X7R ±15 %

Leave the capacitor in ambient conditions for 6 to 24h

(Class1) or 24±2h (Class2) before measurement.

Voltage conditioning:

Rated Capacitance

Q (Class 1)

Voltage treat the capacitors under testing temperature

and voltage for 1 hour.

30pF and over

350 min.

10pF and over to

under 30pF

275+5/2×C min.

Leave the capacitors in ambient conditions for 24±2h

before measurement.

C : Rated capacitance (pF)

Use this measurement for initial value.

D.F. (Class 2)

Characteristics

X7R: 200% of initial spec. max.

Insulation

1,000MΩ min.

Resistance

*As for the initial measurement of capacitors (Class 2) on number 8, 11, 12 and 13, leave capacitors at 150 –10, 0°C for 1

hour and measure the value after leaving capacitor for 24±2h in ambient condition.

TDK MLCC US Catalog

Page 112

Version B11

General

Specifications

C Series – High Voltage Application

Appendix - 1

P.C. Board for reliability test

100 mm

Copper

Solder Resist

Slit

Material : Glass Epoxy (As per JIS C6484 GE4)

P.C. Board thickness : 1.6mm

Copper (thickness 0.035mm)

Solder resist

Case Code

Dimensions (mm)

JIS

EIA

C4520

C4532

CC1808

CC1812

3.5

7.0

2.5

3.7

TDK MLCC US Catalog

Page 113

Version B11

Soldering

Information

C Series – High Voltage Application

• Recommended Soldering Land Pattern

• Recommended Soldering Profile

Reflow Soldering

Manual soldering

(Solder iron)

Natural

cooling

Chip capacitor

Soldering

Solder land

Slit

Preheating

300

Peak

Temp

∆T

Solder resist

Preheating

Over 60 sec.

• This product intended solely for reflow soldering.

• A slit of about 1mm on the circuit board is

recommended to improve removal of the flux after

soldering.

• Ensure that this product is completely dried following

washing.

• Because this product will be subjected to high

voltages, use only low-activity rosin flux (with 0.2% max.

of chlorine).

• Using this product with aluminum circuit boards must

be considered a special implementation because the

high heat stress levels are involved. In case of using

aluminum circuit boards, please contact TDK.

3sec. (As short as possible)

Peak Temp time

Recommended soldering duration

Reflow Soldering

Temp./

Dura.

Peak temp

Duration

(sec.)

Solder

(°C)

Sn-Pb Solder

Lead-Free Solder

230 max.

260 max.

20 max.

10 max.

Recommended solder compositions

Sn-37Pb (Sn-Pb solder)

Reflow Soldering

C4520

Unit: mm

C4532

Sn-3.0Ag-0.5Cu (Lead Free Solder)

Type

[CC1808]

3.1 – 3.7

1.2 – 1.4

1.5 – 2.0

1.0 – 1.3

[CC1812]

3.1 – 3.7

1.2 – 1.4

2.4 – 3.2

1.0 – 1.3

Symbol

Preheating Condition

Soldering

Temp. (ºC)

Reflow soldering

Manual soldering

∆T ≤ 130

• Recommended Solder Amount

Higher tensile

force on the chip

capacitor may

cause cracking.

Excessive

solder

Maximum amount

Minimum amount

Adequate

solder

Small solder fillet

may cause

Insufficient

solder

contact failure or

failure to hold the

chip capacitor to

the P.C. board.

TDK MLCC US Catalog

Page 114

Version B11

Packaging

Information

C Series – High Voltage Application

• Carrier Tape Configuration

Bulk

Chips

160mm min

160mm min.

Leader

Drawing direction

400mm min

• Peel Back Force (Top Tape)

Direction & angle of pull

• Carrier tape shall be flexible enough to be

wound around a minimum radius of 30mm with

components in tape.

Top cover tape

0.05 – 0.7 N

Carrier tape

• The missing of components shall be less than

0.1%

• Components shall not stick to the cover tape.

• The cover tape shall not protrude beyond the

edges of the carrier tape not shall cover the

sprocket holes.

0~15°

• Chip Quantity Per Reel and Structure of Reel

Plastic Carrier Tape & Reel

Top cover tape

Pitch hole

Plastic carrier tape

Case Code

Chip quantity (pcs.)

Chip

Taping

φ178mm

(7”) reel

Φ330mm

(13”) reel

Thickness Material

JIS

EIA

0.85 mm

1.10 mm

5,000

C4520

C4532

CC1808

1.30 mm

1.60 mm

2.00 mm

1.30 mm

1.60 mm

2.00 mm

2.30 mm

3.20 mm

Plastic

1,000

3,000

5,000

1,000

500

CC1812

3,000

TDK MLCC US Catalog

Page 115

Version B11

Additional

Information

C Series – High Voltage Application

• Shape & Dimensions

• Inside Structure & Material System

Terminal electrode

Internal electrode

Ceramic dielectric

No.

NAME

MATERIAL

Case Code

Dimensions (mm)

Class 1

Class 2

JIS

EIA

(1)

(2)

(3)

(4)

(5)

Ceramic Dielectric

Internal Electrode

CaZrO₃

BaTiO₃

0.85 mm

1.10 mm

Nickel (Ni)

0.30 min

Copper (Cu)

Nickel (Ni)

Tin (Sn)

C4520

C4532

CC1808

4.50

2.00 1.30 mm 2.00 min 2.00 min

Termination

1.60 mm

0.30 min

2.00 mm

1.30 mm 0.30 min.

1.60 mm

CC1812

4.50

3.20 2.00 mm 0.20 min 2.00 min

2.30 mm

3.20 mm 0.30 min.

• Environmental Information

TDK Corporation established internal product environmental

assurance standards that include the six hazardous substances

banned by the EU RoHS Directive¹enforced on July 1, 2006

along with additional substances independently banned by TDK

and has successfully completed making general purpose

electronic components conform to the RoHS Directive².

Abbreviation for Restriction on Hazardous Substances,

which refers to the regulation EU Directive 2002/95/EC on

hazardous substances by the European Union (EU)

effective from July 1, 2006. The Directive bans the use of

six specific hazardous substances in electric and

electronic devices and products handled within the EU.

The six substances are lead, mercury, cadmium,

hexavalent chromium, PBB (polybrominated biphenyls),

and PBDE (polybrominated diphenyl ethers).

This means that, in conformity with the EU Directive

2002/95/EC, lead, cadmium, mercury, hexavalent

chromium, and specific bromine-based flame retardants,

PBB and PBDE, have not been used, except for

exempted applications.

For REACH (SVHC : 15 substances according to ECHA /

October 2008) : All TDK MLCC do not contain these 15

substances.

For European Directive 2000/53/CE and 2005/673/CE :

Cadmium, Hexavalent Chromium, Mercury, Lead are not

contained in all TDK MLCC.

For European Directive 2003/11/CE : Pentabromodiphenyl-ether,

Octabromodiphenyl-ether are not contained in all TDK

MLCC.

TDK MLCC US Catalog

Page 116

Version B11

C4520C0G3F330KT [TDK]

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