C4520C0G3F330K [TDK]
C Series High Voltage Application; C系列高电压应用
| 型号： | C4520C0G3F330K |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | C Series High Voltage Application |
| 文件： | 总12页 (文件大小：2379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
C Series
High Voltage Application
Type:
C4520 [EIA CC1808]
C4532 [EIA CC1812]
Issue date:
January 2011
TDK MLCC
US Catalog
Version A11
REMINDERS
Please read before using this product
SAFETY REMINDERS
REMINDERS
1.
2.
3.
If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage,
you must contact our company’s sales window.
We may modify products or discontinue production of a product listed in this catalog without prior
notification.
We provide “Delivery Specification” that explain precautions for the specifications and safety of each product
listed in this catalog. We strongly recommend that you exchange these delivery specifications with
customers that use one of these products.
4.
If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according to
the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export
permission in harmony with this law.
5.
6.
Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from our
company.
We are not responsible for problems that occur related to the intellectual property rights or other rights of our
company or a third party when you use a product listed in this catalog. We do not grant license of these
rights.
7.
This catalog only applies to products purchased through our company or one of our company’s official
agencies. This catalog does not apply to products that are purchased through other third parties.
C Series
High Voltage Application
Type: C4520, C4532
• Inverter circuits with a liquid crystal backlight
• LAN card
• General high voltage circuits.
• Noise bypass for power supply
• Transceiver for LAN
• Advanced design provides improved withstand voltage
characteristics.
Features
Cautions
Applications
• TDK’s proprietary internal electrode structure and the
use of low-dielectric-strength material result in highly
reliable performance in high-voltage applications.
• Complies with ISO8802-3 for LAN applications.
• Designed exclusively for reflow soldering.
• Hub, etc.
• This product intended solely for reflow soldering.
• A slit of about 1mm on the circuit board is
recommended to improve removal of the flux after
soldering.
Shape &
Dimensions
• Ensure that this product is completely dried following
washing.
• Because this product will be subjected to high
voltages, use only low-activity rosin flux (with 0.2% max.
of chlorine).
• Using this product with aluminum circuit boards must
be considered a special implementation because the
high heat stress levels are involved. In case of using
aluminum circuit boards, please contact TDK.
L
Body Length
Body Width
W
T
Body Height
Terminal Width
B
Dimensions in mm
Part Number
Construction
C
4532 X7R 3D 222 K T XXXX
Series Name
Dimensions L x W (mm)
Internal Codes
Packaging Style
Packaging Code
T
Case Code
Length
Width
Style
C4520
C4532
4.50 ± 0.40
4.50 ± 0.40
2.00 ± 0.30
3.20 ± 0.40
Tape and Reel
Capacitance Tolerance
Tolerance Code
Tolerance
Temperature Characteristic
F
K
± 1pF
± 10%
Temperature
Characteristics Change
Capacitance
Temperature
Range
C0G
X7R
0±30 ppm/ºC
±15%
-55 to +125ºC
-55 to +125ºC
Nominal Capacitance (pF)
The capacitance is expressed in three digit codes
and in units of pico Farads (pF). The first and
second digits identify the first and second significant
figures of the capacitance. The third digit identifies
the multiplier. R designates a decimal point.
Rated Voltage (DC)
Voltage Code
Voltage(DC)
3A
3D
3F
1,000V
2,000V
3,000V
Capacitance Code Capacitance
0R5
010
102
105
0.5pF
1pF
1,000pF (1nF)
1,000,000pF (1μF)
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
Capacitance
Range Chart
C4520 [EIA CC1808]
Capacitance Range Chart
Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%)
Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A)
X7R
C0G
3F
Capacitance
(pF)
Cap
Code
Tolerance
3D
3A
(3,000V) (2,000V) (1,000V)
10
12
15
18
22
27
33
39
47
100 F: ± 1pF
120
150
180
220
270
330
390
470
560
680
820
101
471
102
K: ± 10%
Standard Thickness
0.85 ± 0.15 mm
56
68
82
1.10 ± 0.20 mm
1.30 ± 0.20 mm
1.60 ± 0.20 mm
2.00 ± 0.20 mm
100
470
1,000
Capacitance
Range Table
Class 1 (Temperature Compensating)
Temperature Characteristics: C0G (0 ± 30 ppm/ºC)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C4520C0G3F100F
C4520C0G3F120K
C4520C0G3F150K
C4520C0G3F180K
C4520C0G3F220K
C4520C0G3F270K
C4520C0G3F330K
C4520C0G3F390K
C4520C0G3F470K
C4520C0G3F560K
C4520C0G3F680K
C4520C0G3F820K
C4520C0G3F101K
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
3000V
10
12
15
18
22
27
33
39
47
56
68
82
100
± 1pF
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
0.85 ± 0.15
0.85 ± 0.15
1.10 ± 0.20
1.10 ± 0.20
1.10 ± 0.20
1.60 ± 0.20
1.60 ± 0.20
1.60 ± 0.20
1.60 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
Class 2 (Temperature Stable)
Temperature Characteristics: X7R (± 15%)
TDK Part Number
Temperature
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
(Ordering Code)
Characteristics
C4520X7R3A471K
C4520X7R3A102K
C4520X7R3D471K
C4520X7R3D102K
X7R
X7R
X7R
X7R
1000V
1000V
2000V
2000V
470
1,000
470
± 10%
± 10%
± 10%
± 10%
1.30 ± 0.20
1.30 ± 0.20
1.30 ± 0.20
1.30 ± 0.20
1,000
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // High Voltage C4520 Series // Version A11
Capacitance
Range Chart
C4532 [EIA CC1812]
Capacitance Range Chart
Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%)
Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A)
X7R
C0G
3F
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
3D
3A
(3,000V) (2,000V) (1,000V)
100
120
150
180
220
270
330
101
121
151
181
221
271
331
222
472
103
Standard Thickness
1.30 ± 0.20 mm
1.60 ± 0.20 mm
2.00 ± 0.20 mm
2.30 ± 0.20 mm
2.50 ± 0.30 mm
2,200
4,700
10,000
Capacitance
Range Table
Class 1 (Temperature Compensating)
Temperature Characteristics: C0G (0 ± 30 ppm/ºC)
TDK Part Number
Temperature
Rated
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
(Ordering Code)
Characteristics
Voltage
C4532C0G3F101K
C4532C0G3F121K
C4532C0G3F151K
C4532C0G3F181K
C4532C0G3F221K
C4532C0G3F271K
C4532C0G3F331K
C0G
C0G
C0G
C0G
C0G
C0G
C0G
3000V
3000V
3000V
3000V
3000V
3000V
3000V
100
120
150
180
220
270
330
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
1.60 ± 0.20
1.60 ± 0.20
1.60 ± 0.20
1.60 ± 0.20
2.00 ± 0.20
2.30 ± 0.20
2.50 ± 0.30
Class 2 (Temperature Stable)
Temperature Characteristics: X7R (± 15%)
TDK Part Number
Temperature
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
(Ordering Code)
Characteristics
C4532X7R3A472K
C4532X7R3A103K
C4532X7R3D222K
X7R
X7R
X7R
1000V
1000V
2000V
4,700
10,000
2,200
± 10%
± 10%
± 10%
1.60 ± 0.20
2.00 ± 0.20
1.30 ± 0.20
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // High Voltage C4532 Series // Version A11
General
Specifications
C Series — High Voltage Application
No.
1
Item
Performance
Test or Inspection Method
External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×).
2
3
Insulation
Resistance
10,000MΩ min.
Apply 500V DC for 60s.
Voltage Proof
Capacitance
Withstand test voltage without
insulation breakdown or other damage.
1.2 × rated voltage (DC) shall be applied for 1 to 5s.
Charge / discharge current shall not exceed 50mA.
4
Within the specified tolerance.
Measuring
Frequency
Measuring
Voltage
Class
Class 1
Class 2
1MHz±10%
1kHz±10%
0.5 - 5 Vrms
1.0±0.2Vrms
5
Q
See No.4 in this table for measuring condition.
See No.4 in this table for measuring condition.
Rated Capacitance
30pF and over
Under 30pF
Q
(Class 1)
1,000 min.
400+20×C min.
C : Rated capacitance (pF)
6
7
Dissipation
Factor
T.C.
D.F.
X7R
0.03 max.
(Class 2)
Temperature
Characteristics
Temperature coefficient shall be calculated based on
values at 25ºC and 85ºC temperature.
T.C.
Temperature Coefficient
C0G
0 ± 30 (ppm/ºC)
of Capacitance
(Class 1)
Capacitance drift within ± 0.2% or
± 0.05pF, whichever larger.
Measuring temperature below 20ºC shall be -10ºC and
-25ºC.
8
Temperature
Characteristics
Capacitance Change (%)
No Voltage Applied
X7R: ± 15%
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
of Capacitance
(Class 2)
∆C be calculated ref. STEP3 reading
Step
Temperature (ºC)
1
2
3
4
Reference temp. ± 2
Min. operating temp. ± 2
Reference temp. ± 2
Max. operating temp. ± 2
9
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitors on P.C. board (shown in
Appendix 1) and apply a pushing force of 5N with
10±1s.
Pushing force
P.C. board
Capacitor
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
General
Specifications
C Series — High Voltage Application
No.
10
Item
Performance
Test or Inspection Method
Solderability
New solder to cover over 75% of
termination.
Completely soak both terminations in solder at
235±5ºC for 2±0.5s.
Solder: H63A (JIS Z 3282)
25% may have pin holes or rough spots
but not concentrated in one spot.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Ceramic surface of “A sections” shall
not be exposed due to melting or
shifting of termination material.
A section
11
Vibration
Completely soak both terminations in solder at
260±5ºC for 5±1s.
External
No mechanical damage.
Preheating condition
Temp.: 150±10ºC
Time: 1 to 2min.
appearance
Capacitance
Change from the
Characteristics
value before test
Class 1 C0G
Class 2 X7R
±2.5 %
± 7.5 %
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Solder: H63A (JIS Z 3282)
Q (Class 1)
Rated Capacitance
30pF and over
Under 30pF
Q
1,000 min.
400+20×C min.
Leave the capacitor in ambient conditions for 6 to 24h
(Class 1) or 24±2h (Class 2) before measurement.
C : Rated capacitance (pF)
D.F. (Class 2)
Meet the initial spec.
12
Temperature cycle
Reflow solder the capacitor on P.C. board (shown
in Appendix 1) before testing.
External
No mechanical damage.
appearance
Expose the capacitor in the conditions step1
through step 4 and repeat 5 times consecutively.
Change from the
value before test
Capacitance
Characteristics
Leave the capacitor in ambient conditions for 6 to
24h (Class 1) or 24±2h (Class 2) before
measurement.
Class 1 C0G
Class 2 X7R
±2.5 %
± 7.5 %
Q (Class 1)
Rated Capacitance
30pF and over
Under 30pF
Q
Step
Temperature (ºC)
Time (min.)
30 ± 3
2 — 5
1,000 min.
400+20×C min.
1
2
3
4
Min. operating temp. ±3
Reference Temp.
Max. operating temp. ± 2
Reference Temp.
30 ± 2
2 - 5
C : Rated capacitance (pF)
D.F. (Class 2)
Meet the initial spec.
Insulation
Meet the initial spec.
Resistance
Voltage
Proof
No insulation breakdown or other
damage.
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
General
Specifications
C Series — High Voltage Application
No.
13
Item
Performance
Test or Inspection Method
Reflow solder the capacitors on P.C. board (shown in
Appendix 1) before testing.
Moisture Resistance (Steady State)
External
No mechanical damage.
Leave at temperature 40±2ºC, 90 to 95%RH for 500
+24,0h.
appearance
Change from the
value before test
Capacitance
Characteristics
Leave the capacitors in ambient conditions for 6 to 24h
(Class 1) or 24±2h (Class 2) before measurement.
Class 1
Class 2
C0G ±5 %
X7R
±12.5 %
Q (Class 1)
Rated Capacitance
Q
30pF and over
350 min.
10pF and over to
under 30pF
275+5/2×C min.
C : Rated capacitance (pF)
D.F. (Class 2)
Characteristics
X7R: 200% of initial spec. max.
Insulation
1,000MΩ min.
Resistance
14
Life
Reflow solder the capacitors on P.C. board (shown in
Appendix 1) before testing.
External
appearance
No mechanical damage.
Apply rated voltage at maximum operating temperature
±2ºC for 1,000 +48, 0h.
Capacitance
Change from the
Characteristics
Charge/discharge current shall not exceed 50mA.
value before test
Class 1
Class 2
C0G ±3 %
Leave the capacitor in ambient conditions for 6 to 24h
(Class1) or 24±2h (Class2) before measurement.
X7R
±15 %
Voltage conditioning:
Q (Class 1)
Rated Capacitance
Q
Voltage treat the capacitors under testing temperature
and voltage for 1 hour.
30pF and over
350 min.
10pF and over to
under 30pF
Leave the capacitors in ambient conditions for 24±2h
before measurement.
275+5/2×C min.
C : Rated capacitance (pF)
Use this measurement for initial value.
D.F. (Class 2)
Characteristics
X7R: 200% of initial spec. max.
Insulation
1,000MΩ min.
Resistance
*As for the initial measurement of capacitors (Class 2) on number 8, 11, 12 and 13, leave capacitors at 150 —10, 0°C for 1
hour and measure the value after leaving capacitor for 24±2h in ambient condition.
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
General
Specifications
C Series — High Voltage Application
Appendix - 1
P.C. Board for reliability test
c
100 mm
Copper
Solder Resist
Slit
Material : Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness : 1.6mm
Copper (thickness 0.035mm)
Solder resist
Case Code
Dimensions (mm)
JIS
EIA
a
b
c
C4520
C4532
CC1808
CC1812
3.5
3.5
7.0
7.0
2.5
3.7
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
Soldering
Information
C Series — High Voltage Application
• Recommended Soldering Land Pattern
• Recommended Soldering Profile
Reflow Soldering
Manual soldering
(Solder iron)
D
Natural
cooling
Chip capacitor
Soldering
Solder land
Slit
Preheating
300
Peak
Temp
C
B
∆T
∆T
Solder resist
A
Preheating
0
0
Over 60 sec.
• This product intended solely for reflow soldering.
• A slit of about 1mm on the circuit board is
recommended to improve removal of the flux after
soldering.
• Ensure that this product is completely dried following
washing.
• Because this product will be subjected to high
voltages, use only low-activity rosin flux (with 0.2% max.
of chlorine).
• Using this product with aluminum circuit boards must
be considered a special implementation because the
high heat stress levels are involved. In case of using
aluminum circuit boards, please contact TDK.
Peak Temp time
3sec. (As short as possible)
Recommended soldering duration
Reflow Soldering
Temp./
Dura.
Peak temp
Duration
Solder
Sn-Pb Solder
Lead-Free Solder
(°C)
(sec.)
230 max.
260 max.
20 max.
10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Reflow Soldering
C4520
Unit: mm
C4532
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Type
Symbol
[CC1808]
3.1 — 3.7
1.2 — 1.4
1.5 — 2.0
1.0 — 1.3
[CC1812]
3.1 — 3.7
1.2 — 1.4
2.4 — 3.2
1.0 — 1.3
Preheating Condition
A
B
C
D
Soldering
Temp. (ºC)
Reflow soldering
Manual soldering
∆T ≤ 130
∆T ≤ 130
• Recommended Solder Amount
Higher tensile
force on the chip
capacitor may
cause cracking.
Excessive
solder
Maximum amount
Minimum amount
Adequate
solder
Small solder fillet
may cause
Insufficient
solder
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
Packaging
Information
C Series — High Voltage Application
• Carrier Tape Configuration
Bulk
Chips
Bulk
160mm min
160mm min.
Leader
Drawing direction
• Peel Back Force (Top Tape)
Carrier tape
400mm min
Direction & angle of pull
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
Top cover tape
0.05 — 0.7 N
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape not shall cover the
sprocket holes.
0~15°
• Chip Quantity Per Reel and Structure of Reel
Plastic Carrier Tape & Reel
Top cover tape
Pitch hole
Plastic carrier tape
Case Code
Chip quantity (pcs.)
Chip
Taping
φ178mm
Φ330mm
Thickness Material
JIS
EIA
(7”) reel
(13”) reel
0.85 mm
1.10 mm
5,000
C4520
C4532
CC1808
1.30 mm
1.60 mm
2.00 mm
1.30 mm
1.60 mm
2.00 mm
2.30 mm
3.20 mm
Plastic
Plastic
1,000
3,000
5,000
1,000
500
CC1812
3,000
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
Additional
Information
C Series — High Voltage Application
• Shape & Dimensions
• Inside Structure & Material System
3
4
Terminal electrode
W
5
B
L
G
B
T
2
1
Internal electrode
Ceramic dielectric
No.
NAME
MATERIAL
Class 1
CaZrO3
Class 2
Case Code
Dimensions (mm)
(1)
(2)
(3)
(4)
(5)
Ceramic Dielectric
Internal Electrode
BaTiO3
0.85 mm
1.10 mm
Nickel (Ni)
0.30 min
Copper (Cu)
Nickel (Ni)
Tin (Sn)
C4520
CC1808
CC1812
4.50
4.50
2.00
1.30 mm 2.00 min 2.00 min
Termination
1.60 mm
0.30 min
2.00 mm
1.30 mm 0.30 min.
1.60 mm
C4532
3.20
2.00 mm 0.20 min 2.00 min
2.30 mm
3.20 mm 0.30 min.
• Environmental Information
TDK Corporation established internal product environmental
assurance standards that include the six hazardous substances
banned by the EU RoHS Directive1 enforced on July 1, 2006
along with additional substances independently banned by TDK
and has successfully completed making general purpose
electronic components conform to the RoHS Directive2.
1.
Abbreviation for Restriction on Hazardous Substances,
which refers to the regulation EU Directive 2002/95/EC on
hazardous substances by the European Union (EU)
effective from July 1, 2006. The Directive bans the use of
six specific hazardous substances in electric and
electronic devices and products handled within the EU.
The six substances are lead, mercury, cadmium,
hexavalent chromium, PBB (polybrominated biphenyls),
and PBDE (polybrominated diphenyl ethers).
2.
This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame retardants,
PBB and PBDE, have not been used, except for
exempted applications.
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these 15
substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are not
contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-ether,
Octabromodiphenyl-ether are not contained in all TDK
MLCC.
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
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