CGA3E3X5R1V334K080AB_17 [TDK]

Multilayer Ceramic Chip Capacitors;


型号：	CGA3E3X5R1V334K080AB_17
厂家：	TDK ELECTRONICS
描述：	Multilayer Ceramic Chip Capacitors
文件：	总3页 (文件大小：234K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1 of 3

Creation Date : June 26, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA3E3X5R1V334K080AB

TDK item description CGA3E3X5R1V334KT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA3(1608) [EIA 0603]

Production

Size

1.60mm ±0.10mm

Length(L)

Width(W)

0.80mm ±0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

330nF ±10%

35VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

1515MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

2 of 3

Creation Date : June 26, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA3E3X5R1V334K080AB

Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)

Impedance

ESR

CGA3E3X5R1V334K080AB

Capacitance

DC Bias Characteristic

CGA3E3X5R1V334K080AB

Temperature Characteristic

Ripple Temperature Rising

CGA3E3X5R1V334K080AB(100kHz) CGA3E3X5R1V334K080AB(500kHz) CGA3E3X5R1V334K080AB(1MHz)

CGA3E3X5R1V334K080AB(No

Bias)

CGA3E3X5R1V334K080AB(DC Bias

= 17.5V )

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

3 of 3

Creation Date : June 26, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA3E3X5R1V334K080AB

Associated Images

Land Pattern (Terminal Connection)

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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