CGA9N1C0G2J683J230KE [TDK]

Multilayer Ceramic Chip Capacitors;
CGA9N1C0G2J683J230KE
型号: CGA9N1C0G2J683J230KE
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:168K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA9N1C0G2J683J230KE  
TDK item description CGA9N1C0G2J683JT***S  
Applications  
Automotive Grade  
Mid Mid Voltage (100 to 630V)  
Soft Soft Termination  
Feature  
AEC-Q200 AEC-Q200  
Series  
Status  
CGA9(5750) [EIA 2220]  
Production  
Size  
5.70mm +0.50,-0.40mm  
Length(L)  
Width(W)  
5.00mm ±0.40mm  
2.30mm +0.30,-0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
4.10mm to 4.80mm  
1.20mm to 1.40mm  
4.00mm to 5.00mm  
Electrical Characteristics  
Capacitance  
68nF ±5%  
630VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
7352MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
Yes  
Packing  
Blister (Plastic)Taping [180mm Reel]  
500pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA9N1C0G2J683J230KE  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
Impedance  
Capacitance  
CGA9N1C0G2J683J230KE  
CGA9N1C0G2J683J230KE  
DC Bias Characteristic  
Temperature Characteristic  
CGA9N1C0G2J683J230KE(DC Bias =  
315V)  
CGA9N1C0G2J683J230KE  
CGA9N1C0G2J683J230KE(No Bias)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA9N1C0G2J683J230KE  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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