FK11X5R1A226MN006 [TDK]

CAP CER 22UF 10V X5R RADIAL;


型号：	FK11X5R1A226MN006
厂家：	TDK ELECTRONICS
描述：	CAP CER 22UF 10V X5R RADIAL
文件：	总23页 (文件大小：1715K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SPEC. No. D2013-C9

DATE: 2013 Sep.

SPECIFICATION

Non-Controlled Copy

CUSTOMER’S PRODUCT NAME

TDK’S PRODUCT NAME

Multilayer ceramic capacitors

Dipped radial lead type

FK-Series

General (Up to 50V)

Mid voltage (100 to 630V)

RECEIPT CONFIRMATION

DATE:

YEAR

MONTH

DAY

TDK Corporation

Sales

Engineering

Electronic Components Sales &

Marketing Group

TDK-EPC CORPORATION

Ceramic Capacitors Business Group

TDK-MCC CORPORATION

DIELECTRIC PRODUCTS ENGINEERING DEPT.

APPROVED

Person in charge

APPROVED CHECKED Person in charge

1. SCOPE

This specification is applicable to multilayer ceramic capacitors dipped radial lead type

with a priority over the other relevant specifications.

Production places defined in this specification shall be TDK Xiamen Co., Ltd. (China).

EXPLANATORY NOTE:

This specification warrants the quality of the lead type ceramic capacitor. The parts

should be evaluated or confirmed a state of used on your product.

If the use of the parts go beyond the bounds of the specification, we can not afford to

guarantee.

2. CODE CONSTRUCTION

(Example)

FK28

(1)

X7R

(2)

104

(4)

N006

(6)

(3)

(5)

(1)Type

φd

FK18

FK14

φd

FK16

FK11

Dimensions (Unit : mm)

Type

L(max.)

4.0

W(max.)

5.5

T(max.)

2.5



φd

FK18

FK14

FK16

FK11

4.5

5.5

6.0

7.0

2.5

3.5

4.0

+3.0

-1.0

+0.10

-0.03

2.5±0.8

5.0

0.5

＊FK denotes forming lead.

The first digit refers to a distance between leads ( 1－2.5mm ),

the second digit is for TDK internal code.

＊Dimension

 is applied to bulk packaging.

Refer to Appendix 2 for dimension of taping packaging.

―― 1 ――

(1)Type

φd

FK28

FK24

φd

FK26

FK20

Dimensions (Unit : mm)

FK22

Type

L(max.)

4.0

W(max.)

T(max.)

2.5



φd

FK28

FK24

FK26

FK20

FK22

5.5

6.0

7.0

8.0

4.5

5.5

7.5

2.5

3.5

4.0

+0.10

-0.03

5.0±1.0

7.0±2.0

0.5

＊FK denotes forming lead.

The first digit refers to a distance between leads ( 2－5.0mm ),

the second digit is for TDK internal code.

＊Dimension

 is applied to bulk packaging.

Refer to Appendix 3 for dimension of taping packaging.

(2)Temperature Characteristics (Details are shown in para 7 No.7,8)

―― 2 ――

(3)Rated Voltage

Symbol

2 J

Rated Voltage

DC 630 V

2 E

2 A

1 H

1 E

1 C

1 A

0 J

DC 250 V

DC 100 V

50 V

25 V

16 V

10 V

DC 6.3 V

(4)Rated Capacitance

Stated in three digits and in units of pico farads (pF). The first and

second digits identify the first and second significant figures of the

capacitance, the third digit identifies the multiplier.

R is designated for a decimal point.

Example

2R2

104

→

2.2pF

100,000pF

(5)Capacitance tolerance

Symbol

Tolerance

±0.25 pF

Capacitance(C)

C≦5pF

±0.5 pF

5pF＜C≦10pF

± 5

±10

±20

％

Over 10pF

(6)Internal code

Applied voltage

of Life

Symbol

Packaging

Bulk

N020

N000

N006

R020

R000

R006

(FK1*type)

Bulk

Rated voltage

×2

(FK2*type)

Ammo Pack

Bulk

(FK1*type)

Bulk

Rated voltage

×1

(FK2*type)

Ammo Pack

―― 3 ――

3.1 Standard combination of rated capacitances and tolerances

Capacitance tolerance

(*1)

Temperature

Characteristics

Class

Rated capacitance

C≦5

C (±0.25 pF) 1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5

D (±0.5 pF) 6, 6.8, 7, 8, 9, 10

5＜C≦10

C0G

10＜C≦10,000 J (± 5

%) E-12 series

%) E- 6 series

10,000＜C

C≦0.1

J (± 5

K (±10

X5R

X7R

X7S

0.1＜C≦10

10＜C

K (±10

M (±20

E- 6 series

*1 C denotes Capacitance.

Unit : pF for Class1 and μF for Class2.

3.2 Capacitance Step in E series

E series

Capacitance Step

2.2

E- 3

4.7

E- 6

E-12

1.5

2.2

3.3

4.7

6.8

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8 8.2

4. OPERATING TEMPERATURE RANGE

Min. operating

Temperature

Max. operating

Temperature

Reference

Temperature

25℃

T.C.

X5R

-55℃

85℃

C0G

X7R

X7S

125℃

25℃

5. STORING CONDITION AND TERM

5 to 40℃ at 20 to 70%RH

6 months Max.

6. INDUSTRIAL WASTE DISPOSAL

Dispose this product as industrial waste in accordance with the industrial Waste Law.

―― 4 ――

7. PERFORMANCE

table 1

Performance

No defects which may affect

performance.

№

Item

External Appearance

Test or inspection method

By visual checking.

Indication Appearance

Meet a requirement per para 8.

solvent

Solvent temp. Dipping time

Resistance

to solvent

Shall be visible.

Isopropyl

alcohol

20～25 ℃

30±5s.

Voltage

Proof

Between

termination damage.

No insulation breakdown or other

Class Rated voltage

Apply voltage

100V and under

Class1

Over 100V

Rated voltage ×3

Rated voltage ×1.5

Rated voltage ×2.5

Rated voltage ×1.5

100V and under

Class2

Over 100V

Above DC voltage shall be applied

for 1～5s.

Charge / discharge current shall not

exceed 50mA.

Between

No insulation breakdown or other Apply ×2.5 rated voltage.

termination damage.

coating

（By metallic small ball method.）

Insulation Resistance

10,000MΩ or 500 MΩ・μF min.

(As for the capacitor of rated

voltage 16,10 and 6.3V DC,

10,000 MΩ or 100 MΩ・μF min.,)

whichever smaller.

≪250V DC and under≫

Apply rated voltage.

≪630V DC≫

Apply DC500V.

Applying time：60sec.

Capacitance

Within the specified tolerance. Class 1

Rated

Measuring

frequency

Measuring

voltage

capacitance

1,000pF

and under

Over

1MHz±10%

1kHz±10%

0.5～5 Vrms.

1,000pF

Class 2

Rated

capacitance

10μF

and under

Over

10μF

Measuring

frequency

Measuring

voltage

1.0±0.2

Vrms.

0.5±0.2

Vrms.

1kHz±10%

120Hz±10%

As per Table 2.

T.C.

See No.5 in this table for measuring

condition.

(Class 1)

Dissipation Factor

(Class 2)

D.F.

0.03 max.

0.05 max.

0.075 max.

0.10 max.

0.15 max.

For information which product has which

Dissipation Factor, please contact with our

sales representative.

X5R

X7R

X7S

―― 5 ――

(continued)

Item

Temperature

Characteristics

of Capacitance

(Class 1)

№

Performance

Test or inspection method

Temperature Coefficient shall be

calculated based on values at 25℃ and

85℃ temperature.

Temperature Coefficient

(ppm/℃)

C0G

0 ± 30

Measuring temperature below 20℃ shall be

-10℃ and -25℃

Capacitance drift

Within ±0.2% or ±0.05pF,

whichever larger.

Temperature

Capacitance shall be measured by the steps

shown in the following table, after

thermal equilibrium is obtained for each

step.

Characteristics

of Capacitance

(Class 2)

Capacitance Change(%)

No voltage applied

ΔC be calculated ref. STEP3 reading.

Step

Temperature（℃）

X5R: ±15

X7R: ±15

X7S: ±22

Reference temp. ±2

Min. operating temp. ±2

Reference temp. ±2

Max. operating temp. ±2

As for the capacitor of rated voltage 10V

DC(1A) and 6.3V DC(0J), 0.2Vrms. shall be

applied.

Lead

Strength

Tensile

Strength

No mechanical damage such as lead

breakage and loosing.

With holding the parts, apply pulling

force to lead drawing direction

gradually.

Pulling strength：5N

Holding time：10±1s.

Bending

Strength

No mechanical damage such as lead

breakage and loosing.

With holding the capacitors to keep the

axis vertical, bend it 90 degrees with

weighting and put it back to the original

position.

This operation shall be done for 2～3s.

and repeat the following times.

Bending forth：5N（weight：0.51kg）

Testing time：2 times

10 Vibration External

appearance

No mechanical damage.

Solder the capacitors on a P.C.Board shown

in Appendix1 before testing.

Vibrate the capacitor with amplitude of

1.5mm P-P changing the frequencies from

10Hz to 55Hz and back to 10Hz in about

1min.

Capacitance

Change from the

Characteristics

value before test

±2.5% or

Repeat this for 2h each in 3 perpendicular

directions.

Class1

Class2

C0G

±0.25pF,

whichever larger.

±7.5 %

X5R

X7R

X7S

±7.5 %

Shown in Table2.

Meet the initial spec.

Class1

D.F.

Class2

―― 6 ――

(continued)

Item

11 Solderability

№

Performance Test or inspection method

Leads shall be covered by new solder Completely soak both terminations in

more than 75% of its surface.

solder at 245±5℃ for 2±0.5s.

Solder : Sn-3.0Ag-0.5Cu(Pb-free)

Flux : Isopropyl alcohol(JIS K 8839)

Rosin(JIS K 5902)

25% solid solution.

Dipping：By 1.5～2.0mm from the root

of lead.

12 Resistance

to solder

heat

External

appearance

Capacitance

No defects which may affect

performance.

Completely soak both terminations in

solder at 250±5℃ for 5±1s.

Solder : Sn-3.0Ag-0.5Cu(Pb-free)

Flux : Isopropyl alcohol(JIS K 8839)

Rosin(JIS K 5902)

25% solid solution.

Dipping：By 1.5～2.0mm from the root

of lead.

Change from the

Characteristics

value before test

±2.5 % or

±0.25pF

whichever larger.

±7.5 %

Class1

Class2

C0G

X5R

X7R

X7S

±7.5 %

Shown in Table2.

Class1

D.F.

Meet the initial spec.

Class2

Insulation

Resistance

Voltage

proof

No insulation breakdown or other

damage.

13 Temperature

Cycle and

Dipping

Temperature Cycle

Step

Temp.(℃)

Min. operating

Temp.±3

Time(min.)

30 ± 3

Capacitance

Cycle

Change from the

Characteristics

value before test

Reference temp. Less than 3

±2.5 % or

±0.25pF

whichever larger.

Max. operating

30 ± 3

Class1

C0G

X5R

Temp.±3

Reference temp. Less than 3

7.5 %

*Class2 X7R

X7S

± 10

Dipping Cycle

*Applied for some parts

Temp.

(℃)

Time

(min.)

Solidy

liquid

Step

Shown in Table2.

15±2 Pure water

Class1

D.F

Class2

Meet the initial spec.

Saturation

15±2

0±3

salt water

Insulation

Resistance

Solder the capacitors on a P.C.Board

shown in Appendix1 before testing.

Voltage

proof

No insulation breakdown or other

damage.

Leave the capacitors in ambient

condition for the following time before

measurement.

Class1

Class2

24±2h

48±4h

Perform Temperature cycle(5 cycle) and

dipping cycle(2 cycle) consecutively.

―― 7 ――

(continued)

Item

External

№

Performance

No mechanical damage.

Test or inspection method

Solder the capacitors on a P.C.Board

shown in Appendix1 before testing.

Leave at temperature 40±2℃, 90 to

95%RH for 500 +24,0h.

Leave the capacitors in ambient

condition for the following time

before measurement.

14 Moisture

Resistance

(Steady State)

appearance

Capacitance

Change from the

value before test

Characteristics

±5% or

Class1

C0G

X5R

0.5pF

whichever larger.

Class1

Class2

24±2h

48±4h

±12.5%

±25

*Class2 X7R

X7S

*Applied for some parts

Shown in Table2.

Class1

D.F.

Class2

Characteristics

200% of initial spec max.

Insulation

Resistance

1,000MΩ or 50 MΩ・μF min.

(As for the capacitor of rated

voltage 16,10 and 6.3V DC,

1,000 MΩ or 10 MΩ・μF min.,)

whichever smaller.

15 Moisture

Resistance

External

appearance

Capacitance

No mechanical damage.

Solder the capacitors on a P.C.Board

shown in Appendix1 before testing.

Apply the rated voltage at temperature

40±2℃ and 90 to 95%RH for 500

+24,0h.

Charge/discharge current shall not

exceed 50mA.

Leave the capacitors in ambient

condition for the following time

before measurement.

Change from the

Characteristics

value before test

±7.5% or

Class1

C0G

X5R

±0.75pF

whichever larger.

±12.5 %

±25

*Class2 X7R

X7S

*Applied for some parts

Class1

Class2

24±2h

48±4h

Voltage conditioning：(Only Class2)

Voltage treat the capacitor under

testing temperature and voltage for

1hour.

Leave the capacitors in ambient

condition for48±4h before

measurement.

Shown in Table2.

Class1

D.F.

Class2

Characteristics

200% of initial spec max.

Insulation

Resistance

500MΩ or 25MΩ・μF min.

Use this measurement for initial

value.

(As for the capacitor of rated

voltage 16,10 and 6.3V DC,

500 MΩ or 5MΩ・μF min.,)

whichever smaller.

―― 8 ――

(continued)

Item

External

№

Performance

Test or inspection method

Solder the capacitors on a P.C.Board

shown in Appendix1 before testing.

16 Life

No mechanical damage.

appearance

Capacitance

Change from the

Below the voltage shall be applied at

maximum operating temperature ±2℃ for

1,000 +48,0h.

Characteristics

value before test

±3% or

±0.3%

whichever larger.

Class1

C0G

X5R

Applied voltage

Rated voltage ×2

Rated voltage ×1

±15 %

±25 %

*Class2 X7R

X7S

*Applied for some parts

Shown in Table2.

For information which products has

which applied voltage, please contact

with our sales representative.

Class1

D.F.

Class2

characteristics

200% of initial spec max.

Charge/discharge current shall not

exceed 50mA.

Insulation

Resistance

1,000MΩ or 50MΩ・μF min.

(As for the capacitor of rated

voltage 16,10 and 6.3V DC,

1,000 MΩ or 10MΩ・μF min.,)

whichever smaller.

Leave the capacitors in ambient

condition for the following time

before measurement.

Class1

Class2

24±2h

48±4h

Voltage conditioning : (Only Class2)

Voltage treat the capacitor under testing

temperature and voltage for 1hour.

Leave the capacitors in ambient

condition for 48±4h before

measurement.

Use this measurement for initial value.

* As for the initial measurement of capacitors (Class2) on number 8, 10, 12, 13, and 14, leave

capacitors at 150 -10,0℃ for 1h and measure the value after leaving capacitors for 48±4h in

ambient condition.

table2

Specification

Applicable numbers of Table1

6, 10, 12, 13

30pF and over

Q ≧ 1,000

Less than 30pF

Q ≧ 400+20･C

14, 16

30pF and over

Less than 30pF

Q ≧ 350

Q ≧ 275+5/2･C

30pF and over

Less than 30pF

Q ≧ 200

Q ≧ 100+10/3･C

(Note) : C denotes Rated Capacitance(pF)

―― 9 ――

Appendix1

P.C. board

100.0

0.6

Copper

Solder resist

（Unit：mm）

1. Material :Glass Epoxy(As per JIS C6484 GE4)

2. Thickness：1.6mm

Copper(Thickness:0.035mm)

Solder resist

―― 10 ――

8. INDICATION

8.1 Indication (Example)

ＦＫ１８

ＦＫ２８

ＦＫ１４

ＦＫ２４

ＦＫ１６

ＦＫ２６

ＦＫ１１

ＦＫ２０

Type

ＦＫ２２

T.C.

(1)――

(2)―

(4)―

(2)―

(4)―

224J

TDK

―(3)

―(5)

(2)―

―(3)

Ｃ０Ｇ

102

103

104J

155K

Ｘ５Ｒ

Ｘ７Ｒ

Ⅹ７Ｓ

335K

TDK

(2)―

(4)―

(2)―

(4)―

―(3)

―(5)

8.2 Meaning of indication

Item

Type

Detail

FK18, FK14

FK28, FK24

FK16, FK11,

FK26, FK20

FK22

○

For C0G,indicate Black mark on the

head.

(1) T.C.

――

○

(2) Rated Capacitance

Indicate in three digits.

○

(3) Capacitance tolerance Indicates the symbol.

――

For DC50V, indicate a bar under

the rated capacitance.

(4) Rated voltage

(5) Manufacturer

○

Indicates " TDK ".

――

―― 11 ――

9. INSIDE STRUCTURE AND MATERIAL

①

①-3

①-4

①-5

②

③

④

①-2

①-1

MATERIAL

№

①

NAME

No.

NAME

Class 1

CaZrO₃

Class 2

BaTiO₃

①-1 Dielectric

①-2

①-3

Electrode

Multilayer

Ceramic Chip

Capacitors

Termination

①-4

①-5

②

③

④

Coating

Epoxy

Solder for joint

Lead wire

High temp. solder

Solder coated copper wire

10. PACKAGING

Packaging shall be done to protect the components from the damage during Transportation

and storing, and a label which has the following information shall be attached.

1) Total number of components in a plastic bag: 500pcs.max.

2) Tape packaging is as per TDK tape packaging specification.

1) Inspection No.

2) TDK P/N

3) Customer’s P/N

4) Quantity

* Composition of Inspection No.

Example

Ⅹ

３

Ａ

－

○○

(d)

－

○○○

(e)

(a) (b) (c)

a) Line code

b) Last digit of year

c) Month and A for January and B for February and so on. (Skip I)

d) Inspection Date of the month.

e) Serial No. of the day

―― 12 ――

11. Caution

No.

Process

Condition

Operating

Condition

1-1. Storage

1) The capacitor must be stored in an ambient temperature of 5～40℃ with a relative

humidity of 20～70％. The products should be used within 6 months upon receipt.

(Storage,

Transportation)

2) The capacitors must be operated and stored in an environment free of dew

condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,

Chlorine, Ammonia and sulfur.

3) Avoid storing in sun light and wet with dew.

4) Do not use capacitors under high humidity and high and low atmospheric pressure

which may affect capacitors reliability.

5) Capacitors should be tested for the solderability when they are stored for long

time.

1-2. Handling in transportation

1) In case of the transportation of the capacitors, the performance of the

capacitors may be deteriorated depending on the transportation condition.

(Refer to JEITA RCR-2335B 9.2 Handling in transportation)

Circuit design 2-1. Operating temperature

Operating temperature should be followed strictly within this specification,

especially be careful with the maximum temperature.



Caution

1) Do not use capacitor above the maximum allowable operating temperature.

2) Surface temperature including self heating should be below maximum operating

temperature.

(Due to dielectric loss, capacitor will heat itself when AC is applied.

Especially at high frequencies around its SRF, the heat might be so extreme

that it may damage itself or the product mounted on. Please design the circuit

so that the maximum temperature of the capacitor including the self heating

to be below the maximum allowable operating temperature.

Temperature rise shall be bellow 20℃.)

3) The electrical characteristics of the capacitors will vary depending on the

temperature. The capacitors should be selected and designed in taking the

temperature into consideration.

2-2. Operating voltage

1) Operating voltage across the terminals should be below the rated voltage.

When AC and DC are super imposed, V0-P must be below the rated voltage.

――― (1) and (2)

AC or pulse with overshooting, V_P-Pmust be below the rated voltage.

―――(3), (4) and (5)

When the voltage is started to apply to the circuit or it is stopped applying,

the irregular voltage may be generated for a transit period because of resonance

or switching. Be sure to use a capacitor within rated voltage containing these

irregular voltage.

―― 13 ――

No.

Process

Condition

(2) DC＋AC voltage

Circuit design

Voltage

(1) DC voltage

(3) AC voltage



Caution

Positional

Measurement

V_0-P

V_P-P

(Rated voltage)

Voltage

(4) Pulse voltage (A) (5) Pulse voltage (B)

Positional

Measurement

V_P-P

(Rated voltage)

2) Even below the rated voltage, if repetitive high frequancy AC or pulse is

applied, the reliability of the capacitor may be reduced.

3) The effective capacitance will vary depending on applied DC and AC voltages.

The capacitors should be selected and designed in taking the voltages into

consideration.

2-3. Frequency

1) When the capacitors (Class 2) are used in AC and/or pulse voltages, the

capacitors may vibrate themselves and generate audible sound.

Designing

P.C.board

If capacitor leads are inserted into different pitch holes, it may induce excessive

stress in the capacitor or outer resin to result in cracking, and it may degrade

the quality.

Recommend capacitor layout is as following.

Not recommended

Recommend

―― 14 ――

No.

Process

Lead wire

insertion

Condition

1) If the leads clinching is too tight, the lead wire tend to be pulled excessively

to cause lead wire breakage or cracking of the coating and quality degradation.

Please adjust the clinching and provide sufficient preventive maintenance.

Recommended capacitor layout is as following.

Not recommended

Recommended

crack

Clinching

2) If capacitor leads are inserted into different pitch holes, it may induce excessive

stress in the capacitor or outer resin to result in cracking, and it may degrade

the quality.

When the lead pitch does not fit with the through hole on the pc board, please adjust

the lead pitch so that the capacitor body would not receive excessive force.

Soldering 5-1. Flux selection

Although highly-activated flux gives better solderability, substances which

increase activity may also degrade the insulation of the capacitors.

To avoid such degradation, it is recommended following.

1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).

Do not use acidic flux is not recommended.

2) Excessive flux must be avoided. Please provide proper amount of flux.

3) When water-soluble flux is used, enough washing is necessary.

5-2. Recommended soldering profile by various methods

Flow soldering

Manual soldering

(Solder iron)

soldering

Preheating

Natural cooling

300

250

200

400

300

200

△T

Preheating

3 sec.(As short as possible)

Over 60 sec.

Within 5 sec.

5-3. Avoiding thermal shock

1) Preheating condition

Soldering

Temp. (℃)

ΔT≦150

ΔT≦190

Wave soldering

Manual soldering

―― 15 ――

No.

Process

Condition

Soldering

2) Cooling condition

Natural cooling using air is recommended. If the chips are dipped into a solvent

for cleaning, the temperature difference(ΔT) must be less than 100℃.

5-4. Amount of solder

In sufficient solder may detach the capacitor from the P.C.board.

See bellow for example of solder amount.

Adequate

Low robustness may cause

Insufficient

solder

contact failure or

capacitor comes off the

P.C.board.

5-5. Solder repair by solder iron

Tip temperature of solder iron varies by its type, P.C.board material and solder

land size. Higher the tip temperature , quick the operation is, but the heat

shock may crack the capacitor. Following condition is recommended.

( Recommended solder iron condition )

Shape (mm)

Temp. (℃)

350 MAX.

Wattage (W)

Time (sec.)

3 MAX.

20 MAX.

φ3.0 MAX.

Cleaning

1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles

may stick to capacitor surface to deteriorate especially the insulation

resistance.

2) If cleaning condition is not suitable, it may damage the capacitor.

2)-1. Insufficient washing

(1) Terminal electrodes may corrode by Halogen in the flux.

(2) Halogen in the flux may adhere on the surface of capacitor, and lower the

insulation resistance.

(3) Water soluble flux has higher tendency to have above mentioned problems (1)

and (2).

2)-2. Excessive washing

(1) Excessive washing way damage the coating material of coated capacitor and

deteriorate it.

(2) When ultrasonic cleaning is used, excessively high ultrasonic energy output

can affect the adhesion between the ceramic dielectric and the terminal

electrodes.

To avoid this, following is the recommended condition.

Power : 20W/ max.

Frequency : 40kHz max.

Washing time : 5 minutes max.

2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and

it may bring the same result as insufficient cleaning.

―― 16 ――

No.

Process

Condition

Coating and

molding of the

P.C.board

1) When the P.C.board is coated, please verify the quality influence on the

product.

2) Please verify carefully that there is no harmful decomposing or reaction

gas emission during curing which may damage the capacitor.

3) Please verify the curing temperature.

Lead wire bending During lead wire bending process, mechanical stress often concentrates in one

part of capacitor body and it may damage the ceramic and the coating.

Refer to following for bending the lead wire.

fixture

When bending the lead wire, hold the wire closer to the capacitor with a fixture

so that the lead bending would not affect the capacitor body.

Handling of loose If dropped the capacitor may crack. Once dropped do not use it. Especially, the

capacitor large case sized capacitor is tendency to have cracks easily, so please handle

with care.

crack

10 Capacitance

aging

The capacitors (Class 2) have aging in the capacitance. They may not be used

in precision time constant circuit. In case of the time constant circuit, the

evaluation should be done well.

―― 17 ――

No.

Process

Condition

11 Estimated life The estimated life and the estimated failure rate depend on the temperature and the

and estimated voltage. This can be calculated by the equation described in JEITA RCR-2335B Annex

failure rate

F(Informative) Calculation of the estimated lifetime and the estimated failure rate

of capacitors (Temperature acceleration : 3rd powered low, Voltage acceleration : 10degC law)

The failure rate can be decreased by reducing the temperature and the voltage but

they will not be guaranteed.

12 Others

The products listed on this specification sheet are intended for use in general

electronic equipment (AV equipment, telecommunications equipment, home appliances,

amusement equipment, computer equipment, personal equipment, office equipment,

measurement equipment, industrial robots) under a normal operation and use

condition.



Caution

The products are not designed or warranted to meet the requirements of the

applications listed below, whose performance and/or quality require a more stringent

level of safety or reliability, or whose failure, malfunction or trouble could cause

serious damage to society, person or property. Please understand that we are not

responsible for any damage or liability caused by use of the products in any of

the applications below or for any other use exceeding the range or conditions set

forth in this specification sheet.

Aerospace/Aviation equipment. Transportation equipment (cars, electric trains,

ships, etc.) Medical equipment. Power-generation control equipment. Atomic

energy-related equipment. Seabed equipment. Transportation control equipment.

Public information-processing equipment. Military equipment. Electric heating

apparatus, burning equipment. Disaster prevention/crime prevention equipment.

Safety equipment. Other applications that are not considered general-purpose

applications.

When using this product in general-purpose applications, you are kindly requested

to take into consideration securing protection circuit/equipment or providing backup

circuits, etc., to ensure

higher safety.

―― 18 ――

TAPE PACKAGING SPECIFICATION

―― 19 ――

1. CONSTRUCTION AND DIMENSION OF TAPING

Dimensions of FK1* type shall be according to Appendix 2.

Dimensions of FK2* type shall be according to Appendix 3.

2. QUANTITY

Type

Parts quantity/box (pcs.)

2,000

FK18, FK28

FK14, FK24

FK16, FK26

FK11, FK20

FK22

1,500

3. PERFORMANCE SPECIFICATIONS

3-1. The missing of components shall be within consecutive 3pcs.

3-2. Empty part for min 3pcs shall be provided at the beginning and the end of taping.

3-3. Shipping label must be attached at the side of carton.

3-4. When pull the carrier tape for left side with keeping the head of capacitors to

the direction of the above figure, adhesive tape shall be upper side.

3-5. Folded tape shall contain 25pcs. of components.

―― 20 ――

Appendix 2

Taping dimensions

（ＦＫ１８，ＦＫ１４，ＦＫ１６，ＦＫ１１）

Δh

φd

φD

（Unit：mm）

Tolerance

Symbol

Ｐ

Dimensions

１２．７

５．１

±１．０

±０．３

Ｐ０ ※1

Ｐ１

Ｐ２

Ｗ０

Ｗ１

Ｗ２ ※2

Ｗ３

Ｈ０



±０．７

６．３５

１２．０

９．０

±１．３

±１．０

±０．５

３．０

３．０ and under

＋１．０，－０．５

±０．５

１８．０

１６．０

１．０

１．０ and under

±０．２

ｔ

０．６

Ｌ０

Ｆ

１１．０

２．５

１１．０ and under

＋０．５，－０．２

＋０．１，－０．０３

±０．２

φｄ

φＤ

Δh

φ０．５

φ４．０

―――

±２

※1 Accumulated pitch tolerance shall be ±2mm for 20 pitches.

※2 Adhesive tape shall not stick out from carrier tape.

―― 21 ――

Appendix 3

Taping dimensions

（ＦＫ２８，ＦＫ２４，ＦＫ２６，ＦＫ２０，ＦＫ２２）

Δh

φd

φD

（Unit：mm）

Tolerance

Symbol

Ｐ

Dimensions

１２．７

３．８５

６．３５

１２．０

９．０

±１．０

±０．３

Ｐ０ ※1

Ｐ１

Ｐ２

Ｗ０

Ｗ１

Ｗ２ ※2

Ｗ３

Ｈ０



±０．７

±１．３

±１．０

±０．５

３．０

３．０ and under

＋１．０，－０．５

±０．５

１８．０

１６．０

１．０

１．０ and under

±０．２

ｔ

０．６

Ｌ０

Ｆ

１１．０

５．０

１１．０ and under

＋０．８，－０．２

＋０．１，－０．０３

±０．２

φｄ

φＤ

Δh

φ０．５

φ４．０

―――

±２

※1 Accumulated pitch tolerance shall be ±2mm for 20 pitches.

※2 Adhesive tape shall not stick out from carrier tape.

―― 22 ――

FK11X5R1A226MN006 [TDK]

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