FLF3215T-2R2M [TDK]
General Purpose Inductor, 2.2uH, 20%, 1 Element, SMD, 1210, ROHS COMPLIANT;
| 型号： | FLF3215T-2R2M |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | General Purpose Inductor, 2.2uH, 20%, 1 Element, SMD, 1210, ROHS COMPLIANT 测试 功率感应器 电感器 |
| 文件： | 总2页 (文件大小：51K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
(1/2)
Conformity to RoHS Directive
SMD Inductors(Coils)
For Power Line(Wound, Magnetic Shielded)
FLF Series FLF3215
FEATURES
IRON SOLDERING
• Resin mold structure: stress and shock resistant.
• A magnetic shield structure using plastic magnet material for the
exterior.
Tip temperature
Heating time
Soldering rod specifications
300 to 350°C
3 seconds/soldering
Output: 30W Tip diameter: 1mm
• Based on the above conditions, use a maximum product temperature of
260°C and a maximum accumulated heating time of 10 seconds as a
guideline.
• The product uses metal terminals, which realize excellent
connection reliability.
• Please contact us for details.
• From 0.47µH to 100µH, all of the products are available in the
E-3 series.
PRODUCT IDENTIFICATION
• It is lead-free compatible.
FLF 3215 T- 1R0
N
(1) (2) (3) (4) (5)
APPLICATIONS
• HDDs, wirelessLAN modules, digital cameras, flat-TVs
(1) Series name
SPECIFICATIONS
(2) Dimensions
3215
–40 to +125°C
Operating temperature range
3.2× 2.5× 1.55mm (L× W× T)
[Including self-temperature rise]
Storage temperature range
–40 to +125°C
(3) Packaging style
T
Taping (reel)
RECOMMENDED SOLDERING CONDITIONS
REFLOW SOLDERING
(4) Inductance value
10s max.
1R0
100
101
1µH
10µH
100µH
255˚C
Natural
cooling
230˚C
180˚C
150˚C
(5) Inductance tolerance
M
N
20%
30%
Pre-heating
90 to 120s
40s max.
PACKAGING STYLE AND QUANTITIES
( )
Time s
Packaging style
Taping
Quantity
2000 pieces/reel
FLOW SOLDERING
10s max.
260˚C max.
Natural
cooling
170˚C
150˚C
Pre-heating
60 to 120s
( )
Time s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-01 / 20090818 / e531_flf3215.
(2/2)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
Inductor
3.2 0.2
2.5 0.2
Solder land pattern
1.9 0.1
1.2
2
1.2
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Rated current∗(mA)max.
Based on
inductance change
2800
2000
1400
1000
700
Test
Self-resonant DC
resistance
Inductance
(µH)
Inductance
tolerance
Q
ref.
frequency L,Qfrequency
(MHz)
Part No.
Based on
temperature rise
2800
2350
1800
1360
900
600
430
(MHz)min.
(Ω) 20%
0.021
0.03
0.05
0.09
0.20
0.45
0.90
0.47
1
30%
30%
20%
20%
20%
20%
20%
20%
30
30
20
20
25
30
35
40
1
1
1
1
1
1
1
1
200
100
60
40
25
14
9
FLF3215T-R47N
FLF3215T-1R0N
FLF3215T-2R2M
FLF3215T-4R7M
FLF3215T-100M
FLF3215T-220M
FLF3215T-470M
FLF3215T-101M
2.2
4.7
10
22
47
100
∗
450
280
200
6
2.00
280
Rated current:The rated current is the smaller of the values given based on the rate of inductance change (30% decrease from the initial value) or the
temperature rise (temperature rise of 40°C caused by the heat generated by the product itself).
• Test equipment L, Q: Agilent 4294A PRECISION IMPEDANCE ANALYZER
SRF: HP8753C NETWORK ANALYZER or equivalent
Rdc: ADEX AX-114N DIGITAL OHM METER or equivalent
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
1000
100000
100μH
47μH
22μH
10000
10μH
100
100μH
1000
47μH
22μH
10
100
10μH
4.7μH
2.2μH
4.7μH
1μH
10
2.2μH
0.47μH
1
1μH
1
0.47μH
0.1
0.1
10
100
1000
10000
0.1
1
10
100
(
)
(
)
DC current mA
Frequency MHz
• All specifications are subject to change without notice.
001-01 / 20090818 / e531_flf3215.
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