GYPRO2300LD [TDK]
陀螺仪;
| 型号： | GYPRO2300LD |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 陀螺仪 CD |
| 文件： | 总22页 (文件大小：1534K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
Features
•
•
•
•
•
•
•
Digital angular rate sensor with SPI interface
Angular rate measurement around Z-axis (yaw)
±300°/sec input range
Ultra low noise
Excellent bias instability
General Description
GYPRO® product line is an established family of Micro-Electro-
Mechanical Systems (MEMS) angular rate sensor specifically
designed for demanding applications.
24 bit angular rate output
Embedded temperature sensor for on-chip or
external temperature compensation
Built-in Self-Test
•
•
•
•
•
•
5V single supply voltage
The MEMS transducer is manufactured using Tronics
proprietary vacuum wafer-level packaging technology based on
micro-machined thick single crystal silicon.
Low operating current consumption: 25mA
CLCC 30 package: 19.6 mm x 11.5 mm x 2.9 mm
Weight : 2 grams
The integrated circuit (IC) provides a stable primary anti-
phase vibration of the ‘drive’ proof masses, thanks to
electrostatic comb drives. When the sensor is subjected to a
rotation, the Coriolis force acts on the ‘sense’ proof masses and
REACH and RoHS compatible
forces them into
a secondary anti-phase movement
perpendicular to the direction of drive vibration, which is itself
counter-balanced by electrostatic forces. The sense closed loop
operates as an electromechanical ΣΔ modulator providing a
digital output. This output is finally demodulated using the
drive reference signal.
Applications
Precision instrumentation
Platform stabilization and control
Unmanned aerial vehicles
•
•
•
The sensor is factory calibrated and compensated for
temperature effects to provide high-accuracy digital output
over a broad temperature range.
Raw data output can be also chosen to enable customer-made
compensations.
GYPRO® Product references
Part Number
G2300
G2310
G3300
Improved vibration
tolerance & ultra-low
delay configuration
1ms
G4300
Improved bias thermal
stability & reduced
dimensions
1ms
Low delay
configuration
Description
Standard configuration
Latency
Vibration range
Bandwidth
40ms
4g rms
100Hz
2ms
4g rms
>200Hz
8g rms
>200Hz
8g rms
>200Hz
Datarate
200Hz
1700Hz
1800Hz
1800Hz
Angular Random Walk
Size (L x l x h)
Package
0.14°/√hr
19 x 11 x 3mm
CLCC 30
0.14°/√hr
19 x 11 x 3mm
CLCC 30
0.15°/√hr
19 x 11 x 4mm
CLCC 30
0.10°/√hr
12 x 12 x 6mm
28 pins J-Lead
Disclaimer
Information furnished by Tronics is believed to be accurate and reliable. However, no responsibility is assumed by Tronics for its
use, nor for any infringements of patents or other rights of third parties that may result from its use.
Specification subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Tronics. Trademarks and registered
trademarks are the property of their respective owners.
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
Contents
Features ............................................................................................................................................... 1
Applications.......................................................................................................................................... 1
General Description .............................................................................................................................. 1
GYPRO® Product references.................................................................................................................. 1
Disclaimer............................................................................................................................................. 1
Block diagram ............................................................................................................................................................................... 3
Overall Dimensions....................................................................................................................................................................... 3
1.
2.
3.
4.
Specifications ............................................................................................................................... 4
Maximum Ratings ........................................................................................................................ 6
Typical performances ................................................................................................................... 7
Interface ...................................................................................................................................... 9
4.1. Pinout, sensitive axis identification................................................................................................................................... 9
4.2. Application circuit.............................................................................................................................................................. 9
4.3. Input/Output Pin Definitions........................................................................................................................................... 10
5.
6.
Soldering Recommendations ...................................................................................................... 11
Digital SPI interface .................................................................................................................... 13
6.1. Electrical and Timing Characteristics............................................................................................................................... 13
6.2. SPI frames description..................................................................................................................................................... 14
6.3. Angular rate readings ...................................................................................................................................................... 14
6.4. Temperature readings..................................................................................................................................................... 14
6.5. Advanced use of SPI registers.......................................................................................................................................... 15
7.
Angular rate calibration procedure ............................................................................................. 17
7.1. Algorithm overview ......................................................................................................................................................... 17
7.2. Programming of the new coefficients ............................................................................................................................. 18
7.3. Switch to uncompensated data output........................................................................................................................... 18
8.
9.
Temperature Sensor Calibration Procedure ................................................................................ 19
8.1. Temperature sensor calibration model........................................................................................................................... 19
8.2. Recommended Procedure............................................................................................................................................... 19
Device Identification/Ordering information ................................................................................ 20
9.1. Device identification........................................................................................................................................................ 20
9.2. Ordering information ...................................................................................................................................................... 20
10. Internal construction and Theory of Operation ........................................................................... 21
11. Available Tools and Resources.................................................................................................... 22
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
Block diagram
Overall Dimensions
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Specification subject to change without notice.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
1. Specifications
Unless specified in brackets, GYPRO2300LD characteristics are the same as GYPRO2300.
Parameter
Unit
Typ.
Max
Notes
Measurement Ranges
Input range*
°/s
°C
±300
±350
Electronic clamping is applied and sensors will saturate before
±500°/s.
Temperature range *
Bias
-40 to +85
Bias instability
°/h
°/h
0.8
30
Lowest point of Allan variance curve at room temperature.
Bias in-run (short term)
stability
Standard deviation of the 1 second filtered output over 1 hour
at room temperature, after 30 min of stabilization.
Residual Bias Temperature
Error, calibrated *
°/s
0.05
0.2
Peak to peak deviation of the bias over the specified
temperature range after warm-up. Factory calibration is
performed in test socket following one stabilization thermal
cycle and while sensor is powered up. As printed circuit board
reflow soldering may cause shifts in bias temperature variations,
it may be necessary to do an on-board calibration after
soldering, depending on applications requirements.
Bias run to run repeatability
°/h
10
30
Standard deviation of 7 bias measurements at 30°C that occurs
between seven runs of operation with 30 minutes power off
between each run.
Vibration rectification
coefficient
°/h/g²
Bias rectification under vibration, overall level 4g rms, according
to Figure 11.
Scale Factor (tested on ±300°/s range)
Scale Factor *
LSB/°/s
%
10 000
0.2
Nominal scale factor.
Residual Scale factor
Temperature Error,
calibrated *
0.75
Peak to peak deviation of the scale factor over the specified
temperature range.
Scale Factor run to run
repeatability
ppm
ppm
100
70
Standard deviation of 7 scale factor measurements at 30°C that
occurs between seven runs of operation with 30 minutes power
off between each run.
Scale factor non linearity*
500
Maximum deviation of the output from the expected value using
a best fit straight line, at room temperature.
Noise
RMS Noise [1-100Hz] *
°/s
0.02
0.14
0.05
RMS noise level in the band [1-100Hz], obtained by integrating
the power spectral density of the sensor output between 1 and
100Hz at zero rate and room temperature.
Angular random walk
Frequency response
Bandwidth
°/√h
-1/2 slope of Allan variance curve at room temperature.
Hz
Hz
100
(>200)
Defined as the frequency for which attenuation is equal to -3dB.
Drive resonant frequency of the sensor, at room temperature.
Resonant Frequency
3300 to 3950
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
Parameter
Unit
Typ.
Max
Notes
Data Rate
Hz
190 to 240
Refresh rate of the output data at room temperature.
(1560 to 1890)
Latency
ms
s
40
(2)
Group delay of the filtering chain.
Start-up Time
0.8
Time interval between application of power on and the
availability of an output signal (at least 90% of the input rate, at
room temperature.
Linear acceleration
G sensitivity
°/h/g
ms
18
10
Mean value on all axis of output variations under 1g.
Recovery time
Time interval between an impact (half sine 50 g, 6 ms) and the
presence of a usable output of the sensor.
Axis alignment
Rate Axis misalignment
mrad
16
Misalignment between the sensitive axis and the normal to the
package bottom plane, by design.
Environmental
Storage temperature range
Humidity at 45°C
°C
%
--
-55 to +100
<98
1
Moisture Sensitivity Level
(MSL)
Unlimited floor life out of the bag (hermetic package).
Half sine.
Shock (operating)
Shock (survival)
g | ms
g | ms
grms
50 | 6
2000 | 0.3
Vibrations (operating)
Vibrations (survival)
Electrical
4
See Figure 11
grms
20
Power Supply Voltage
V
4.75 to 5.25
25
Current consumption
(normal mode)
mA
Current consumption
(power down mode)
µA
1
<5
Power down mode is activated by switching EN pin to GND.
Power supply rejection ratio
Temperature sensor
°/h/V
40
Scale Factor (raw data)
LSB/°C
LSB
20
Temperature sensor is not factory-calibrated.
Temperature sensor is not factory-calibrated.
25°C typical output (raw
data)
2000
Refresh rate
Hz
6
Table 1 Specifications
* 100% tested in production.
** Unless otherwise specified, max values are ±3 sigma variation limits from validation test population.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
2. Maximum Ratings
Stresses at or exceeding the maximum ratings listed below may cause permanent damage to the device, or affect its reliability.
Exposure to maximum ratings conditions for extended periods may also affect device reliability.
Functional operation is not guaranteed once stresses exceeding the maximum ratings have been applied.
Parameter
Unit
V
Min
Max
Supply Voltage
-0.5
+7
±2
Electrostatic Discharge (ESD) protection, any pin, Human Body Model
Storage temperature range
Shock survival
kV
°C
--
-55
+100
2000
20
g
--
--
Vibrations survival, 20-2000Hz
Ultrasonic cleaning
grms
Not allowed
Table 2 Maximum ratings
Caution!
The product may be damaged by ESD, which can cause performance degradation or device failure! We
recommend handling the device only on a static safe work station. Precaution for the storage should also
be taken.
The sensor MUST be powered-on before any SPI operation, as shown in Figure 1 below. Having the SPI
pads, or EN at a high level while VDD is at a low level could damage the sensor, due to ESD protection
diodes and buffers.
Figure 1 Recommended voltage sequence
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
3. Typical performances
Figure 2 Distribution of bias over temperature
Figure 5 Bias variation over temperature (5 samples)
Figure 3 Distribution of scale factor over temperature
Figure 6 Scale factor variation over temperature (5 samples)
Figure 4 Distribution of scale factor non linearity (RT)
Figure 7 Scale factor non linearity over temperature (5 samples)
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
Figure 8 Distribution of RMS Noise (RT)
Figure 12 Typical Noise density (RT)
Figure 13 Start-Up Time variation over temperature
Figure 14 Allan variance (RT)
Figure 9 Distribution of Start-Up time (RT)
Figure 10 Typical Bandwidth
Figure 11 Operating vibration profile
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
4.2. Application circuit
4. Interface
4.1. Pinout, sensitive axis identification
Figure 17: Recommended Application Schematic (top view)
Notes:
•
All capacitances of Figure 17 should be placed as
close as possible to their corresponding pins, except
the 100nF capacitance between VDD and GND,
which should be as close as possible to the board’s
supply input.
•
•
The 100µF filtering capacitance between GREF and
GND should have low Equivalent Series Resistance
(ESR < 1Ω) and low leakage current (< 6µA). A
tantalum capacitor is recommended.
Figure 15: How to locate Pin 1
5.6µF and 330nF filtering capacitance between PLLF
and GND should have a low leakage current (<1µA).
Figure 16: GYPRO2300 Sensors Pinout (bottom view)
Figure 18: Recommended Pad Layout in mm (top view)
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO2300 Datasheet
4.3. Input/Output Pin Definitions
Pin name
Pin number
Pin type
Pin
direction
Pin levels
Function
1, 2, 3, 9, 26,
28, 29, 30
8, 10, 25
GND
VDD
Supply
Supply
n/a
n/a
0V
Power Ground
+5V
Power Supply
External decoupling pad. MUST be
connected to the board’s VSS through
a 100µF external capacitor, in order to
ensure low noise.
GREF
4
Analog
n/a
4.4V
VDD with pull-
up of 100kΩ
EN
6
Digital
Analog
Input
Enable command. Active high.
External filtering pad. MUST be
PLLF
11
Output
0.8V
connected to
a
filtering stage,
described in Figure 17.
Self-test status. Logic “1” when the
sensor is OK.
Reset. Reloads the internal calibration
data. Active low
Slave Selection signal. Active low
SPI clock signal
Master Output Slave Input signal
Master Input Slave Output signal
Internal clock
ST
15
16
Digital
Digital
Output
Input
VDD
VDD with pull-
up of 100kΩ
VDD
VDD
VDD
VDD
VDD
RSTB
SSB
SCLK
MOSI
MISO
CLCK400K
20
21
22
23
27
Digital
Digital
Digital
Digital
Digital
Input
Input
Input
Output
Output
Do Not electrically Connect.
These pins provide additional
mechanical fixing to the board and
should be soldered to an unconnected
pad.
5, 7, 12, 13,
14, 17, 18, 19, --
24
DNC
--
--
Table 3: Pin Functions
Note: The digital pads maximum ratings are GND-0.3V and VDD+0.3V.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO2300 Datasheet
5. Recommendations
5.1. Soldering
Please note that the reflow profile to be used does not depend only on the sensor. The whole populated board characteristics
shall be taken into account.
MEMS components are sensitive to mechanical stress coming from the Printed Circuit Board (PCB) during the soldering reflow.
This stress is caused by the mismatch between the Coefficient of Thermal Expansion (CTE) of the ceramic package and the PCB
and can affect the Bias temperature variations. In order to achieve the best performance, it is recommended to do an on-board
calibration after the soldering of the sensor.
For a better reliability of the soldering, Tronics recommends using Copper-Invar-Copper or ceramic boards. These types of boards
have a coefficient of thermal expansion (CTE) close to the CTE of GYPRO2300 package (6.8 ppm/°C).
Figure 19: Reflow Profile, according to IPC/JEDEC J-STD-020D.1
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO2300 Datasheet
Profile Feature
Eutectic Assembly
Time maintained above
Temperature (TL)
183°C
Time (tL)
60-150 sec
240°C (+/-5°C)
10-30 sec
Peak Temperature (Tp)
Time within 5°C of Actual Peak Temperature (tp)
Table 4: Reflow Profile Details, according to IPC/JEDEC J-STD-020D.1
5.2. Multi-sensor integration
Mechanical coupling between drive frequencies of several sensors can affect performance at system level, for example within
Inertial Measurement Units. Customer has to take care of such coupling during system design and validation.
5.3. Traceability
Label integrity has been validated with Vigon® and IPA. For other chemical treatment, the label integrity is not guaranteed.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
6. Digital SPI interface
6.1. Electrical and Timing Characteristics
The device acts as a slave supporting only SPI “mode 0” (clock polarity CPOL=0, clock phase CPHA=0).
Figure 20: SPI timing diagram
Symbol
Parameter
Condition
Unit
Min
Typ
Max
Electrical characteristics
VIL
Low level input voltage
VDD
VDD
V
0
0.1
1
VIH
High level input voltage
Low level output voltage
High level output voltage
Pull-up resistor
0.8
VOL
ioL=0mA (Capacitive Load)
GND
VDD
100
-
VOH
Rpull_up
ioH=0mA (Capacitive Load)
V
Internal pull-up resistance to VDD
Internal pull-down resistance to GND
kΩ
kΩ
Rpull_down
Pull-down resistor
Timing parameters
Fspi
SPI clock input frequency
SCLK low pulse
Maximal load 25pF on MOSI or MISO
MHz
ns
0.2
8
T_low_sclk
T_high_sclk
T_setup_mosi
T_hold_mosi
T_delay_miso
T_setup_ssb
T_hold_ssb
62.5
62.5
10
SCLK high pulse
MOSI setup time
MOSI hold time
MISO output delay
SSB setup time
ns
ns
ns
5
Load 25pF
ns
40
Tsclk
1
1
Tsclk
SSB hold time
Table 5: SPI timing parameters
The MISO pin is kept in high impedance when the SSB level is high, which allows sharing the SPI bus with other components.
IMPORTANT NOTE: It is forbidden to keep SPI pads at a high level while VDD is at 0V due to ESD protection diodes and buffers.
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GYPRO2300 Datasheet
24-bit value by a factor 10 000 results in the angular
rate in °/s, as shown in Table 7.
6.2. SPI frames description
The SPI frames used for the communication through the SPI
Register are composed of an instruction followed by
arguments. The SPI instruction is composed of 1 byte, and the
arguments are composed of 2, 4 or 8 bytes, depending on the
cases, as can be seen in Table 6 below.
-350.0000 °/s
…
-300.0000 °/s
1100 1010 1001 1000 0010 0000
1101 0010 0011 1001 0100 0000
…
-0.0002 °/s
-0.0001 °/s
0.0000 °/s
+0.0001 °/s
+0.0002 °/s
…
1111 1111 1111 1111 1111 1110
1111 1111 1111 1111 1111 1111
0000 0000 0000 0000 0000 0000
0000 0000 0000 0000 0000 0001
0000 0000 0000 0000 0000 0010
Figure 21: SPI Message Structure
+300.0000 °/s
…
+350.0000 °/s
0010 1101 1100 0110 1100 0000
Instruction Argument
Meaning
0011 0101 0110 0111 1110 0000
Table 7: Conversion table for calibrated angular rate output
0x50
0x54
0x58
0x78
0x7C
0x00000000 (n=4) Read Angular Rate
0x0000 (n=2)
Read Temperature
6.3.2.
Data Ready (DRY) bit
0x00000000 (n=4)
Advanced commands.
The Data Ready bit is a flag which is raised when a new angular
rate data is available. The flag stays raised until the new data is
read.
0xXXXXXXXX (n=8) See Section 6.5 for more
details.
0xXXXX (n=2)
Table 6: Authorized SPI commands
6.3.3.
Self-Test (ST) bit
The ST bit raises a flag (1 logic) at the same frequency as the
angular rate output data rate indicating whether if the sensor
is properly operating (i.e. whether the drive loop control
provides stable drive oscillations amplitude).
6.3. Angular rate readings
From the 32-bits (4 bytes) frame obtained after the “Read
Angular Rate” instruction, the 24-bits word of angular rate data
(RATE) must be extracted as shown below in Figure 22.
The self-test procedure is running in parallel to the main
functions of the sensor.
DRY and ST are respectively the “data ready” and “self-test”
bits.
The ST data is also available on the pin 15. This pin is set to
VDD when the sensor is working properly.
6.4. Temperature readings
The temperature data is an unsigned integer, 12-bits word
(TEMP). It must be extracted from the 2 bytes of read data, as
shown below in Figure 23.
Figure 22: Angular rate reading frames and data organization
6.3.1.
Angular rate (RATE) output
The 24-bit gyro output is coded in two’s complement
(Table 7).
Figure 23: Temperature reading frames and data organization
•
If the temperature compensation is not enabled
(GOUT_SEL=1), then the user should perform scale
factor measurements.
If the temperature compensation of the angular
rate output is enabled (default case), dividing the
By default the temperature sensor is not factory-calibrated
(TOUTSEL=0).
•
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GYPRO2300 Datasheet
6.5. Advanced use of SPI registers
SPI registers can also be used to access the System register or the MTP (Multi-Time-Programmable memory).
6.5.1.
R/W access to the System Registers
IMPORTANT NOTE: Modifications to the system registers are reversible. Modified registers will not be restored after a RESET.
There is no limitation to the number of times the system registers can be modified.
Figure 24: Sequence of instructions to READ address 0xMM of the system registers
Figure 25: Sequence of instructions to WRITE ‘0xXXXXXXXX’ to address ‘0xMM’ of the system registers
6.5.2.
R/W access to the MTP
IMPORTANT NOTE: Modifications to the MTP are non-reversible. Modified parameters will be restored, even after a RESET, and
previous values of the MTP cannot be accessed anymore. The maximum number of times the MTP can be written depends on the
address:
•
7 times for the angular rate calibration coefficients (see Section 7 for more details)
•
Only 1 time for all the other coefficients, including the temperature sensor calibration coefficients.
Figure 26 : Sequence of instructions to READ address 0xMM of the MTP
Figure 27: Sequence of instructions to WRITE data ‘0xXXXXXXXX’ to address ‘0xMM’ of the MTP
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GYPRO2300 Datasheet
6.5.3.
Useful Sensor Parameters
The instructions given in Sections 6.5.1 and 6.5.2 can be used to read and/or to modify the sensor’s useful parameters given in
Table 8 below.
Parameter
Address M
(System
Bits
Encoding
Meaning
Register &
MTP)
Sensor Identification
UID 0x00
[30:1]
Tronics reserved Sensor ‘Unique Identification’ number
Temperature output compensation
TOUT_SEL
0x09
0x04
0x04
2*
0 **
1
0x000 **
See section 8
0x800 **
See section 8
Disable the calibrated temperature output
Enable the calibrated temperature output
Offset calibration of temperature sensor
O
G
[27:16] *
[13:2] *
Gain calibration of temperature sensor
Angular rate output compensation
GOUT_SEL
0x02
27 *
0**
1
Enable the calibrated angular rate output
Disable the calibrated angular rate output
Scale Factor 2nd order coefficient (calibrated angular rate)
Bias 2nd order coefficient (calibrated angular rate)
Bias 1st order coefficient (calibrated angular rate)
Bias constant coefficient (calibrated angular rate)
Scale Factor 1st order coefficient (calibrated angular rate)
Scale Factor constant coefficient (calibrated angular rate)
Mid-temperature calibration point
Unprogrammed part
Programmed once, 7 slots remaining
Programmed twice, 6 slots remaining
…
SF2
B2
B1
B0
SF1
SF0
TMID
MTPSLOTNB
0x2E
0x2E
0x2F
0x30
0x31
0x32
0x33
0x02
[31:16] *
[15:0] *
[29:0] *
[29:0] *
[29:0] *
[29:0] *
[19:0] *
[15:8] *
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
0b00000000
0b00000001 **
0b00000011
…
0b01111111
0b11111111
Programmed 7 times, 1 slot remaining
Programmed 8 times, no slot remaining
Table 8: Useful parameters information
Notes:
* The other bits at those addresses shall remain unchanged. Please make sure that you write them without modification!
** Default Value
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Specification subject to change without notice.
Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
7. Angular rate calibration procedure
7.1. Algorithm overview
After filtering, the raw angular rate sensor output is temperature compensated based on the on-chip temperature sensor output
and the stored temperature compensation parameters.
7.1.1.
Angular rate output calibration model
7.1.2.
Recommended procedure
The formula below models the link between raw and 1. Set GOUT_SEL to 1 in the System Registers (disable the
compensated angular rate outputs:
calibration)
[ ]
RATEꢁꢂW LSB − 퐁퐈퐀퐒[LSB]
RATECOMP[LSB]
[
]
RATE °/s =
=
2. Place the sensor on a rate table in a thermal chamber and
implement temperature profile according to Figure 281
⁄
⁄
퐒퐅[LSB °/s]
SFꢀetting[LSB °/푠]
where:
3. Perform continuous acquisition of the angular rate output
with the following pattern:
•
•
•
RATE is the angular rate output converted in °/s;
RATECOMP is the calibrated angular rate output;
SFsetting is the constant conversion factor from LSB to
°/s for the calibrated angular rate output. Default
value for this parameter is SFsetting = 10 000;
RATERAW is the raw data angular rate output;
BIAS is a polynomial (2nd degree) temperature-
varying coefficient to model the sensor’s bias
temperature variations;
•
Rest position (0°/s input) to evaluate the BIAS
parameter
•
+ 300°/s input then -300°/s input to evaluate the SF
parameter2
•
•
4. Calculate the coefficients of BIAS and SF polynomials:
2
•
SF is a polynomial (2nd degree) temperature-varying
coefficient to model the sensor’s Scale Factor
temperature variations.
푖
(
)
BIAS = ∑ b푖 TꢁꢂW − TMꢃD
푖ꢄ0
2
푖
(
)
푆퐹 = ∑ sf푖 TꢁꢂW − TMꢃD
푖ꢄ0
where
•
TRAW is the raw output of the temperature sensor
multiplied by 256;
TMID is the mid-value of TRAW;
b0 to b2 are the 3 coefficients of BIAS polynomial;
sf0 to sf2 are the 3 coefficients of SF polynomial.
•
•
•
5. Convert TMID, bi and sfi parameters to their binary values
according to Table 9 below:
Parameter Value (decimal)
Format
SF2
SF1
SF0
B2
B1
B0
sf2 . 255 / SFsetting
sf1 . 246 / SFsetting
sf0 . 227 / SFsetting
b2 . 239
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
unsigned
Figure 28: Recommended Temperature profile for calibration
b1 . 235
b0
TMID
TMID
Table 9: Angular rate calibration parameters
_________________________________________________________________________________________________________
1 Temperature profile can be adapted to be in line with customer applications
2 Rate applied can be adapted to be in line with customer applications
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
9. Program B1 in the MTP
7.2. Programming of the new coefficients
10. Write B0 in the system register
11. Program B0 in the MTP
12. Write TMID in the system register
13. Program TMID
IMPORTANT NOTE: The following steps are non-reversible.
The previous values of the coefficients will not be accessible
anymore. The temperature compensation coefficients can be
re-programmed up to 7 additional times on the IC.
The detailed SPI commands are given in section 6.5. The
detailed information about each coefficient is given in Table 8.
The programming procedure consists in three major steps:
•
•
•
Checking the available MTP slot status
Programming the coefficients
Updating the available MTP slot status
An overview of the procedure is given in Figure 29.
7.2.1.
Checking the MTP slot status
The first step is to check the number of remaining MTP slots
(MTPSLOTNB), in other words, checking how many times the
chip has been programmed before.
The detailed information of MTPSLOTNB register content is
given in Table 8. The sequence of instructions to read the
register is given in Figure 26.
The MTP slot number (MTPSLOTNB) re-programming
iteration is given in the following table:
Iteration
Correspondence
MTP number
Value
Binary
0
1
2
3
4
5
6
7
8
Unprogrammed part
Programmed once
Programmed twice
0
1*
3
00000000
00000001
00000011
00000111
00001111
00011111
00111111
01111111
11111111
7
Figure 29 Procedure to program new calibration parameters
15
31
63
127
255
7.2.3.
Updating MTP slot status
…
This section describes the procedure for programming the
updated status of the MTP slots.
Cannot be further
programmed
Table 10: MTPSLOTNB iterations
If this step is not performed properly, the new compensation
coefficients will not be effective.
1. Read the MTPSLOTNB as described in section 6.5.2.
2. Increment MTPSLOTNB according to Table 10.
3. Write the updated MTPSLOTNB in the system register.
4. Program the updated MTPSLOTNB in the MTP.
5. After a reset, the new coefficients will be available.
* Default value
7.2.2.
Programming the coefficients
This step describes the procedure for programming the
calculated coefficients (temperature compensation of angular
rate output). The programming procedure is:
7.3. Switch to uncompensated data output
1. Write SF2 in the system register
2. Write B2 in the system register
3. Program SF2 & B2 in the MTP
4. Write SF1 in the system register
5. Program SF1 in the MTP
To optimize the thermal compensation of the angular rate
output, it is possible to disable the on-chip compensation and
use the uncompensated (raw) output to perform an external
thermal compensation.
6. Write SF0 in the system register
7. Program SF0 in the MTP
8. Write B1 in the system register
To switch the output to uncompensated data, the procedure
is described on section 6.5, by modifying the GOUT register
described on Table 8.
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
Specification subject to change without notice.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
8. Temperature Sensor Calibration Procedure
The temperature output of GYPRO2300 sensors is not factory-calibrated, since only the relative temperature output is needed
to perform temperature compensation of the angular rate output. However, it is possible to perform a first-order polynomial
calibration of the temperature sensor, in order to output the absolute temperature information.
This section shows how to get and store temperature calibration parameters for the temperature output.
3. Calculate the GAIN and OFFSET coefficients according to
8.1. Temperature sensor calibration model
formula above.
The formula below models the link between raw and calib-
rated temperature output:
T1퐴퐵ꢇ[°ꢅ] − Tꢈ퐴퐵ꢇ[°ꢅ]
GAIN = GAINꢆ푒푡푡푖푛푔
.
[
]
T1푅퐴푊 LSB − 푇ꢈ푅퐴푊[LSB]
[ ]
퐆퐀퐈퐍 . TꢁꢂW LSB + 퐎퐅퐅퐒퐄퐓[LSB]
TCOMP[LSB]
[
]
T °ꢅ =
=
⁄
⁄
GAINꢀetting[LSB °ꢅ]
GAINꢀetting[LSB °ꢅ]
[
]
[
]
ꢉFFSET = GAINꢆ푒푡푡푖푛푔 . T1퐴퐵ꢇ °ꢅ − GAIN . T1푅퐴푊 LSB
where:
where:
•
•
•
T is the output temperature converted in °C;
TCOMP is the calibrated temperature output;
GAINsetting is the constant conversion factor from LSB
to °C for the calibrated temperature output. This gain
is set to 20LSB/°C to provide an output resolution of
0,1°C;
•
•
•
•
T1ABS is the absolute temperature of T1 in °C;
T2ABS is the absolute temperature of T2 in °C;
T1RAW is the raw output temperature of T1 in LSB;
T2RAW is the raw output temperature of T2 in LSB;
4. Convert GAIN and OFFSET to their binary values according
to Table 11 below:
•
•
•
TRAW is the raw data temperature output;
OFFSET is a constant coefficient to tune the offset;
GAIN is a constant coefficient to tune gain.
Parameter Value (decimal)
G
O
Format
Unsigned
Unsigned
GAIN . 209
OFFSET
The OFFSET and GAIN parameters will be computed and
written in the ASIC as per the following calibration procedure.
Table 11: Temperature calibration parameters
5. [ Optional step: Write GAIN and OFFSET into the System
Registers and repeat step 2. to check the accuracy of the
new calibration. ]
8.2. Recommended Procedure
1. Check that TOUT_SEL = 0. If not, set it to 0 in the System
Registers.
6. Write GAIN and OFFSET into the MTP according to
instructions of Section 6.5.2. Meanwhile, set TOUT_SEL to
1 during this step, so that the new calibration parameters
are effective after a RESET.
2. Measure the temperature output with at least
temperature points T1 and T2.
2
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
9. Device Identification / Ordering information
9.1. Device identification
GYPRO2300 tracking information is accessible on the label, as shown in the next figure.
Figure 30: GYPRO2300 label.
9.2. Ordering information
Figure 31 Ordering information
* For second 2nd generation only
** Custom version or specific requirement can be address upon request.
Product
GYPRO2300
Ordering code
3-G2300-A0
GYPRO2300LD
GYPRO3300
GYPRO2300-EVB2
GYPRO2300LD-EVB2
GYPRO3300-EVB2
3-G2310-A0
3-G3300-A0
4-G2300-A0
4-G2310-A0
4-G3300-A0
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
10.Internal construction and Theory of Operation
2)
Simplicity of hardware implementation. Oversampling
concept allows significant design relaxation of the analog
detection chain signal resolution. Additionally the voltage
reference used for actuation force feedback is also of simple
implementation as it is a 1-bit D/A converter, thus simplifying
its design.
3)
Linearization of the electrostatic forces thanks to the
Sigma-delta principle (through force averaging) furthermore
reduces non-linearity overall and more importantly its even-
order terms, which result in rectification error.
Figure 32 : Inner view of the package, showing the MEMS and IC
4)
Sigma-Delta signal output is inherently a digital signal,
GYPRO series is using the dominant architecture for high
performance MEMS gyro, namely the “Tunning fork or dual
mass” design.
thus suppressing the need for costly high resolution A/D
converter.
The digital part implements digital drive and sense loops,
demodulates, decimates and processes the gyro output based
on the on-chip temperature sensor output. The system
controller manages the interface between the SPI registers, the
system register and the non-volatile memory (OTP). The non-
volatile memory provides the gyro settings, in particular the
coefficients for angular rate sensor temperature
compensation. On power up, the gyro settings are transferred
from the OTP to the system registers and output data are
available in the SPI registers. The angular rate sensor output
and the temperature sensor output are available in the SPI
registers. The SPI registers are available through the SPI
interface (SSB, SCLK, MOSI, MISO). The self-test is available on
the external pins ST.
In details, each sensor consists in a MEMS transducer and an
integrated circuit (IC) packaged in a 30-pins Ceramic Leadless
Chip Carrier Package.
The sensing element (MEMS die), which is located on the left
part of the Figure 32, is manufactured using Tronics’ wafer-
level packaging technology based on micro-machined thick
single crystal silicon. The MEMS consists of two coupled sub-
structures subjected to linear anti-phase vibrations. The
structures are vacuumed at the wafer-level providing high Q-
factor in the drive mode. The drive system is decoupled from
the sense system in order to reduce feedback from sense
motion to drive electrodes. The drive anti phase vibration is
sustained by electrostatic comb drives. The sense anti phase
vibration resulting from Coriolis forces is counter balanced by
electrostatic forces. Differential detection and actuation are
used for both drive and sense systems and for each sub-
structure, keeping two identical structures for efficient
common mode rejection.
The “References” block generates the required biasing
currents and voltages for all blocks as well as the low-noise
reference voltage for critical blocks.
The “Power Management” block manages the power supply
of the sensor from a single 5V supply between the VDD and
GND pins. It includes a power on reset as well as an external
reset pin (RSTB) to start or restart operation using default
configuration. An enable pin (EN) with power-down capability
is also available.
The integrated circuit (IC), which is located on the right part
of the Figure 32, is designed to interface the MEMS sensing
element. It includes ultra-low noise capacitive to voltage
converters (C2V) followed by high resolution voltage
digitization (ADC) for both drive and sense paths. Excitation
voltage required for capacitance sensing circuits is generated
on the common electrode node. 1-bit force feedbacks (DAC)
are used for both drive and sense system actuation.
The sensor is powered with a single 5V DC power supply
through pins VDD and GND. Although the sensor contains three
separate VDD pins, the sensor is supplied by a single 5V voltage
source. It is recommended to supply the three VDD pins in a
star connection with appropriate decoupling capacitors.
Regarding the sensor grounds, all the GND pins are internally
shorted. The GND pins redundancy is used for multiple bonds
in order to reduce the total ground inductance. It is therefore
recommended to connect all the GND pins to the ground.
The choice for the implemented close-loop architecture based
on a Sigma-Delta principle is particularly well adapted as it
brings the following key advantages:
1)
Sigma-Delta is well suited for low-frequency signals.
Noise shaping principle rejects quantization noise in high
frequency bands.
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
Specification subject to change without notice.
Internal ref. : MCD001-F
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO2300 Datasheet
11.Available Tools and Resources
The following tools and resources are available on the GYPRO® product page of our website or upon request.
Item Description
Documentation & technical notes
GYPRO® product line - Flyer
GYPRO® product – Technical note
External filtering for Gypro2300LD and Gypro3300
GYPRO® product – Technical note
GYPRO MTBF Methodology
Mechanical tools
Evaluation kit
GYPRO2300 – 3D model
GYPRO2300-EVB2 – Evaluation board
Evaluation board for GYPRO2300, compatible with Arduino Yun_rev2
Evaluation Board – User manual
Evaluation Kit – Quick start guide
Evaluation Tool – Software user manual
GYPRO® Evaluation Tool – Tutorial
Installation and programming of the Evaluation kit
GYPRO® Evaluation Tool – Tutorial
Software
Evaluation Tool – Software
Evaluation Tool – Arduino Firmware
©Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Specification subject to change without notice.
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