ICS-40212 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40212 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) |
| 文件： | 总16页 (文件大小：428K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS‐40212
Analog Microphone with Low Power Mode
GENERAL DESCRIPTION
APPLICATIONS
The ICS‐40212 is an analog MEMS microphone with very high
dynamic range and a low‐power AlwaysOn mode. The ICS‐
40212 includes a MEMS microphone element, an impedance
converter, and an output amplifier.
Smartphones
“AlwaysOn” listening
Wearable devices
Still and video cameras
IoT devices
This microphone features a low‐power mode, which is active
when the supply voltage is <2.0V. In this mode, the
ICS‐40212 operates with 55 µA.
FEATURES
SPEC
HIGH PERFORMANCE
LOW‐POWER
Other high‐performance specifications include 128 dB SPL
acoustic overload point in high performance mode, tight
±1 dB sensitivity tolerance.
MODE
MODE
SNR
Current
AOP
66 dBA
66 dBA
55 µA
165 µA
The ICS‐40212 is available in a small 3.50 mm × 2.65 mm ×
0.98 mm bottom port surface‐mount package.
128 dB SPL
123 dB SPL
Analog output
−38 dBV sensitivity
±1 dB sensitivity tolerance
Extended frequency response from 35 Hz to 20 kHz
−84 dB PSRR
3.50 × 2.65 × 0.98 mm surface‐mount package
Compatible with Sn/Pb and Pb‐free solder processes
RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
TEMP RANGE
PACKAGING
ICS‐40212
−40°C to +85°C
13” Tape and Reel
OUTPUT
AMPLIFIER
EV_ICS‐40212‐FX
—
OUTPUT
POWER
ICS‐40212
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense, Inc. reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS‐000126
Revision: 1.3
Rev Date: 4/15/2020
www.invensense.com
ICS‐40212
TABLE OF CONTENTS
General Description.............................................................................................................................................1
Functional Block Diagram ....................................................................................................................................1
Applications .........................................................................................................................................................1
Features...............................................................................................................................................................1
Ordering Information...........................................................................................................................................1
Specifications....................................................................................................................................................... 3
Table 1. Electrical Characteristics.............................................................................................................. 3
Absolute Maximum Ratings................................................................................................................................. 5
2.1 Table 2. Absolute Maximum Ratings......................................................................................................... 5
2.2 ESD Caution...............................................................................................................................................5
2.3 Soldering Profile........................................................................................................................................6
2.4 Table 3. Recommended Soldering Profile................................................................................................. 6
Pin Configurations And Function Descriptions .................................................................................................... 7
3.1 Table 4. Pin Function Descriptions............................................................................................................ 7
Typical Performance Characteristics.................................................................................................................... 8
Theory Of Operation............................................................................................................................................ 9
5.1 Low‐Power Mode......................................................................................................................................9
Applications Information ................................................................................................................................... 10
6.1 Codec Connection ...................................................................................................................................10
Supporting Documents...................................................................................................................................... 11
7.1 Evaluation Board User Guide.................................................................................................................. 11
7.2 Application Notes....................................................................................................................................11
PCB Design And Land Pattern Layout ................................................................................................................ 12
8.1 PCB Material And Thickness.................................................................................................................... 12
Handling Instructions......................................................................................................................................... 13
9.1 Pick And Place Equipment....................................................................................................................... 13
9.2 Reflow Solder..........................................................................................................................................13
9.3 Board Wash.............................................................................................................................................13
Outline Dimensions............................................................................................................................................ 14
10.1 Ordering Guide........................................................................................................................................14
10.2 Revision History ......................................................................................................................................15
Compliance Declaration Disclaimer................................................................................................................... 16
1
2
3
4
5
6
7
8
9
10
11
Page 2 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
1 SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = 25°C, VDD = 1.52 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
PERFORMANCE
MIN
TYP
MAX
UNITS
NOTES
Directionality
Omni
Inverted
−39
Output Polarity
Sensitivity
1 kHz, 94 dB SPL
HIGH PERFORMANCE MODE
20 kHz bandwidth, A‐weighted
−38
−37
dBV
Signal‐to‐Noise Ratio (SNR)
66
28
dBA
dBA
Equivalent Input Noise (EIN)
20 kHz bandwidth, A‐weighted
Derived from EIN and acoustic
overload point
Dynamic Range
100
0.2
dB
%
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
105 dB SPL
1
1 kHz, 100 mV p‐p sine wave
superimposed on VDD = 2.75V
−84
dB
217 Hz, 100 mVp‐p square wave
superimposed on VDD = 2.75V
Power Supply Rejection (PSR)
Acoustic Overload Point
‐102
dBV
10% THD
128
dB SPL
LOW‐POWER MODE
Signal‐to‐Noise Ratio (SNR)
20 kHz bandwidth, A‐weighted
20 kHz bandwidth, A‐weighted
66
28
dBA
dBA
Equivalent Input Noise (EIN)
Derived from EIN and acoustic
overload point
Dynamic Range
95
0.2
‐75
dB
%
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
105 dB SPL
1
1 kHz, 100 mV p‐p sine wave
superimposed on VDD = 1.8V
dB
217 Hz, 100 mVp‐p square wave
superimposed on VDD = 1.8V
Power Supply Rejection (PSR)
Acoustic Overload Point
−96
dBV
10% THD, VDD = 1.8 V
POWER SUPPLY
Low‐power mode
High performance mode
VDD = 1.8V
123
dB SPL
Supply Voltage (VDD
Supply Current (IS)
)
1.52
2.2
2.0
3.63
65
V
V
55
µA
µA
VDD = 2.75V
165
190
Page 3 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
OUTPUT CHARACTERISTICS
Output Impedance
High‐performance mode
190
Ω
Low‐power mode
2.90
kΩ
Output Common Mode Voltage
High‐performance mode
Low‐power mode
1.0
0.8
15
V
V
Startup Time
Output to within ±0.5 dB of stable
sensitivity
20
1
ms
Mode Switching Time
High performance mode to low‐
power mode
ms
ms
Low‐power mode to high
1
performance mode
Maximum Output Voltage
Noise Floor
128 dB SPL input
0.631
V rms
dBV
20 Hz to 20 kHz, A‐weighted, rms,
high performance mode
−104
Page 4 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
2 ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
2.1 TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD
Mechanical Shock
Vibration
)
−0.3V to +3.63V
10,000g
Per MIL‐STD‐883 Method 2007, Test Condition B
Temperature Range
Biased
−40°C to +85°C
−55°C to +150°C
Storage
2.2 ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 5 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
2.3 SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
2.4 TABLE 3. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
SN63/PB37
PB‐FREE
1.25°C/sec max
Average Ramp Rate (TL to TP)
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMAX
Time (TSMIN to TSMAX), tS
1.25°C/sec max
100°C
100°C
200°C
)
Preheat
150°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp‐Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
Ramp‐Down Rate
3°C/sec max
5 min max
3°C/sec max
5 min max
Time +25°C (t25°C) to Peak Temperature
Note: The reflow profile in Table 3 is recommended for board manufacturing with INVENSENSE MEMS microphones. All microphones are also compatible with the
J‐STD‐020 profile.
Page 6 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
3 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
GND
GND
4
5
2
GND
VDD
OUTPUT
1
Figure 2. Pin Configuration (Top View, Terminal Side Down)
3.1 TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN
NAME
OUTPUT
GND
FUNCTION
1
Analog Output Signal
Ground
2
3
4
5
GND
Ground
GND
Ground
VDD
Power Supply
Page 7 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
4 TYPICAL PERFORMANCE CHARACTERISTICS
20
LOW POWER MODE
10.0
10
HIGH PERFORMANCE MODE
1.0
0
0.1
‐10
0.0
‐20
90
100
110
120
130
10
100
1000
FREQUENCY (Hz)
10000
INPUT AMPLITUDE (dB SPL)
Figure 3. Typical Frequency Response (Measured)
Figure 4. THD + N vs. Input Amplitude
0
‐5
0
‐20
LOW POWER MODE
‐10
‐15
‐20
‐25
‐30
‐35
‐40
‐45
HIGH‐PERFORMANCE MODE
‐40
‐60
LOW POWER MODE
‐80
HIGH‐PERFORMANCE
MODE
‐100
‐120
90
95
100
105
110
115
120
125
130
100
1000
10000
INPUT AMPLITUDE (dB SPL)
FREQUENCY (Hz)
Figure 5. Power‐Supply Rejection Ratio (PSRR) vs. Frequency
Figure 6. Linearity
Page 8 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
5 THEORY OF OPERATION
5.1 LOW‐POWER MODE
The ICS‐40212 will enter a low‐power mode when the supply voltage VDD falls below 2.0 V. In this mode, the microphone will operate
with 55 µA supply current. While the microphone is switched between the two modes, the output signals should be muted for a
short time.
Page 9 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
6 APPLICATIONS INFORMATION
6.1 CODEC CONNECTION
The ICS‐40212 output can be connected to a dedicated codec microphone input (see Figure 7) or to a high input impedance gain
stage. A 0.1 µF ceramic capacitor placed close to the ICS‐40212 supply pin is used for testing and is recommended to adequately
decouple the microphone from noise on the power supply. A dc blocking capacitor is required at the output of the microphone. This
capacitor creates a high‐pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 7 for codecs, which may have a very low input impedance at some PGA gain
settings.
MICBIAS
0.1µF
ADC
OR
CODEC
VDD
2.2µF
MINIMUM
ICS‐40212
INPUT
OUTPUT
GND
Figure 7. ICS‐40212 Connected to a Codec
Page 10 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
7 SUPPORTING DOCUMENTS
For additional information, see the following documents.
7.1 EVALUATION BOARD USER GUIDE
AN‐000013, Analog Output MEMS Microphone Flex Evaluation Board
7.2 APPLICATION NOTES
AN‐100, MEMS Microphone Handling and Assembly Guide
AN‐1003, Recommendations for Mounting and Connecting the InvenSense Bottom‐Ported MEMS Microphones
AN‐1112, Microphone Specifications Explained
AN‐1124, Recommendations for Sealing InvenSense Bottom‐Port MEMS Microphones from Dust and Liquid Ingress
AN‐1140, Microphone Array Beamforming
AN‐1165, Op Amps for Microphone Preamp Circuits
AN‐1181, Using a MEMS Microphone in a 2‐Wire Microphone Circuit
AN‐000056, MEMS Microphones for Active Noise Cancellation Applications
Page 11 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
8 PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40212 at a 1:1 ratio to the solder pads on the microphone package (see Figure 8.) Avoid
applying solder paste to the sound hole in the PCB. Figure 9 shows a suggested solder paste stencil pattern layout.
The response of the ICS‐40212 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐
phone (0.325 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X)
Ø1.625
Ø1.025
1.675
0.838
0.822
1.252
Figure 8. Recommended PCB Land Pattern Layout
0.422x0.625(4X)
Ø1.625
Ø1.125
1.675
0.1(4x)
0.822
1.252
Figure 9. Recommended Solder Paste Stencil Pattern Layout
8.1 PCB MATERIAL AND THICKNESS
The performance of the ICS‐40212 is not affected by PCB thickness. The ICS‐40212 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 12 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
9 HANDLING INSTRUCTIONS
9.1 PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick‐and‐place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
9.2 REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
9.3 BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow‐off procedures or
ultrasonic cleaning.
Page 13 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
10 OUTLINE DIMENSIONS
d
0.10
(4X)
0.522X0.725 (4x)
j
0.10 m C A B
3.50
A
0.125
PIN 1
CORNER
PIN 1
CORNER
0.82
Ø1.625
Ø1.025
Ø0.325±0.05
1
5
2
4
(2.45)
2.65
2.650
0.950
1.675
1.33
3
0.300
0.125
B
(3.30)
1.040
1.513
3.500
BOTTOM VIEW
TOP VIEW
f
0.10 C
0.98
C
(0.254)
SIDE VIEW
Figure 10. 5‐Terminal Chip Array Small Outline No Lead Cavity
3.50 mm × 2.65 mm × 0.98 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
212
YYXXX
DATE CODE
LOT TRACEABILITY CODE
Figure 11. Package Marking Specification (Top View, not to scale)
10.1 ORDERING GUIDE
PART
TEMP RANGE
−40°C to +85°C
—
PACKAGE
QUANTITY
10,000
PACKAGING
ICS‐40212
5‐Terminal LGA_CAV
Flexible Evaluation Board
13” Tape and Reel
EV_ICS‐40212‐FX
—
Page 14 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
10.2 REVISION HISTORY
REVISION DATE
REVISION
1.0
DESCRIPTION
2/16/2017
Initial Version
7/05/2017
4/6/2020
4/15/2020
1.1
1.2
1.3
Updated Section 2 and 4
Corrected typos
Corrected typos
Page 15 of 16
Document Number: DS‐000126
Revision: 1.3
ICS‐40212
11 COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics
are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from
vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice.
InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without
prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.
InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other
intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise
under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered
trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or
utilization of any conventional or mass‐destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical
applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster
prevention and crime prevention equipment.
©2019 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the
InvenSense logo are trademarks of InvenSense, Inc. The InvenSense logo is a trademark of InvenSense Corporation. Other company and product names may
be trademarks of the respective companies with which they are associated.
©2019 InvenSense. All rights reserved.
Page 16 of 16
Document Number: DS‐000126
Revision: 1.3
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