INMP405 [TDK]
Omnidirectional Microphone with Bottom Port and Analog Output;
| 型号： | INMP405 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Omnidirectional Microphone with Bottom Port and Analog Output |
| 文件： | 总13页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INMP405
Omnidirectional Microphone with Bottom Port and Analog Output
APPLICATIONS
GENERAL DESCRIPTION
The INMP405* is a high-quality, high-performance, low-power,
analog-output bottom-ported omnidirectional MEMS
microphone. The INMP405 consists of a MEMS microphone
element, an impedance converter, and an output amplifier.
The INMP405 sensitivity specification makes it an excellent
choice for near-field applications. The INMP405 has a
wideband frequency response, resulting in natural sound with
high intelligibility. The specially designed low frequency cutoff
reduces wind noise. Its low current consumption enables long
battery life for portable applications.
•
•
•
•
•
Mobile Devices
Teleconferencing Systems
Headsets
Security Panels
Intercom Devices
FEATURES
•
•
•
•
•
•
•
•
•
3.35 × 2.50 × 0.88 mm Surface-Mount Package
SNR of 62 dBA
Sensitivity of −38 dBV
Flat Frequency Response from 200 Hz to 15 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of 70 dB
Compatible with Sn/Pb and Pb-free Solder Processes
RoHS/WEEE Compliant
The INMP405 complies with the TIA-920 Telecommunications
Telephone Terminal Equipment Transmission Requirements for
Wideband Digital Wireline Telephones standard.
The INMP405 is available in a miniature 3.35 ×
2.50 × 0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The INMP405 is
halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
ORDERING INFORMATION
FUNCTIONAL BLOCK DIAGRAM
PART
TEMP RANGE
INMP405ACEZ-R0*
INMP405ACEZ-R7†
EV_INMP405-FX
−40°C to +85°C
−40°C to +85°C
—
OUTPUT
AMPLIFIER
OUTPUT
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Contact sales@invensense.com for
availability.
POWER
INMP405
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
www.invensense.com
INMP405
TABLE OF CONTENTS
General Description ........................................................................................................................................................1
Applications ....................................................................................................................................................................1
Features ..........................................................................................................................................................................1
Functional Block Diagram ...............................................................................................................................................1
Ordering Information......................................................................................................................................................1
Table of Contents............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ...................................................................................................................................3
Absolute Maximum Ratings............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ..............................................................................................................................4
ESD Caution.....................................................................................................................................................................4
Soldering Profile..............................................................................................................................................................5
Table 3. Recommended Soldering Profile*.....................................................................................................................5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions..................................................................................................................................6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ..........................................................................................................................................8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide..........................................................................................................................................9
Application Note (product specific) ................................................................................................................................9
Application Notes (general) ............................................................................................................................................9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions.................................................................................................................................................... 11
Pick And Place Equipment ............................................................................................................................................11
Reflow Solder................................................................................................................................................................11
Board Wash...................................................................................................................................................................11
Outline Dimensions....................................................................................................................................................... 12
Ordering Guide .............................................................................................................................................................12
Revision History ............................................................................................................................................................12
Compliance Declaration Disclaimer: ............................................................................................................................. 13
Environmental Declaration Disclaimer: ........................................................................................................................ 13
Page 2 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Omni
−38
62
1 kHz, 94 dB SPL
−41
−35
dBV
dBA
32
dBA SPL
Derived from EIN and
maximum acoustic input
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
Dynamic Range
88
dB
200
15
Hz
kHz
%
Frequency Response
1
Total Harmonic Distortion (THD)
3
217 Hz, 100 mVp-p square
wave superimposed on VDD
= 1.8 V
Power-Supply Rejection (PSR)
−70
dBV
Maximum Acoustic Input
Peak
120
dB SPL
POWER SUPPLY
Supply Voltage (VDD
)
1.5
3.3
V
Supply Current (IS)
250
µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT
Output DC Offset
)
200
Ω
0.8
90
V
Output Current Limit
Note 1: See Figures 3 and 5.
µA
Page 3 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
−0.3 V to +3.6 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
−40°C to +85°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Sn63/Pb37
Pb-Free
1.25°C/sec max
1.25°C/sec max
100°C
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
Time (TSMIN to TSMAX), tS
100°C
)
Preheat
150°C
200°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
245°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
3°C/sec max
Ramp-Down Rate
Time +25°C (t25°C) to Peak
Temperature
5 min max
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Page 5 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
GND
2
1
OUTPUT
3
VDD
INMP405
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
1
2
OUTPUT
GND
Analog Output Signal
Ground
3
VDD
Power Supply
Page 6 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
TYPICAL PERFORMANCE CHARACTERISTICS
10
10
8
6
4
0
2
0
–2
–4
–6
–8
–10
–10
–20
100
1k
10k
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Frequency Response Mask
Figure 4. Typical Frequency Response (Measured)
0
–10
–20
–30
–40
–50
–60
–70
–80
100
1k
10k
FREQUENCY (Hz)
Figure 5. Typical Power Supply Rejection Ratio vs. Frequency
Page 7 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
APPLICATIONS INFORMATION
CONNECTING TO AUDIO CODECS
The INMP405 output can be connected to a dedicated codec microphone input (see Figure 6) or to a high input impedance gain
stage (see Figure 7.) A 0.1 µF ceramic capacitor placed close to the INMP405 supply pin is used for testing and is recommended to
adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the
microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 µF is recommended in Figure 6 because the input impedance of codecs can be as low as 2 kΩ at its highest
PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 7 shows the INMP405 connected to an op
amp configured as a non-inverting preamplifier.
MICBIAS
0.1 µF
ADC
OR
VDD
2.2 µF
MINIMUM
CODEC
MP405
IN
INPUT
OUTPUT
GND
Figure 6. INMP405 Connected to a Codec
1.8-3.3 V
GAIN = (R1 + R2)/R1
R1 R2
V
REF
0.1µF
VDD
V
AMP
OUT
1µF
MINIMUM
INMP405
OUTPUT
GND
10kΩ
V
REF
Figure 7. INMP405 Connected to an Op Amp
Page 8 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-325 Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTE (PRODUCT SPECIFIC)
AN-0207 High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec
AN-0262 Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating
APPLICATION NOTES (GENERAL)
AN-1003 Recommendations for Mounting and Connecting the Invensense Bottom-Ported MEMS Microphones
AN-1068 Reflow Soldering of the MEMS Microphone
AN-1112 Microphone Specifications Explained
AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140 Microphone Array Beamforming
AN-1165 Op Amps for MEMS Microphone Preamp Circuits
AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit
Page 9 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the INMP405 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
1.52
0.68
1.22
0.61
0.61
Ø1.55
1.90
Ø0.95
0.90
Figure 8. PCB Land Pattern Layout
Dimensions shown in millimeters
1.55/1.05 DIA.
0.225 CUT WIDTH (2×)
0.8 × 0.6
2×
1.22
0.2 × 45
TYP
1.52mm
Figure 9. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
Page 10 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 11 of 13
Document Number: DS-INMP405-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP405
OUTLINE DIMENSIONS
3.425
3.350
3.275
0.75 REF
1.52
1.08
REFERENCE
CORNER
0.30 BSC
0.25 NOM
0.20 MIN
3.06 REF
PIN 1
DIA.
THRU HOLE
(SOUND PORT)
0.90 × 0.68
(PINS 1, 3)
1.56 DIA.
1
0.95 DIA.
2.575
2.500
2.425
0.54
REF
2
1.22 BSC
2.21
REF
1.25
3
TOP VIEW
0.64 REF
BOTTOM VIEW
0.20 TYP
× 45°
0.98
0.88
0.78
0.65 REF
SIDE VIEW
0.21 REF
Figure 10. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]
3.35 × 2.50 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
405
YYXXX
DATECODE
LOT TRACEABILITY CODE
Figure 11. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
−40°C to +85°C 3-Terminal LGA_CAV
PACKAGE
QUANTITY
10,000
INMP405ACEZ-R01 *
INMP405ACEZ-R71†
−40°C to +85°C 3-Terminal LGA_CAV
1,000
—
EV_INMP405-FX
—
Flex Evaluation Board
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Check with sales@invensense.com for availability.
1Z = RoHS-Compliant Part
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
1.0 Initial Release
02/06/2014
Page 12 of 13
Document Number: DS-INMP405-00
Revision: 1.0
Rev Date: 02/06/2014
INMP405
Compliance Declaration Disclaimer:
InvenSense believes this compliance information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Page 13 of 13
Document Number: DS-INMP405-00
Revision: 1.0
Rev Date: 02/06/2014
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