INMP411 [TDK]
Omnidirectional Microphone with Bottom Port and Analog Output;
| 型号： | INMP411 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Omnidirectional Microphone with Bottom Port and Analog Output |
| 文件： | 总14页 (文件大小：375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INMP411
Omnidirectional Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
APPLICATIONS
The INMP411* is a high performance, high SPL, low noise, low
power, analog output bottom ported, omnidirectional MEMS
microphone. The INMP411 consists of a MEMS microphone
element and an impedance converter amplifier. The INMP411
sensitivity specification makes it an excellent choice for near-
field applications. The INMP411 is pin compatible with the
INMP401 microphone, providing an easy upgrade path.
•
•
•
•
•
•
Fire and Safety Radios
Safety Masks
Tablet Computers
Teleconferencing Systems
Studio Microphones
Security and Surveillance
FEATURES
The INMP411 has a linear response up to 131 dB SPL. It offers
high SNR and extended wideband frequency response
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable
applications.
•
•
•
•
•
•
•
•
•
•
•
•
4.72 × 3.76 × 1.0 mm Surface-Mount Package
High 131 dB SPL Acoustic Overload Point
Sensitivity of −46 dBV
±2 dB Sensitivity Tolerance
Omnidirectional Response
The INMP411 is available in a 4.72 × 3.76 × 1.0 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation.
High SNR of 62 dBA
Extended Frequency Response from 28 Hz to 20 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of −80 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
ORDERING INFORMATION
FUNCTIONAL BLOCK DIAGRAM
PART
TEMP RANGE
INMP411ACEZ-R0*
INMP411ACEZ-R7†
EV_INMP411-FX
−40°C to +85°C
−40°C to +85°C
—
OUTPUT
AMPLIFIER
OUTPUT
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Check with sales@invensense.com
for availability.
POWER
INMP411
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS-INMP411-00
Revision: 1.0.
Rev Date: 02/06/2014
www.invensense.com
INMP411
TABLE OF CONTENTS
General Description .................................................................................................................................................1
Applications .............................................................................................................................................................1
Features ...................................................................................................................................................................1
Functional Block Diagram ........................................................................................................................................1
Ordering Information...............................................................................................................................................1
Table of Contents..................................................................................................................................................... 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................3
Absolute Maximum Ratings............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings .......................................................................................................................4
ESD Caution .............................................................................................................................................................4
Soldering Profile.......................................................................................................................................................5
Table 3. Recommended Soldering Profile................................................................................................................5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions...........................................................................................................................6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ...................................................................................................................................8
Dynamic Range Considerations ...............................................................................................................................8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide...................................................................................................................................9
Application Note (product specific) .........................................................................................................................9
Application Notes (general) .....................................................................................................................................9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions.................................................................................................................................................... 11
Pick And Place Equipment .....................................................................................................................................11
Reflow Solder.........................................................................................................................................................11
Board Wash............................................................................................................................................................11
Outline Dimensions....................................................................................................................................................... 12
Ordering Guide ............................................................................................................................................................. 13
Revision History .....................................................................................................................................................13
Compliance Declaration Disclaimer: ............................................................................................................................. 14
Environmental Declaration Disclaimer: ........................................................................................................................ 14
Page 2 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Omni
−46
62
1 kHz, 94 dB SPL
−48
−44
dBV
dBA
32
dBA SPL
Derived from EIN and maximum
acoustic input
Dynamic Range
99
dB
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V
10% THD
28
>20
0.2
Hz
kHz
%
Frequency Response
1
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
1
−80
dBV
Acoustic Overload Point
131
dB SPL
POWER SUPPLY
Supply Voltage (VDD
)
1.5
3.63
V
Supply Current (IS)
VDD = 1.8 V
VDD = 3.3 V
180
210
220
250
µA
µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT
Output DC Offset
)
200
0.8
Ω
V
Maximum Output Voltage
V RMS
131 dB SPL input
0.355
−108
Noise Floor
dBV
20 Hz to 20 kHz, A-weighted, rms
Note 1: See Figures 3 and 5.
Page 3 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Storage Temperature Range
−40°C to +150°C
−40°C to +85°C
Operating Temperature Range
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Sn63/Pb37
Pb-Free
1.25°C/sec max
1.25°C/sec max
100°C
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
Time (TSMIN to TSMAX), tS
100°C
)
Preheat
150°C
200°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
245°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
3°C/sec max
Ramp-Down Rate
Time +25°C (t25°C) to Peak
Temperature
5 min max
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Page 5 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
OUTPUT
GND
2
1
GND
3
GND
6
VDD
5
4
GND
BOTTOM VIEW
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
Analog Output Signal
Ground
1
2
OUTPUT
GND
Ground
3
4
5
6
GND
GND
VDD
GND
Ground
Power Supply
Ground
Page 6 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
TYPICAL PERFORMANCE CHARACTERISTICS
20
15
10
5
15
10
5
0
0
–5
–10
–15
–5
–10
10
100
1k
10k 20k
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Frequency Response Mask
Figure 4. Typical Frequency Response (Measured)
0
–10
–20
–30
–40
–50
–60
10
1
0.1
90
100
110
120
130
140
90
100
110
120
130
140
AMPLITUDE (dB SPL)
INPUT AMPLITUDE (dB SPL)
Figure 5. THD+N vs. Input Level
Figure 6. Linearity
0
1.2
128dB SPL
130dB SPL
132dB SPL
134dB SPL
136dB SPL
138dB SPL
140dB SPL
–10
–20
–30
–40
–50
–60
–70
–80
1.0
0.8
0.6
0.4
0.2
0
0
0.2
0.4
0.6
TIME (ms)
0.8
1.0
100
1k
10k
FREQUENCY (Hz)
Figure 7. Typical Power Supply Rejection Ratio vs. Frequency
Figure 8. Clipping Characteristics
Page 7 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
APPLICATIONS INFORMATION
CONNECTING TO AUDIO CODECS
The INMP411 output can be connected to a dedicated codec microphone input (see Figure 6) or to a high input impedance gain
stage (see Figure 7.) A 0.1 µF ceramic capacitor placed close to the inMP411 supply pin is used for testing and is recommended to
adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the
microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 4.7 µF is recommended in Figure 6 because the input impedance of codecs can be as low as 2 kΩ at its highest
PGA gain setting, which results in a high-pass filter corner frequency at 17 Hz. Figure 7 shows the INMP411 connected to an op amp
configured as a non-inverting preamplifier.
MICBIAS
0.1 µF
ADC
OR
CODEC
VDD
2.2 µF
MINIMUM
INMP411
INPUT
OUTPUT
GND
Figure 9. INMP411 Connected to a Codec
1.8-3.3 V
GAIN = (R1 + R2)/R1
R1 R2
V
REF
0.1µF
VDD
V
AMP
OUT
1µF
MINIMUM
INMP411
OUTPUT
GND
10kΩ
V
REF
Figure 10. INMP411 Connected to an Op Amp
DYNAMIC RANGE CONSIDERATIONS
To fully utilize the 99 dB dynamic range of the INMP411 in a design, the preamp, ADC, or codec circuit following it must be chosen
carefully. A typical codec may have a 98 dB dynamic range with VDD = 3.3 V. To match the dynamic ranges between the microphone
and the ADC input of the codec, some gain must be added to the INMP411 output. For example, at the 131 dB SPL maximum acoustic
input, the INMP411 outputs a −13 dBV RMS signal. The full-scale input voltage of a codec may be 0 dBV; therefore, 13 dB of gain must be
added to the signal to match the dynamic range of the microphone with the dynamic range of the codec.
Page 8 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-445 Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTE (PRODUCT SPECIFIC)
AN-0284 High Performance, Low-Noise Studio Microphone with MEMS Microphones, Analog Beamforming, and Power Management
AN-0207 High-Performance Analog MEMS Microphone Simple Interface-to-SigmaDSP Audio Codec
AN-0262 Low-Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating
APPLICATION NOTES (GENERAL)
AN-1003 Recommendations for Mounting and Connecting the Invensense Bottom-Ported MEMS Microphones
AN-1068 Reflow Soldering of the MEMS Microphone
AN-1112 Microphone Specifications Explained
AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140 Microphone Array Beamforming
AN-1165 Op Amps for MEMS Microphone Preamp Circuits
AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit
Page 9 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the INMP411 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
2.62
ø0.90 (3×)
ø1.10
ø1.68
2.54
2.40
1.20
1.27
ø0.70 (2×)
0.79
Figure 11. PCB Land Pattern Layout
Dimensions shown in millimeters
1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)
0.649mm DIA. (2×)
0.85mm DIA. (3×)
2.4mm
2.54mm
1.2mm
1.27mm
2.62mm
3.41mm
Figure 12. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
Page 10 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 11 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
OUTLINE DIMENSIONS
4.82
4.72
4.62
3.30 REF
2.62 BSC
REFERENCE
CORNER
0.79 BSC
4.10 REF
PIN 1
0.90 DIA.
(PINS 1, 5, 6)
1
6
2
1.68 DIA.
3.86
3.76
3.66
3
2.54
BSC
2.40 BSC
1.10 DIA.
3.14
REF
1.27 BSC
(THRU HOLE)
1.20 BSC
0.25 DIA.
5
4
0.61 REF
0.70 DIA.
(PINS 2, 4)
0.68 REF
TOP VIEW
BOTTOM VIEW
1.10
1.00
0.90
0.73 REF
0.24 REF
SIDE VIEW
Figure 13. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]
4.72 × 3.76 × 1.00 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
411
YYXXXX
DATECODE
LOT TRACEABILITY CODE
Figure 14. Package Marking Specification (Top View)
Page 12 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
4,500
INMP411ACEZ-R01*
−40°C to +85°C 6-Terminal LGA_CAV
INMP411ACEZ-R71 †
−40°C to +85°C 6-Terminal LGA_CAV
1,000
—
EV_INMP411-FX
—
Flex Evaluation Board
* – 13” Tape and Reel
† – 7” Tape and Reel to be discontinued. Contact sales@invensense.com for availability.
1Z = RoHS-Compliant Part
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
1.0 Initial Release
02/06/2014
Page 13 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
INMP411
Compliance Declaration Disclaimer:
InvenSense believes this compliance information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Page 14 of 14
Document Number: DS-INMP411-00
Revision: 1.0.
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