INMP522 [TDK]
MEMS麦克风(麦克风);
| 型号： | INMP522 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) |
| 文件： | 总21页 (文件大小：467K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INMP522
Ultra-Low Noise, Low Sensitivity Tolerance, PDM Digital Microphone
APPLICATIONS
GENERAL DESCRIPTION
•
•
•
•
•
•
•
•
Smartphones and Feature Phones
Microphone Arrays
Tablet Computers
Teleconferencing Systems
Digital Still and Video Cameras
Bluetooth Headsets
The INMP522* is an omnidirectional, bottom-ported, digital
output MEMS microphone with high performance, ultra-low
noise, and low power. The INMP522 has a sensitivity
tolerance of ±1 dB from part to part, making it ideal for
microphone array and beamforming applications.
Notebook PCs
Security and Surveillance
The INMP522 consists of a MEMS microphone element and an
impedance converter amplifier followed by a fourth-order Σ-Δ
modulator. The digital interface enables the pulse density
modulated (PDM) output of two microphones to be time-
multiplexed on a single data line using a single clock. The
INMP522 is function- and pin-compatible with the INMP521 and
INMP421 microphones, providing an easy upgrade path.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Sensitivity Tolerance of ±1 dB
Small, Thin 4 × 3 × 1 mm Surface-Mount Package
Omnidirectional Response
Very High SNR of 65 dBA
Sensitivity of −26 dBFS
Wide Frequency Response from 75 Hz to >20 kHz
Low Current Consumption of 800 µA
Sleep Mode for Extended Battery Life, <2 µA
Acoustic Overload Point of 116 dB SPL
High PSR of −83 dBFS
The INMP522 has a very high signal-to-noise ratio (SNR) of
65 dBA and sensitivity of −26 dBFS, making it an excellent
choice for near- and far-field applications. The INMP522 has
an extended wideband frequency response, resulting in
natural sound with high intelligibility. Low current
consumption and a sleep mode with less than 2 µA current
consumption enables long battery life for portable
applications.
Fourth-Order Σ-Δ Modulator
Digital PDM Output
Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
The INMP522 is available in a thin 4 × 3 × 1 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
INMP522
PART
TEMP RANGE
CLK
PDM
INMP522ACEZ-R0*
INMP522ACEZ-R7†
EV_INMP522-FX
−40°C to +85°C
−40°C to +85°C
—
ADC
MODULATOR
DATA
POWER
MANAGEMENT
CHANNEL
SELECT
* – 13” Tape and Reel
† – 7” Tape and reel is to be discontinued. Contact sales@invensense.com for
availability.
BOTTOM
TOP
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS-INMP522-00
Revision: 1.1
Release Date: 05/14/2014
www.invensense.com
INMP522
TABLE OF CONTENTS
General Description ............................................................................................................................................................................ 1
Applications ........................................................................................................................................................................................ 1
Features .............................................................................................................................................................................................. 1
Functional Block Diagram ................................................................................................................................................................... 1
Ordering Information.......................................................................................................................................................................... 1
Table of Contents.......................................................................................................................................................................................2
Specifications .............................................................................................................................................................................................4
Table 1. Electrical Characteristics ....................................................................................................................................................... 4
Table 2. Timing Characteristics........................................................................................................................................................... 5
Timing Diagram................................................................................................................................................................................... 5
Absolute Maximum Ratings.......................................................................................................................................................................6
Table 3. Absolute Maximum Ratings .................................................................................................................................................. 6
ESD Caution ........................................................................................................................................................................................ 6
Soldering Profile.................................................................................................................................................................................. 7
Table 4. Recommended Soldering Profile........................................................................................................................................... 7
Pin Configurations And Function Descriptions ..........................................................................................................................................8
Table 5. Pin Function Descriptions...................................................................................................................................................... 8
Typical Performance Characteristics..........................................................................................................................................................9
Theory Of Operation................................................................................................................................................................................10
PDM Data Format ............................................................................................................................................................................. 10
Table 6. INMP522 Channel Setting ................................................................................................................................................... 10
PDM Microphone Sensitivity ............................................................................................................................................................ 11
Connecting PDM Microphones......................................................................................................................................................... 12
Sleep Mode....................................................................................................................................................................................... 14
Start-Up Time.................................................................................................................................................................................... 14
Supporting Documents ............................................................................................................................................................................15
Evaluation Board User Guide............................................................................................................................................................ 15
application note (product specific)................................................................................................................................................... 15
Application Notes (general) .............................................................................................................................................................. 15
PCB Design And Land Pattern Layout ......................................................................................................................................................16
Alternative PCB Land Patterns.......................................................................................................................................................... 17
PCB Material And Thickness ............................................................................................................................................................. 17
Handling Instructions...............................................................................................................................................................................18
Pick And Place Equipment ................................................................................................................................................................ 18
Reflow Solder.................................................................................................................................................................................... 18
Board Wash....................................................................................................................................................................................... 18
Outline Dimensions..................................................................................................................................................................................18
Page 2 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
Ordering Guide ................................................................................................................................................................................. 19
Revision History ................................................................................................................................................................................ 19
Compliance Declaration Disclaimer .................................................................................................................................................20
Page 3 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.8 to 3.3 V, CLK = 2.4 MHz, CLOAD = 30 pF, unless otherwise noted. All minimum and maximum specifications
are guaranteed across temperature, voltage, and clock frequency specified in Table 1, unless otherwise noted. Typical specifications
are not guaranteed.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Omni
−26
65
1 kHz, 94 dB SPL
−27
−25
dBFS
dBA
1
20 Hz to 20 kHz, A-weighted
20 Hz to 20 kHz, A-weighted
Derived from EIN and
maximum acoustic input
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
29
dBA SPL
Dynamic Range
91
dB
75
>20
0.5
Hz
kHz
%
Frequency Response
2
Total Harmonic Distortion (THD)
1.5
217 Hz, 100 mVp-p square
wave superimposed on VDD
Power-Supply Rejection (PSR)
=
−83
dBFS
1.8 V
Acoustic Overload Point
Full-Scale Acoustic Level
POWER SUPPLY
10% THD
0 dBFS, derived from
sensitivity
116
120
dB SPL
dB SPL
Supply Voltage (VDD
Supply Current (IS)
)
1.62
3.63
1.2
V
Normal
Mode
Sleep Mode
Normal
Mode
0.8
1.0
mA
VDD = 1.8 V
2
1.4
µA
mA
µA
3
3
VDD = 3.3 V
Sleep Mode
3
DIGITAL FILTER
0.65 x
VDD
Input Voltage High (VIH)
V
0.35 x
VDD
Input Voltage Low (VIL)
V
V
Output Voltage High (VOH
)
0.7 x
VDD
ILOAD = 0.5 mA
VDD
0
Output Voltage Low (VOL)
0.3 x
VDD
V
ILOAD = 0.5 mA
Output DC Offset
Latency
Noise Floor
Percent of full scale
5
<30
−91
%
µs
dBFS
20 Hz to 20 kHz, A-weighted
Note 1: Relative to the RMS level of sine wave with positive amplitude equal to 100% logical 1s density and negative amplitude equal to 0% logical 1s density.
Note 2: See Figure 4 and Figure 5.
Note 3: The microphone enters sleep mode when the clock frequency is less than 1kHz.
Page 4 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
TABLE 2. TIMING CHARACTERISTICS
TA = −40 to 85°C, VDD = 1.8 to 3.3 V, CLK = 2.4 MHz, CLOAD = 30 pF, unless otherwise noted. All minimum and maximum specifications
are guaranteed. Typical specifications are not guaranteed.
PARAMETER
SLEEP MODE
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Time from CLK falling (fCLK < 1 kHz)
µs
Sleep Time
30
10
1
1
Wake-Up Time
Time from CLK rising (fCLK > 1 kHz),
power on
ms
INPUT
ns
tCLKIN
Input clock period
270
0.9
40
1111
3.6
1
Clock Frequency (CLK)
2.4
MHz
%
Clock Duty Cycle
60
OUTPUT
DATA1 (right) driven after falling clock
edge
DATA1 (right) disabled after rising
clock edge
DATA2 (left) driven after rising clock
edge
ns
T1OUTEN
T1OUTDIS
T2OUTEN
T2OUTDIS
54
15
54
15
54
54
ns
ns
DATA2 (left) disabled after falling clock
edge
ns
Note 1: The microphone operates at any clock frequency between 0.9 MHz and 3.6 MHz. Some specifications may not be guaranteed at frequencies other than 2.4 MHz.
TIMING DIAGRAM
tCLKIN
CLK
t1OUTEN
t1OUTDIS
DATA1
DATA2
t2OUTDIS
t2OUTEN
Figure 1. Pulse Density Modulated Output Timing
Page 5 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 3. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD
)
−0.3 V to +3.63 V
Digital Pin Input Voltage
Sound Pressure Level
Mechanical Shock
Vibration
−0.3 V to VDD + 0.3 V or 3.63 V, whichever is less
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
−40°C to +85°C
Storage
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 6 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 4. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
100°C
100°C
)
Preheat
150°C
200°C
)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
1.25°C/sec
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
20 sec to 30 sec
Temperature (tP)
3°C/sec max
Ramp-Down Rate
5 min max
Time +25°C (t25°C) to Peak Temperature 5 min max
*The reflow profile in Table4 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Page 7 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
5
4
DATA
VDD
1
2
CLK
L/R SELECT
3
GND
Figure 3. Pin Configuration
TABLE 5. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
Clock Input to Microphone
1
CLK
Left Channel or Right Channel Select:
DATA 1 (right): L/R SELECT tied to GND
DATA 2 (left): L/R SELECT tied to VDD
2
L/R SELECT
3
4
GND
VDD
Ground
Power Supply. For best performance and to avoid potential parasitic artifacts, place a 0.1 µF
(100 nF) ceramic type X7R capacitor between Pin 4 (VDD) and ground. Place the capacitor as
close to Pin 4 as possible.
5
DATA
Digital Output Signal (DATA1 or DATA2)
Page 8 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
TYPICAL PERFORMANCE CHARACTERISTICS
15
10
8
10
5
6
4
2
0
0
–2
–4
–6
–8
–10
–5
–10
–15
10
100
1k
10k
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Frequency Response Mask
Figure 5. Typical Frequency Response (Measured)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
10
1
0.1
95
100
105
110
115
120
100
1k
10k
INPUT LEVEL (dB SPL)
FREQUENCY (Hz)
Figure 7. THD+N vs. Input SPL
Figure 6. Power Supply Rejection (PSR) vs. Frequency
Page 9 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
THEORY OF OPERATION
PDM DATA FORMAT
The output from the DATA pin of the INMP522 is in PDM format. This data is the 1-bit output of a fourth-order Σ-Δ modulator. The
data is encoded so that the left channel is clocked on the falling edge of CLK and the right channel is clocked on the rising edge of
CLK.
After driving the DATA signal high or low in the appropriate half frame of the CLK signal, the DATA driver of the microphone is
tristated. In this way, two microphones—one set to the left channel and the other to the right channel—can drive a single DATA line.
Figure 1 shows a timing diagram of the PDM data format; the DATA1 and DATA2 lines shown in Figure 1 are two halves of the single
physical DATA signal. Figure 8 shows a diagram of the two stereo channels sharing a common DATA line.
CLK
DATA2 (L)
DATA1 (R)
DATA2 (L)
DATA1 (R)
DATA
Figure 8. Stereo PDM Format
If only one microphone is connected to the DATA signal, the output is clocked on a single edge only (See Figure 9.)
CLK
DATA
DATA1 (R)
DATA1 (R)
DATA1 (R)
Figure 9. Mono PDM Format
For example, a left channel microphone is never clocked on the rising edge of CLK. In a single microphone application, each bit of the
DATA signal is typically held for the full CLK period until the next transition of the CLK signal because the leakage of the DATA line is
not sufficient to discharge the line while the driver is tristated.
The channel assignments are determined by the logic level on the L/R SELECT pin (see Table 6.)
TABLE 6. INMP522 CHANNEL SETTING
L/R SELECT Pin Setting
Low (tie to GND)
High (tie to VDD)
Channel
Right (DATA1)
Left (DATA2)
Page 10 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
For PDM data, the density of the pulses indicates the signal amplitude. A high density of high pulses indicates a signal near positive
full scale, and a high density of low pulses indicates a signal near negative full scale. A perfect zero (dc) audio signal
is indicated by an alternating pattern of high and low pulses.
The output PDM data signal has a small dc offset of approximately 5% of full scale. A high-pass filter in the codec that is connected
to the digital microphone typically removes this dc signal and does not affect the performance of the microphone.
PDM MICROPHONE SENSITIVITY
The sensitivity of a PDM output microphone is specified in units of dBFS (decibels relative to a full-scale digital output). A 0 dBFS sine
wave is defined as a signal whose peak just touches the full-scale code of the digital word (see Figure 10). This measurement
convention means that signals with a different crest factor may have an RMS level higher than 0 dBFS. For example, a full-scale
square wave has an RMS level of 3 dBFS.
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TIME (ms)
Figure 10. 1 kHz, 0 dBFS Sine Wave
The definition of a 0 dBFS signal must be understood when measuring the sensitivity of the inMP522. An acoustic input signal of a
1 kHz sine wave at 94 dB SPL applied to the INMP522 results in an output signal with a −26 dBFS level. This means that the output
digital word peaks at −26 dB below the digital full-scale level. A common misunderstanding is that the output has an RMS level of
−29 dBFS; however, this is not the case because of the definition of a 0 dBFS sine wave.
There is no commonly accepted unit of measurement to express the instantaneous level of a digital signal output from the
microphone, as opposed to the RMS level of the signal. Some measurement systems express the instantaneous level of an individual
sample in units of D, where 1.0 D is digital full scale (see Figure 10). In this case, a −26 dBFS sine wave has peaks at 0.05 D.
For more information about digital microphone sensitivity, see the AN-1112 Application Note, Microphone Specifications Explained.
Page 11 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
CONNECTING PDM MICROPHONES
A PDM output microphone is typically connected to a codec with a dedicated PDM input. This codec separately decodes the left and right
channels and filters the high sample rate modulated data back to the audio frequency band. The codec also generates the clock for
the PDM microphones or is synchronous with the source that generates the clock.
Figure 11 and Figure 12 show mono and stereo connections between the INMP522 and a codec. The mono connection shows an
INMP522 set to output data on the right channel. To output data on the left channel, tie the L/R SELECT pin to VDD instead of GND.
1.8V TO 3.3V
0.1µF
CODEC
VDD
CLK
CLOCK OUTPUT
INMP522
DATA
DATA INPUT
L/R SELECT
GND
Figure 11. Mono PDM Microphone (Right Channel) Connection to Codec
Page 12 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
1.8V TO 3.3V
0.1µF
CODEC
VDD
CLK
CLOCK OUTPUT
INMP522
DATA
GND
DATA INPUT
L/R SELECT
1.8V TO 3.3V
0.1µF
VDD
CLK
INMP522
L/R SELECT
DATA
GND
Figure 12. Stereo PDM Microphone Connection to Codec
Decouple the VDD pin of the INMP522 to GND with a 0.1 µF capacitor. Place this capacitor as close to VDD as the printed circuit board
(PCB) layout allows.
Do not use a pull-up or pull-down resistor on the PDM data signal line because the resistor can pull the signal to an incorrect state
during the period that the signal line is tristated.
Page 13 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
The DATA signal does not need to be buffered in normal use when the INMP522 microphones are placed close to the codec on the
PCB. If the INMP522 must drive the DATA signal over a long cable (>15 cm) or other large capacitive load, a digital buffer may be
needed. Use a signal buffer on the DATA line only when one microphone is in use or after the point where two microphones are
connected (see Figure 13.)
CODEC
INMP522
CLOCK OUTPUT
CLK
DATA
DATA INPUT
INMP522
CLK
DATA
Figure 13. Buffered Connection Between stereo INMP522 Devices and a Codec
The DATA output of each microphone in a stereo configuration cannot be individually buffered because the two buffer outputs
cannot drive a single signal line. If a buffer is used, take care to select a buffer with low propagation delay so that the timing of the
data connected to the codec is not corrupted.
When long wires are used to connect the codec to the INMP522, a 100 Ω source termination resistor can be used on the clock output
of the codec instead of a buffer to minimize signal over-shoot or ringing. Depending on the drive capability of the codec clock output,
a buffer may still be needed, as shown in Figure 13.
SLEEP MODE
The microphone enters sleep mode when the clock frequency falls below 1 kHz. In sleep mode, the microphone data output
is in a high impedance state. The current consumption of the INMP522 in sleep mode is less than 2 µA at VDD = 1.8 V.
The INMP522 enters sleep mode within 1ms of the clock frequency falling below 1 kHz. The microphone wakes up from sleep mode
32,768 cycles after the clock becomes active. For a 2.4 MHz clock, the microphone begins to output data in 13.7 ms. The wake-up
time, as specified in Table 2, indicates the time from when the clock is enabled to when the INMP522 is consuming its specified
current.
START-UP TIME
The start-up time of the INMP522 from when the clock is active is the same as the wake-up time from sleep mode. The microphone
starts up 32,768 cycles after the clock is active.
Page 14 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-326, PDM Digital Output MEMS Microphone Evaluation Board
APPLICATION NOTE (PRODUCT SPECIFIC)
AN-0078, High Performance Digital MEMS Microphone Simple Interface to a SigmaDSP Audio Codec
APPLICATION NOTES (GENERAL)
AN-1003, Recommendations for Mounting and Connecting the Invensense, Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
Page 15 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the inMP522 at a 1:1 ratio to the solder pads on the microphone package (see Figure 14.) Take care
to avoid applying solder paste to the sound hole in the PCB. Figure 15 shows a suggested solder paste stencil pattern layout.
The response of the inMP522 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro-
phone (0.25 mm, or 0.010 inch, in diameter). A 0.5 mm to 1 mm (0.020 inch to 0.040 inch) diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
3.80
ø1.70
CENTER LINE
(0.30)
0.40 × 0.60 (4×)
0.35
(1.000)
0.90 (0.30)
2.80
ø1.10
(0.30)
(0.550)
0.70
2× R0.10
(0.30)
2.05
0.35
Figure 14. Suggested PCB Land Pattern Layout
Dimensions shown in millimeters
2.45
1.498 × 0.248
0.9
0.248 × 0.948 (2×)
0.398 × 0.298 (4×)
1.849
0.35
0.7
1.45
CENTER
LINE
1.000
0.248 × 1.148 (2×)
1.525
1.849
0.375
0.248 × 0.498 (2×)
24°
24°
1.498
1.17
0.205 WIDE
0.362 CUT (3×)
Figure 15. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
Page 16 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
ALTERNATIVE PCB LAND PATTERNS
The standard PCB land pattern of the INMP522 has a solid rectangle around the edge of the footprint (see Figure 14). In some board
designs, this rectangle can make routing the microphone signals more difficult. The rectangle is used to improve the RF immunity
performance of the INMP522; however, it is not necessary to have the full rectangle connected for electrical functionality. If a design
can tolerate reduced RF immunity, this rectangle can either be broken or removed completely from the PCB footprint.
Figure 16 shows an example PCB land pattern with no enclosing rectangle around the edge of the part.
Figure 16. Example PCB Land Pattern with No Enclosing Rectangle
Figure 17 shows an example PCB land pattern with the rectangle broken on two sides so that the inner pads can be more easily
routed on the PCB.
Figure 17. Example PCB Land Pattern with Broken Enclosing Rectangle
Note that in both of these patterns, the solid ring around the sound port is still present; this ring is needed to ground the microphone
and for acoustic performance. The pad on the package connected to this ring is ground and still needs a solid electrical connection to
the PCB ground.
If a land pattern similar to Figure 16 or Figure 17 is used on a PCB, make sure that the unconnected rectangle on the bottom of the
INMP522 is not placed directly over any exposed copper. The rectangle on the microphone is still at ground, and any PCB traces
routed beneath it must be properly masked to avoid short circuits.
PCB MATERIAL AND THICKNESS
The performance of the INMP522 is not affected by PCB thickness. The INMP522 can be mounted on either a rigid or flexible PCB. A
flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port, while providing the shortest acoustic path for good sound quality.
Page 17 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 4.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 18 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
OUTLINE DIMENSIONS
4.10
4.00
3.90
0.95 REF
2.05
0.70
1.70 DIA.
REFERENCE
CORNER
3.54 REF
0.40 × 0.60
PIN 1
(Pins 1, 2, 4, 5)
1.10 DIA.
0.25 DIA.
0.30 REF
3
1.50
0.90
1
5
2
4
2.48
REF
(THRU HOLE)
0.30 REF
3.10
3.00
2.90
R 0.10 (2 ×)
2.80
1.05 REF
TOP VIEW
0.35
0.35
0.30 REF
0.30 REF
1.10
1.00
0.90
0.72 REF
0.24 REF
3.80
BOTTOM VIEW
SIDE VIEW
Figure 18. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
4 mm × 3 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
522
YY XXXX
DATECODE
LOT TRACEABILITY CODE
Figure 19. Package Marking Specification (Top View)
Page 18 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
INMP522ACEZ-R0
−40°C to +85°C 5-Terminal LGA_CAV*
5,000
INMP522ACEZ-R7
−40°C to +85°C 5-Terminal LGA_CAV†
1,000
—
EV_INMP522-FX
—
Flexible Evaluation Board
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Check with sales@invensense.com for availability.
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
02/06/2014
05/14/2014
1.0
1.1
Initial Release
Corrected typo in EC Table
Page 19 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
INMP522
Compliance Declaration Disclaimer
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Page 20 of 21
Document Number: DS-INMP522-00
Revision: 1.1
Rev Date: 02/06/2014
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