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MLF2012A4R7KT [TDK]

Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series; 电感器的标准多层电路/ STD磁屏蔽MLF系列
MLF2012A4R7KT
型号： MLF2012A4R7KT
厂家： TDK ELECTRONICS    TDK ELECTRONICS
描述：

Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series
电感器的标准多层电路/ STD磁屏蔽MLF系列

电感器 固定电感器 测试 射频感应器
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中文：  中文翻译
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Inductors for Standard Circuits  
Multilayer/STD • magnetic shielded  
MLF series  
Type:  
MLF1005L  
MLF1608  
MLF2012  
1005[0402 inch]*  
1608[0603 inch]  
2012[0805 inch]  
* Dimensions Code JIS[EIA]  
Issue date:  
November 2011  
• All specifications are subject to change without notice.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
(1/9)  
Conformity to RoHS Directive  
Inductors for Standard Circuits  
Multilayer/STD • Magnetic Shielded  
MLF Series MLF1005L  
Various digital devices are required to be further downsized yet  
remain highly functional, and to excel in low power consumption,  
and parts mounted on the devices are also required to have lower  
resistance.  
PRODUCT IDENTIFICATION  
MLF 1005 R10  
(1) (2) (3) (4) (5) (6)  
L
K
T
(7)  
(1) Series name  
The MLF1005L type is a new line of inductors that have been  
developed to meet such requirements: their resistance has been  
lowered by up to 35% in comparison with that of the existing  
MLF1005 type.  
(2) Dimensions L×W  
1005  
1.0×0.5×0.5  
In addition, the new inductors use similar magnetic shielding,  
which enables their high-density mounting.  
(3) Type name  
L
Low-resistance type  
FEATURES  
(4) Inductance  
• The resistance of the MLF1005L type has been lowered by up to  
35% in comparison with that of the existing MLF1005 type.  
• Magnetically shielded configuration allowing for high-density  
mounting.  
R10  
1R0  
0.1µH  
1.0µH  
(5) Tolerance  
K
• Does not contain lead and is compatible with lead-free  
soldering.  
10%  
• It is a product conforming to RoHS directive.  
(6) Packaging style  
T
Taping [reel]  
APPLICATIONS  
Signal processing modules such as cellular phones and tuners  
(7) TDK internal code  
SPECIFICATIONS  
PACKAGING STYLE AND QUANTITIES  
Operating temperature range  
Storage temperature range  
–40 to +85°C  
–40 to +85°C(After mount)  
Packaging style  
Taping  
Quantity  
10000 pieces/reel  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the tempera-  
ture difference between the solder temperature and product  
temperature does not exceed 150°C.  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
180˚C  
150˚C  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application is considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(2/9)  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN  
1.0 0.05  
0.5 0.4 0.5  
0.1min.  
0.1min.  
Weight : 1.2mg  
Dimensions in mm  
ELECTRICAL CHARACTERISTICS  
Test  
frequency  
L, Q (MHz)  
Test  
current  
L, Q (mA)  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
Self-resonant  
Inductance  
(µH)  
Inductance  
tolerance  
DC resistance  
(Ω)max.  
Rated current  
(mA)max.  
Q min.  
frequency  
(MHz)min.  
450  
400  
350  
320  
290  
260  
230  
210  
190  
170  
150  
130  
120  
110  
100  
Part No.  
0.1  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
25  
25  
25  
25  
25  
25  
25  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
0.51  
0.59  
0.63  
0.76  
0.79  
0.91  
1.05  
0.41  
0.42  
0.47  
0.55  
0.59  
0.64  
0.79  
0.95  
1.05  
1.15  
150  
140  
130  
120  
110  
100  
90  
50  
50  
45  
40  
35  
35  
35  
30  
20  
15  
MLF1005LR10KT  
MLF1005LR12KT  
MLF1005LR15KT  
MLF1005LR18KT  
MLF1005LR22KT  
MLF1005LR27KT  
MLF1005LR33KT  
MLF1005LR39KT  
MLF1005LR47KT  
MLF1005LR56KT  
MLF1005LR68KT  
MLF1005LR82KT  
MLF1005L1R0KT  
MLF1005L1R2KT  
MLF1005L1R5KT  
MLF1005L1R8KT  
MLF1005L2R2KT  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1.0  
1.2  
1.5  
1.8  
2.2  
1.0  
1.0  
90  
80  
TYPICAL ELECTRICAL CHARACTERISTICS  
INDUCTANCE vs. FREQUENCY CHARACTERISTICS  
IMPEDANCE vs. FREQUENCY CHARACTERISTICS  
10  
10000  
1000  
2.2µH  
2.2µH  
1
1.0µH  
1.0µH  
0.1µH  
100  
0.33µH  
0.33µH  
0.1  
0.1µH  
10  
1
0.01  
1
10  
100  
1000  
1
10  
100  
1000  
(
)
(
)
Frequency MHz  
Frequency MHz  
Q vs. FREQUENCY CHARACTERISTICS  
70  
2.2µH  
60  
50  
1.0µH  
0.1µH  
40  
0.33µH  
30  
20  
10  
0
1
10  
100  
1000  
(
)
Frequency MHz  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(3/9)  
PACKAGING STYLES  
REEL DIMENSIONS  
1.0  
+2.0  
8.4  
–0.0  
2.0 0.5  
ø13 0.2  
ø21 0.8  
14.4max.  
ø180 2.0  
Dimensions in mm  
TAPE DIMENSIONS  
+0.1  
–0.0  
1.5  
Sprocket hole  
Cavity  
0.8max.  
0.65 0.1  
4.0 0.1  
2.0 0.05  
2.0 0.05  
160min.  
Taping  
200min.  
300min.  
Drawing direction  
Dimensions in mm  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(4/9)  
Conformity to RoHS Directive  
Inductors for Standard Circuits  
Multilayer/STD • Magnetic Shielded  
MLF Series MLF1608  
FEATURES  
PRODUCT IDENTIFICATION  
MLF 1608 1R0  
(1) (2) (3) (4) (5) (6)  
• High-reliability monolithic structure.  
• Ferrite core and magnetic shielding enables the design of com-  
pact circuits with high density mounting.  
• Excellent solderability and high heat resistance permits either  
flow or reflow soldering.  
A
K
T
(7)  
(1) Series name  
(2) Dimensions L×W  
• The products contain no lead and also support lead-free  
soldering.  
1608  
1.6×0.8mm  
• It is a product conforming to RoHS directive.  
(3) Type name  
(4) Inductance  
APPLICATIONS  
Digital cellular phone, tuner, personal computers, audio, or various  
electronic appliances  
47N  
R15  
1R0  
47nH[0.047µH]  
0.15µH  
1µH  
SPECIFICATIONS  
Operating temperature range  
Storage temperature range  
–40 to +85°C  
–40 to +85°C(After mount)  
(5) Tolerance  
K
M
10%  
20%  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
(6) Packaging style  
T
Taping [reel]  
10s max.  
250 to 260˚C  
230˚C  
(7) TDK internal code  
Natural  
cooling  
PACKAGING STYLE AND QUANTITIES  
Packaging style  
Taping  
Quantity  
4000 pieces/reel  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the tempera-  
ture difference between the solder temperature and product  
temperature does not exceed 150°C.  
Time(s)  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application is considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(5/9)  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN  
1.6 0.15  
0.6 0.8 0.6  
0.3 0.2  
Weight: 4mg  
Dimensions in mm  
ELECTRICAL CHARACTERISTICS  
Self-resonant  
frequency (MHz) (Ω)  
DC resistance  
Test  
frequency  
L, Q (MHz)  
Test  
current  
L, Q (mA)  
Q
Inductance  
(µH)  
Inductance  
tolerance  
Rated current  
(mA)max.  
Part No.  
min. typ.  
min.  
600  
550  
500  
450  
400  
350  
320  
290  
260  
230  
210  
190  
170  
150  
130  
120  
110  
100  
90  
80  
70  
65  
60  
55  
45  
40  
35  
30  
25  
22  
20  
18  
15  
10  
typ.  
900  
700  
650  
600  
550  
500  
450  
400  
350  
320  
290  
260  
230  
210  
190  
170  
150  
140  
130  
120  
110  
100  
90  
max.  
0.20  
0.30  
0.30  
0.35  
0.40  
0.45  
0.50  
0.55  
0.60  
0.75  
0.85  
0.95  
1.05  
1.25  
1.40  
0.50  
0.65  
0.70  
0.85  
1.00  
1.15  
1.30  
1.45  
1.60  
1.10  
1.30  
1.50  
1.70  
1.80  
1.50  
1.60  
1.70  
1.80  
2.20  
typ.  
MLF1608D47N∗MT  
MLF1608D68NMT  
MLF1608D82NMT  
MLF1608DR10KT  
MLF1608DR12KT  
MLF1608DR15KT  
MLF1608DR18KT  
MLF1608DR22KT  
MLF1608DR27KT  
MLF1608DR33KT  
MLF1608DR39KT  
MLF1608DR47KT  
MLF1608DR56KT  
MLF1608DR68KT  
MLF1608DR82KT  
MLF1608A1R0KT  
MLF1608A1R2KT  
MLF1608A1R5KT  
MLF1608A1R8KT  
MLF1608A2R2KT  
MLF1608A2R7KT  
MLF1608A3R3KT  
MLF1608A3R9KT  
MLF1608A4R7KT  
MLF1608E5R6KT  
MLF1608E6R8KT  
MLF1608E8R2KT  
MLF1608E100KT  
MLF1608E120KT  
MLF1608C150KT  
MLF1608C180KT  
MLF1608C220KT  
MLF1608C270KT  
MLF1608C330KT  
0.047  
0.068  
0.082  
0.1  
20%  
20%  
20%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10  
10  
10  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
30  
30  
20  
20  
20  
20  
20  
20  
20  
20  
25  
25  
25  
25  
25  
25  
25  
25  
30  
30  
30  
30  
50  
50  
55  
55  
55  
55  
60  
60  
60  
60  
60  
60  
55  
55  
40  
40  
40  
40  
40  
50  
50  
50  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
10  
10  
10  
10  
10  
10  
10  
10  
10  
4
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.10  
0.15  
0.15  
0.20  
0.20  
0.25  
0.25  
0.30  
0.35  
0.40  
0.45  
0.50  
0.55  
0.65  
0.75  
0.25  
0.25  
0.30  
0.35  
0.45  
0.50  
0.55  
0.65  
0.75  
0.55  
0.65  
0.80  
1.00  
1.20  
0.80  
0.85  
0.90  
1.20  
1.40  
200  
200  
200  
200  
200  
200  
150  
150  
150  
100  
100  
100  
100  
70  
70  
50  
50  
50  
50  
30  
30  
30  
30  
30  
15  
15  
10  
10  
10  
2
2
2
2
2
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
80  
70  
60  
55  
50  
45  
42  
40  
5.6  
6.8  
8.2  
10  
12  
15  
18  
22  
4
4
2
2
1
1
1
1
38  
35  
30  
27  
33  
1
∗ 47N means for 47nH (0.047µH).  
• Test equipment  
Inductance, Q: Ag4294A-16034G  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(6/9)  
TYPICAL ELECTRICAL CHARACTERISTICS  
INDUCTANCE CHANGE vs. DC SUPERPOSITION  
CHARACTERISTICS  
IMPEDANCE vs. FREQUENCY CHARACTERISTICS  
100  
100  
22µH  
8.2µH  
10  
1
10  
1µH  
1
22µH  
1µH  
8.2µH  
0.68µH  
0.1  
0.068µH  
0.1  
0.01  
0.01  
1
5
10  
50 100  
5001000  
1
5
10  
50 100  
5001000  
(
)
DC current mA  
(
)
Frequency MHz  
INDUCTANCE CHANGE vs. TEMPERATURE  
CHARACTERISTICS  
Q vs. FREQUENCY CHARACTERISTICS  
80  
60  
22µH  
10  
5
0.68µH  
8.2µH  
1µH  
8.2µH  
1µH  
–25  
0
1µH  
0 25  
50  
Temperature ˚C  
85  
)
40  
20  
0
–5  
8.2µH  
0.68µH  
22µH  
(
22µH  
0.68µH  
–10  
0.1  
0.5 1  
5
10  
50100  
5001000  
(
)
Frequency MHz  
PACKAGING STYLES  
REEL DIMENSIONS  
TAPE DIMENSIONS  
+0.1  
–0.0  
1.5  
Sprocket hole  
Cavity  
1.0  
1.1max.  
1.1 0.2  
4.0 0.1  
2.0 0.05  
4.0 0.1  
+2.0  
8.4  
–0.0  
2.0 0.5  
160min.  
Taping  
200min.  
ø13 0.2  
ø21 0.8  
14.4max.  
ø180 2.0  
Dimensions in mm  
300min.  
Dimensions in mm  
Drawing direction  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(7/9)  
Conformity to RoHS Directive  
Inductors for Standard Circuits  
Multilayer/STD • Magnetic Shielded  
MLF Series MLF2012  
FEATURES  
PRODUCT IDENTIFICATION  
MLF 2012 1R0  
(1) (2) (3) (4) (5) (6)  
• High-reliability monolithic structure.  
• Ferrite core and magnetic shielding enables the design of com-  
pact circuits with high density mounting.  
• Excellent solderability and high heat resistance permits either  
flow or reflow soldering.  
A
K
T
(7)  
(1) Series name  
(2) Dimensions L×W  
• The products contain no lead and also support lead-free  
soldering.  
2012  
2.0×1.25mm  
• It is a product conforming to RoHS directive.  
(3) Type name  
(4) Inductance  
APPLICATIONS  
Digital cellular phone, car audio, TV, personal computers, or vari-  
ous electronic appliances  
47N  
R15  
1R0  
100  
47nH[0.047µH]  
0.15µH  
1µH  
SPECIFICATIONS  
10µH  
Operating temperature range  
Storage temperature range  
–40 to +85°C  
–40 to +85°C(After mount)  
(5) Tolerance  
K
M
10%  
20%  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
(6) Packaging style  
T
10s max.  
Taping [reel]  
250 to 260˚C  
230˚C  
Natural  
cooling  
(7) TDK internal code  
PACKAGING STYLE AND QUANTITIES  
180˚C  
150˚C  
Packaging style  
Taping  
Product’s thickness  
0.85mm  
Quantity  
4000 pieces/reel  
2000 pieces/reel  
1.25mm  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
HANDLING AND PRECAUTIONS  
Time(s)  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the tempera-  
ture difference between the solder temperature and product  
temperature does not exceed 150°C.  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application is considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(8/9)  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN  
2.0 0.2  
0.8  
1
0.8  
0.5 0.3  
(
)
T Thickness  
(
)
Weight mg  
0.85 0.2  
1.25 0.2  
10  
14  
Dimensions in mm  
Self-resonant  
ELECTRICAL CHARACTERISTICS  
DC resistance  
Test  
frequency  
L, Q (MHz)  
Test  
Rated  
current  
Thickness  
T
Q
Inductance  
(µH)  
Inductance  
tolerance  
frequency (MHz) (Ω)  
current  
Part No.  
L, Q (mA)  
(mA)max. (mm)  
min. typ.  
min.  
550  
500  
450  
400  
360  
320  
280  
250  
220  
200  
180  
160  
150  
140  
130  
120  
110  
100  
90  
80  
70  
60  
55  
50  
45  
40  
35  
30  
25  
22  
20  
18  
17  
15  
13  
typ.  
700  
600  
550  
500  
450  
410  
370  
330  
300  
270  
250  
230  
210  
190  
170  
160  
150  
140  
130  
120  
100  
90  
80  
70  
65  
60  
55  
50  
45  
40  
38  
35  
33  
28  
23  
20  
18  
16  
max.  
0.10  
0.15  
0.15  
0.15  
0.20  
0.20  
0.25  
0.30  
0.35  
0.40  
0.45  
0.50  
0.55  
0.60  
0.65  
0.30  
0.35  
0.40  
0.45  
0.50  
0.55  
0.60  
0.65  
0.70  
0.60  
0.65  
0.70  
0.80  
0.90  
0.70  
0.80  
0.90  
1.00  
1.10  
2.40  
2.70  
2.80  
2.90  
3.00  
3.10  
typ.  
MLF2012D47N∗MT  
MLF2012D68NMT  
MLF2012D82NMT  
MLF2012DR10KT  
MLF2012DR12KT  
MLF2012DR15KT  
MLF2012DR18KT  
MLF2012DR22KT  
MLF2012DR27KT  
MLF2012DR33KT  
MLF2012DR39KT  
MLF2012DR47KT  
MLF2012DR56KT  
MLF2012DR68KT  
MLF2012DR82KT  
MLF2012A1R0KT  
MLF2012A1R2KT  
MLF2012A1R5KT  
MLF2012A1R8KT  
MLF2012A2R2KT  
MLF2012A2R7KT  
MLF2012A3R3KT  
MLF2012A3R9KT  
MLF2012A4R7KT  
MLF2012E5R6KT  
MLF2012E6R8KT  
MLF2012E8R2KT  
MLF2012E100KT  
MLF2012E120KT  
MLF2012C150KT  
MLF2012C180KT  
MLF2012C220KT  
MLF2012C270KT  
MLF2012C330KT  
MLF2012K390KT  
MLF2012K470KT  
MLF2012K560KT  
MLF2012C680KT  
MLF2012C820KT  
MLF2012C101KT  
0.047  
0.068  
0.082  
0.1  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
10  
12  
15  
18  
22  
27  
33  
39  
47  
56  
68  
82  
100  
20%  
20%  
20%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
15  
15  
15  
20  
20  
20  
20  
20  
20  
20  
25  
25  
25  
25  
25  
45  
45  
45  
45  
45  
45  
45  
45  
45  
50  
50  
50  
50  
50  
30  
30  
30  
30  
30  
35  
35  
35  
25  
25  
25  
25  
25  
25  
30  
30  
30  
30  
30  
30  
30  
35  
35  
35  
35  
35  
55  
55  
60  
60  
60  
70  
70  
70  
70  
75  
75  
75  
75  
75  
45  
45  
45  
45  
45  
55  
55  
55  
45  
45  
45  
50  
50  
50  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
10  
10  
10  
10  
10  
10  
10  
10  
10  
4
4
4
2
2
1
1
1
1
0.4  
2
2
2
1
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.05  
0.08  
0.08  
0.10  
0.12  
0.13  
0.15  
0.16  
0.18  
0.23  
0.25  
0.25  
0.30  
0.35  
0.40  
0.15  
0.15  
0.18  
0.20  
0.22  
0.25  
0.28  
0.30  
0.35  
0.30  
0.32  
0.35  
0.40  
0.50  
0.35  
0.38  
0.45  
0.50  
0.55  
1.30  
1.60  
1.80  
2.00  
2.40  
2.50  
300  
300  
300  
300  
300  
300  
300  
250  
250  
250  
200  
200  
150  
150  
150  
80  
80  
80  
80  
50  
50  
50  
30  
30  
15  
15  
15  
15  
15  
5
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
0.85  
1.25  
1.25  
1.25  
1.25  
0.85  
0.85  
0.85  
0.85  
0.85  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
1.25  
5
5
5
5
4
4
4
2
11  
10  
9
8
1
1
14  
12  
2
2
7
∗ 47N means for 47nH (0.047µH).  
• Test equipment  
Inductance, Q: Ag4294A-16034G  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
(9/9)  
TYPICAL ELECTRICAL CHARACTERISTICS  
INDUCTANCE CHANGE vs. DC SUPERPOSITION  
CHARACTERISTICS  
IMPEDANCE vs. FREQUENCY CHARACTERISTICS  
100  
100  
22µH  
10µH  
10  
10  
1µH  
1
1
22µH  
10µH  
0.1µH  
1µH  
0.1µH  
0.1  
0.1  
0.01  
0.01  
1
5
10  
50 100  
5001000  
1
5
10  
50 100  
5001000  
(
)
(
)
Frequency MHz  
DC current mA  
INDUCTANCE CHANGE vs. TEMPERATURE  
CHARACTERISTICS  
Q vs. FREQUENCY CHARACTERISTICS  
80  
12  
1µH  
10µH  
8
10µH  
60  
0.1µH  
22µH  
1µH  
4
–25  
0
0.1µH  
22µH  
0 25  
–4  
–8  
50  
85  
40  
0.1µH  
1µH  
22µH  
(
)
Temperature ˚C  
10µH  
20  
0
–12  
–16  
0.1  
0.5 1  
5
10  
50100  
5001000  
(
)
Frequency MHz  
PACKAGING STYLES  
REEL DIMENSIONS  
TAPE DIMENSIONS  
t=0.85mm  
+0.1  
–0.0  
1.5  
Sprocket hole  
Cavity  
1.0  
1.1max.  
1.5 0.2  
4.0 0.1  
2.0 0.05  
4.0 0.1  
+2.0  
8.4  
–0.0  
t=1.25mm  
2.0 0.5  
ø13 0.2  
ø21 0.8  
14.4max.  
+0.1  
–0.0  
1.5  
1.5max.  
Sprocket hole  
0.5min.  
Cavity  
ø180 2.0  
Dimensions in mm  
0.3max.  
160min.  
1.5 0.2  
4.0 0.1  
2.0 0.05  
4.0 0.1  
Taping  
200min.  
300min.  
Drawing direction  
Dimensions in mm  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  

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