MLK0603L1N0S [TDK]
General Purpose Inductor, 0.001uH, 30%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT;
| 型号： | MLK0603L1N0S |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | General Purpose Inductor, 0.001uH, 30%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT 测试 射频感应器 电感器 |
| 文件： | 总7页 (文件大小：244K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Conforming to RoHS Directive
Multilayer Chip Inductors
For High-frequency Circuits
And Modules,
Conformity to RoHS Directive: This means that, in conformity with
EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame retardants, PBB
and PBDE, have not been used, except for exempted applications.
MLK0603 series
The 0603 type - the smallest in the industry, and the most advanced in the
MLK series, with numerous achievements in its use as a high Q element
optimal for signal-processing circuits in the 1-2GHz band in mobile commu-
nication devices such as RF amplifiers, mixers, VCO, PLL synthesizers - is
available in 19 varieties covering 1-33nH, responding to the cutting-edge
design needs of small digital devices.
With further fine-tuned super-fine lamination
technology, allowing no misalignment - even
of micron-order, mass-production technology
of condensed "GigaspiraTM Multilayer struc-
ture", of greater precision than ever, inside
the super-small 0603 chip where the area of
internal conductor pattern can be reduced
to1/3 of the1005 type, has been established.
Shapes and dimensions
Recommende PC board pattern
(Reflow process)
0.6 0.03
B
A
B
A: 0.25 to 0.35
B : 0.2 to 0.3
0.15 0.05
0.65 to 0.95
C: 0.25 to 0.35
Dimensions in mm
Weight:0.2 mg
Dimensions in mm
0.2 min.
GigaspiraTM multilayer structure
Original GHz-band-ready structure
overcoming the limitations of the
conventional structures.
Recommended soldering conditions
Lead-free solder/High-temperature reflow process
240 to 250°C
230°C
Slow cooling
Cutting-edge hyper specifications and out-
standing circuit condensation effects are
offered too - not to mention diverse modules
for mobile telephones of the next generation;
small device RF modules such as DVC, digital
still cameras, and PDA devices; and CCD
modules, as well as downsizing the design of
Bluetooth modules integrated in those devices.
180°C
30 s max.
150°C
Preheating : 60 to 120 s
TDK CORPORATION
MLK0603
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Basic characteristics
Typical data
MLK0603 series
Temperature range
-
+
°
55 to 125 C
Operating
Storage*
-
+
°
55 to 125 C
*Individual product
Inductance vs. frequency characteristics
Q vs. frequency characteristics
50
100
40
30
30
10
15nH
10nH
1.5nH
10nH
6.8nH
4.7nH
4.7nH
20
3.3nH
2.2nH
3
15nH
6.8nH
10
1.5nH
1nH
1nH
3.3nH
1
2.2nH
0.5
10M
0
10M
100M
1G
10G
100M
1G
10G
Frequency (Hz)
Frequency (Hz)
Typical Electrical Characteristics
Inductance
Part No.
Q
Self-resonance
DC resistance
(ohm)
Rated current
(mA)
(nH) at 100MHz
at 100MHz at300MHz at1GHz
frequency (GHz)
12 min. / 17.1 typ.
11min. / 15.2 typ.
9.5 min. / 14.8 typ.
8.5 min. / 12.7 typ.
8 min. / 11.7 typ.
7.5 min. / 10.7 typ.
7 min. / 10.2 typ.
6.5 min. / 9.5 typ.
6 min. / 9 typ.
MLK0603L1N0S
MLK0603L1N2S
MLK0603L1N5S
MLK0603L1N8S
MLK0603L2N2S
MLK0603L2N7S
MLK0603L3N3S
MLK0603L3N9S
MLK0603L4N7S
MLK0603L5N6S
MLK0603L6N8J
MLK0603L8N2J
MLK0603L10NJ
MLK0603L12NJ
MLK0603L15NJ
MLK0603L18NJ
MLK0603L22NJ
MLK0603L27NJ
MLK0603L33NJ
Measuring instruments
1.0 0.3nH
1.2 0.3nH
1.5 0.3nH
1.8 0.3nH
2.2 0.3nH
2.7 0.3nH
3.3 0.3nH
3.9 0.3nH
4.7 0.3nH
5.6 0.3nH
6.8 5%
3 typ.
4 typ.
4 typ.
4 typ.
4 typ.
4 typ.
4 typ.
4 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
5 typ.
7 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
9 typ.
9 typ.
9 typ.
9 typ.
8 typ.
8 typ.
8 typ.
8 typ.
8 typ.
13 typ.
14 typ.
14 typ.
14 typ.
14 typ.
14 typ.
14 typ.
14 typ.
14 typ.
15 typ.
15 typ.
15 typ.
15 typ.
15 typ.
14 typ.
14 typ.
14 typ.
13 typ.
13 typ.
0.2 max. / 0.13 typ.
0.25 max. / 0.14 typ.
0.3 max. / 0.15 typ.
0.35 max. / 0.18 typ.
0.4 max. / 0.21 typ.
0.45 max. / 0.24 typ.
0.5 max. / 0.26 typ.
0.55 max. / 0.3 typ.
0.6 max. / 0.34 typ.
0.7 max. / 0.38 typ.
0.8 max. / 0.49 typ.
0.9 max. / 0.51 typ.
1 max. / 0.59 typ.
1.1 max. / 0.7 typ.
1.2 max. / 0.86 typ.
1.4 max. / 0.92 typ.
1.6 max. / 0.98 typ.
1.8 max. / 1.1 typ.
2.0 max. / 1.3 typ.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
100 max.
100 max.
100 max.
100 max.
5.7 min. / 8.5 typ.
5.5 min. / 7.9 typ.
5 min. / 7.6 typ.
4.7 min. / 7.3 typ.
4.3 min. / 6.8 typ.
4 min. / 6.1 typ.
3.7 min. / 5.5 typ.
3.5 min. / 5 typ.
3.0 min. / 4.5 typ.
2.8 min. / 4.2 typ.
8.2 5%
10 5%
12 5%
15 5%
18 5%
22 5%
27 5%
33 5%
°
L,Q :HP4291A+16197A / SRF: HP8720C / Rdc :YOKOGAWA TYPE7561 / Idc:The value where the temperature of the inductor increases by 20 C
TDK CORPORATION
MLK0603
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Example of mobile phone applications
GSM/DCS1800 Dual-band System
MLK0603 series
For matching
Choke coil
L3
Vcc
LNA
LNA
L1
L2
IF SAW
SAW
L1
L2
GSM/RX
LNA
LNA
T/R Switch
GSM
RF
1st IF
IF
SAW
2nd IF
Balun
Balun
R
SAW
ANT
I/Q
Demod
I/Q
T
DCS1800
RF SAW
AGC
DIV
GSM
90 Deg
Shifter
Diplexer
IF
VCO
IF PLL
DCS1800/RX
GSM/TX
GSM
VCO
DCS1800
VCO
90 Deg
Shifter
DCS1800
DIV
RF PLL
DCS1800
LPF
I/Q
Mod
Phase Detecter
I/Q
PA
GSM
LPF
Balun
Balun
Coupler
Coupler
LPF
LPF
R
DCS1800
LPF
GSM
DCS1800
T
High Power
VCO
High Power
VCO
T/R Switch
PA
DCS1800/TX
APC
RF SAW
SAW
L1
L2
PA
L1
L2
L3
Vdd1
Vdd2
Vdd2
L4
L5
L6
L7
VGG
VGG
VGG
VCO
L2
L1
Vt
Oscillation
Stage
Buffer
Stage
L4
L3
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MLK0603
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TM
Gigaspira multilayer structure
Advantages of the MLK 0603 and 1005 series
Unprecedented GHz-band
high Q characteristics
MLK0603 series
1. Adoption of low-permissivity micro ceramic
materials and low-resistance Ag internal con-
ductors. 2. Development of new lamination
structure - GigaspiraTM - offering minimization
of the internal stray capacitance's effect (de-
creased self-resonant frequency; decreased
Q in GHz band), which increases as elements
are minimized and inductance is increased
(highly integrated internal conductors). 3. By
establishing advanced fine lamination tech-
nology with improved micron-level masspro-
duction process control order, low-loss/highQ
characteristics are provided in designing mo-
bile devices with high-frequency circuits such
as RF circuits, Blue-tooth modules, DVC, DSC,
and PDA of diverse mobile devices.
One additional advantage -
fully compliant with bulk attachment
TM
Gigaspira multilayer structure
With altered lamination direction of internal
conductors, and both ends of the conduc-
tors being placed in the center of an element's
longitudinal direction, and the original design,
where, via hole conductors used to connect
them with the center of terminal electrodes,
electrical symmetry that can maintain bal-
ance of its characteristic, whether it revolves
in an a or b direction (see the diagram right),
has been realized. For the first time, the bulk
attachment is fully compliant as a high-fre-
quency chip inductor.
The spiral conductors and terminal electrodes laminated
in the center and the longitudinal direction of the element
are connected through the via hole conductors formed
on the central axis in the element's longitudinal direction.
Original GHz-ready high Q laminated L chip structure
where the stray capacitance between the internal con-
ductors and terminal electrodes is minimized.
a
b
In addition to the circuit condensation effect
after minimization of the chips and the im-
provement in signal quality using high-Q, more
effective benefits than those of conventional
elements are promised such as stable design
of circuit characteristic, stabilized quality,
improved implementation cost, and so forth.
Element with the conventional structure
With the conventional structure, if minimization is performed
while maintaining the L value, the distance between the
internal conductors and terminal electrodes shortens and the
stray capacitance increases, and, as a result, causes deterio-
ration of self-resonant frequency.
Stray capacitance
90 degree rotation
Also, because the conventional structure altered the relative
position of the internally-connected conductors and land
patterns as the element revolved, the inductance value
showed a minor fluctuation. However, when it's used for
matching of GHz-band signal circuits, this small fluctuation
can't be ignored and attachment by the directional identifi-
cation marking was necessary.
PC board pattern
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MLK0603
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Comparison of frequency characteristics
Comparative example of the type 1005, 100nH products
An unprecedented-degree of self-resonant
frequency of 2GHz(100nH products) - 19GHz
MLK0603 series
(1nH products), surpassing the chip inductors
of conventionally-laminated structure, is sup-
ported.
The optimal and the most powerful high Q
characteristic (20-32 at 1GHz) for GHz-band
signal circuits such as RF amplifiers, mixers,
VCO, PLL synthesizers, and so forth, which
determine the communication quality, has
been achieved.
Chip inductor with the conventional structure
30
25
20
15
10
5
1000
100
10
MLK
MLK
0
10M
100M
Frequency (Hz)
1G
10G
10M
100M
Frequency (Hz)
1G
10G
TDK CORPORATION
MLK0603
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Information on related products
Multilayer Chip Inductors
For High-frequency Circuits And Modules,
Conforming to RoHS Directive
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium,
and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
MLK1005 series
Shapes and dimensions
Frequency characteristics
Inductance vs. frequency characteristics
300
1.0 0.1
100nH
56nH
0.1min.
100
33nH
22nH
30
10
10nH
4.7nH
Weight : 1 mg
0.3min.
Dimensions in mm
3
1
2.2nH
1.2nH
10M
100M
Frequency (Hz)
1G
10G
Recommende PC board pattern
(Reflow process)
Q vs. frequency characteristics
50
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
1.2 to 1.5
10nH
40
Dimensions in mm
56nH
1.2nH
30
22nH
100nH
4.7nH
Recommended soldering conditions
Lead-free solder/High-temperature reflow process
240 to 250°C
20
2.2nH
10
33nH
230°C
Slow cooling
0
10M
100M
Frequency (Hz)
1G
10G
180°C
30 s max.
150°C
Preheating : 60 to 120 s
TDK CORPORATION
MLK0603
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Information on related products
MLK1005 series
Temperature range
-
+
°
55 to 125 C
Operating
Storage*
-
+
°
55 to 125 C
*Individual product
Typical Electrical Characteristics
Inductance
Part No.
Q
Self-resonance
frequency (GHz)
DC resistance
(ohm)
Rated current
(mA)
(nH) at 100MHz
at 100MHz at300MHz at1GHz
MLK1005S1N0S
MLK1005S1N2S
MLK1005S1N5S
MLK1005S1N8S
MLK1005S2N2S
MLK1005S2N7S
MLK1005S3N3S
MLK1005S3N9S
MLK1005S4N7S
MLK1005S5N6D
MLK1005S6N8D
MLK1005S8N2D
MLK1005S10NJ
MLK1005S12NJ
MLK1005S15NJ
MLK1005S18NJ
MLK1005S22NJ
MLK1005S27NJ
MLK1005S33NJ
MLK1005S39NJ
MLK1005S47NJ
MLK1005S56NJ
MLK1005S68NJ
MLK1005S82NJ
MLK1005SR10J
1.0 0.3nH
1.2 0.3nH
1.5 0.3nH
1.8 0.3nH
2.2 0.3nH
2.7 0.3nH
3.3 0.3nH
3.9 0.3nH
4.7 0.3nH
5.6 0.5nH
6.8 0.5nH
8.2 0.5nH
10 5%
7 typ.
7 typ.
8 typ.
8 typ.
8 typ.
8 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
9 typ.
12 typ.
13 typ.
15 typ.
15 typ.
15 typ.
15 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
16 typ.
15 typ.
14 typ.
14 typ.
24 typ.
26 typ.
28 typ.
29 typ.
29 typ.
30 typ.
32 typ.
30 typ.
31 typ.
31 typ.
31 typ.
31 typ.
31 typ.
32 typ.
30 typ.
30 typ.
30 typ.
28 typ.
27 typ.
27 typ.
26 typ.
25 typ.
23 typ.
20 typ.
20 typ.
12 min. / 19 typ.
11 min. / 16.2 typ.
9.5 min. / 13.6 typ.
8.5 min. / 10.5 typ.
8 min. / 10 typ.
0.1 max. / 0.05 typ.
0.15 max. / 0.07 typ.
0.16 max. / 0.08 typ.
0.2 max. / 0.11 typ.
0.21 max. / 0.11 typ.
0.23 max. / 0.16 typ.
0.25 max. / 0.16 typ.
0.28 max. / 0.16 typ.
0.32 max. / 0.19 typ.
0.35 max. / 0.21 typ.
0.38 max. / 0.28 typ.
0.42 max. / 0.31 typ.
0.45 max. / 0.33 typ.
0.5 max. / 0.41 typ.
0.55 max. / 0.44 typ.
0.65 max. / 0.53 typ.
0.75 max. / 0.58 typ.
0.95 max. / 0.75 typ.
1.1 max. / 0.81 typ.
1.2 max. / 0.67 typ.
1.3 max. / 0.79 typ.
1.4 max. / 0.97 typ.
1.6 max. / 1.18 typ.
1.8 max. / 1.24 typ.
2.2 max. / 1.5 typ.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
300 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
200 max.
100 max.
100 max.
100 max.
100 max.
50 max.
7.5 min. / 9.2 typ.
7 min. / 8.5 typ.
6.5 min. / 8.2 typ.
6 min. / 7.3 typ.
5.7 min. / 7.2 typ.
5.5 min. / 6.8 typ.
5 min. / 6.5 typ.
4.7 min. / 6.3 typ.
4.3 min. / 6.2 typ.
4 min. / 5.6 typ.
3.7 min. / 5.3 typ.
3.5 min. / 5.1 typ.
3 min. / 4.7 typ.
2.5 min. / 4.2 typ.
2.0 min. / 3.4 typ.
1.8 min. / 2.9 typ.
1.5 min. / 2.8 typ.
1.2 min. / 2.7 typ.
1 min. / 2.1 typ.
0.8 min. / 2 typ.
12 5%
15 5%
18 5%
22 5%
27 5%
33 5%
39 5%
47 5%
56 5%
68 5%
82 5%
100 5%
50 max.
Measuring instruments
°
L,Q : HP4291A+16197A / SRF:HP8720C / Rdc : YOKOGAWA TYPE7561 / Idc: The value where the temperature of the inductor increases by 20 C
BSF-E01EB 2005.12.11
TDK CORPORATION
MLK0603
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