MPU-3050 [TDK]
陀螺仪;
| 型号： | MPU-3050 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 陀螺仪 PC |
| 文件： | 总52页 (文件大小：1115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPU-3050
MPU-3050
Motion Processing Unit
Product Specification
InvenSense reserves the right to change the
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
Document Number: PS-MPU-3050A-00
Revision: 2.7
Rev. Date: 03/10/2016
detail specifications as may be required to
permit improvements in the design of its
products.
www.invensense.com
MPU-3050
TABLE OF CONTENTS
1
INTRODUCTION....................................................................................................................................................4
1.1
1.2
1.3
PURPOSE AND SCOPE ............................................................................................................................................... 4
PRODUCT OVERVIEW ............................................................................................................................................... 4
APPLICATIONS......................................................................................................................................................... 5
2
FEATURES ............................................................................................................................................................6
2.1
SENSORS................................................................................................................................................................ 6
DIGITAL OUTPUT ..................................................................................................................................................... 6
MOTION PROCESSING .............................................................................................................................................. 6
CLOCKING .............................................................................................................................................................. 6
POWER.................................................................................................................................................................. 6
PACKAGE ............................................................................................................................................................... 7
2.2
2.3
2.4
2.5
2.6
3
ELECTRICAL CHARACTERISTICS.............................................................................................................................8
3.1
SENSOR SPECIFICATIONS ........................................................................................................................................... 8
ELECTRICAL SPECIFICATIONS....................................................................................................................................... 9
ELECTRICAL SPECIFICATIONS, CONTINUED ................................................................................................................... 10
ELECTRICAL SPECIFICATIONS, CONTINUED ................................................................................................................... 11
I2C TIMING CHARACTERIZATION ............................................................................................................................... 12
ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 13
3.2
3.3
3.4
3.5
3.6
4
5
APPLICATIONS INFORMATION ...........................................................................................................................14
4.1
PIN OUT AND SIGNAL DESCRIPTION .......................................................................................................................... 14
TYPICAL OPERATING CIRCUITS.................................................................................................................................. 15
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 15
RECOMMENDED POWER-ON PROCEDURE................................................................................................................... 16
4.2
4.3
4.4
FUNCTIONAL OVERVIEW....................................................................................................................................17
5.1
BLOCK DIAGRAM................................................................................................................................................... 17
OVERVIEW ........................................................................................................................................................... 17
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ............................................................ 17
DIGITAL MOTION PROCESSOR.................................................................................................................................. 18
PRIMARY I2C SERIAL COMMUNICATIONS INTERFACE..................................................................................................... 18
SECONDARY I2C SERIAL INTERFACE (FOR A THIRD-PARTY ACCELEROMETER)....................................................................... 18
5.2
5.3
5.4
5.5
5.6
6
CLOCKING ..........................................................................................................................................................19
6.1
INTERNAL CLOCK GENERATION................................................................................................................................. 19
CLOCK OUTPUT..................................................................................................................................................... 19
SENSOR DATA REGISTERS........................................................................................................................................ 19
FIFO................................................................................................................................................................... 19
INTERRUPTS.......................................................................................................................................................... 19
BIAS AND LDO...................................................................................................................................................... 20
CHARGE PUMP...................................................................................................................................................... 20
CHIP VERSION....................................................................................................................................................... 20
6.2
6.3
6.4
6.5
6.6
6.7
6.8
7
8
DIGITAL INTERFACE............................................................................................................................................21
7.1
I2C SERIAL INTERFACE............................................................................................................................................. 21
SERIAL INTERFACE CONSIDERATIONS (MPU-3050).............................................................................................25
Rev Date: 03/10/2016
InvenSense Confidential & Proprietary
Page 2 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
8.1
8.2
MPU-3050 SUPPORTED INTERFACES ....................................................................................................................... 25
LOGIC LEVELS........................................................................................................................................................ 25
9
MOTION PROCESSING LIBRARY (MPL) ...............................................................................................................28
9.1
DEMO SOFTWARE.................................................................................................................................................. 29
10
ASSEMBLY......................................................................................................................................................29
10.1 ORIENTATION ....................................................................................................................................................... 29
10.2 PCB LAYOUT GUIDELINES ....................................................................................................................................... 30
10.3 TRACE ROUTING.................................................................................................................................................... 32
10.4 COMPONENT PLACEMENT ....................................................................................................................................... 32
10.5 PCB MOUNTING AND CROSS-AXIS SENSITIVITY........................................................................................................... 33
10.6 PACKAGE MARKING SPECIFICATION........................................................................................................................... 34
11
12
REGISTER MAP ...............................................................................................................................................35
REGISTER DESCRIPTION..................................................................................................................................36
12.1 REGISTER 0 – WHO AM I........................................................................................................................................ 36
12.2 REGISTER 01 – PRODUCT ID.................................................................................................................................... 37
12.3 REGISTERS 12 TO 17 – GYRO OFFSETS ...................................................................................................................... 38
12.4 REGISTER 18 – FIFO ENABLE................................................................................................................................... 39
12.5 REGISTER 19 – AUX (ACCEL) VDDIO....................................................................................................................... 39
12.6 REGISTER 20 – AUX (ACCEL) SLAVE ADDRESS ............................................................................................................ 40
12.7 REGISTER 21 – SAMPLE RATE DIVIDER....................................................................................................................... 40
12.8 REGISTER 22 – DLPF, FULL SCALE, EXTERNAL SYNC..................................................................................................... 41
12.9 REGISTER 23 – INTERRUPT CONFIGURATION............................................................................................................... 43
12.10
12.11
12.12
12.13
12.14
12.15
12.16
REGISTER 24 – AUX (ACCEL) BURST READ ADDRESS ............................................................................................... 43
REGISTER 26 – INTERRUPT STATUS ....................................................................................................................... 44
REGISTERS 27 TO 40 – SENSOR REGISTERS............................................................................................................. 44
REGISTERS 58 TO 59 – FIFO COUNT..................................................................................................................... 45
REGISTER 60 – FIFO DATA ................................................................................................................................. 45
REGISTER 61 – USER CONTROL ............................................................................................................................ 47
REGISTER 62 – POWER MANAGEMENT.................................................................................................................. 47
13
14
REFERENCE.....................................................................................................................................................49
REVISION HISTORY.........................................................................................................................................50
Rev Date: 03/10/2016
Page 3 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
1
Introduction
1.1
Purpose and Scope
This document provides a description, specifications, and design-related information for the MPU-3050
Motion Processing Unit ®. References [1], [2] and [3] provide a complementary set of software guides
for the Motion Processing Library (MPL) and describe in detail the API and System Layer routines
needed for interfacing to the MPU-3050.
Electrical characteristics are based upon simulation results and limited characterization data.
Specifications are subject to change without notice.
1.2
Product Overview
The MPU-3050 Motion Processing Unit (MPU) is the world’s first motion processing solution with
integrated 6-axis sensor fusion for smartphone applications. The MPU-3050 has an embedded 3-axis
gyroscope and Digital Motion Processor ® (DMP) hardware accelerator engine with a secondary I2C
port that interfaces to third party digital accelerometers to deliver a complete 6-axis sensor fusion output
to its primary I2C port. This combines both linear and rotational motion into a single data stream for the
application. This breakthrough in gyroscope technology provides a dramatic 68% smaller footprint, 40%
thinner package, consumes 55% less power, and has inherent cost advantages compared to the latest
competitive gyro solutions to uniquely address the fast-growing demand for 6-axis motion processing
in mobile handsets.
The MPU-3050 significantly extends and transforms motion sensing features provided by
accelerometers beyond portrait and landscape orientation, to motion processing functionality. The MPU
measures and processes both linear and rotational movements, creating a higher degree of 1:1 motion
interactivity between the user and their handset. Similar to the proliferation of Bluetooth, camera phone
image sensors and Wi-Fi, motion processing is becoming a “must-have” function in mobile handsets
benefitting wireless carriers, mobile handset OEMs, application developers and end-users. By providing
an integrated sensor fusion output, the DMP in the MPU-3050 offloads the intensive motion processing
computation requirements from the applications processor, reducing the need for frequent polling of the
motion sensor output and enabling use of low-cost, low-power application processors, thereby
increasing overall battery life of handsets. Since handsets today are of multi-function nature, MPU-3050
not only provides accurate 1:1 motion tracking for some of the more common applications such as
still/video image stabilization, gaming and dead reckoning, the 32-bit DMP can be programmed to
deliver advanced UI, e.g. multiple kinds of gestures and character recognition leading to applications
such as Airsign ®, TouchAnywhere ®, MotionCommand ®.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the
MPU-3050 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the
highest performance, lowest noise, and the lowest cost semiconductor packaging to address a wide
range of handheld consumer electronic devices.
The MPU-3050 integrates 16-bit analog-to-digital converters (ADCs), selectable low-pass filters, FIFO,
embedded temperature sensor, and Fast Mode I2C interface. Performance features include
programmable full-scale range from 250 degrees-per-second up to 2000 degrees-per-second (º/s or
dps), and low-noise of 0.01º/s/√Hz, while providing the highest robustness supporting 10,000g shock
in operation. The highest cross-axis isolation is achieved by design from its single silicon integration.
Factory-calibrated initial sensitivity reduces production-line calibration requirements. The part’s on-chip
FIFO and dedicated I2C-master accelerometer sensor bus simplifies system timing and lowers system
power consumption. The sensor bus allows the MPU-3050 to directly acquire data from the off-chip
Rev Date: 03/10/2016
Page 4 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
[1] MPL Programmer’s Guide – Application Note (AN-MPL-3000-UG-01 or later)
[2] MPL Functional Specification (DOC-MPL-FS-V2.3 or later)
[3] MPL Product Specification (PS-MPL-3000-v2.0 or later)
accelerometer without intervention from an external processor. Other industry-leading features include
a small 4 mm x 4 mm x 0.9 mm plastic QFN package, an embedded temperature sensor, programmable
interrupts, and a low 13 mW power consumption. Parts are available with I2C serial interface, a VDD
operating range of 2.1 V to 3.6 V, and a VLOGIC interface voltage from 1.71 V to 3.6 V.
The MPU-3050 supports the I2C serial interface and has a separate VLOGIC reference pin (in addition
to its analog supply pin, VDD), which sets the logic levels of its I2C interface. The VLOGIC voltage may
be between 1.71 V min to VDD max. The table below outlines these details:
Power Supply and supported interface for MPU-3050
Part / Item
MPU-3050
2.1 V to 3.6 V
1.71 V to VDD
I2C
VDD
VLOGIC
Serial Interfaces Supported
Pin 8
VLOGIC
AD0
Pin 9
Pin 23
Pin 24
SCL
SDA
1.3
Applications
•
•
•
•
Handset gaming
Location-based services, points of interest, and dead reckoning
Improved camera image quality through image stabilization
Health and sports monitoring
Rev Date: 03/10/2016
Page 5 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
2
Features
The MPU-3050 Motion Processing Unit includes a wide range of features:
2.1
Sensors
•
•
•
•
X-, Y-, Z-Axis angular rate sensors (gyros) on one integrated circuit
Digital-output temperature sensor
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
6-axis motion processing capability using secondary I2C interface to directly connect to a digital
3-axis third-party accelerometer
•
•
•
Factory calibrated scale factor
High cross-axis isolation via proprietary MEMS design
10,000g shock tolerant
2.2
2.3
Digital Output
•
•
•
Fast Mode (400 kHz) I2C serial interface
16-bit ADCs for digitizing sensor outputs
Angular rate sensors (gyros) with applications-programmable full-scale-range of ±250°/sec,
±500°/sec, ±1000°/sec, or ±2000°/sec.
Motion Processing
•
Embedded Digital Motion Processing engine supports 3D motion processing and gesture
recognition algorithms
•
When used together with a digital 3-axis third party accelerometer, the MPU-3050 collects the
accelerometer data via a dedicated interface, while synchronizing data sampling at a user defined
rate. The total data set obtained by the MPU-3050 includes 3-axis gyroscope data and 3-axis
accelerometer data, temperature data, and the one bit external sync signal connected to the
FSYNC pin. The MPU also downloads the results calculated by the digital 3-axis third party
accelerometer internal registers.
•
•
FIFO buffers complete data set, reducing timing requirements on the system processor and saving
power by letting the processor burst read the FIFO data, and then go into a low-power sleep mode
while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,
zero-motion detection, tap detection, and shake detection
•
•
•
•
Hand jitter filter
Programmable low-pass filters
Feature extraction for peak and zero-crossing detection
Pedometer functionality
2.4
2.5
Clocking
•
•
•
On-chip timing generator clock frequency +/-2% over full temperature range
Optional external clock inputs of 32.768kHz or 19.2 MHz
1 MHz clock output to synchronize with digital 3-axis accelerometer
Power
•
•
•
•
•
VDD supply voltage range of 2.1 V to 3.6 V
Flexible VLOGIC reference voltage allows for multiple I2C interface voltage
Power consumption with all three axis and DMP active: 6.1 mA
Sleep mode: 5 μA
Each axis can be individually powered down
Rev Date: 03/10/2016
Page 6 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
2.6
Package
•
4 x 4 x 0.9 mm QFN plastic package
•
•
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
Rev Date: 03/10/2016
Page 7 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
3
Electrical Characteristics
3.1
Sensor Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5 V, VLOGIC = 2.5 V, TA=25°C.
Parameter
Conditions
Min
Typical
Max
Unit
Note
s
GYRO SENSITIVITY
Full-Scale Range
FS_SEL = 0
FS_SEL = 1
FS_SEL = 2
FS_SEL = 3
±250
±500
±1000
±2000
16
º/s
4, 7
4, 7
4, 7
4, 7
3
Gyro ADC Word Length
Sensitivity Scale Factor
Bits
FS_SEL = 0
FS_SEL = 1
FS_SEL = 2
FS_SEL = 3
25°C
131
LSB/(º/s)
1
3
3
3
65.5
32.8
16.4
±2
Sensitivity Scale Factor Tolerance
-6
+6
%
%
1
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +85°C
±2
8
Nonlinearity
Best fit straight line; 25°C
0.2
2
%
%
6
6
Cross-Axis Sensitivity
GYRO ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±20
±0.15
0.2
º/s
º/s/°C
º/s
1
8
5
5
5
6
ZRO Variation Over Temperature
-40°C to +85°C
Power-Supply Sensitivity (1-10 Hz)
Power-Supply Sensitivity (10 – 250 Hz)
Power-Supply Sensitivity (250 Hz – 100 kHz)
Linear Acceleration Sensitivity
GYRO NOISE PERFORMANCE
Total RMS Noise
Sine wave, 100mVpp; VDD = 2.2 V
Sine wave, 100mVpp; VDD = 2.2 V
Sine wave, 100mVpp; VDD = 2.2 V
Static
0.2
º/s
4
º/s
0.1
º/s/g
FS_SEL=0
DLPFCFG = 2 (100 Hz)
Bandwidth 1 Hz to 10 Hz
At 10 Hz
0.1
0.033
0.01
º/s-rms
º/s-rms
º/s/√Hz
1
1
3
Low-frequency RMS noise
Rate Noise Spectral Density
GYRO MECHANICAL FREQUENCIES
X-Axis
30
27
24
33
30
27
36
33
30
kHz
kHz
kHz
1
1
1
Y-Axis
Z-Axis
GYRO START-UP TIME
ZRO Settling
DLPFCFG = 0
to ±1º/s of Final
50
ms
ºC
5
2
TEMPERATURE RANGE
Specified Temperature Range
-40
85
Notes:
1. Tested in production
2. Based on characterization of 30 parts over temperature on evaluation board or in socket
3. Based on design, through modeling and simulation across PVT
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Based on characterization of 5 parts over temperature
6. Tested on 20 parts at room temperature
7. Part is characterized to Full-Scale Range. Maximum ADC output is [216 / (Sensitivity x 2)]
Example: For Sensitivity of 131 LSB/(º/s), [216 / (131 x 2)] = ±250 º/s.
8. Based on characterization of 48 parts on evaluation board or in socket
Rev Date: 03/10/2016
Page 8 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
3.2
Electrical Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5 V, VLOGIC = 2.5 V, TA = 25°C.
Parameters
Conditions
Min
2.1
0
Typical
Max
3.6
5
Units
V
Notes
VDD POWER SUPPLY
Operating Voltage Range
2
2
1
4
Monotonic ramp. Ramp
rate is 10% to 90% of the
final value (see Figure in
Section 4.4)
Power-Supply Ramp Rate
ms
6.1
5.9
5
mA
mA
µA
Normal Operating Current
DMP disabled
Sleep Mode Current
VLOGIC REFERENCE VOLTAGE
VLOGIC must be ≤VDD at
all times
Voltage Range
1.71
VDD
1
V
Monotonic ramp. Ramp
rate is 10% to 90% of the
final value
Power-Supply Ramp Rate
ms
3, 5
Normal Operating Current
START-UP TIME FOR REGISTER
READ/WRITE
(see Figure in Section 4.4)
100
20
µA
ms
100
4
1
AD0 = 0
AD0 = 1
1101000
1101001
I2C ADDRESS
DIGITAL INPUTS (SDI, SCLK,
FSYNC, AD0, /CS, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
0.7*VDD
4
4
V
V
0.3*VDD
DIGITAL OUTPUT (INT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage
VOL.INT1, INT Low-Level Output Voltage
RLOAD = 1 MΩ
RLOAD = 1 MΩ
OPEN =1, 0.3 mA sink
current
0.9*VLOGIC
V
V
V
2
2
2
0.1*VLOGIC
0.1
Output Leakage Current
tINT, INT Pulse Width
OPEN = 1
LATCH_INT_EN = 0
100
50
nA
µs
3
3
Notes:
1. Tested in production
2. Based on characterization of 30 parts over temperature on evaluation board or in socket
3. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
4. Based on characterization of 5 parts over temperature
5. Refer to Section 4.4 for the recommended power-on procedure
Rev Date: 03/10/2016
Page 9 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
3.3
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5 V, VLOGIC = 2.5 V, TA=25°C.
Parameters
Conditions
Typical
Units
Notes
Primary I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
MPU-3050
MPU-3050
0.5V to 0.3*VLOGIC
V
V
1
1
0.7*VLOGIC to VLOGIC + 0.5 V
V
V
1
MPU-3050
0.1*VLOGIC
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
0 to 0.4
1
1
1
2
VOL = 0.4V
VOL = 0.6V
3
5
mA
mA
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Secondary I2C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
1
Cb bus capacitance in pf
ACCEL_VDDIO=0
20+0.1Cb to 250
-0.5 V to 0.3*VLOGIC
0 to 0.4
V
V
1
1
VLOGIC > 2V; 1mA sink
current
VOL1, LOW-Level Output Voltage
VLOGIC < 2V; 1mA sink
current
VOL3, LOW-Level Output Voltage
IOL, LOW-Level Output Current
0 to 0.2*VLOGIC
V
1
1
1
2
VOL = 0.4V
1
1
mA
mA
V
OL = 0.6V
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Secondary I2C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
1
Cb bus capacitance in pF
ACCEL_VDDIO = 1
20+0.1Cb to 250
-0.5 to 0.3*VDD
0.7*VDD to VDD + 0.5 V
0 to 0.4
V
V
V
1
1
1
1
1
2
VIH, HIGH-Level Input Voltage
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
1mA sink current
VOL = 0.4 V
VOL = 0.6 V
1
1
mA
mA
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
1
Cb bus cap. in pF
20+0.1Cb to 250
Notes:
1. Based on characterization of 5 parts over temperature.
2. Typical. Randomly selected part measured at room temperature on evaluation board or in socket.
Rev Date: 03/10/2016
Page 10 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
3.4
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5 V, VLOGIC = 2.5 V, TA=25°C.
Parameters
Conditions
Min
Typical
Max
Units Notes
INTERNAL CLOCK SOURCE
CLK_SEL = 0,1,2,3
DLPFCFG = 0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8
kHz
kHz
3
3
DLPFCFG = 1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1
Reference Clock Output
CLKOUTEN = 1
1.024
MHz
%
3
1
1
2
2
3
Clock Frequency Initial Tolerance
CLK_SEL = 0, 25°C
CLK_SEL = 1,2,3; 25°C
CLK_SEL = 0
-5
-1
+5
+1
%
Frequency Variation over Temperature
-15 to +10
%
CLK_SEL =1,2,3
CLK_SEL=1,2,3
+/-1
1
%
PLL Settling Time
ms
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Jitter
CLK_SEL=4
32.768
1 to 2
kHz
µs
Cycle-to-cycle rms
DLPFCFG = 0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8.192
1.024
kHz
kHz
DLPFCFG = 1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.0486
1
MHz
ms
EXTERNAL 19.2 MHz CLOCK
External Clock Frequency
CLK_SEL = 5
19.2
MHz
DLPFCFG = 0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8
1
kHz
kHz
DLPFCFG = 1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.024
1
MHz
ms
Notes:
1. Tested in production.
2. Based on characterization of 30 parts over temperature on evaluation board or in socket.
3. Typical. Randomly selected part measured at room temperature on evaluation board or in socket.
Rev Date: 03/10/2016
Page 11 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
3.5
I2C Timing Characterization
Typical Operating Circuit of Section 4.2, VDD = 2.5 V, VLOGIC = 1.8 V ± 5%, 2.5 V ± 5%, 3.0 V ± 5%, o
3.3 V ± 5%, TA=25°C.
Parameters
Conditions
Note
s
Min
Typical
Max
Units
I2C TIMING
I2C FAST-MODE
fSCL, SCL Clock Frequency
0
400
kHz
µs
1
1
tHD.STA, (Repeated) START Condition
Hold Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
1
1
1
tSU.STA, Repeated START Condition
Setup Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
0
µs
ns
ns
1
1
1
100
Cb bus cap. from 10 to
400pF
Cb bus cap. from 10 to
400pF
20+0.1Cb
300
300
tf, SDA and SCL Fall Time
20+0.1Cb
ns
1
tSU.STO, STOP Condition Setup Time
0.6
1.3
µs
µs
1
1
tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus Line
400
0.9
0.9
pF
µs
µs
tVD.DAT, Data Valid Time
1
1
tVD.ACK, Data Valid Acknowledge Time
Notes:
1. Based on characterization of 5 parts over temperature on evaluation board or in socket.
I2C Bus Timing Diagram
Rev Date: 03/10/2016
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Revision: 2.7
MPU-3050
3.6
Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to
the absolute maximum ratings conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Parameter
Rating
Supply Voltage, VDD
-0.5 V to +6 V
VLOGIC Input Voltage Level (MPU-
3050)
-0.5 V to VDD + 0.5 V
-0.5 V to 2 V
REGOUT
Input Voltage Level (CLKIN, AUX_DA,
AD0, FSYNC, INT, SCL, SDA)
-0.5 V to VDD + 0.5 V
CPOUT (2.1V ≤ VDD ≤ 3.6V )
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
-0.5 V to 30 V
10,000g for 0.3 ms
-40°C to +105°C
-40°C to +125°C
Electrostatic Discharge (ESD)
Protection
1.5 kV (HBM); 200 V
(MM)
60 mA @ 125°C
JEDEC Condition “B”
Latch-up
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Revision: 2.7
MPU-3050
4
Applications Information
Pin Out and Signal Description
MPU-
4.1
Pin Number
Pin Name
Pin Description
3050
1
6
Y
CLKIN
External reference clock input
Interface to a 3rd party accelerometer, SDA pin. Logic levels are set to be
either VDD or VLOGIC. See Section 7 for more details.
Interface to a 3rd party accelerometer, SCL pin. Logic levels are set to be
either VDD or VLOGIC. See Section 7 for more details.
Y
Y
AUX_DA
7
AUX_CL
8
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
VLOGIC
AD0
Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.
I2C Slave Address LSB
9
10
11
12
13
18
19
20
21
22
23
24
REGOUT
FSYNC
INT
Regulator filter capacitor connection
Frame synchronization digital input
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
VDD
GND
RESV
CPOUT
RESV
CLKOUT
SCL
Reserved. Do not connect.
Charge pump capacitor connection
Reserved. Do not connect.
1 MHz clock output for third-party accelerometer synchronization
I2C serial clock
I2C serial data
SDA
2, 3, 4, 5, 14,
15, 16, 17
Y
NC
Not internally connected. May be used for PCB trace routing.
24 23 22 21 20 19
CLKIN
NC
1
2
3
4
5
6
18 GND
+Z
17 NC
NC
16 NC
MPU
MPU-3050
-
3050
NC
15 NC
14 NC
13 VDD
NC
AUX_DA
+Y
+X
7
8
9
10 11 12
Orientation of Axes of Sensitivity
and Polarity of Rotation
QFN Package (Top View)
24-pin, 4mm x 4mm x 0.9mm
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MPU-3050
4.2
Typical Operating Circuits
GND
C3
2.2nF
24 23 22 21 20 19
1
2
3
4
5
6
18
17
16
15
14
13
CLKIN
GND
MPU-3050
VDD
AUX_DA
7
8
9
10 11 12
C2
0.1µF
AUX_CL
VLOGIC
GND
C1
0.1µF
C4
10nF
GND
GND
Typical Operating Circuit
4.3
Bill of Materials for External Components
Component
Label
C1
Specification
Quantity
VDD Bypass Capacitor
Regulator Filter Capacitor
Charge Pump Capacitor
VLOGIC Bypass Capacitor
Ceramic, X7R, 0.1 µF ±10%, 4 V
Ceramic, X7R, 0.1 µF ±10%, 2 V
Ceramic, X7R, 2.2 nF ±10%, 50 V
Ceramic, X7R, 10 nF ±10%, 4 V
1
1
1
1
C2
C3
C4
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MPU-3050
4.4
Recommended Power-on Procedure
Power-Up Sequencing
1. TVDDR is VDD rise time: Time for VDD to
rise from 10% to 90% of its final value.
TVDDR
90%
2. TVDDR is ≤ 10 msec.
3. TVDDR is VLOGIC rise time: Time for
VLOGIC to rise from 10% to 90% of its
final value.
10%
VDD
TVLGR
90%
4. TVLGR is ≤ 1 msec.
5. TVLG-VDD is the delay from the start of
VDD ramp to the start of VLOGIC rise.
10%
6. TVLG-VDD is 0 to 20 msec but VLOGIC
amplitude must always be ≤ VDD
amplitude.
VLOGIC
TVLG - VDD
7. VDD and VLOGIC must be monotonic
ramps.
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Document Number: PS-MPU-3050A-00
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MPU-3050
5
Functional Overview
5.1
Block Diagram
1
12
CLKIN
CLKOUT
INT
Clock
MPU-3050
CLOCK
Interrupt
Status
22
Register
Primary
I2C or SPI
Serial
9
23
24
AD0
SCL
SDA
Signal
Conditioning
X Gyro
Y Gyro
Z Gyro
ADC
ADC
ADC
FIFO
Interface
Signal
Conditioning
Config
Register
7
6
Secondary
Interface
Bypass
Mux
Secondary
I2C Serial
Interface
AUX_CL
AUX_DA
Signal
Conditioning
Sensor
Register
11
FSYNC
OTP
Digital
Motion
Processor
(DMP)
Charge
Pump
Bias & LDO
20
13
8
18
10
CPOUT
VDD
VLOGIC GND
REGOUT
5.2
Overview
The MPU-3050 is comprised of the following key blocks / functions:
•
•
•
•
•
•
•
•
•
•
•
Three-axis MEMS rate gyroscope sensors with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP)
Primary I2C serial communications interface
Secondary I2C serial interface for 3rd party accelerometer
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDO
Charge Pump
5.3
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-3050 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X, Y, and Z axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to
produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors may
be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). ADC sample rate is
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MPU-3050
programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-
pass filters enable a wide range of cut-off frequencies.
5.4 Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-3050 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
gyroscopes, and additional sensors such as magnetometers, and processes the data. The resulting data can
be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to some of MPU’s
external pins, which can be used for synchronizing external devices to the motion sensors, or generating
interrupts for the application.
The purpose of the DMP is to offload both timing requirements and processing power from the host processor.
Typically, motion processing algorithms should be run at a high rate, often around 200 Hz, in order to provide
accurate results with low latency. This is required even if the application updates at a much lower rate; for
example, a low power user interface may update as slowly as 5 Hz, but the motion processing should still run
at 200 Hz. The DMP can be used as a tool in order to minimize power, simplify timing and software architecture,
and save valuable MIPS on the host processor for use in the application.
5.5
Primary I2C Serial Communications Interface
The MPU-3050 communicates to a system processor using I2C serial interface, and the device always acts
as a slave when communicating to the system processor. The logic level for communications to the master is
set by the voltage on the VLOGIC pin. The LSB of the I2C slave address is set by pin 9 (AD0).
5.6
Secondary I2C Serial Interface (for a third-party Accelerometer)
The MPU-3050 has a secondary I2C bus for communicating to an off-chip 3-axis digital output accelerometer.
This bus has two operating modes: I2C Master Mode, where the MPU-3050 acts as a master to an external
accelerometer connected to the secondary I2C bus; and Pass-Through Mode, where the MPU-3050 directly
connects the primary and secondary I2C buses together, to allow the system processor to directly communicate
with the external accelerometer.
Secondary I2C Bus Modes of Operation:
•
I2C Master Mode: allows the MPU-3050 to directly access the data registers of an external digital
accelerometer. In this mode, the MPU-3050 directly obtains sensor data from accelerometers and
optionally, another sensor (such as a magnetometer), thus allowing the on-chip DMP to generate
sensor fusion data without intervention from the system applications processor. In I2C master mode,
the MPU-3050 can be configured to perform burst reads, returning the following data from the
accelerometer:
.
.
.
X accelerometer data (2 bytes)
Y accelerometer data (2 bytes)
Z accelerometer data (2 bytes)
•
Pass-Through Mode: allows an external system processor to act as master and directly communicate
to the external accelerometer connected to the secondary I2C bus pins (AUX_DA and AUX_CL). This
is useful for configuring the accelerometers, or for keeping the MPU-3050 in a low-power mode, when
only accelerometers are to be used. In this mode, the secondary I2C bus control logic (third-party
accelerometer Interface block) of the MPU-3050 is disabled, and the secondary I2C pins AUX_DA and
AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24) through analog switches.
Secondary I2C Bus IO Logic Levels
The logic levels of the secondary I2C bus can be programmed to be either VDD or VLOGIC (see Sections 7
and 8).
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MPU-3050
6
Clocking
6.1
Internal Clock Generation
The MPU-3050 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for
the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
•
•
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with an accuracy of ±2% over temperature)
Allowable external clocking sources are:
•
•
32.768 kHz square wave
19.2 MHz square wave
Which source to select for generating the internal synchronous clock depends on the availability of external
sources and the requirements for power consumption and clock accuracy. Most likely, these requirements will
vary by mode of operation. For example, in one mode, where the biggest concern is power consumption, one
may wish to operate the Digital Motion Processor of the MPU-3050 to process accelerometer data, while
keeping the gyros off. In this case, the internal relaxation oscillator is a good clock choice. However, in another
mode, where the gyros are active, selecting the gyros as the clock source provides for a more accurate clock
source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (or by extension, by any processor).
There are also start-up conditions to consider. When the MPU-3050 first starts up, the device operates off of
its internal clock, until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
6.2
Clock Output
In addition, the MPU-3050 provides a clock output, which allows the device to operate synchronously with an
external digital 3-axis accelerometer. Operating synchronously provides for higher-quality sensor fusion data,
since the sampling instant for the sensor data can be set to be coincident for all sensors.
6.3
Sensor Data Registers
The sensor data registers contain the latest gyro and temperature data. They are read-only registers, and are
accessed via the Serial Interface. Data from these registers may be read anytime, however, the interrupt
function may be used to determine when new data is available.
6.4
FIFO
The MPU-3050 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines what data goes into it, with possible choices being gyro data, accelerometer
data, temperature readings, auxiliary ADC readings, and FSYNC input. A FIFO counter keeps track of how
many bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt
function may be used to determine when new data is available.
6.5
Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) Digital Motion Processor Done (programmable function); (3) new data is available to be read
(from the FIFO and Data registers); and (4) the MPU-3050 did not receive an acknowledge from the
accelerometer on the Secondary I2C bus. The interrupt status can be read from the Interrupt Status register.
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MPU-3050
6.6
Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-3050. Its two inputs are an unregulated VDD of 2.1 V to 3.6 V and a VLOGIC logic reference supply
voltage of 1.71 V to VDD. The LDO output is bypassed by a 0.1 µF capacitor at REGOUT.
6.7
Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is bypassed
by a 2.2 nF capacitor at CPOUT.
6.8
Chip Version
The chip version is written into OTP memory that is accessed using Register 1 (PRODUCT_ID).
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MPU-3050
7
Digital Interface
7.1
I2C Serial Interface
The internal registers and memory of the MPU-3050 can be accessed using I2C.
Serial Interface
Pin Number MPU-3050
Pin Name
Pin Description
Digital I/O supply voltage. VLOGIC must be ≤ VDD at all
times.
8
Y
VLOGIC
9
Y
Y
Y
AD0
SCL
SDA
I2C Slave Address LSB
I2C serial clock
I2C serial data
23
24
7.1.1 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can be
a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-3050 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-3050 is b110100X which is 7 bits long. The LSB bit of the 7-bit address is
determined by the logic level on pin ADO. This allows two MPU-3050s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin ADO is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high). The I2C address is stored in
register 0 (WHO_AM_I register).
I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
SDA
SCL
S
P
START condition
STOP condition
START and STOP Conditions
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MPU-3050
Data Format / Acknowledge
I2C data bytes are defined to be 8 bits long. There is no restriction to the number of bytes transmitted per data
transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed,
it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave
is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Acknowledge on the I2C Bus
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed
by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is
writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK)
from the slave device. Each byte transferred must be followed by an acknowledge bit. To acknowledge, the
slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line. Data transmission
is always terminated by the master with a STOP condition (P), thus freeing the communications line. However,
the master can generate a repeated START condition (Sr), and address another slave without first generating
a STOP condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition.
All SDA changes should take place when SCL is low, with the exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Complete I2C Data Transfer
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MPU-3050
To write the internal MPU-3050 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-3050 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-3050 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last ACK
signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-3050 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
ACK
To read the internal MPU-3050 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-3050, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-3050 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK) signal
and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the 9th clock
cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
ACK
DATA
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MPU-3050
I2C Terms
Signal
S
Description
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
AD
W
Write bit (0)
R
Read bit (1)
ACK
NACK
RA
Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle
Not-Acknowledge: SDA line stays high at the 9th clock cycle
MPU-3050 internal register address
Transmit or received data
DATA
P
Stop condition: SDA going from low to high while SCL is high
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Revision: 2.7
MPU-3050
8
Serial Interface Considerations (MPU-3050)
8.1
MPU-3050 Supported Interfaces
The MPU-3050 supports I2C communications on both its primary (microprocessor) serial interface and its
secondary (accelerometer) interface.
8.2
Logic Levels
The MPU-3050 I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.
I/O Logic Levels vs. AUX_VDDIO (bit 2, Register 19 – Accelerometer Burst Read Address)
ACCELEROMETER LOGIC LEVELS
MICROPROCESSOR LOGIC LEVELS
AUX_VDDIO
(Pins: SDA, SCL, AD0,CLKIN, INT)
(Pins: AUX_DA, AUX_CL)
0
1
VLOGIC
VLOGIC
VLOGIC
VDD
Notes:
1. CLKOUT has logic levels that are always referenced to VDD.
2. The power-on-reset value for AUX_VDDIO is 0.
VLOGIC may be set to be equal to VDD or to another voltage, such that at all times VLOGIC is ≤ VDD. When
AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the power supply voltage for both the
microprocessor system bus and the accelerometer secondary bus, as shown in the figure of Section 8.2.1.
When AUX_VDDIO is set to 1, VLOGIC is the power supply voltage for the microprocessor system bus and
VDD is the supply for the accelerometer secondary bus, as shown in the figure of Section 8.2.2.
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MPU-3050
8.2.1 AUX_VDDIO = 0
The figure below shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration
will depend on the type of third-party accelerometer used.
VLOGIC
(0V - VLOGIC)
SYSTEM BUS
System
Processor
IO
VDD
VLOGIC
VLOGIC
VDD
(0V - VLOGIC)
INT
VLOGIC
(0V - VLOGIC)
(0V - VLOGIC)
I2C
Master IO
SDA
SCL
(0V - VLOGIC)
(0V - VLOGIC)
CLKIN
FSYNC
VLOGIC
MPU-3050
0V - VDD
No connect
CLKOUT
VLOGIC
AD0
CS
(0V - VLOGIC)
(0V - VLOGIC)
3rd Party
Accel
(0V - VLOGIC)
(0V - VLOGIC)
INT 1
INT 2
AUX_DA
AUX_CL
SDA
SCL
(0V, VLOGIC)
(0V, VLOGIC)
SA0
Notes:
1. AUX_VDDIO is bit 7 in Register 24, and determines the IO voltage levels of AUX_DA and AUX_CL (0
= set output levels relative to VLOGIC)
2. CLKOUT is always referenced to VDD
3. Other MPU-3050 logic IO are always referenced to VLOGIC
I/O Levels and Connections for AUX_VDDIO = 0
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MPU-3050
8.2.2 AUX_VDDIO = 1
When AUX_VDDIO is set to 1 by the user, VLOGIC is the power supply voltage for the microprocessor system
bus and VDD is the power supply for the accelerometer secondary bus, as shown in the figure below. This is
useful when interfacing to a third-party accelerometer where there is only one supply for both the logic and
analog sections of the 3rd party accelerometer..
VLOGIC
(0V - VLOGIC)
SYSTEM BUS
System
Processor
IO
VDD
VLOGIC
VLOGIC
(0V - VLOGIC)
INT
(0V - VLOGIC)
(0V - VLOGIC)
VLOGIC
I2C
Master IO
SDA
SCL
(0V - VLOGIC)
(0V - VLOGIC)
CLKIN
VDD
FSYNC
VLOGIC
MPU-3050
VLOGIC
AD0
INT 1
0V - VDD
DIO
CLKOUT
(0V - VLOGIC)
(0V - VLOGIC)
INT 2
0V - VDD
0V - VDD
AUX_DA
AUX_CL
SDA
SCL
(0V, VLOGIC)
3rd Party
Accel
0V - VDD
ADDR
Voltage/
Configuration
Configuration 1
Configuration 2
VLOGIC
1.8V±5%
2.5V±5%
1
3.0V±5%
3.0V±5%
1
VDD
AUX_VDDIO
Notes:
1. AUX_VDDIO is bit 7 in Register 24, and determines the IO voltage levels of AUX_DA and
AUX_CL (1 = set output levels relative to VDD)
2. CLKOUT is always referenced to VDD
3. Other MPU-3050 logic IO are always referenced to VLOGIC
4. Third-party accelerometer logic levels are referenced to VDD; setting INT1 and INT2 to open-
drain configuration provides voltage compatibility when VDD ≠ VLOGIC.
When VDD = VLOGIC, INT1 and INT2 may be set to push-pull outputs, and the external pull-up
resistors will not be needed.
I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Note: Actual configuration will depend on the type of third-party accelerometer used.
Rev Date: 03/10/2016
Page 27 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
9
Motion Processing Library (MPL)
To assist in the rapid development and deployment of products using the MPU-3050, InvenSense provides a
Motion Processing Library (MPL) file that has been compiled to work the hardware and software environment
specific to InvenSense devices.
The MPL contains the core algorithm engines for motion processing, and includes an API layer which provides
a simple interface into using these engines (see figure below).
User Application
API
ML – Motion Library
MPL
Sensor fusion, bias tracking, etc.
Completely independent
of platform
MLDL – Driver Layer
Configure sampling, set modes, get data, etc.
Predefined functions
implemented by
customers for their
platform
MLSL – System Layer
TV, Game
Console, PC
Serial I/O
NVM
OS info
I2C/SPI
IMU
IMU
-
3000
3050
Time
delay, etc.
-
File I/O
MPL Interfacing with Hardware Devices and Application Level
The MPL communicates with the System Layer, which is a platform-specific interface into the hardware and
software environment; this System Layer software must be implemented by the customer – for his particular
environment. InvenSense provides shell functions to speed up the development of this System Layer software.
The MPL is independent of the Operating System (OS) since the System Layer software handles OS-specific
requirements.
The purpose of the DMP is to offload both timing requirements and processing power from the host processor.
Typically, raw data integration (sensor fusion) should be run at a high rate, often around 200Hz, in order to
provide accurate results with low latency. This is required even if the application updates at a much lower rate;
for example, a low power user interface may update as slowly as 5Hz, but the sensor fusion should still run at
200Hz. The DMP can be used as a tool in order to minimize power, simplify timing and software architecture,
and save valuable MIPS on the host processor for use in the application.
A complementary software guide, MPU-3000 MPL Functional Specification Version 1.0, describes in detail the
API and System Layer routines needed for interfacing to the MPU-3050.
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
9.1
Demo Software
InvenSense provides demonstration software that runs on a PC running Windows XP. This software works in
conjunction with the hardware shown in the figure shown above. The PC demo software provides the
functionality that allows a user to become familiar with the use of gyros and accelerometers.
10 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) devices packaged in QFN package.
The following six best practices will ensure higher quality in assembly.
1. Do not leave parts out of the original moisture-sealed bags for more than 48 hours before assembly
2. Do not solder the center pad
3. Do not place large insertion components, such as buttons, switches, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro
4. Do use Electrostatic Discharge (ESD) protection at or better than 200V, preferably 150V, to prevent
Machine Model (MM) type ESD damage
5. Do use ESD protection measures to ensure that personnel prevent Human Body Model (HBM) type
ESD damage
6. Do not mechanically impact or shock the package in any of the production processes
10.1 Orientation
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation.
+Z
MPU
-
3050
+Y
+X
Orientation of Axes of Sensitivity and Polarity of Rotation
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
10.2 PCB Layout Guidelines
10.2.1 Package Dimensions
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
10.2.2 PCB Design Guidelines:
The Pad Diagram is shown in Figure 2 using a JEDEC type extension with solder rising on the outer edge.
The Pad Dimensions Table shows pad sizing (mean dimensions) for the MPU-3050 product.
JEDEC type extension with solder rising on outer edge
PIN 1 INDENT
Pad Diagram
Nominal Package I/O Pad Dimensions (mm)
Pad Pitch (a)
0.50
Pad Width (b)
0.30
0.40
0.35
2.80
3.00
Pad Length (L1)
Pad Length (L3)
Exposed Pad Width (X)
Exposed Pad Length (Y)
I/O Land Design Dimensions Guidelines (mm)
Land Width (c)
0.35
0.40
0.05
0.80
0.75
Outward Extension (Tout)
Inward Extension (Tin)
Land Length (L2)
Land Length (L4)
Pad Dimensions Table
Rev Date: 03/10/2016
Page 31 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming
from the PCB. This PCB stress is minimized with simple design rules:
1. Component Placement – Testing indicates that there are no specific design considerations other than
generally accepted industry design practices for component placement near the MPU-3050 gyroscope to
prevent noise coupling and thermo-mechanical stress.
2. The area below the MEMS gyro (on the same side of the board) must be defined as a keep-out area. It is
strongly recommended to not place any structure in top metal layer underneath the keep-out area.
3. Traces connected to pads should be as much symmetric as possible. Symmetry and balance for pad
connection will help component self-alignment and will lead to better control of solder paste reduction
after reflow.
4. Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the
package of frequencies from DC to 1MHz do not affect the operation of the MEMS gyro. However,
routing traces or vias under the MEMS gyro package such that they run under the exposed die pad is
prohibited.
5. To achieve best performance over temperature and to prevent thermo-mechanical package stress, do
not place large insertion components like buttons, connectors, or shielding boxes at a distance of less
than 6 mm from the MEMS gyro.
10.2.3 Exposed Die Pad Precautions
The MPU-3050 has very low active and standby current consumption. The exposed die pad is not required
for heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance
changes due to package thermo-mechanical stress. There is no electrical connection between the pad and
the CMOS.
10.2.4 Gyro Removal from PCB
Never apply high mechanical force while removing MEMS gyros from PCB. Otherwise, the QFN package
leads can be removed and failure analysis of the gyro unit will be impossible. Tweezers are practical.
Do not apply a pulling force upward. Instead apply a gentle force sideward while heating. When sufficient
heat has been applied, the unit will start to slide sideways and can now be pulled gently upwards with the
tweezers.
In any case, mechanical or thermo-mechanical overstress during manual handling and soldering, (especially
contact between the soldering iron or hot air gun and the package) has to be avoided.
If safe removal of the suspected component is not possible or deemed too risky, send the whole PCB or the
part of the PCB containing the defective component back to InvenSense. If requested, we will return the PCB
after we have removed the gyro.
10.3 Trace Routing
Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the package
of frequencies from DC to 1 MHz do not affect the operation of the MEMS gyro. However, routing traces or
vias under the MEMS gyro package such that they run under the exposed die pad is prohibited.
10.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-3050 to prevent noise coupling and thermo-mechanical stress.
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
10.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about another axis, for example, the X-axis gyroscope responding to
rotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below.
Z
Φ
Y
MPU
-
3050
X
Θ
Package Gyro Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope’s sensitivity for a
given orientation error.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
(sinθ or sinΦ)
0º
0.5º
1º
0%
0.87%
1.75%
The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with
respect to the package.
Rev Date: 03/10/2016
Page 33 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
10.6 Package Marking Specification
TOP VIEW
InvenSense
MPU-30X0
Lot traceability code
XXXXXX-XX
XX YYWW X
Foundry code
Package Vendor Code
Rev Code
YY = Year Code
WW = Work Week
Package Marking Specification
Rev Date: 03/10/2016
Page 34 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
11 Register Map
Addr
(Hex)
Addr
(Decimal)
Register Name
R/W
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
I2C_IF_
DIS
0
0
WHO_AM_I
R/W
ID
-
1
C
1
PRODUCT_ID
X_OFFS_USRH
X_OFFS_USRL
Y_OFFS_USRH
Y_OFFS_USRL
Z_OFFS_USRH
Z_OFFS_USRL
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PART_NUM
VERSION
12
13
14
15
16
17
X_OFF_H
X_OFF_L
D
E
Y_OFFS_H
Y_OFFS_L
Z_OFFS_H
Z_OFFS_L
F
10
11
FIFO_
FOOTER
TEMP_
OUT
GYRO_
XOUT
GYRO_
YOUT
GYRO_
ZOUT
AUX_
XOUT
AUX_
YOUT
AUX_
ZOUT
12
13
14
18
19
20
FIFO_EN
R/W
R/W
R/W
AUX_
VDDIO
AUX_VDDIO
0
0
0
0
0
0
0
AUX_SLV_
ADDR
CLKOUT
EN
AUX_ID
15
16
21
22
SMPLRT_DIV
R/W
R/W
SMPLRT_DIV
FS_SEL
DLPF_FS_SYNC
EXT_SYNC_SET
OPEN
DLPF_CFG
INT_
MPU_
RDY_
EN
DMP_
DONE
_EN
LATCH_
INT_EN
RAW_
RDY_ EN
17
18
1A
23
24
26
INT_CFG
AUX_ADDR
INT_STATUS
R/W
R/W
R
ACTL
ANYRD_
2CLEAR
-
BURST_ADDR
RAW_
DATA_
RDY
MPU_
RDY
DMP_
DONE
-
-
-
-
-
1D
1E
1F
20
21
22
23
24
25
26
27
28
3A
3B
3C
29
30
31
32
33
34
35
36
37
38
39
40
58
59
60
GYRO_XOUT_H
GYRO_XOUT_L
GYRO_YOUT_H
GYRO_YOUT_L
GYRO_ZOUT_H
GYRO_ZOUT_L
AUX_XOUT_H
AUX_XOUT_L
AUX_YOUT_H
AUX_YOUT_L
AUX_ZOUT_H
AUX_ZOUT_H
FIFO_COUNTH
FIFO_COUNTL
FIFO_R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
GYRO_XOUT_H
GYRO_XOUT_L
GYRO_YOUT_H
GYRO_YOUT_L
GYRO_ZOUT_H
GYRO_ZOUT_L
AUX_XOUT_H
AUX_XOUT_L
AUX_YOUT_H
AUX_YOUT_L
AUX_ZOUT_H
AUX_ZOUT_L
-
-
-
-
-
-
-
FIFO_COUNT_H
FIFO_COUNT_L
FIFO_DATA
AUX_IF_
AUX_IF_
EN
FIFO_
RST
3D
3E
61
62
USER_CTRL
PWR_MGM
R/W
R/W
FIFO_ EN
-
-
GYRO_RST
RST
H_RESET
SLEEP
STBY_XG STBY_YG STBY_ZG
CLK_SEL
Rev Date: 03/10/2016
Page 35 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12 Register Description
This section details each register within the InvenSense MPU-30X0 gyroscope. Note that any bit that is not
defined should be set to zero in order to be compatible with future InvenSense devices.
The register space allows single-byte reads and writes, as well as burst reads and writes. When performing
burst reads or writes, the memory pointer will increment until either (1) reading or writing is terminated by the
master, or (2) the memory pointer reaches an indirect-read or indirect read/write register (registers 57 and 60).
12.1 Register 0 – Who Am I
Type: Read/Write
Register
(Hex)
Register
Default
Value
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
0
0
I2C_IF_ DIS
ID
-
68 h
Description:
This register is used to verify the identity of the device, and to enable/disable the I2C interface.
Parameters:
I2C_IF_DIS
ID
Setting this bit disables I2C access mode.
Contains the I2C address of the device, which can also be changed by writing to this
register.
The Power-On-Reset value of Bit6: Bit1 is 110 100.
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.2 Register 01 – Product ID
Type: Read/Write
Register
(Decimal)
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
VERSION
Bit1
Bit0
1
1
PART_NUM
Description:
This register is used to read the part number and silicon version of the MPU-3050.
The PART_NUM parameter lists the part number for the device, and its value is interpreted as
follows:
PART_NUM
PART_NUM
Device Part Number
0
1
Reserved
MPU-3000
Reserved
MPU-3050
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
2
3
4
5
6
7
8
9
10
11
12
13
14
15
The VERSION parameter lists the silicon version for the device, and its value is interpreted as follows:
VERSION
Part Package
VERSION
Description
Label
0
1
2
3
4
5
6
n/a
n/a
n/a
n/a
n/a
n/a
n/a
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
MPU-3000/3050
(G)
7
8
All-layer CMOS change – preproduction units
Trim update
MPU-3000/3050
(G)
9
10
11
12
13
MPU-3000/3050 (J) CMOS metal change
MPU-3000/3050 (J) Trim Update
Changed auxiliary slave addressing scheme to 8-bit;
relocated auxiliary interface voltage selection bit accordingly.
14
15
MPU-3000/3050 (K)
n/a = not applicable
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
Parameters:
PART_NUM
VERSION
Part number
Part version
12.3 Registers 12 to 17 – Gyro Offsets
Type: Read/Write
Register
(Decimal)
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
C
D
12
13
14
15
16
17
X_OFFS_H
X_OFFS_L
Y_OFFS_H
Y_OFFS_L
Z_OFFS_H
Z_OFFS_L
E
F
10
11
Description:
These registers are used to remove DC bias from the sensor outputs. The values in these registers
are subtracted from the gyro sensor values before going into the sensor registers (see registers 27 to
34).
Parameters:
X_OFFS_H/L 16-bit offset (high and low bytes) of X gyro offset (2’s complement)
Y_OFFS_H/L 16-bit offset (high and low bytes) of Y gyro offset (2’s complement)
Z_OFFS_H/L 16-bit offset (high and low bytes) of Z gyro offset (2’s complement)
Rev Date: 03/10/2016
Page 38 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.4 Register 18 – FIFO Enable
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
FIFO_
FOOTER
00h
GYRO_
XOUT
GYRO_
YOUT
GYRO_
ZOUT
AUX_
XOUT
AUX_
YOUT
AUX_
ZOUT
12
18
-
Description:
This register determines what data goes into the MPU-3050 FIFO, which is a 512-byte First-In-First-
Out buffer (see register 60). Sensor data is automatically placed into the FIFO after each ADC
sampling period is complete. The ADC sample rate is controlled by register 21.
The order at which the data is put into the FIFO is from MSB to LSB, which means that it will match
the order shown in the parameter detail below. Two bytes are used for each reading. For example, if
Gyro X, Gyro Y, Gyro Z, and FIFO_FOOTER are configured to go into the FIFO, then each sample
period the following 8 bytes would be inserted into the FIFO, as shown below:
Gyro
X high X low
byte byte
Gyro
Gyro
Y high Y low
byte byte
Gyro
Gyro
Z high Z low
byte byte
Gyro
FIFO_FOOTER FIFO_FOOTER Low
High byte byte
Parameters:
GYRO_XOUT
GYRO_YOUT
GYRO_ZOUT
AUX_XOUT
AUX_YOUT
AUX_ZOUT
FIFO_FOOTER
Setting this inserts the X Gyro reading into FIFO
Setting this inserts the Y Gyro reading into FIFO
Setting this inserts the Z Gyro reading into FIFO
Setting this inserts the X Accelerometer reading into FIFO
Setting this inserts the Y Accelerometer reading into FIFO
Setting this inserts the Z Accelerometer reading into FIFO
Last word (2 bytes) for FIFO read. Described in more detail in register 60
12.5 Register 19 – AUX (Accel) VDDIO
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
AUX_
VDDIO
13
19
0
0
0
0
0
0
0
00h
Description:
This register determines the I/O logic levels for the secondary I2C bus clock and data lines (AUX_CL,
AUX_DA). 1=VDD, 0=VLOGIC.
Parameters:
AUX_VDDIO
I/O logic levels for the secondary I2C bus clock and data lines (AUX_CL,
AUX_DA). 1=VDD, 0=VLOGIC.
0
Load zeros into Bits 0, 1, 3-7.
Rev Date: 03/10/2016
Page 39 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.6 Register 20 – AUX (Accel) Slave Address
Type: Read/Write
Register
(Hex)
14
Register
(Decimal)
20
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Default
value
00h
CLKOUT_EN
AUX_ID
Description:
This register contains the 7-bit slave address of the external accelerometer device. This address is
used to access the accel device so that its sensor reading can be automatically read during each
sample period at the same time as the gyro sensors.
When reading the accel sensor registers, the MPU-3050 takes over the secondary I2C bus, as a master
to the accel device, performing a burst read of the sensor registers. For this interface to be active, the
AUX_IF_EN flag in the User Control register (61) must be cleared (set to 0).
Whenever changing this register, the accel interface must be reset to take effect. Refer to the User
Control register (61).
Parameters:
AUX_ID
Contains the I2C address of the device, which can also be changed by writing to this
register.
CLKOUT_EN 1 – Reference clock output is provided at CLKOUT pin.
0 – Function is disabled.
12.7 Register 21 – Sample Rate Divider
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
15
21
SMPLRT_DIV
00h
Description:
This register determines the sample rate of the MPU-3050 gyros. The analog gyros are sampled
internally at either 1 kHz or 8 kHz, determined by the DLPF_CFG setting (see register 22). This
sampling is then filtered digitally and delivered into the sensor registers after the number of cycles
determined by this register. The sample rate is given by the following formula:
Fsample = Finternal / (divider+1), where Finternal is either 1 kHz or 8 kHz
As an example, if the internal sampling is at 1 kHz, then setting this register to 7 would give the
following:
Fsample = 1 kHz / (7 + 1) = 125 Hz, or 8 ms per sample
Parameters:
SMPLRT_DIV Sample rate divider: 0 to 255
Rev Date: 03/10/2016
Page 40 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.8 Register 22 – DLPF, Full Scale, External Sync
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
16
22
EXT_SYNC_SET
FS_SEL
DLPF_CFG
00h
Description:
This register configures several parameters related to the sensor acquisition.
The EXT_SYNC_SET parameter allows capturing the state of the external frame synchronization input
pin (FSYNC, pin 11). The value of this input can be inserted into the LSB of one of the sensor registers.
The register chosen is as follows:
EXT_SYNC_SET
EXT_SYNC_SET
Register
0
1
2
3
4
5
6
7
No sync (default)
TEMP_OUT_L[0]
GYRO_XOUT_L[0]
GYRO_YOUT_L[0]
GYRO_ZOUT_L[0]
AUX_XOUT_L[0]
AUX_YOUT_L[0]
AUX_ZOUT_L[0]
The FS_SEL parameter allows setting the full-scale range of the gyro sensors, as described in the
table below.
FS_SEL
FS_SEL
Gyro Full-Scale Range
±250°/sec
0
1
2
3
±500°/sec
±1000°/sec
±2000°/sec
The DLPF_CFG parameter sets the digital low pass filter configuration. It also determines the
internal analog sampling rate used by the device as shown in the table below.
DLPF_CFG
DLPF_CFG
Low Pass Filter Bandwidth
Analog Sample Rate
0
1
2
3
4
5
6
256Hz
188Hz
98Hz
42Hz
20Hz
10Hz
5Hz
8kHz
1kHz
1kHz
1kHz
1kHz
1kHz
1kHz
Parameters:
EXT_SYNC_SET Routing for the external frame synchronization input bit
FS_SEL
DLPF_CFG
Full scale selection for gyro sensor data
Digital low pass filter configuration
Rev Date: 03/10/2016
Page 41 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
DLPF Characteristics: The gain and phase responses of the digital low pass filter settings
(DLPF_CFG) are shown below:
Bode Diagram
0
-10
-20
-30
-40
-50
6
5
4
3 2 1 0
0
-45
6
5
4
3
2
1
0
-90
100
101
102
Frequency (Hz)
103
Gain and Phase vs. Digital Filter Setting
Bode Diagram
2
0
-2
-4
6
5
4
3
2
1 0
-6
0
-5
-10
-15
6
5
4
3
2
1
0
100
101
102
Frequency (Hz)
103
Gain and Phase vs. Digital Filter Setting, Showing Passband Details
Rev Date: 03/10/2016
Page 42 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.9 Register 23 – Interrupt Configuration
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
INT_
ANYRD_
2CLEAR
MPU_
RDY_
EN
DMP_
DONE
_EN
RAW_
RDY_
EN
LATCH_
INT_EN
17
23
ACTL
OPEN
-
00h
Description:
This register configures the interrupt operation of the MPU-3050. The interrupt output pin (INT)
configuration can be set, the interrupt latching/clearing method can be set, and the triggers for the
interrupt can be set. If LATCH_INT_EN = 1, the INT pin is held active until the interrupt status register
is cleared.
Note that if the application requires reading every sample of data from the MPU-3050, it is best to
enable the raw data ready interrupt (RAW_RDY_EN). This allows the application to know when new
sample data is available.
Parameters:
ACTL
OPEN
LATCH_INT_EN
Logic level for INT output pin – 1=active low, 0=active high
Drive type for INT output pin – 1=open drain, 0=push-pull
Latch mode – 1=latch until interrupt is cleared, 0=50us pulse
INT_ANYRD_2CLEAR Interrupt status register clear method – 1=clear by reading any register,
0=clear by reading interrupt status register (26) only
MPU_RDY_EN
Enable interrupt when device is ready (PLL ready after changing clock
source)
DMP_DONE_EN
RAW_RDY_EN
Enable interrupt when DMP is done (programmable functionality)
Enable interrupt when data is available
12.10 Register 24 – AUX (Accel) Burst Read Address
Type: Read only
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
18
24
BURST_ADDR
00h
Description:
This register configures the burst-mode-read starting address for an accelerometer attached to the
secondary I2C bus of the MPU-3000/3050.
Parameters:
BURST_ADDR Burst-mode read starting address for external accelerometer attached to secondary
I2C bus of the MPU-3000/3050. This is the starting address of the accelerometer
which the MPU could use to read from.
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.11 Register 26 – Interrupt Status
Type: Read only
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
RAW_
DATA_
RDY
MPU_
RDY
DMP_
DONE
1A
26
-
-
-
-
-
00h
Description:
This register is used to determine the status of the MPU-3050 interrupt. Whenever one of the interrupt
sources is triggered, the corresponding bit will be set. The polarity of the interrupt pin (active high/low)
and the latch type (pulse or latch) has no effect on these status bits.
In normal use, the RAW_DATA_RDY interrupt is used to determine when new sensor data is available
in either the sensor registers (27 to 34) or in the FIFO (60).
Interrupt Status bits get cleared as determined by INT_ANYRD_2CLEAR in the interrupt configuration
register (23).
Parameters:
MPU_RDY
PLL ready
DMP_DONE
Digital Motion Processor (DMP) is done
RAW_DATA_RDY Raw data or FIFO data is ready
12.12 Registers 27 to 40 – Sensor Registers
Type: Read only
Register
Default
Value*
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
GYRO_XOUT_H
GYRO_XOUT_L
GYRO_YOUT_H
GYRO_YOUT_L
GYRO_ZOUT_H
GYRO_ZOUT_L
AUX_XOUT_H
AUX_XOUT_L
AUX_YOUT_H
AUX_YOUT_L
AUX_ZOUT_H
AUX_ZOUT_L
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
*Default Value applies if sensor is disabled.
Description:
These registers contain the gyro, temperature, and auxillary (accel) sensor data for the MPU-3050. At
any time, these values can be read from the device; however it is best to use the interrupt function to
determine when new data is available.
Before being placed into these registers, the sensor data are first manipulated by the full scale setting
(register 22) and the offset settings (registers 12 to 17).
Parameters:
GYRO_XOUT_H/L 16-bit X gyro output data (2’s complement data format)
GYRO_YOUT_H/L 16-bit Y gyro output data (2’s complement data format)
Rev Date: 03/10/2016
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Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
GYRO_ZOUT_H/L 16-bit Z gyro output data (2’s complement data format)
AUX_XOUT_H/L
AUX_YOUT_H/L
AUX_ZOUT_H/L
16-bit X aux (accel) output data (as available from aux)
16-bit Y aux (accel) output data (as available from aux)
16-bit Z aux (accel) output data (as available from aux)
12.13 Registers 58 to 59 – FIFO Count
Type: Read only
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
3A
3B
58
59
-
-
-
-
-
-
FIFO_COUNT_H
00h
00h
FIFO_COUNT_L
Description:
These registers indicate how many bytes of valid data are contained in the FIFO. The FIFO can
contain up to 512 bytes of data
If the FIFO gets filled up completely, the length will read 512. In this state, the MPU-3050 continues
to put new sensor data into the FIFO, thus overwriting old FIFO data. Note, however, that the
alignment of sensor data can change in this overflow condition. InvenSense recommends resetting
the FIFO if an overflow condition occurs (use register 61), which will clear out the FIFO.
Parameters:
FIFO_COUNT_H/L Number of bytes currently in FIFO
12.14 Register 60 – FIFO Data
Type: Read only
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
3C
60
FIFO_DATA
00h
Parameters:
FIFO_DATA
Contains the FIFO data
Description:
This is the output register of the FIFO. Each read of this register gets the oldest contents of the MPU-
3050 FIFO buffer; thus the data is read out in the same order that the DMP put the data in. If the FIFO
operation is enabled, the DMP puts new data into the FIFO at each sample interval. The data that
goes in is determined by the FIFO enable registers (18 and 19).
A burst read is required for reading multiple bytes from this register, since any read on this register
causes an auto increment and a pre-fetch to occur.
Proper operation of the FIFO requires that at least one word (2 bytes) of data be left in the FIFO during
any read operation. To implement this, it is recommended that one extra word be added to the end of
the FIFO data so that all desired data can be read at each cycle, leaving the extra word remaining in
the FIFO. This extra word will be read out (first) during the next read operation on the FIFO.
Data is read into the FIFO in the following order:
GYRO_XOUT
GYRO_YOUT
GYRO_ZOUT
AUX_XOUT
X Gyro
Y Gyro
Z Gyro
X Accelerometer high and low bytes (2 bytes)
Rev Date: 03/10/2016
Page 45 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
AUX_YOUT
AUX_ZOUT
FIFO_FOOTER
Y Accelerometer high and low bytes (2 bytes)
Z Accelerometer high and low bytes (2 bytes)
Last word for FIFO read (2 bytes)
For example, if it is desired to obtain gyro, and accel data from the FIFO, then one should also add
one of the aux ADC readings (the required extra word) into the FIFO enable registers (18 or 19) in
addition to the desired data. As shown in the figure below, the first time data is written to the FIFO,
the FIFO will contain: GYRO_XOUT, GYRO_YOUT, GYRO_ZOUT, AUX_XOUT, AUX_YOUT,
AUX_ZOUT, and FIFO_FOOTER. The first FIFO read will read all but the FIFO_FOOTER data, which
will be read in the 2nd FIFO read. In the 2nd FIFO read, the FIFO_FOOTER data that was left over
from the previous read is read out first, followed by all but the last FIFO_FOOTER data in the FIFO.
This pattern of reading is continued, as shown in the figure below.
Note that the first FIFO read is similar to the subsequent reads in that one word of data is always left
in the FIFO. It differs, though, in that in subsequent reads the leftover data from the previous read is
read first; however, for the first read there is no leftover data from a previous read.
If the FIFO is allowed to overflow, it operates as a circular buffer in which at any time it contains the
most recent 512 bytes. Recommended operation in this mode is to disable data going into the FIFO
prior to reading the FIFO to avoid pointer conflicts. After halting the FIFO input, the 512 bytes in the
FIFO should be read out in a single burst read. The first byte read will not be valid.
FIFO Read 1
1: TEMP_XOUT
FIFO Read 2
FIFO Read 3
n: FIFO_FOOTER
n+1: TEMP_XOUT
n+1: GYRO_XOUT
n+1: GYRO_YOUT
n+1: GYRO_ZOUT
n+1: AUX_XOUT
n+1: AUX_YOUT
n+1: AUX_ZOUT
n+1: FIFO_FOOTER
n+2: TEMP_XOUT
n+2: GYRO_XOUT
n+2: GYRO_YOUT
n+2: GYRO_ZOUT
n+2: AUX_XOUT
n+2: AUX_YOUT
n+2: AUX_ZOUT
n+2: FIFO_FOOTER
1: FIFO_FOOTER
2: TEMP_XOUT
2: GYRO_XOUT
2: GYRO_YOUT
2: GYRO_ZOUT
2: AUX_XOUT
2: AUX_YOUT
2: AUX_ZOUT
2: FIFO_FOOTER
3: TEMP_XOUT
3: GYRO_XOUT
3: GYRO_YOUT
3: GYRO_ZOUT
3: AUX_XOUT
3: AUX_YOUT
3: AUX_ZOUT
3: FIFO_FOOTER
1: GYRO_XOUT
1: GYRO_YOUT
1: GYRO_ZOUT
1: AUX_XOUT
1: AUX_YOUT
1: AUX_ZOUT
1: FIFO_FOOTER
n: TEMP_XOUT
n: GYRO_XOUT
n: GYRO_YOUT
n: GYRO_ZOUT
n: AUX_XOUT
n: AUX_YOUT
n: AUX_ZOUT
n: FIFO_FOOTER
Reading from the FIFO
Rev Date: 03/10/2016
Page 46 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
12.15 Register 61 – User Control
Type: Read/Write
Register
Default
Value
Register
(Hex)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
FIFO_
EN
AUX_IF_
EN
AUX_IF_
RST
FIFO_
RST
GYRO_
00h
3D
61
-
-
-
RST
Description:
This register is used to enable various modes on the MPU-3050, as well as reset these functions.
For each of the functions that can be enabled, the function should be reset at the same time to assure
it works properly. Note that the reset bits in the register are automatically cleared after the function is
reset.
Parameters:
FIFO_EN
Enable FIFO operation for sensor data
AUX_IF_EN
Enable third-party accelerometer interface via I2C (clear bit to pass through I2C bus)
AUX_IF_RST Reset third-party accelerometer interface function; set this only after changing
AUX_IF_EN to 0.
FIFO_RST
GYRO_RST
Reset FIFO function; set this to clear FIFO or when changing FIFO_EN
Reset gyro analog and digital functions
12.16 Register 62 – Power Management
Type: Read/Write
Register
(Hex)
Register
Default
Value
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
(Decimal)
STBY
_XG
STBY
_YG
STBY
_ZG
3E
62
H_RESET
SLEEP
CLK_SEL
00h
Description:
This register is used to manage the power control, select the clock source, and to issue a master reset
to the device.
Setting the SLEEP bit in the register puts the device into a low power sleep mode. In this mode, only
the serial interface and internal registers remain active, allowing for a very low standby current.
Clearing this bit puts the device back into normal mode. The individual standby selections for each of
the gyros should be used if any of them are not used by the application.
The power-up sequence of the SLEEP register bit is shown in the figure below. After VDD is applied
to the part, SLEEP is initially low (part in normal operating mode). A short while afterwards, the internal
charge pumps are brought up, and the part’s OTP memory is read, and SLEEP is set high, thus putting
the part into its low-power sleep mode. The part stays in this mode until the register bit is cleared.
VDD
OTP Read
SLEEP Register Bit
5ms typ*
Power-Up Sequence of SLEEP Register Bit
Rev Date: 03/10/2016
Page 47 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
The CLK_SEL setting determines the device clock source as follows:
CLK_SEL
CLK_SEL Clock Source
0
1
2
3
4
5
6
7
Internal oscillator
PLL with X Gyro reference
PLL with Y Gyro reference
PLL with Z Gyro reference
PLL with external 32.768 kHz reference
PLL with external 19.2 MHz reference
Reserved
Stop clock and synchronous reset clock state
On power up, the MPU-3050 defaults to the internal oscillator. It is highly recommended that the
device is configured to use one of the gyros (or an external clock) as the clock reference, due to the
improved stability.
Parameters:
H_RESET
SLEEP
Reset device and internal registers to the power-up-default settings
Enable low power sleep mode
STBY_XG
STBY_YG
STBY_ZG
CLK_SEL
Put gyro X in standby mode (1=standby, 0=normal)
Put gyro Y in standby mode (1=standby, 0=normal)
Put gyro Z in standby mode (1=standby, 0=normal)
Select device clock source
Rev Date: 03/10/2016
Page 48 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
13 Reference
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following
information:
• Manufacturing Recommendations
o
o
o
o
o
o
o
o
o
o
o
Assembly Guidelines and Recommendations
PCB Design Guidelines and Recommendations
MEMS Handling Instructions
ESD Considerations
Reflow Specification
Storage Specifications
Package Marking Specification
Tape & Reel Specification
Reel & Pizza Box Label
Packaging
Representative Shipping Carton Label
• Compliance
o
o
o
Environmental Compliance
DRC Compliance
Compliance Declaration Disclaimer
Rev Date: 03/10/2016
Page 49 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
14 Revision History
Revision
Date
Revision Description
6/25/09
1.0
Initial Release
Changes for revision level compliance of MPU-3050 to MPU-3000
specification:
Sec. 1.2
Sec. 1.3
Sec. 2.3
Sec. 3.1
Sec. 3.2
Added Revision B1 silicon note
Updated noise specification to 0.03º/s/√Hz
Added secondary I2C interface
Updated sensor specifications table
Changed VDD to 2.5 V and TA = 250C
Sec. 3.2-3.3 Changed electrical specifications table format and typical
values
9/28/09
2.0
Sec. 4.1
Sec. 4.2
Sec. 5.1
Updated pin-out and signal descriptions with new diagram
Updated typical operating circuit diagram
Updated new block diagram descriptions for primary and
secondary I2C serial interfaces
Sec. 5.9
Sec. 6
Changed FIFO description
Edited digital interface
Sec. 10.2
Sec. 10.7
Sec. 13
Updated package drawing/dimensions
Edited trace routing
Added Appendix 1.0 Errata for Revision G devices
Sec. 10
section
Added Material Handling Specification content to this
11/5/09
2.1
2.2
Sec. 3.2
Updated Electrical Specifications with Power-supply
ramp rate for VLOGIC Reference Voltage
Sec. 3.3
Updated Level Output Current specifications for the
Primary and Secondary I2C interfaces
12/23/09
Sec. 3.4
Updated Frequency Variation Over Temperature
specification for internal clock source
Sec. 3.5.1
Sec. 4.4
Sec 1.4
Sec 2.2
Sec 3.1
Sec 4.4
Sec 8.2
Updated ESD specification
Added recommended power-on procedure diagram
Added new InvenSense trademarks under Applications
Edited Digital Output for 400 kHz standard (not up to)
Changed Sensitivity Scale Factor to 115 LSB/(º/s)
Updated Recommended Power-on Procedure diagram
Modified Example Power Configuration diagram to
3/15/10
2.3
remove IME-3000 reference
Sec 11.2
Updated ESD-HBM for Device Component Level Tests
Removed all references to IME-3000 and replaced with third-party
accelerometer.
Section 3.1
performance
Section 3.2
start-up time
Updated sensitivity scale factor, ZRO, Noise
Added operating current for without DMP case, added
8/18/10
2.4
Updated table in section 8.2 with reference to ACCEL_VDDIO
Added section 9.1 Demo Software
Added sections 10 (Register Maps) and 11 (Register Description)
Updated text and table in section 12.9
Added section 12.11 Storage Specifications
Rev Date: 03/10/2016
Page 50 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
Created a new section 14 for Environment Compliance
Made this document specific to MPU-3050
Corrected typo for ZRO Variation Over Temperature from ±0.03 dps/C
to ±0.3 dps/C
Updated ZRO Variation Over Temperature from ± 0.3 dps/C to
± 0.15 dps/C
10/15/14
2/27/15
2.5
2.6
Removed references to the Temperature Sensor
Updated to Production; updated corporate logo and document format;
updated trademarks, updated Applications, replaced sections 12.6 -
12.10, 12.12 – 12.14, and 13 with a new section 13; updated 1st
sentence of section 12; moved Assembly section before Register Map
section; moved Revision History section to the end of the document
3/10/16
2.7
Rev Date: 03/10/2016
Page 51 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
MPU-3050
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility
is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that
may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to
make changes to this product, including its circuits and software, in order to improve its design and/or
performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied,
regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use
of products and services detailed therein. This includes, but is not limited to, claims or damages based on
the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No
license is granted by implication or otherwise under any patent or patent rights of InvenSense. This
publication supersedes and replaces all information previously supplied. Trademarks that are registered
trademarks are the property of their respective companies. InvenSense sensors should not be used or sold
in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as
medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant
equipment, disaster prevention and crime prevention equipment.
©2016 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing,
MotionProcessor, MotionFusion, MotionApps, Digital Motion Processor, AAR, and the InvenSense logo are
trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective
companies with which they are associated.
©2016 InvenSense, Inc. All rights reserved.
Rev Date: 03/10/2016
Page 52 of 52
Document Number: PS-MPU-3050A-00
Revision: 2.7
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