MPU-6500 [TDK]
IMU (惯性测量设备);
| 型号： | MPU-6500 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | IMU (惯性测量设备) 先进先出芯片 |
| 文件： | 总40页 (文件大小：766K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
InvenSense Inc.
Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
MPU-6500
Product Specification
Revision 1.1
1 of 40
Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
TABLE OF CONTENTS
TABLE OF TABLES ..........................................................................................................................................5
1
2
3
DOCUMENT INFORMATION......................................................................................................................6
1.1
REVISION HISTORY ..............................................................................................................................6
PURPOSE AND SCOPE..........................................................................................................................7
PRODUCT OVERVIEW...........................................................................................................................7
APPLICATIONS .....................................................................................................................................7
1.2
1.3
1.4
FEATURES ..................................................................................................................................................8
2.1
GYROSCOPE FEATURES.......................................................................................................................8
ACCELEROMETER FEATURES ...............................................................................................................8
ADDITIONAL FEATURES ........................................................................................................................8
MOTIONPROCESSING...........................................................................................................................8
2.2
2.3
2.4
ELECTRICAL CHARACTERISTICS...........................................................................................................9
3.1
GYROSCOPE SPECIFICATIONS..............................................................................................................9
ACCELEROMETER SPECIFICATIONS.....................................................................................................10
ELECTRICAL SPECIFICATIONS.............................................................................................................11
I2C TIMING CHARACTERIZATION.........................................................................................................15
SPI TIMING CHARACTERIZATION.........................................................................................................16
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18
3.2
3.3
3.4
3.5
3.6
4
APPLICATIONS INFORMATION..............................................................................................................19
4.1
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION.....................................................................................19
TYPICAL OPERATING CIRCUIT.............................................................................................................20
BILL OF MATERIALS FOR EXTERNAL COMPONENTS..............................................................................20
BLOCK DIAGRAM ...............................................................................................................................21
OVERVIEW ........................................................................................................................................21
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................22
THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................22
DIGITAL MOTION PROCESSOR ............................................................................................................22
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES............................................................22
AUXILIARY I2C SERIAL INTERFACE......................................................................................................24
SELF-TEST........................................................................................................................................25
CLOCKING.........................................................................................................................................25
SENSOR DATA REGISTERS.................................................................................................................26
FIFO ................................................................................................................................................26
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
4.15
4.16
4.17
4.18
4.19
INTERRUPTS......................................................................................................................................26
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26
BIAS AND LDOS ................................................................................................................................27
CHARGE PUMP ..................................................................................................................................27
STANDARD POWER MODES................................................................................................................27
5
6
PROGRAMMABLE INTERRUPTS............................................................................................................28
5.1
WAKE-ON-MOTION INTERRUPT...........................................................................................................29
DIGITAL INTERFACE ...............................................................................................................................30
6.1
I2C AND SPI SERIAL INTERFACES ......................................................................................................30
I2C INTERFACE..................................................................................................................................30
I2C COMMUNICATIONS PROTOCOL .....................................................................................................30
I2C TERMS ........................................................................................................................................33
SPI INTERFACE .................................................................................................................................34
6.2
6.3
6.4
6.5
7
8
SERIAL INTERFACE CONSIDERATIONS...............................................................................................35
7.1
MPU-6500 SUPPORTED INTERFACES.................................................................................................35
ASSEMBLY ...............................................................................................................................................36
8.1
8.2
ORIENTATION OF AXES ......................................................................................................................36
PACKAGE DIMENSIONS ......................................................................................................................37
9
PART NUMBER PACKAGE MARKING ...................................................................................................38
10 RELIABILITY .............................................................................................................................................39
10.1
10.2
QUALIFICATION TEST POLICY .............................................................................................................39
QUALIFICATION TEST PLAN ................................................................................................................39
11 REFERENCE .............................................................................................................................................40
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
Table of Figures
Figure 1: I2C Bus Timing Diagram ...................................................................................................................15
Figure 2: SPI Bus Timing Diagram ...................................................................................................................16
Figure 3: Pin out Diagram for MPU-6500 3.0x3.0x0.9mm QFN.......................................................................19
Figure 4: MPU-6500 QFN Application Schematic. (a) I2C operation, (b) SPI operation. ................................20
Figure 5: MPU-6500 Block Diagram.................................................................................................................21
Figure 6: MPU-6500 Solution Using I2C Interface............................................................................................23
Figure 7: MPU-6500 Solution Using SPI Interface...........................................................................................24
Figure 8: Wake-on-Motion Interrupt Configuration ...........................................................................................29
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
Table of Tables
Table 1: Gyroscope Specifications .....................................................................................................................9
Table 2: Accelerometer Specifications .............................................................................................................10
Table 3: D.C. Electrical Characteristics............................................................................................................11
Table 4: A.C. Electrical Characteristics ............................................................................................................13
Table 5: Other Electrical Specifications............................................................................................................14
Table 6: I2C Timing Characteristics ..................................................................................................................15
Table 7: SPI Timing Characteristics .................................................................................................................16
Table 8: fCLK = 20MHz ....................................................................................................................................17
Table 9: Absolute Maximum Ratings................................................................................................................18
Table 10: Signal Descriptions...........................................................................................................................19
Table 11: Bill of Materials .................................................................................................................................20
Table 12: Standard Power Modes for MPU-6500.............................................................................................27
Table 13: Table of Interrupt Sources ................................................................................................................28
Table 14: Serial Interface..................................................................................................................................30
Table 15: I2C Terms..........................................................................................................................................33
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
1
Document Information
1.1 Revision History
Revision
Revision Description
Date
09/18/2013
1.0
1.1
Initial Release
Updated Sections 1, 2, 4, 9, 11
03/05/2014
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
1.2 Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information on the MPU-6500™ MotionTracking device. The device is housed in a small 3x3x0.90mm
QFN package.
Specifications are subject to change without notice. Final specifications will be updated based upon
characterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the MPU-6500 Register Map and Register Descriptions document.
1.3 Product Overview
The MPU-6500 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer,
and a Digital Motion Processor™ (DMP) all in a small 3x3x0.9mm package. It also features a 512-byte FIFO
that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system
processor to burst read sensor data and then go into a low-power mode. With its dedicated I2C sensor bus,
the MPU-6500 directly accepts inputs from external I2C devices. MPU-6500, with its 6-axis integration, on-
chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly and complex
selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion
performance for consumers. MPU-6500 is also designed to interface with multiple non-inertial digital
sensors, such as pressure sensors, on its auxiliary I2C port.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very
low rate noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale range
of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line
calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock
with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The
device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital
IO supply, VDDIO from 1.71V to 3.6V.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x0.90mm (24-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.
1.4 Applications
•
•
•
•
•
•
•
•
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
2
Features
2.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-6500 includes a wide range of features:
•
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Factory calibrated sensitivity scale factor
•
•
•
•
Self-test
2.2 Accelerometer Features
The triple-axis MEMS accelerometer in MPU-6500 includes a wide range of features:
•
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g,
±8g and ±16g and integrated 16-bit ADCs
•
•
•
•
•
Accelerometer normal operating current: 450µA
Low power accelerometer mode current: 6.37µA at 0.98Hz, 17.75µA at 31.25Hz
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
2.3 Additional Features
The MPU-6500 includes the following additional features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Auxiliary master I2C bus for reading data from external sensors (e.g. magnetometer)
3.4mA operating current when all 6 motion sensing axes are active
VDD supply voltage range of 1.8 – 3.3V ± 5%
VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I2C devices
Smallest and thinnest QFN package for portable devices: 3x3x0.9mm
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
2.4 MotionProcessing
•
Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionProcessing and low
power functions such as gesture recognition using programmable interrupts
In addition to the angular rate, this device optionally outputs the angular position (angle).
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
•
•
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3
Electrical Characteristics
3.1 Gyroscope Specifications
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
GYROSCOPE SENSITIVITY
MIN
TYP
MAX
UNITS
NOTES
Full-Scale Range
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
±250
±500
±1000
±2000
16
º/s
º/s
3
3
3
3
3
3
3
3
3
2
1
º/s
º/s
Gyroscope ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C
131
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
%
65.5
32.8
16.4
±3
Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +85°C
±4
%
Nonlinearity
Best fit straight line; 25°C
±0.1
±2
%
%
1
1
Cross-Axis Sensitivity
ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±5
º/s
2
1
ZRO Variation Over Temperature
-40°C to +85°C
±0.24
º/s/°C
GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)
Total RMS Noise
DLPFCFG=2 (92 Hz)
0.1
0.01
27
º/s-rms
º/s/√Hz
KHz
2
4
2
3
1
Rate Noise Spectral Density
GYROSCOPE MECHANICAL FREQUENCIES
LOW PASS FILTER RESPONSE
25
29
Programmable Range
From Sleep mode
5
250
Hz
GYROSCOPE START-UP TIME
OUTPUT DATA RATE
35
ms
Hz
Programmable, Normal (Filtered)
mode
1
4
8000
Table 1: Gyroscope Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
4. Calculated from Total RMS Noise.
Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and
Gyroscope Self-Test Implementation; AN-MPU-6500A-02
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3.2 Accelerometer Specifications
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
ACCELEROMETER SENSITIVITY
MIN
TYP
MAX
UNITS
NOTES
AFS_SEL=0
±2
±4
g
3
3
3
3
3
3
3
3
3
2
AFS_SEL=1
g
Full-Scale Range
AFS_SEL=2
±8
g
AFS_SEL=3
±16
g
ADC Word Length
Sensitivity Scale Factor
Output in two’s complement format
AFS_SEL=0
16
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
16,384
8,192
4,096
2,048
±3
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Initial Tolerance
Component-level
-40°C to +85°C AFS_SEL=0
Component-level
Sensitivity Change vs. Temperature
±0.026
%/°C
1
Nonlinearity
Best Fit Straight Line
±0.5
±2
%
%
1
1
Cross-Axis Sensitivity
ZERO-G OUTPUT
Initial Tolerance
Component-level, all axes
±60
±0.64
±1
mg
2
1
1
-40°C to +85°C,
Board-level
X and Y axes
Z axis
mg/°C
mg/°C
Zero-G Level Change vs. Temperature
NOISE PERFORMANCE
µg/√Hz
Power Spectral Density
Low noise mode
300
4
4
3
LOW PASS FILTER RESPONSE
Programmable Range
5
260
Hz
INTELLIGENCE FUNCTION
INCREMENT
mg/LSB
3
From Sleep mode
From Cold Start, 1ms VDD ramp
20
30
ms
ms
1
1
ACCELEROMETER STARTUP TIME
Low power (duty-cycled)
Duty-cycled, over temp
Low noise (active)
0.24
4
500
Hz
%
1
OUTPUT DATA RATE
±15
4000
Hz
Table 2: Accelerometer Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
4. Calculated from Total RMS Noise.
Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and
Gyroscope Self-Test Implementation; AN-MPU-6500A-02
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3.3 Electrical Specifications
3.3.1 D.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SUPPLY VOLTAGES
VDD
1.71
1.71
1.8
1.8
3.45
3.45
V
V
1
1
VDDIO
SUPPLY CURRENTS
Normal Mode
6-axis
3.4
3.2
mA
mA
µA
µA
µA
1
1
3-axis Gyroscope
3-Axis Accelerometer, 4kHz ODR
0.98 Hz update rate
450
1
Accelerometer Low Power Mode
7.27
18.65
1,2
1,2
31.25 Hz update rate
Standby Mode
1.6
6
mA
µA
1
1
Full-Chip Sleep Mode
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable
beyond Specified Temperature Range
-40
+85
°C
1
Table 3: D.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Accelerometer Low Power Mode supports the following output data rates (ODRs): 0.24, 0.49, 0.98,
1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rate can be
calculated as:
a. Supply Current in µA = 6.9 + Update Rate * 0.376
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3.3.2 A.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameter
Conditions
MIN
TYP
MAX
Units
NOTES
SUPPLIES
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value
Supply Ramp Time
0.1
100
ms
1
TEMPERATURE SENSOR
Operating Range
Sensitivity
Ambient
Untrimmed
21°C
-40
85
°C
1
333.87
0
LSB/°C
LSB
Room Temp Offset
Power-On RESET
Supply Ramp Time (TRAMP
)
Valid power-on RESET
0.01
20
11
100
100
ms
ms
1
1
Start-up time for register read/write
From power-up
AD0 = 0
AD0 = 1
1101000
1101001
I2C ADDRESS
DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
CI, Input Capacitance
0.7*VDDIO
V
V
0.3*VDDIO
1
1
< 10
pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage
VOL.INT1, INT Low-Level Output Voltage
RLOAD=1MΩ;
0.9*VDDIO
V
V
V
RLOAD=1MΩ;
0.1*VDDIO
0.1
OPEN=1, 0.3mA sink
Current
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
LATCH_INT_EN=0
I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
-0.5V
0.3*VDDIO
V
V
0.7*VDDIO
VDDIO +
0.5V
Vhys, Hysteresis
0.1*VDDIO
V
V
VOL, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
1
0
0.4
VOL=0.4V
VOL=0.6V
3
6
mA
mA
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Cb bus capacitance in pf
20+0.1Cb
250
AUXILLIARY I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
-0.5V
0.3*VDDIO
V
V
0.7* VDDIO
VDDIO +
0.5V
1
Vhys, Hysteresis
0.1* VDDIO
V
V
VOL1, LOW-Level Output Voltage
VDDIO
current
> 2V; 1mA sink
0
0.4
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
Parameter
Conditions
MIN
TYP
MAX
Units
NOTES
VOL3, LOW-Level Output Voltage
VDDIO
current
VOL
<
2V; 1mA sink
0.4V
0
0.2* VDDIO
V
IOL, LOW-Level Output Current
=
3
6
mA
mA
VOL = 0.6V
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Cb bus capacitance in pF
20+0.1Cb
250
INTERNAL CLOCK SOURCE
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
Fchoice=3;
32
8
kHz
kHz
2
2
Sample Rate
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
1
kHz
2
1
1
1
1
CLK_SEL=0, 6; 25°C
CLK_SEL=1,2,3,4,5; 25°C
CLK_SEL=0,6
-2
-1
+2
+1
%
%
%
%
Clock Frequency Initial Tolerance
-10
+10
Frequency Variation over Temperature
CLK_SEL=1,2,3,4,5
±1
Table 4: A.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Guaranteed by design.
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3.3.3 Other Electrical Specifications
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
100
±10%
Low Speed Characterization
High Speed Characterization
kHz
MHz
MHz
1
1
1
SPI Operating Frequency, All
Registers Read/Write
1 ±10%
SPI Operating Frequency, Sensor
and Interrupt Registers Read Only
20 ±10%
All registers, Fast-mode
400
100
kHz
kHz
1
1
I2C Operating Frequency
All registers, Standard-mode
Table 5: Other Electrical Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
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Document Number: PS-MPU-6500A-01
Revision: 1.1
Release Date: 03/05/2014
MPU-6500 Product Specification
3.4
I2C Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameters
Conditions
I2C FAST-MODE
Min
Typical
Max
Units
Notes
I2C TIMING
1
2
2
fSCL, SCL Clock Frequency
400
kHz
µs
tHD.STA, (Repeated) START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
2
2
2
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
0
µs
ns
ns
ns
µs
2
2
2
2
2
100
Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF
20+0.1Cb
20+0.1Cb
0.6
300
300
tSU.STO, STOP Condition Setup Time
tBUF, Bus Free Time Between STOP and
START Condition
1.3
µs
2
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
< 400
pF
µs
µs
2
2
2
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
Table 6: I2C Timing Characteristics
Notes:
1. Timing Characteristics apply to both Primary and Auxiliary I2C Bus
2. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 1: I2C Bus Timing Diagram
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MPU-6500 Product Specification
3.5 SPI Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Notes
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
fSCLK, SCLK Clock Frequency
1
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
1
1
1
1
1
1
1
1
1
1
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
400
400
8
500
11
7
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
tHD.SDO, SDO Hold Time
tDIS.SDO, SDO Output Disable Time
Cload = 20pF
Cload = 20pF
100
50
4
Table 7: SPI Timing Characteristics
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 2: SPI Bus Timing Diagram
3.5.1 fSCLK = 20MHz
Parameters
Conditions
Min
Typical
Max
Units
Notes
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
0.9
-
20
-
MHz
ns
1
-
-
ns
1
ns
1
1
1
ns
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
tSU.SDI, SDI Setup Time
0
ns
ns
ns
ns
1
1
1
1
tHD.SDI, SDI Hold Time
1
tVD.SDO, SDO Valid Time
tDIS.SDO, SDO Output Disable Time
Cload = 20pF
25
25
Table 8: fCLK = 20MHz
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
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MPU-6500 Product Specification
3.6 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage, VDD
-0.5V to +4V
-0.5V to +4V
-0.5V to 2V
Supply Voltage, VDDIO
REGOUT
Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA)
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
-0.5V to VDD + 0.5V
10,000g for 0.2ms
-40°C to +105°C
-40°C to +125°C
2kV (HBM);
250V (MM)
Electrostatic Discharge (ESD) Protection
Latch-up
JEDEC Class II (2),125°C, ±100mA
Table 9: Absolute Maximum Ratings
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MPU-6500 Product Specification
4
Applications Information
4.1 Pin Out Diagram and Signal Description
Pin Number
Pin Name
AUX_CL
VDDIO
Pin Description
I2C Master serial clock, for connecting to external sensors
7
8
Digital I/O supply voltage
9
AD0 / SDO
REGOUT
FSYNC
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
Regulator filter capacitor connection
10
11
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Note: The Interrupt line should be connected to a pin on the
Application Processor (AP) that can bring the AP out of
suspend mode.
12
INT
13
VDD
GND
Power supply voltage and Digital I/O supply voltage
Power supply ground
18
19
RESV
Reserved. Do not connect.
20
RESV
Reserved. Connect to GND.
I2C master serial data, for connecting to external sensors
21
AUX_DA
nCS
22
Chip select (SPI mode only)
23
24
SCL / SCLK
SDA / SDI
NC
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
No Connect pins. Do not connect.
1 – 6, 14 - 17
Table 10: Signal Descriptions
GND
NC
1
2
3
4
5
6
18
17
16
15
14
NC
NC
NC
NC
NC
NC
NC
NC
NC
MPU-6500
13 VDD
Figure 3: Pin out Diagram for MPU-6500 3.0x3.0x0.9mm QFN
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4.2 Typical Operating Circuit
nCS
VDDIO
SCLK
SDI
SCL
SDA
GND
18
GND
NC
1
2
3
4
5
6
NC
NC
1
2
3
4
5
6
18
NC
17
17
16
15
14
13
NC
NC
NC
NC
NC
NC
NC
16
15
14
13
NC
NC
MPU-6500
MPU-6500
NC
NC
NC
NC
NC
NC
NC
VDD
VDD
1.8 – 3.3VDC
C2, 0.1 µF
1.8 – 3.3VDC
C2, 0.1 µF
1.8 – 3.3VDC
1.8 – 3.3VDC
C1, 0.1 µF
C1, 0.1 µF
C3, 10 nF
C3, 10 nF
AD0
SD0
(a)
(b)
Figure 4: MPU-6500 QFN Application Schematic. (a) I2C operation, (b) SPI operation.
4.3 Bill of Materials for External Components
Component
Label
C1
Specification
Quantity
Regulator Filter Capacitor
VDD Bypass Capacitor
VDDIO Bypass Capacitor
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 10nF ±10%, 4V
1
1
1
C2
C3
Table 11: Bill of Materials
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
4.4 Block Diagram
MPU-6500
Self
test
X Accel
ADC
ADC
INT
Interrupt
Status
Register
nCS
Self
test
Y Accel
Slave I2C and
SPI Serial
Interface
AD0 / SDO
SCL / SCLK
SDA / SDI
FIFO
Self
test
Z Accel
X Gyro
ADC
ADC
User & Config
Registers
Serial
Interface
Bypass
Master I2C
Serial
Interface
AUX_CL
Self
test
AUX_DA
Mux
Sensor
Registers
FSYNC
Self
test
Y Gyro
Z Gyro
ADC
ADC
Digital Motion
Processor
(DMP)
Self
test
Temp Sensor
ADC
Bias & LDOs
Charge
Pump
VDD
GND
REGOUT
Figure 5: MPU-6500 Block Diagram
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend
mode.
4.5 Overview
The MPU-6500 is comprised of the following key blocks and functions:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
Primary I2C and SPI serial communications interfaces
Auxiliary I2C serial interface
Self-Test
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
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MPU-6500 Product Specification
4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-6500 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
4.7 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-6500’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-6500’s architecture reduces the accelerometers’ susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
4.8 Digital Motion Processor
The embedded Digital Motion Processor (DMP) within the MPU-6500 offloads computation of motion
processing algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes,
and additional 3rd party sensors such as magnetometers, and processes the data. The resulting data can be
read from the FIFO. The DMP has access to one of the MPU’s external pins, which can be used for
generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order
to provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used to minimize power, simplify timing, simplify the software
architecture, and save valuable MIPS on the host processor for use in applications.
The DMP supports the following functionality:
•
Low Power Quaternion (3-Axis Gyroscope)
•
•
Screen Orientation (A low-power implementation of Android’s screen rotation algorithm)
Pedometer (InvenSense implementation)
4.9 Primary I2C and SPI Serial Communications Interfaces
The MPU-6500 communicates to a system processor using either a SPI or an I2C serial interface. The MPU-
6500 always acts as a slave when communicating to the system processor. The LSB of the of the I2C slave
address is set by pin 9 (AD0).
4.9.1 MPU-6500 Solution Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-6500. In addition, the MPU-6500 is an
I2C master to the optional external compass sensor. The MPU-6500 has limited capabilities as an I2C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
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The MPU-6500 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23
and 24 (SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so that the MPU-6500 auxiliary I2C master can take control of the sensor I2C bus and
gather data from the auxiliary sensors.
For further information regarding I2C master control, please refer to section 6.
I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
Interrupt
Status
Register
INT
MPU-6500
AD0
SCL
VDD or GND
Slave I2C
or SPI
SCL
SDA
System
Processor
Serial
Interface
SDA/SDI
FIFO
Sensor I2C Bus: for
configuring and reading
from external sensors
User & Config
Registers
Optional
Sensor
Master I2C
Serial
AUX_CL
AUX_DA
SCL
SDA
Sensor
Register
Interface
Bypass
Mux
Compass
Interface
Factory
Calibration
Digital
Motion
Processor
(DMP)
Interface bypass mux allows
direct configuration of
compass by system processor
Bias & LDOs
VDD
GND
REGOUT
Figure 6: MPU-6500 Solution Using I2C Interface
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend
mode.
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4.9.2 MPU-6500 Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-6500. Pins 8, 9, 23, and 24 are used
to support the CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are
shared with the I2C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I2C bus
through the interface bypass multiplexer, which connects the processor I2C interface pins to the sensor I2C
interface pins. Since the MPU-6500 has limited capabilities as an I2C Master, and depends on the system
processor to manage the initial configuration of any auxiliary sensors, another method must be used for
programming the sensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-6500 and the system processor, configuration of
devices on the auxiliary I2C sensor bus can be achieved by using I2C Slaves 0-4 to perform read and write
transactions on any device and register on the auxiliary I2C bus. The I2C Slave 4 interface can be used to
perform only single byte read and write transactions. Once the external sensors have been configured, the
MPU-6500 can perform single or multi-byte reads using the sensor I2C bus. The read results from the Slave
0-3 controllers can be written to the FIFO buffer as well as to the external sensor registers.
For further information regarding the control of the MPU-6500’s auxiliary I2C interface, please refer to the
MPU-6500 Register Map and Register Descriptions document.
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU and external sensors
Interrupt
INT
Status
Register
nCS
nCS
SDO
MPU-6500
SDI
Slave I2C
or SPI
Serial
Interface
System
Processor
SCLK
SDI
SCLK
SDO
FIFO
Sensor I2C Bus: for
configuring and
reading data from
external sensors
Config
Register
Optional
Sensor
Master I2C
Serial
AUX_CL
AUX_DA
SCL
SDA
Sensor
Register
Interface
Bypass
Mux
Compass
Interface
Factory
Calibration
Digital
Motion
Processor
(DMP)
I2C Master performs
read and write
transactions on
Sensor I2C bus.
Bias & LDOs
VDD
GND
REGOUT
Figure 7: MPU-6500 Solution Using SPI Interface
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend
mode.
4.10 Auxiliary I2C Serial Interface
The MPU-6500 has an auxiliary I2C bus for communicating to an off-chip 3-Axis digital output magnetometer
or other sensors. This bus has two operating modes:
•
•
I2C Master Mode: The MPU-6500 acts as a master to any external sensors connected to the
auxiliary I2C bus
Pass-Through Mode: The MPU-6500 directly connects the primary and auxiliary I2C buses together,
allowing the system processor to directly communicate with any external sensors.
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
Auxiliary I2C Bus Modes of Operation:
•
I2C Master Mode: Allows the MPU-6500 to directly access the data registers of external digital
sensors, such as a magnetometer. In this mode, the MPU-6500 directly obtains data from auxiliary
sensors without intervention from the system applications processor.
For example, In I2C Master mode, the MPU-6500 can be configured to perform burst reads, returning
the following data from a magnetometer:
.
.
.
X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)
The I2C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
•
Pass-Through Mode: Allows an external system processor to act as master and directly
communicate to the external sensors connected to the auxiliary I2C bus pins (AUX_DA and
AUX_CL). In this mode, the auxiliary I2C bus control logic (3rd party sensor interface block) of the
MPU-6500 is disabled, and the auxiliary I2C pins AUX_DA and AUX_CL (Pins 6 and 7) are
connected to the main I2C bus (Pins 23 and 24) through analog switches internally.
Pass-Through mode is useful for configuring the external sensors, or for keeping the MPU-6500 in a
low-power mode when only the external sensors are used. In this mode the system processor can
still access MPU-6500 data through the I2C interface.
4.11 Self-Test
Please refer to the register map document for more details on self-test.
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by means of the gyroscope and accelerometer self-test registers
(registers 13 to 16).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output
signal. The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for
each accelerometer axis is defined in the accelerometer specification table.
When the value of the self-test response is within the specified min/max limits of the product specification,
the part has passed self-test. When the self-test response exceeds the min/max values, the part is deemed
to have failed self-test. It is recommended to use InvenSense MotionApps software for executing self-test.
4.12 Clocking
The MPU-6500 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the
internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
•
•
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
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Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation. For
example, in one mode, where the biggest concern is power consumption, the user may wish to operate the
Digital Motion Processor of the MPU-6500 to process accelerometer data, while keeping the gyros off. In this
case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the gyros
are active, selecting the gyros as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-6500 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
4.13 Sensor Data Registers
The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature
measurement data. They are read-only registers, and are accessed via the serial interface. Data from these
registers may be read anytime.
4.14 FIFO
The MPU-6500 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-6500 Register Map and Register
Descriptions document.
4.15 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event
interrupts; and (4) the MPU-6500 did not receive an acknowledge from an auxiliary sensor on the secondary
I2C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-6500 Register Map and Register
Descriptions document.
4.16 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-6500 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
4.17 Bias and LDOs
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-6500. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the
Bill of Materials for External Components.
4.18 Charge Pump
An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.19 Standard Power Modes
The following table lists the user-accessible power modes for MPU-6500.
Mode
Name
Gyro
Off
Accel
Off
DMP
Off
1
2
3
4
5
6
Sleep Mode
Standby Mode
Drive On Off
Off
Low-Power Accelerometer Mode
Low-Noise Accelerometer Mode
Gyroscope Mode
6-Axis Mode
Off
Off
On
On
Duty-Cycled
Off
On
Off
On
Off
On or Off
On or Off
Table 12: Standard Power Modes for MPU-6500
Notes:
1. Power consumption for individual modes can be found in section 3.3.1.
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
5
Programmable Interrupts
The MPU-6500 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Interrupt Name
Module
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master
I2C Master
I2C Master errors: Lost Arbitration, NACKs
I2C Slave 4
Table 13: Table of Interrupt Sources
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-
6500 Register Map and Register Descriptions document. Some interrupt sources are explained below.
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MPU-6500 Product Specification
5.1 Wake-on-Motion Interrupt
The MPU-6500 provides motion detection capability. A qualifying motion sample is one where the high
passed sample from any axis has an absolute value exceeding a user-programmable threshold. The
following flowchart explains how to configure the Wake-on-Motion Interrupt. For further details on individual
registers, please refer to the MPU-6500 Registers Map and Registers Description document.
Configuration Wake-on-Motion Interrupt using low power Accel mode
Make Sure Accel is running:
In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0
In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1
•
•
Set Accel LPF setting to 184 Hz Bandwidth:
In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPFCFG[2:0]=1(b001)
•
Enable Motion Interrupt:
In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.
•
•
Enable Accel Hardware Intelligence:
In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1
Set Motion Threshold:
In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)
•
Set Frequency of Wake-up:
In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz
•
Enable Cycle Mode (Accel Low Power Mode):
In PWR_MGMT_1 (0x6B) make CYCLE =1
•
Motion Interrupt Configuration Completed
Figure 8: Wake-on-Motion Interrupt Configuration
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Document Number: PS-MPU-6500A-01
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MPU-6500 Product Specification
6
Digital Interface
6.1 I2C and SPI Serial Interfaces
The internal registers and memory of the MPU-6500 can be accessed using either I2C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Pin Number
Pin Name
VDDIO
Pin Description
6
7
Digital I/O supply voltage.
AD0 / SDO
SCL / SCLK
SDA / SDI
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
21
22
Table 14: Serial Interface
Note:
To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6500 Register Map and
Register Descriptions document.
6.2 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-6500 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-6500 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two MPU-6500s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
6.3 I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
P
START condition
STOP condition
Figure 9: START and STOP Conditions
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Figure 10: Acknowledge on the I2C Bus
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Figure 11: Complete I2C Data Transfer
To write the internal MPU-6500 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-6500 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-6500 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-6500 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
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To read the internal MPU-6500 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-6500, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-6500 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
DATA
6.4 I2C Terms
Signal Description
S
AD
W
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA
DATA
P
MPU-6500 internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
Table 15: I2C Terms
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6.5 SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6500
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select
(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the non-
selected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on the rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. The maximum frequency of SCLK is 1MHz
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
LSB
R/W A6 A5 A4 A3 A2 A1
A0
SPI Data format
MSB
LSB
D7
D6 D5 D4 D3 D2 D1
D0
6. Supports Single or Burst Read/Writes.
SCLK
SDI
SPI Master
SPI Slave 1
SDO
/CS
/CS1
/CS2
SCLK
SDI
SDO
/CS
SPI Slave 2
Figure 12 Typical SPI Master / Slave Configuration
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7
Serial Interface Considerations
7.1 MPU-6500 Supported Interfaces
The MPU-6500 supports I2C communications on both its primary (microprocessor) serial interface and its
auxiliary interface..
The MPU-6500’s I/O logic levels are set to be VDDIO.
The figure below depicts a sample circuit of MPU-6500 with a third party magnetometer attached to the
auxiliary I2C bus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.
Figure 13: I/O Levels and Connections
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend
mode.
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8
Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
8.1
Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
+Y
+Z
MPU
+Y
-
6500
+X
+X
Figure 14: Orientation of Axes of Sensitivity and Polarity of Rotation
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8.2
Package Dimensions
24 Lead QFN (3x3x0.9) mm NiPdAu Lead-frame finish
h
w
DIMENSIONS IN MILLIMETERS
SYMBOLS
DESCRIPTION
MIN
NOM
MAX
A
A1
b
c
D
D2
E
E2
e
f (e-b)
K
L
Package thickness
0.85
0.00
0.15
---
2.90
1.65
2.90
1.49
---
0.90
0.02
0.20
0.95
0.05
0.25
---
3.10
1.75
3.10
1.59
---
0.25
---
0.35
---
Lead finger (pad) seating height
Lead finger (pad) width
Lead frame (pad) height
Package width
Exposed pad width
Package length
0.20 REF
3.00
1.70
3.00
1.54
0.40
Exposed pad length
Lead finger-finger (pad-pad) pitch
Lead-lead (Pad-Pad) space
Lead (pad) to Exposed Pad Space
Lead (pad) length
Lead (pad) corner radius
Corner lead (pad) outer radius
Corner lead (pad) inner radius
Corner lead-lead (pad-pad) spacing
Corner lead dimension
Corner lead dimension
Lead Conformality
0.15
---
0.20
0.35 REF
0.30
0.25
0.075
0.10
0.10
---
R
REF
0.11
0.11
R’
R’’
s
h
w
0.12
0.12
---
0.25 REF
0.22
0.12
---
y
0.00
0.075
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9
Part Number Package Marking
The part number package marking for MPU-6500 devices is summarized below:
Part Number
Part Number Package Marking
MP65
MPU-6500
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10 Reliability
10.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-6500 followed the JESD47I Standards, “Stress-Test-Driven Qualification
of Integrated Circuits,” with the individual tests described below.
10.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D, Dynamic, 3.63V biased,
Tj>125°C [read-points 168, 500, 1000 hours]
3
3
77
77
(0/1)
(HAST)
JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia. unbiased, [read-
point 96 hours]
(0/1)
Highly Accelerated Stress Test (1)
(HTS)
JEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]
3
77
(0/1)
High Temperature Storage Life
Device Component Level Tests
Method/Condition
TEST
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(ESD-HBM)
ANSI/ESDA/JEDEC JS-001-2012, (2KV)
1
3
(0/1)
ESD-Human Body Model
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C, (250V)
1
1
3
3
6
5
(0/1)
(0/1)
(0/1)
(LU)
Latch Up
JEDEC JESD-78D Class II (2), 125°C; ±100mA
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883,
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
(VIB)
Vibration
JEDEC JESD22-B103B, Variable Frequency (random),
Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
3
3
5
(0/1)
(0/1)
(TC)
JEDEC JESD22-A104D
Condition G [-40°C to +125°C],
Soak Mode 2 [5’], 1000 cycles
77
Temperature Cycling (1)
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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11 Reference
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following
information:
• Manufacturing Recommendations
o
o
o
o
o
o
o
o
o
o
o
Assembly Guidelines and Recommendations
PCB Design Guidelines and Recommendations
MEMS Handling Instructions
ESD Considerations
Reflow Specification
Storage Specifications
Package Marking Specification
Tape & Reel Specification
Reel & Pizza Box Label
Packaging
Representative Shipping Carton Label
• Compliance
o
o
o
Environmental Compliance
DRC Compliance
Compliance Declaration Disclaimer
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
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