MZA1210D680CT [TDK]
Ferrite Chip, 2 Function(s), 5V, 0.05A, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0504, SMD, 4 PIN;
| 型号： | MZA1210D680CT |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Ferrite Chip, 2 Function(s), 5V, 0.05A, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0504, SMD, 4 PIN |
| 文件： | 总7页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Chip Beads(SMD Array)
For signal line
MZA series
Type:
MZA1210
MZA2010
[0504 inch]* (2 lines)
[0804 inch] (4 lines)
* Dimensions Code JIS[EIA]
Issue date:
May 2011
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/6)
Conformity to RoHS Directive
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1210 Type
FEATURES
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
• A single MZA series chip provides noise attenuation for two
lines, making it ideal for use with I/O lines of various highly
miniaturized.
1.25 0.15
0.4
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
0.35 0.15 0.35 0.15
• Electroplated terminal electrodes accommodate reflow
soldering.
0.3
• Monolithic structure ensures high reliability.
• The products contain no lead and also support lead-free
soldering.
Weight: 3mg
0.65 0.10
Dimensions in mm
• It is a product conforming to RoHS directive.
CIRCUIT DIAGRAM
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
• No polarity
PRODUCT IDENTIFICATION
MZA 1210 D 121 C
T
TEMPERATURE RANGES
(1) (2) (3) (4) (5) (6)
Operating/storage
–55 to +125°C
(1) Series name
PACKAGING STYLE AND QUANTITIES
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
Packaging style
Taping
Quantity
5000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
HANDLING AND PRECAUTIONS
Natural
cooling
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
180˚C
150˚C
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
(2/6)
ELECTRICAL CHARACTERISTICS
Impedance
Part No.
Rated current
(mA)max.
Rated voltage
(V)max.
DC resistance
(Ω)max.
(Ω)[100MHz]∗
MZA1210D330C
MZA1210D680C
MZA1210D121C
MZA1210D241C
∗
33 25%
68 25%
120 25%
240 25%
0.30
0.50
0.80
1.20
50
50
50
50
5
5
5
5
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25 10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA1210D330C
MZA1210D680C
MZA1210D121C
500
250
800
700
600
500
400
300
200
100
0
400
300
200
100
0
200
150
100
50
Z
Z
Z
R
R
R
X
X
X
0
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
(
Frequency MHz
(
Frequency MHz
Frequency MHz
MZA1210D241C
1600
1400
1200
1000
800
600
400
200
0
Z
R
X
1
10
100
1000
10000
(
)
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
+0.1
–0.0
1.5
Sprocket hole
Cavity
1.0
0.8max.
1.2 0.2
4.0 0.1
2.0 0.05
4.0 0.1
+2.0
8.4
–0.0
2.0 0.5
160min.
Taping
200min.
ø13 0.2
ø21 0.8
14.4max.
ø180 2.0
Dimensions in mm
300min.
Dimensions in mm
Drawing direction
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
(3/6)
Conformity to RoHS Directive
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA2010 Type
FEATURES
MATERIAL CHARACTERISTICS
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
Y material: High frequency range type intended for the 100MHz
region and above.
APPLICATIONS
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
MZA 2010 D 121 C
T
(1) (2) (3) (4) (5) (6)
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
TYPICAL MATERIAL CHARACTERISTICS
2000
D
1800
1600
HANDLING AND PRECAUTIONS
Y
1400
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
1200
1000
F
S
800
600
400
200
0
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
B
10
100
Frequency(MHz)
1000
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
(4/6)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
2.0 0.15
Ferrite
10s max.
Terminal
electrode
250 to 260˚C
230˚C
Natural
cooling
0.5 0.1 0.25+0.15/–0.10
0.5
0.25
180˚C
150˚C
Weight: 5mg
Dimensions in mm
Preheating
60 to 120s
Soldering
30 to 60s
CIRCUIT DIAGRAM
Time(s)
• No polarity
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
5000 pieces/reel
ELECTRICAL CHARACTERISTICS
Impedance
Part No.
Rated current
(mA)max.
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
Rated voltage
(V)max.
DC resistance
(Ω)max.
(Ω)[100MHz]∗
MZA2010B241C
MZA2010S800C
MZA2010S121C
MZA2010S241C
MZA2010S601C
MZA2010S102C
MZA2010Y800C
MZA2010Y121C
MZA2010Y241C
MZA2010Y601C
MZA2010Y102C
MZA2010D330C
MZA2010D680C
MZA2010D121C
MZA2010D241C
MZA2010F330C
MZA2010F470C
MZA2010F560C
∗
240 25%
80 25%
0.45
0.22
0.25
0.35
0.50
0.75
0.30
0.40
0.60
0.80
1.00
0.30
0.50
0.80
1.20
0.60
0.80
0.80
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
120 25%
240 25%
600 25%
1000 25%
80 25%
120 25%
240 25%
600 25%
1000 25%
33 25%
68 25%
120 25%
240 25%
33 25%
47 25%
56 25%
100
100
100
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25 10°C
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
(5/6)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA2010B241C
MZA2010S800C
MZA2010S121C
250
140
120
100
80
300
250
200
150
100
50
Z
200
Z
R
Z
150
R
R
60
100
40
X
X
X
50
20
0
0
0
1
10
100
1000
)
10000
10000
10000
10000
1
10
100
1000
)
10000
1
10
100
1000
)
10000
(
(
Frequency MHz
(
Frequency MHz
Frequency MHz
MZA2010S241C
MZA2010S601C
MZA2010S102C
400
350
300
250
200
150
100
50
1400
1200
1000
800
900
800
700
600
500
400
300
200
100
0
Z
Z
R
Z
R
R
600
400
X
X
200
X
0
0
1
1
10
100
1000
)
10000
10
100
1000
)
1
10
100
1000
)
10000
10000
10000
(
(
Frequency MHz
Frequency MHz
(
Frequency MHz
MZA2010Y800C
MZA2010Y121C
MZA2010Y241C
180
160
140
120
100
80
450
400
350
300
250
200
150
100
50
300
250
200
150
100
50
Z
R
X
Z
Z
R
R
60
X
X
40
20
0
0
0
1
10
100
1000
)
10000
1
10
100
1000
)
1
10
100
(
1000
)
(
(
Frequency MHz
Frequency MHz
Frequency MHz
MZA2010Y601C
MZA2010Y102C
MZA2010D330C
1000
1400
1200
1000
800
250
Z
800
600
400
200
200
150
100
50
Z
Z
R
R
R
600
400
X
X
X
200
0
1
0
1
0
10
100
1000
)
10000
10
100
1000
)
1
10
100
1000
)
(
Frequency MHz
(
Frequency MHz
(
Frequency MHz
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
(6/6)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA2010D680C
MZA2010D121C
MZA2010D241C
500
400
300
800
700
600
500
400
300
200
100
0
1600
1400
1200
1000
800
600
400
200
0
Z
Z
R
R
R
Z
200
100
0
X
X
X
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100
1000
10000
(
( )
Frequency MHz
(
Frequency MHz
Frequency MHz
MZA2010F330C
MZA2010F470C
MZA2010F560C
1200
1000
800
600
400
200
0
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
R
R
Z
Z
Z
X
X
X
R
1
10
100
1000
)
10000
1
10
100
1000
)
10000
1
10
100 1000
( )
Frequency MHz
10000
(
(
Frequency MHz
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
+0.1
–0.0
1.5
Sprocket hole
Cavity
1.0
0.8max.
1.3 0.2
4.0 0.1
2.0 0.05
4.0 0.1
+2.0
8.4
–0.0
2.0 0.5
160min.
Taping
200min.
ø13 0.2
ø21 0.8
14.4max.
ø180 2.0
Dimensions in mm
300min.
Dimensions in mm
Drawing direction
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
相关型号：
MZA2010D-121CT
Ferrite Chip, 4 Function(s), 5V, 0.05A, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0804, SMD, 8 PIN
TDK
MZA2010D-241CT
4 FUNCTIONS, 5 V, 0.05 A, FERRITE CHIP, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0804, SMD, 8 PIN
TDK
MZA2010D-330CT
4 FUNCTIONS, 5 V, 0.05 A, FERRITE CHIP, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0804, SMD, 8 PIN
TDK
©2020 ICPDF网 联系我们和版权申明