P2102AA61AP [TECCOR]

SIDACtor devices; SIDACtor装置
P2102AA61AP
型号: P2102AA61AP
厂家: TECCOR ELECTRONICS    TECCOR ELECTRONICS
描述:

SIDACtor devices
SIDACtor装置

装置 双向触发二极管
文件: 总212页 (文件大小:1854K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Book  
and Design Guide  
TECCOR ELECTRONICS  
1800 Hurd Drive  
Irving, Texas 75038  
United States of America  
Phone: +1 972-580-7777  
Fax: +1 972-550-1309  
Web site: http://www.teccor.com  
E-mail: sidactor.techsales@teccor.com  
An Invensys company  
Teccor Electronics is the proprietor of the SIDACtor®, Battrax®, and TeleLink®  
trademarks. All other brand names may be trademarks of their respective companies.  
Teccor Electronics SIDACtor products are covered by these and other U.S. Patents:  
4,685,120  
4,827,497  
4,905,119  
5,479,031  
5,516,705  
All SIDACtor products are recognized and listed under UL file E133083 as a UL 497B  
compliant device. All TeleLink fuses are recognized under UL file E191008 and are also  
listed for CSA marking by certificate LR 702828.  
9
T
E
S
C
I
C
C
O
N
O
R
L
EC  
T
R
E
Teccor Electronics reserves the right to make changes at any time in order to improve  
designs and to supply the best products possible. The information in this catalog has  
been carefully checked and is believed to be accurate and reliable; however, no liability  
of any type shall be incurred by Teccor for the use of the circuits or devices described in  
this publication. Furthermore, no license of any patent rights is implied or given to any  
purchaser.  
NOTES  
1 Product Selection  
Guide  
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2  
Product Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4  
Part Number Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6  
Description of Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8  
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10  
Quality and Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11  
Standard Terms and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12  
© 2002 Teccor Electronics  
1-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Product Description  
Product Description  
SIDACtor components are solid state crowbar devices designed to protect telecom  
equipment during hazardous transient conditions. Capitalizing on the latest in thyristor  
advancements, Teccor makes SIDACtor devices with a patented ion implant technology.  
This technology ensures effective protection within nanoseconds, up to 5000 A surge  
current ratings, and simple solutions for regulatory requirements such as GR 1089,  
TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.  
Operation  
In the standby mode, SIDACtor devices exhibit a high off-state impedance, eliminating  
excessive leakage currents and appearing transparent to the circuits they protect. Upon  
application of a voltage exceeding the switching voltage (VS), SIDACtor devices crowbar  
and simulate a short circuit condition until the current flowing through the device is either  
interrupted or drops below the SIDACtor device’s holding current (IH). Once this occurs,  
SIDACtor devices reset and return to their high off-state impedance.  
+I  
IT  
IS  
IH  
IDRM  
-V  
+V  
VDRM  
VT  
VS  
-I  
V-I Characteristics  
Advantages  
Compared to surge suppression using other technologies, SIDACtor devices offer absolute  
surge protection regardless of the surge current available and the rate of applied voltage  
(dv/dt). SIDACtor devices:  
Cannot be damaged by voltage  
Eliminate hysteresis and heat dissipation typically found with clamping devices  
Eliminate voltage overshoot caused by fast-rising transients  
Are non-degenerative  
Will not fatigue  
Have low capacitance, making them ideal for high-speed transmission equipment  
http://www.teccor.com  
+1 972-580-7777  
1 - 2  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Product Description  
Applications  
When protecting telecommunication circuits, SIDACtor devices are connected across Tip  
and Ring for metallic protection and across Tip and Ground and Ring and Ground for  
longitudinal protection. They typically are placed behind some type of current-limiting  
device, such as Teccor’s F1250T Telelink slow blow fuse. Common applications include:  
Central office line cards (SLICs)  
T-1/E-1, ISDN, and xDSL transmission equipment  
Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct  
boxes  
PBXs, KSUs, and other switches  
Primary protection including main distribution frames, five-pin modules, building  
entrance equipment, and station protection modules  
Data lines and security systems  
CATV line amplifiers and power inserters  
Sprinkler systems  
For more information regarding specific applications, design requirements, or surge  
suppression, please contact Teccor Electronics directly at +1 972-580-7777 or through our  
local area representative. Access Teccor’s web site at http://www.teccor.com or  
e-mail us at sidactor.techsales@teccor.com.  
© 2002 Teccor Electronics  
1 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Product Packages  
Product Packages  
Surface Mount Packages  
Modified  
Modified  
Surface Mount  
(Fuse)  
DO-214AA  
DO-214AA  
MS-013 Six-pin  
Balanced SIDACtor Device  
Battrax Dual Negative SLIC Protector  
Battrax Dual Positive/Negative SLIC  
Protector  
Battrax Quad Negative SLIC Protector  
Battrax SLIC Protector  
CATV/HFC SIDACtor Device  
CATV Line Amplifiers/Power Inserters  
SIDACtor Device  
Fixed Voltage SLIC Protector  
Four-port Metallic Line Protector  
High Surge (D-rated) SIDACtor Device  
LCAS Asymmetrical Device  
Longitudinal Protector  
MC Balanced SIDACtor Device  
MC SIDACtor Device  
Multiport Balanced SIDACtor Device  
Multiport Quad SLIC Protector  
Multiport SIDACtor Device  
SIDACtor Device  
TeleLink Fuse  
Twin SLIC Protector  
http://www.teccor.com  
+1 972-580-7777  
1 - 4  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Product Packages  
Through-hole Packages  
Modified  
TO-92  
TO-220  
TO-218  
Hybrid SIP  
Balanced SIDACtor Device  
Battrax Dual Negative SLIC Protector  
Battrax Dual Positive/Negative SLIC  
Protector  
Battrax Quad Negative SLIC Protector  
Battrax SLIC Protector  
CATV/HFC SIDACtor Device  
CATV Line Amplifiers/Power Inserters  
SIDACtor Device  
Fixed Voltage SLIC Protector  
Four-port Metallic Line Protector  
High Surge (D-rated) SIDACtor Device  
LCAS Asymmetrical Device  
Longitudinal Protector  
MC Balanced SIDACtor Device  
MC SIDACtor Device  
Multiport Balanced SIDACtor Device  
Multiport Quad SLIC Protector  
Multiport SIDACtor Device  
SIDACtor Device  
TeleLink Fuse  
Twin SLIC Protector  
© 2002 Teccor Electronics  
1 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Part Number Index  
Part Number Index  
Note: For explanation of part numbers, see "Description of Part Number" on page 1-8.  
Part Number  
P0602A_  
P0602AC MC  
P0602Z_  
P0640E_  
P0640EC MC  
P0640S_  
P0640SC MC  
P0640SD  
P0640Z_  
P0641CA2  
P0641S_  
P0641U_  
P0642S_  
P0644U_  
P0720E_  
Page  
2-28  
Part Number  
P1101S_  
P1101U_  
P1102S_  
P1104U_  
P1200S_  
P1300E_  
P1300S_  
P1300SC MC  
P1300SD  
P1300Z_  
P1304U_  
P1400AD  
P1402A_  
P1402AC MC  
P1402Z_  
P1500E_  
P1500EC MC  
P1500S_  
P1500SC MC  
P1500SD  
P1500Z_  
P1504U_  
P1553A_  
P1553AC MC  
P1553U_  
P1553Z_  
P1556U_  
P1602A_  
P1602AC MC  
P1602Z_  
P1800AD  
P1800E_  
Page  
2-46  
Part Number  
A1220U_4  
A1225U_4  
A2106A_  
A2106U_  
A2106U_6  
A2106Z_  
A5030A_  
A5030U_  
A5030U_6  
A5030Z_  
B1100C_  
B1101U_  
B1101U_4  
B1160C_  
B1161U_  
B1161U_4  
B1200C_  
B1201U_  
B1201U_4  
B2050C_  
B3104U_  
B3164U_  
B3204U_  
F0500T  
Page  
2-36  
2-30  
2-42  
2-16  
2-18  
2-4  
2-50  
2-14  
2-22  
2-38  
2-16  
2-4  
2-36  
2-32  
2-20  
2-24  
2-40  
2-32  
2-20  
2-24  
2-40  
2-52  
2-54  
2-58  
2-52  
2-54  
2-58  
2-52  
2-54  
2-58  
2-52  
2-56  
2-56  
2-56  
2-66  
2-66  
2-66  
2-16  
2-4  
2-6  
2-10  
2-44  
2-48  
2-46  
2-50  
2-14  
2-22  
2-16  
2-4  
2-6  
2-10  
2-44  
2-22  
2-60  
2-28  
2-30  
2-42  
2-16  
2-18  
2-4  
P0720S_  
P0720SC MC  
P0720SD  
P0720Z_  
P0721CA2  
P0721S_  
P0721U_  
P0722S_  
P0724U_  
P0900E_  
2-6  
2-10  
2-44  
2-48  
2-46  
2-50  
2-14  
2-22  
2-16  
2-4  
2-6  
2-10  
2-44  
2-22  
2-32  
2-34  
2-20  
2-40  
2-24  
2-28  
2-30  
2-42  
2-60  
2-16  
2-4  
F1250T  
F1251T  
P0900S_  
P0900SC MC  
P0900SD  
P0900Z_  
P0901CA2  
P0901S_  
P0901U_  
P0902S_  
P0904U_  
P1100E_  
2-6  
P0080E_  
P0080S_  
P0080SA MC  
P0080SC MC  
P0080SD  
P0080Z_  
P0084U_  
P0300E_  
P0300S_  
P0300SA MC  
P0300SC MC  
P0300SD  
P0300Z_  
P0304U_  
2-10  
2-44  
2-48  
2-46  
2-50  
2-14  
2-22  
2-16  
2-4  
2-8  
2-6  
2-10  
2-44  
2-22  
2-16  
2-4  
2-8  
2-6  
2-10  
2-44  
2-22  
P1800S_  
P1800SC MC  
P1800SD  
P1800Z_  
P1803A_  
P1803AC MC  
P1803U_  
2-6  
2-10  
2-44  
2-32  
2-34  
2-20  
2-40  
P1100S_  
P1100SC MC  
P1100SD  
P1100Z_  
2-6  
2-10  
2-44  
2-48  
P1101CA2  
P1803Z_  
http://www.teccor.com  
+1 972-580-7777  
1 - 6  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Part Number Index  
Part Number  
P1804U_  
P1806U_  
P1900ME  
P2000AA61  
P2000S_  
P2103A_  
P2103AC MC  
P2103U_  
P2103Z_  
P2106U_  
P2200AA61  
P2202A_  
P2202AC MC  
P2202Z_  
P2300E_  
P2300ME  
P2300S_  
P2300SC MC  
P2300SD  
P2300Z_  
P2304U_  
P2353A_  
Page  
2-22  
Part Number  
P2703AC MC  
P2703U_  
P2703Z_  
P2706U_  
P3000AA61  
P3002A_  
P3002AC MC  
P3002CA  
P3002S_  
P3002Z_  
P3100AD  
P3100E_  
P3100EC MC  
P3100S_  
P3100SC MC  
P3100SD  
P3104U_  
P3100Z_  
P3203A_  
P3203AC MC  
P3203U_  
P3203Z_  
P3206U_  
P3300AA61  
P3403A_  
P3403AC MC  
P3403U_  
P3403Z_  
P3406U_  
P3500E_  
P3500S_  
P3500SC MC  
P3500SD  
P3500Z_  
P3504U_  
P3602A_  
P3602AC MC  
P3602Z_  
P4202A_  
Page  
2-34  
Part Number  
P4202Z_  
P4802A_  
P4802AC MC  
P4802Z_  
P5103A_  
P5103AC MC  
P5103U_  
P5106U_  
P6002A_  
Page  
2-42  
2-24  
2-64  
2-26  
2-38  
2-32  
2-34  
2-20  
2-40  
2-24  
2-26  
2-28  
2-30  
2-42  
2-16  
2-64  
2-4  
2-20  
2-40  
2-24  
2-26  
2-28  
2-30  
2-12  
2-14  
2-42  
2-62  
2-16  
2-18  
2-4  
2-28  
2-30  
2-42  
2-32  
2-34  
2-20  
2-24  
2-28  
2-30  
2-62  
2-12  
2-42  
P6002AC MC  
P6002AD  
P6002CA  
P6002Z_  
2-6  
2-10  
2-22  
2-44  
2-32  
2-34  
2-20  
2-40  
2-24  
2-26  
2-32  
2-34  
2-20  
2-40  
2-24  
2-16  
2-4  
2-6  
2-10  
2-44  
2-22  
2-32  
2-34  
2-20  
2-40  
2-24  
2-26  
2-26  
2-38  
2-16  
2-18  
2-4  
P2353AC MC  
P2353U_  
P2353Z_  
P2356U_  
P2400AA61  
P2500AA61  
P2500S_  
P2600E_  
P2600EC MC  
P2600S_  
P2600SC MC  
P2600SD  
P2600Z_  
P2604U_  
P2702A_  
2-6  
2-6  
2-10  
2-44  
2-22  
2-28  
2-30  
2-42  
2-28  
2-30  
2-10  
2-44  
2-22  
2-28  
2-30  
2-42  
2-32  
P2702AC MC  
P2702Z_  
P2703A_  
P4202AC MC  
© 2002 Teccor Electronics  
1-7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Description of Part Number  
Description of Part Number  
The following illustration shows a description of a sample SIDACtor device part number.  
P
210  
2
A
A
61 RP  
PACKING OPTIONS  
RP1 = TO-92 reel pack (0.100" lead spacing)  
RP2 = TO-92 reel pack (0.200" lead spacing)  
AP = Ammo pack  
DEVICE TYPE  
P = SIDACtor  
RP = Reel pack  
TP = Tube pack  
MEDIAN VOLTAGE RATING  
210 = 210 V  
LEAD FORM OPTIONS  
TO-220 modified type 60, 61, or 62  
For U type:  
CONSTRUCTION VARIABLE  
0 = One chip  
1 = Unidirectional part  
2 = Two chips  
3 = 3 chips  
4 = 4 chips  
6 = 6 chips  
3 = Three chips  
I
PP RATING  
A = 50 A (10x560 µs)  
B = 100 A (10x560 µs)  
C = 500 A (2x10 µs)  
D = 1000 A (8x20 µs)  
E = 3000 A (8x20 µs)  
0 = One SIDACtor Chip  
1
3
2
2 = Two Matched SIDACtor Chips  
PACKAGE TYPE  
A = TO–220  
C = Three-leaded DO-214  
E = TO–92  
1
3
M = TO-218  
S = DO–214  
Patented  
U = Six-pin SOIC  
Z = SIP  
2
3 = Three Matched SIDACtor Chips  
http://www.teccor.com  
+1 972-580-7777  
1 - 8  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Description of Part Number  
The following illustration shows a description of a sample Battrax device part number.  
B 1 10 1  
U
A
IPP RATING  
DEVICE TYPE  
B = Battrax  
A = 50 A (10x560 µs)  
B = 100 A (10x560 µs)  
C = 500 A (2x10 µs)  
Battrax TYPE  
1 = Negative  
2 = Positive  
3 = Dual  
PACKAGE TYPE  
C = Three-leaded DO-214  
U = Six-pin SOIC  
HOLDING CURRENT  
05 = 50 mA  
10 = 100 mA  
16 = 160 mA  
20 = 200 mA  
CONSTRUCTION VARIABLE  
0 = No diode  
1 = Diode  
4 = Four Battrax Devives  
The following illustration shows a description of a sample asymmetrical SIDACtor device  
part number.  
A
1806  
U
C
4
TP  
PACKING OPTIONS  
AP = Ammo pack  
RP = Reel pack  
DEVICE TYPE  
A = Asymmetrical SIDACtor  
TP = Tube pack  
MEDIAN VOLTAGE RATING  
1806 = 180 V and 60 V  
LEAD FORM OPTIONS  
TO-220 modified type 60, 61, or 62  
For U type:  
3 = 3 chips  
4 = 4 chips  
6 = 6 chips  
1
3
Patented  
IPP RATING  
A = 50 A (10x560 µs)  
B = 100 A (10x560 µs)  
C = 500 A (2x10 µs)  
D = 1000 A (8x20 µs)  
E = 3000 A (8x20 µs)  
2
3 = Three Matched SIDACtor chips  
PACKAGE TYPE  
A = TO-220  
M = TO-218  
U = Six-pin SOIC  
© 2002 Teccor Electronics  
1 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Electrical Parameters  
Electrical Parameters  
Electrical parameters are based on the following definition of conditions:  
On state (also referred to as the crowbar condition) is the low impedance condition  
reached during full conduction and simulates a short circuit.  
Off state (also referred to as the blocking condition) is the high impedance condition prior  
to beginning conduction and simulates an open circuit.  
CO  
Off-state Capacitance — typical capacitance measured in off state  
di/dt  
Rate of Rise of Current — maximum rated value of the acceptable rate of  
rise in current over time  
dv/dt  
IS  
Rate of Rise of Voltage — rate of applied voltage over time  
Switching Current — maximum current required to switch to on state  
Leakage Current — maximum peak off-state current measured at VDRM  
Holding Current — minimum current required to maintain on state  
Peak Pulse Current — maximum rated peak impulse current  
On-state Current — maximum rated continuous on-state current  
Peak One-cycle Surge Current — maximum rated one-cycle AC current  
Switching Voltage — maximum voltage prior to switching to on state  
IDRM  
IH  
IPP  
IT  
ITSM  
VS  
VDRM  
Peak Off-state Voltage — maximum voltage that can be applied while  
maintaining off state  
VF  
VT  
On-state Forward Voltage — maximum forward voltage measured at rated  
on-state current  
On-state Voltage — maximum voltage measured at rated on-state current  
http://www.teccor.com  
+1 972-580-7777  
1 - 10  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Quality and Reliability  
Quality and Reliability  
It is Teccor’s policy to ship quality products on time. We accomplish this through Total  
Quality Management based on the fundamentals of customer focus, continuous  
improvement, and people involvement.  
In support of this commitment, Teccor applies the following principles:  
Employees shall be respected, involved, informed, and qualified for their job with  
appropriate education, training, and experience.  
Customer expectations shall be met or exceeded by consistently shipping products that  
meet the agreed specifications, quality levels, quantities, schedules, and test and  
reliability parameters.  
Suppliers shall be selected by considering quality, service, delivery, and cost of  
ownership.  
Design of products and processes will be driven by customer needs, reliability, and  
manufacturability.  
It is the responsibility of management to incorporate these principles into policies and  
systems.  
It is the responsibility of those in leadership roles to coach their staff and to reinforce these  
principles.  
It is the responsibility of each individual employee to follow the spirit of this statement to  
ensure that we meet the primary policy — to ship quality products on time.  
© 2002 Teccor Electronics  
1 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Standard Terms and Conditions  
Standard Terms and Conditions  
Supplier shall not be bound by any term proposed by Buyer in the absence of written agreement to such term signed by an  
authorized officer of Supplier.  
(1) PRICE:  
(A) Supplier reserves the right to change product prices at any time but, whenever practicable, Supplier will give Buyer at  
least thirty (30) days written notice before the effective date of any price change. Unless Supplier has specifically  
agreed in writing, signed by an authorized officer of Supplier, that a quoted price shall not be subject to change for a  
certain time, all products shipped on or after the effective date of a price change may be billed at the new price level.  
(B) Whenever Supplier agrees to a modification of Buyer's order (which modification must be in writing and signed by an  
authorized officer of Supplier), Supplier reserves the right to alter its price, whether or not such price was quoted  
as “firm”.  
(C) Prices do not include federal, state or local taxes, now or hereafter enacted, applicable to the goods sold. Taxes will  
be added by Supplier to the sales prices whenever Supplier has legal obligation to collect them and will be paid by  
Buyer as invoiced unless Buyer provides Supplier with a proper tax exemption certificate.  
(2) PRODUCTION: Supplier may, at its sole discretion and at any time, withdraw any catalog item from further production without  
notice or liability to Buyer.  
(3) INTEREST:  
(A) All late payments shall bear interest thirty (30) days after the due date stated on the invoice until paid at the lower of one  
and one-half percent per month or the maximum rate permitted by law. All interest becoming due shall, if not paid when  
due, be added to principal and bear interest from the due date. At Supplier's option, any payment shall be applied first  
to interest and then to principal.  
(B) It is the intention of the parties to comply with the laws of the jurisdiction governing any agreement between the  
parties relating to interest. If any construction of the agreement between the parties indicates a different right given  
to Supplier to demand or receive any sum greater than that permissible by law as interest, such as a mistake in  
calculation or wording, this paragraph shall override. In any contingency which will cause the interest paid or  
agreed to be paid to exceed the maximum rate permitted by law, such excess will be applied to the reduction of  
any principal amount due, or if there is no principal amount due, shall be refunded.  
(4) TITLE AND DELIVERY: Title to goods ordered by Buyer and risk of loss or damage in transit or thereafter shall pass to Buyer  
upon Supplier's delivery of the goods at Supplier's plant or to a common carrier for shipment to Buyer.  
(5) CONTINGENCIES: Supplier shall not be responsible for any failure to perform due to causes reasonably beyond its control.  
These causes shall include, but not be restricted to, fire, storm, flood, earthquake, explosion, accident, acts of public enemy,  
war rebellion, insurrection, sabotage, epidemic, quarantine restrictions, labor disputes, labor shortages, labor slow downs  
and sit downs, transportation embargoes, failure or delays in transportation, inability to secure raw materials or machinery for  
the manufacture of its devices, acts of God, acts of the Federal Government or any agency thereof, acts of any state or local  
government or agency thereof, and judicial action. Similar causes shall excuse Buyer for failure to take goods ordered by  
Buyer, from the time Supplier receives written notice from Buyer and for as long as the disabling cause continues, other than  
for goods already in transit or specially fabricated and not readily saleable to other buyers.  
Supplier assumes no responsibility for any tools, dies, and other equipment furnished Supplier by Buyer.  
(6) LIMITED WARRANTY AND EXCLUSIVE REMEDY: Supplier warrants all catalog products to be free from defects in materials  
and workmanship under normal and proper use and application for a period of twelve (12) months from the date code on the  
product in question (or if none, from the date of delivery to Buyer.) With respect to products assembled, prepared, or manu-  
factured to Buyer's specifications, Supplier warrants only that such products will meet Buyer's specifications upon delivery.  
As the party responsible for the specifications, Buyer shall be responsible for testing and inspecting the products for adher-  
ence to specifications, and Supplier shall have no liability in the absence of such testing and inspection or if the product  
passes such testing or inspection. THE ABOVE WARRANTY IS THE ONLY WARRANTY EXTENDED BY SUPPLIER, AND  
IS IN LIEU OF AND EXCLUDES ALL OTHER WARRANTIES AND CONDITIONS, EXPRESSED OR IMPLIED (EXCEPT AS  
PROVIDED HEREIN AS TO TITLE), ON ANY GOODS OR SERVICES SOLD OR RENDERED BY SUPPLIER, INCLUDING  
ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THIS WARRANTY  
WILL NOT CREATE WARRANTY COVERAGE FOR ANY ITEM INTO WHICH ANY PRODUCT SOLD BY SUPPLIER MAY  
HAVE BEEN INCORPORATED OR ADDED.  
SUPPLIER'S ENTIRE LIABILITY AND BUYER'S EXCLUSIVE REMEDY UNDER THIS WARRANTY SHALL BE, AT  
SUPPLIER'S OPTION, EITHER THE REPLACEMENT OF, REPAIR OF, OR ISSUANCE OF CREDIT TO BUYER'S  
ACCOUNT WITH SUPPLIER FOR ANY PRODUCTS WHICH ARE PROPERLY RETURNED BY BUYER DURING THE  
WARRANTY PERIOD. All returns must comply with the following conditions:  
© 2002 Teccor Electronics  
1 - 12  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Standard Terms and Conditions  
(A) Supplier is to be promptly notified in writing upon discovery of defects by Buyer.  
(B) Buyer must obtain a Return Material Authorization (RMA) number from the Supplier prior to returning product.  
(C) The defective product is returned to Supplier, transportation charges prepaid by Buyer.  
(D) Supplier's examination of such product discloses, to its satisfaction, that such defects have not been caused by  
misuse, neglect, improper installation, repair, alteration, or accident.  
(E) The product is returned in the form it was delivered with any necessary disassembly carried out by Buyer at Buyer's  
expense.  
IN NO EVENT SHALL SUPPLIER, OR ANYONE ELSE ASSOCIATED IN THE CREATION OF ANY OF SUPPLIER'S  
PRODUCTS OR SERVICES, BE LIABLE TO BUYER FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY  
NATURE INCLUDING LOSS OF PROFITS, LOSS OF USE, BUSINESS INTERUPTION, AND THE LIKE. BUYER  
ACKNOWLEDGES THAT THE ABOVE WARRANTIES AND LIMITATIONS THEREON ARE APPROPRIATE AND  
REASONABLE IN EFFECTUATING SUPPLIER'S AND BUYER'S MUTUAL INTENTION TO CONDUCT AN EFFICIENT  
TRANSACTION AT PRICES MORE ADVANTAGEOUS TO BUYER THAN WOULD BE AVAILABLE IN THE PRESENCE  
OF OTHER WARRANTIES AND ASSURANCES.  
(7) PATENTS: Buyer shall notify Supplier in writing of any claim that any product or any part of use thereof furnished under this  
agreement constitutes an infringement of any U.S. patent, copyright, trade secret, or other proprietary rights of a third party.  
Notice shall be given within a reasonable period of time which should in most cases be within ten (10) days of receipt by  
Buyer of any letter, summons, or complaint pertaining to such a claim. At its option, Supplier may defend at its expense any  
action brought against Buyer to the extent that it is based on such a claim. Should Supplier choose to defend any such claim,  
Supplier may fully participate in the defense, settlement, or appeal of any action based on such claim.  
Should any product become, or in Supplier's opinion be likely to become, the subject of an action based on any such  
claim, Supplier may, at its option, as the Buyer's exclusive remedy, either procure for the Buyer the right to continue  
using the product, replace the product or modify the product to make it noninfringing. IN NO EVENT SHALL SUPPLIER  
BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES BASED ON ANY CLAIM OF INFRINGEMENT.  
Supplier shall have no liability for any claim based on modifications of a product made by any person or entity other than  
Supplier, or based on use of a product in conjunction with any other item, unless expressly approved by Supplier.  
Supplier does not warrant goods against claims of infringement which are assembled, prepared, or manufactured to  
Buyer's specifications.  
(8) NON-WAIVER OF DEFAULT: Each shipment made under any order shall be treated as a separate transaction, but in the  
event of any default by Buyer, Supplier may decline to make further shipments without in any way affecting its rights under  
such order. If, despite any default by Buyer, Supplier elects to continue to make shipments, its action shall not constitute a  
waiver of that or any default by Buyer or in any way affect Supplier's legal remedies for any such default. At any time, Sup-  
plier's failure to exercise any right to remedy available to it shall not constitute a waiver of that right or remedy.  
(9) TERMINATION: If the products to be furnished under this order are to be used in the performance of a Government contract  
or subcontract, and the Government terminates such contract in whole or part, this order may be canceled to the extent it  
was to be used in the canceled portion of said Government contract and the liability of Buyer for termination allowances shall  
be determined by the then applicable regulations of the Government regarding termination of contracts. Supplier may cancel  
any unfilled orders unless Buyer shall, upon written notice, immediately pay for all goods delivered or shall pay in advance  
for all goods ordered but not delivered, or both, at Supplier's option.  
(10) LAW: The validity, performance and construction of these terms and conditions and any sale made hereunder shall be gov-  
erned by the laws of the state of Texas.  
(11) ASSIGNS: This agreement shall not be assignable by either Supplier or Buyer. However, should either Supplier or Buyer be  
sold or transferred in its entirety and as an ongoing business, or should Supplier or Buyer sell or transfer in its entirety and as  
an ongoing concern, any division, department, or subsidiary responsible in whole or in part for the performance of this Agree-  
ment, this Agreement shall be binding upon and inure to the benefit of those successors and assigns of Supplier, Buyer, or  
such division, department, or subsidiary.  
(12) MODIFICATION OF STANDARD TERMS AND CONDITIONS: No attempted or suggested modification of or addition to any  
of the provisions upon the face or reverse of this form, whether contained or arising in correspondence and/or documents  
passing between Supplier and Buyer, in any course of dealing between Supplier or Buyer, or in any customary usage preva-  
lent among businesses comparable to those of Supplier and/or Buyer, shall be binding upon Supplier unless made and  
agreed to in writing and signed by an officer of Supplier.  
(13) QUANTITIES: Any variation in quantities of electronic components, or other goods shipped over or under the quantities  
ordered (not to exceed 5%) shall constitute compliance with Buyer's order and the unit price will continue to apply.  
© 2002 Teccor Electronics  
1 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
NOTES  
2 Data Sheets  
This section presents complete electrical specifications for Teccor’s SIDACtor solid state  
overvoltage protection devices.  
DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3  
DO-214AA  
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4  
MicroCapacitance (MC) SC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6  
MicroCapacitance (MC) SA SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8  
High Surge Current (D-rated) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10  
Compak Two-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12  
Ethernet/10BaseT/100BaseT Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14  
TO-92  
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16  
MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18  
Modified MS-013 (Six-pin Surface Mount)  
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20  
Multiport SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22  
Multiport Balanced SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24  
Modified TO-220  
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26  
Two-chip SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28  
Two-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30  
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32  
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . 2-34  
LCAS  
LCAS Asymmetrical Multiport Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36  
LCAS Asymmetrical Discrete Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38  
SIP Hybrid Overvoltage and Overcurrent Protector  
Four-Port Balanced Three-chip Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40  
Four-Port Longitudinal Two-chip Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42  
Four-Port Metallic Line Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44  
SLICs  
Fixed Voltage SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46  
Twin SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48  
Multiport SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50  
Battrax  
Battrax SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-52  
Battrax Dual Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54  
Battrax Dual Positive/Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-56  
Battrax Quad Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-58  
CATVs  
CATV and HFC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-60  
High Surge Current SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-62  
CATV Line Amplifiers/Power Inserters SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64  
TeleLink Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66  
Acronyms: CATV  
Community Antenna TV  
Hybrid Fiber Coax  
HFC  
LCAS  
SIP  
Line Circuit Access Switch  
Single In-line Package  
Subscriber Line Interface Circuit  
SLIC  
© 2002 Teccor Electronics  
2-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
DO-214AA Package Symbolization  
DO-214AA Package Symbolization  
Part Number  
Part Number  
Part Number  
Catalog  
P0080SA  
Symbolized  
P-8A  
P-8AM  
P-8B  
P-8C  
P-8D  
P-8CM  
P03A  
P03AM  
P03B  
Catalog  
P0901SC  
P1100SA  
Symbolized  
P91C  
P11A  
P11B  
P11C  
P11D  
P11CM  
P02A  
Catalog  
P2300SB  
P2300SC  
P2300SD  
P2300SC MC  
P2500SA  
P2500SB  
P2500SC  
P2500SD  
P2500SC MC  
P2600SA  
P2600SB  
P2600SC  
P2600SD  
P2600SC MC  
P3002CB  
P3002SB  
P3100SA  
P3100SB  
P3100SC  
P3100SD  
P3100SC MC  
P3500SA  
P3500SB  
P3500SC  
P3500SD  
P3500SC MC  
P6002CB  
B1100CA  
B1100CC  
B1160CA  
B1160CC  
B1200CA  
B1200CC  
B2050CA  
B2050CC  
Symbolized  
P23B  
P23C  
P23D  
P23CM  
P25A  
P25B  
P25C  
P25D  
P25CM  
P26A  
P26B  
P26C  
P26D  
P26CM  
P30B  
P30B  
P31A  
P31B  
P31C  
P31D  
P31CM  
P35A  
P35B  
P35C  
P35D  
P35CM  
P60B  
B10A  
B10C  
B16A  
B16C  
B12A  
B12C  
B25A  
B25C  
P0080SA MC  
P0080SB  
P0080SC  
P0080SD  
P0080SC MC  
P0300SA  
P0300SA MC  
P0300SB  
P0300SC  
P0300SD  
P0300SC MC  
P0640SA  
P1100SB  
P1100SC  
P1100SD  
P1100SC MC  
P1101CA2  
P1101SA  
P01A  
P01C  
P12A  
P1101SC  
P1200SA  
P1200SB  
P1200SC  
P1200SD  
P1200SC MC  
P1300SA  
P1300SB  
P1300SC  
P1300SD  
P1300SC MC  
P1500SA  
P1500SB  
P1500SC  
P1500SD  
P1500SC MC  
P1800SA  
P1800SB  
P1800SC  
P1800SD  
P1800SC MC  
P2000SA  
P2000SB  
P2000SC  
P2000SD  
P2000SC MC  
P2300SA  
P03C  
P03D  
P03CM  
P06A  
P12B  
P12C  
P12D  
P12CM  
P13A  
P0640SB  
P06B  
P0640SC  
P0640SD  
P0640SC MC  
P0641CA2  
P0641SA  
P0641SC  
P0720SA  
P0720SB  
P0720SC  
P0720SD  
P0720SC MC  
P0721CA2  
P0721SA  
P0721SC  
P0900SA  
P0900SB  
P06C  
P06D  
P06CM  
P62A  
P61A  
P61C  
P07A  
P13B  
P13C  
P13D  
P13CM  
P15A  
P15B  
P07B  
P15C  
P15D  
P15CM  
P18A  
P07C  
P07D  
P07CM  
P72A  
P71A  
P71C  
P09A  
P18B  
P18C  
P18D  
P18CM  
P20A  
P09B  
P0900SC  
P0900SD  
P0900SC MC  
P0901CA2  
P0901SA  
P09C  
P09D  
P09CM  
P92A  
P20B  
P20C  
P20D  
P20CM  
P23A  
P91A  
Note: Date code is located below the symbolized part number.  
© 2002 Teccor Electronics  
2 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Device  
SIDACtor Device  
DO-214AA SIDACtor solid state protection devices protect telecommunications equipment  
such as modems, line cards, fax machines, and other CPE.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0080S_  
P0300S_  
P0640S_  
P0720S_  
P0900S_  
P1100S_  
P1300S_  
P1500S_  
P1800S_  
P2300S_  
P2600S_  
P3100S_  
P3500S_  
6
25  
58  
65  
75  
90  
120  
140  
170  
190  
220  
275  
320  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
100  
110  
50  
50  
50  
40  
40  
40  
30  
30  
30  
30  
30  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is  
approximately 2x the listed value. The off-state capacitance of the P0080SB is equal to the “SC” device.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
30  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 4  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
SIDACtor Device  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SC SIDACtor Device  
MicroCapacitance (MC) SC SIDACtor Device  
The DO-214AA SC MC SIDACtor series is intended for applications sensitive to load  
values. Typically, high speed connections require a lower capacitance. CO values for the  
MicroCapacitance device are 40% lower than a standard SC part.  
This MC SIDACtor series is used to enable equipment to meet various regulatory  
requirements including GR 1089, IEC 60950, UL 60950, and TIA-968 (formerly known as  
FCC Part 68). Contact factory regarding ITU K.20, K.21, and K.45.  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0080SC MC **  
P0300SC MC **  
P0640SC MC  
P0720SC MC  
P0900SC MC  
P1100SC MC  
P1300SC MC  
P1500SC MC  
P1800SC MC  
P2300SC MC  
P2600SC MC  
P3100SC MC  
P3500SC MC  
6
25  
58  
65  
75  
90  
120  
140  
170  
190  
220  
275  
320  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
55  
35  
60  
60  
60  
50  
50  
50  
40  
40  
40  
40  
40  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
* For surge ratings, see table below.  
** Contact factory for release date.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
C
500  
400  
200  
150  
100  
30  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 6  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SC SIDACtor Device  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
I
S  
I
H
Waveform = tr x td  
I
DRM  
50  
0
-V  
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SA SIDACtor Device  
MicroCapacitance (MC) SA SIDACtor Device  
The DO-214AA SA MC SIDACtor series is intended for applications sensitive to load  
values. Typically, high speed connections require a lower capacitance. CO values for the  
MicroCapacitance device are 40% lower than a standard SA part.  
This MC SIDACtor series is used to enable equipment to meet various regulatory  
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-  
968 (formerly known as FCC Part 68).  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0080SA MC  
P0300SA MC  
6
25  
25  
40  
4
4
5
5
800  
800  
2.2  
2.2  
50  
50  
45  
25  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
150  
150  
90  
50  
45  
20  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 8  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SA SIDACtor Device  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
I
S  
I
H
Waveform = tr x td  
I
DRM  
50  
0
-V  
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Surge Current (D-rated) SIDACtor Device  
High Surge Current (D-rated) SIDACtor Device  
DO-214AA SIDACtor solid state protection devices with a D surge rating protect  
telecommunications equipment such as modems, line cards, fax machines, and other CPE.  
These SIDACtor devices withstand simultaneous surges incurred in GR 1089 lightning  
tests. (See "First Level Lightning Surge Test" on page 4-5.) Surge ratings are twice that of a  
device with a C surge rating. This allows a discrete surface mount version of Teccor’s  
patented “Y” configuration. (US Patent 4,905,119)  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0080SD **  
P0300SD **  
P0640SD **  
P0720SD **  
P0900SD **  
P1100SD  
P1300SD  
P1500SD  
P1800SD  
P2300SD  
P2600SD  
P3100SD  
P3500SD  
6
25  
58  
65  
75  
90  
120  
140  
170  
190  
220  
275  
320  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
200  
220  
100  
100  
100  
80  
80  
80  
60  
60  
60  
60  
60  
* For surge ratings, see table below.  
** Contact factory for release date.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
D
1000  
800  
400  
300  
200  
50  
1000  
http://www.teccor.com  
+1 972-580-7777  
2 - 10  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
High Surge Current (D-rated) SIDACtor Device  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Compak Two-chip SIDACtor Device  
Compak Two-chip SIDACtor Device  
The modified DO-214AA SIDACtor device provides low-cost, longitudinal protection.  
1
(T)  
2
(G)  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
3
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
(R)  
known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
CO  
pF  
Volts  
Volts  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
Number  
Pins1-2, 2-3  
Pins 1-3  
Volts  
µAmps  
mAmps Amps mAmps Pins 1-3  
P3002CA  
P6002CA  
140  
275  
180  
350  
280  
550  
360  
700  
4
4
5
5
800  
800  
1
1
120  
120  
15  
15  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-3 at 1 MHz with a 2 V bias.  
UL 60950 creepage requirements must be considered.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
150  
150  
90  
50  
45  
20  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 12  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Compak Two-chip SIDACtor Device  
Thermal Considerations  
Package  
Modified DO-214AA  
Pin 3  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
85  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
Pin 1  
Pin 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Ethernet/10BaseT/100BaseT Protector  
Ethernet/10BaseT/100BaseT Protector  
The DO-214AA SIDACtor Ethernet protection series is intended for applications sensitive to  
load values. Typically, high speed connections require a lower capacitance. CO values are  
40% lower than standard devices.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0642S_  
P0722S_  
P0902S_  
P1102S_  
P3002S_  
58  
65  
75  
90  
280  
77  
88  
98  
130  
360  
4
4
4
4
4
5
5
5
5
5
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
120  
120  
120  
120  
120  
25  
25  
25  
20  
15  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
A
B**  
Amps/µs  
150  
250  
150  
250  
90  
150  
50  
100  
45  
80  
20  
30  
500  
500  
** Contact factory for release date of B-rated devices.  
http://www.teccor.com  
+1 972-580-7777  
2 - 14  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Ethernet/10BaseT/100BaseT Protector  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 15  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Device  
SIDACtor Device  
TO-92 SIDACtor solid state protection devices protect telecommunications equipment such  
as modems, line cards, fax machines, and other CPE.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68)  
.
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
6
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0080E_  
P0300E_  
P0640E_  
P0720E_  
P0900E_  
P1100E_  
P1300E_  
P1500E_  
P1800E_  
P2300E_  
P2600E_  
P3100E_  
P3500E_  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
100  
110  
50  
50  
50  
40  
40  
40  
30  
30  
30  
30  
30  
25  
58  
65  
75  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
90  
120  
140  
170  
190  
220  
275  
320  
* For individual “EA”, “EB”, and “EC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “EA” and “EB” product. “EC” capacitance is  
approximately 2x the listed value. The off-state capacitance of the P0080EB is equal to the “EC” device.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 16  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
TO-92  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 17  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SIDACtor Device  
MicroCapacitance (MC) SIDACtor Device  
The TO-92 MC SIDACtor series is intended for applications sensitive to load values.  
Typically, high speed connections require a lower capacitance. CO values for MC devices  
are 40% lower than a standard EC part.  
This MC SIDACtor series is used to enable equipment to meet various regulatory  
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-  
968 (formerly known as FCC Part 68) without the need of series resistors.  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0640EC MC  
P1500EC MC  
P2600EC MC  
P3100EC MC  
58  
77  
4
4
4
4
5
5
5
5
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
60  
50  
40  
40  
140  
220  
275  
180  
300  
350  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
C
500  
400  
200  
150  
100  
50  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 18  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
MicroCapacitance (MC) SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
TO-92  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 19  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Balanced Three-chip SIDACtor Device  
Balanced Three-chip SIDACtor Device  
This balanced protector is a surface mount alternative to the modified TO-220 package.  
1
2
3
6
5
4
Based on a six-pin surface mount SOIC package, it uses Teccor’s patented “Y”  
(US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Pins 1-3, 1-4  
Pins 3-4  
Volts  
µAmps mAmps Amps mAmps  
P1553U_  
P1803U_  
P2103U_  
P2353U_  
P2703U_  
P3203U_  
P3403U_  
P5103U_  
A2106U_3 **  
A5030U_3 **  
130  
150  
170  
200  
230  
270  
300  
420  
170  
400  
180  
210  
250  
270  
300  
350  
400  
600  
250  
550  
130  
150  
170  
200  
230  
270  
300  
420  
50  
180  
210  
250  
270  
300  
350  
400  
600  
80  
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
150  
150  
150  
150  
120  
150  
40  
40  
40  
40  
30  
30  
30  
30  
40  
30  
270  
350  
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.  
** Asymmetrical  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-3 and 1-4 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”  
and “UC” capacitance is approximately 2x higher.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 20  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Balanced Three-chip SIDACtor Device  
Thermal Considerations  
Package  
Modified MS-013  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 21  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Multiport SIDACtor Device  
Multiport SIDACtor Device  
The multiport line protector is an integrated multichip solution for protecting multiple  
twisted pair from overvoltage conditions. Based on a six-pin surface mount SOIC  
package, it is equivalent to four discrete DO-214AA or two TO-220 packages. Available  
in surge current ratings up to 500 A, the multiport line protector is ideal for densely  
populated, high-speed line cards that cannot afford PCB inefficiencies or the use of  
series power resistors.  
1
(R )  
6
(T )  
1
2
5
(G )  
2
(G )  
2
1
3
(T )  
4
(R )  
1
2
SIDACtor devices are used to enable equipment to meet various regulatory  
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and  
TIA-968 (formerly known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
Pins 1-3, 4-6  
12  
50  
116  
130  
150  
180  
240  
280  
340  
380  
440  
550  
640  
VS  
Volts  
Part  
Volts  
Volts  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
P0084U_  
P0304U_  
P0644U_  
P0724U_  
P0904U_  
P1104U_  
P1304U_  
P1504U_  
P1804U_  
P2304U_  
P2604U_  
P3104U_  
P3504U_  
Pins 1-2, 3-2, 4-5, 6-5  
6
25  
58  
65  
75  
90  
120  
140  
170  
190  
220  
275  
320  
Volts  
µAmps  
mAmps Amps mAmps  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
50  
80  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
100  
110  
50  
50  
50  
40  
40  
40  
30  
30  
30  
30  
30  
154  
176  
196  
260  
320  
360  
440  
520  
600  
700  
800  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
IPP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
VDRM is measured at IDRM, and VS is measured at 100 V/µs.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”  
and “UC” capacitance is approximately 2x higher.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 22  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Multiport SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
60  
Unit  
°C  
°C  
Modified MS-013  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 23  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Multiport Balanced SIDACtor Device  
Multiport Balanced SIDACtor Device  
This multiport balanced protector is a surface mount alternative to the modified TO-220  
1
2
3
6
5
4
package. It is based on a six-pin surface mount SOIC package and uses Teccor’s  
patented “Y” (US Patent 4,905,119) configuration. It is available in surge current ratings up  
to 500 A.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters — Symmetrical  
VDRM  
VS  
VDRM  
VS  
CO  
pF  
Volts  
Volts  
Volt  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
Number *  
Pins 1-2, 2-3, 1-3 Pins 4-5, 5-6, 4-6  
Volts  
µAmps  
mAmps Amps mAmps Pins 3-2, 6-5, 1-2, 4-5  
P1556U_  
P1806U_  
P2106U_  
P2356U_  
P2706U_  
P3206U_  
P3406U_  
P5106U_  
130  
150  
170  
200  
230  
270  
300  
420  
180  
210  
250  
270  
300  
350  
400  
600  
130  
150  
170  
200  
230  
270  
300  
420  
180  
210  
250  
270  
300  
350  
400  
600  
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
150  
150  
150  
150  
50  
50  
40  
40  
40  
40  
40  
40  
Electrical Parameters — Asymmetrical  
VDRM  
VS  
VDRM  
Volt  
VS  
Volts  
Volts  
Volts  
Part  
Pins 1-2, 2-3, 4-5,  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
5-6  
Pins 4-6, 1-3  
Volts  
µAmps  
mAmps Amps mAmps  
A2106U_6  
A5030U_6  
170  
400  
250  
550  
50  
270  
80  
350  
3.5  
3.5  
5
5
800  
800  
2.2  
2.2  
120  
150  
40  
30  
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”  
and “UC” capacitance is approximately 10 pF higher.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 24  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Multiport Balanced SIDACtor Device  
Thermal Considerations  
Package  
Modified MS-013  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 25  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Device  
SIDACtor Device  
The modified TO-220 Type 61 SIDACtor solid state protection device can be used in  
telecommunication protection applications that do not reference earth ground.  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P2000AA61  
P2200AA61  
P2400AA61  
P2500AA61  
P3000AA61  
P3300AA61  
180  
200  
220  
240  
270  
300  
220  
240  
260  
290  
330  
360  
4
4
4
4
4
4
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
150  
150  
30  
30  
30  
30  
30  
30  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
0.2x310 µs  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
5x320 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
20  
150  
150  
90  
50  
75  
45  
20  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 26  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
50  
Unit  
°C  
°C  
Modified  
TO-220  
Type 61  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 27  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Two-chip SIDACtor Device  
Two-chip SIDACtor Device  
The two-chip modified TO-220 SIDACtor solid state device protects telecommunication  
equipment in applications that reference Tip and Ring to earth ground but do not require  
balanced protection.  
1
(T)  
2
(G)  
3
(R)  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Part  
Volts  
Volts  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
P0602A_  
P1402A_  
P1602A_  
P2202A_  
P2702A_  
P3002A_  
P3602A_  
P4202A_  
P4802A_  
P6002A_  
Pins 1-2, 3-2  
25  
58  
65  
90  
120  
140  
170  
190  
220  
275  
Pins 1-3  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
40  
77  
95  
130  
160  
180  
220  
250  
300  
350  
50  
80  
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
110  
50  
50  
40  
40  
40  
40  
30  
30  
30  
116  
130  
180  
240  
280  
340  
380  
440  
550  
154  
190  
260  
320  
360  
440  
500  
600  
700  
150  
150  
150  
150  
150  
150  
150  
150  
150  
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” and “AB”  
product. “AC” capacitance is approximately 2x the listed value.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 28  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Two-chip SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
50  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
PIN 1  
PIN 3  
PIN 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 29  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Two-chip MicroCapacitance (MC) SIDACtor Device  
Two-chip MicroCapacitance (MC)  
SIDACtor Device  
The two-chip modified TO-220 MC SIDACtor solid state device protects telecommunication  
1
equipment in applications that reference Tip and Ring to earth ground but do not require  
(T)  
2
(G)  
balanced protection.  
3
(R)  
SIDACtor devices are used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Pins 1-2, 3-2  
Pins 1-3  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0602AC MC  
P1402AC MC  
P1602AC MC  
P2202AC MC  
P2702AC MC  
P3002AC MC  
P3602AC MC  
P4202AC MC  
P4802AC MC  
P6002AC MC  
25  
58  
65  
40  
77  
95  
130  
160  
180  
220  
250  
300  
350  
50  
80  
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
60  
60  
60  
50  
50  
50  
40  
40  
40  
40  
116  
130  
180  
240  
280  
340  
380  
440  
550  
154  
190  
260  
320  
360  
440  
500  
600  
700  
150  
150  
150  
150  
150  
150  
150  
150  
150  
90  
120  
140  
170  
190  
220  
275  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
C
500  
400  
200  
150  
100  
50  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 30  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Two-chip MicroCapacitance (MC) SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
50  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
PIN 1  
PIN 3  
PIN 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 31  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Balanced Three-chip SIDACtor Device  
Balanced Three-chip SIDACtor Device  
The three-chip modified TO-220 SIDACtor balanced solid state device is designed for  
1
3
telecommunication protection systems that reference Tip and Ring to earth ground.  
Applications include any piece of transmission equipment that requires balanced protection.  
This device is built using Teccor’s patented “Y” (US Patent 4,905,119) configuration.  
2
The SIDACtor device is used to enable equipment to meet various regulatory requirements  
including GR 1089, ITU K.20,K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly  
known as FCC Part 68).  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Pins 1-2, 2-3  
Pins 1-3  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P1553A_  
P1803A_  
P2103A_  
P2353A_  
P2703A_  
P3203A_  
P3403A_  
P5103A_  
A2106A_3 **  
A5030A_3 **  
130  
150  
170  
200  
230  
270  
300  
420  
170  
400  
180  
210  
250  
270  
300  
350  
400  
600  
250  
550  
130  
150  
170  
200  
230  
270  
300  
420  
50  
180  
210  
250  
270  
300  
350  
400  
600  
80  
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
150  
150  
150  
150  
120  
150  
40  
40  
40  
40  
30  
30  
30  
30  
40  
30  
270  
350  
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.  
** Asymmetrical  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” product. “AB”  
and “AC” capacitance is approximately 2x the listed value.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 32  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Balanced Three-chip SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
50  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
PIN 1  
PIN 3  
PIN 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 33  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device  
Balanced Three-chip MicroCapacitance (MC)  
SIDACtor Device  
The balanced three-chip TO-220 MC SIDACtor solid state device protects telecommunica-  
tion equipment in high-speed applications that are sensitive to load values and that require  
a lower capacitance. CO values for the MC are 40% lower than a standard AC part.  
1
3
2
This MC SIDACtor series is used to enable equipment to meet various regulatory  
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and  
TIA-968 (formerly known as FCC Part 68) without the need of series resistors.  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Part  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Pins 1-2, 2-3  
Pins 1-3  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P1553AC MC  
P1803AC MC  
P2103AC MC  
P2353AC MC  
P2703AC MC  
P3203AC MC  
P3403AC MC  
P5103AC MC  
130  
150  
170  
200  
230  
270  
300  
420  
180  
210  
250  
270  
300  
350  
400  
600  
130  
150  
170  
200  
230  
270  
300  
420  
180  
210  
250  
270  
300  
350  
400  
600  
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
150  
150  
150  
150  
150  
150  
150  
150  
40  
40  
40  
40  
30  
30  
30  
30  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
C
500  
400  
200  
150  
100  
50  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 34  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
50  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
PIN 1  
PIN 3  
PIN 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 35  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
LCAS Asymmetrical Multiport Device  
LCAS Asymmetrical Multiport Device  
This is an integrated multichip solution for protecting multiple twisted pair from  
1
(R )  
6
(T )  
overvoltage conditions. Based on a six-pin surface mount SOIC package, it is  
equivalent to four discrete DO-214AA or two TO-220 packages. Available in surge  
current ratings up to 500 A, the multiport line protector is ideal for densely populated  
line cards that cannot afford PCB inefficiencies or the use of series power resistors.  
1
2
5
(G )  
2
(G )  
2
1
3
(T )  
4
(R )  
For a diagram of an LCAS (Line Circuit Access Switch) application, see Figure 3.21.  
1
2
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
Pins 1-2, 4-5  
180  
230  
VS  
CO  
pF  
Volts  
Part  
Volts  
Volts  
VT  
IDRM  
IS  
IT  
IH  
Number *  
A1220U_4  
A1225U_4  
Pins 3-2, 6-5  
100  
100  
Volts  
µAmps  
mAmps Amps mAmps  
Pins 3-2, 6-5, 1-2, 4-5  
130  
130  
220  
290  
4
4
5
5
800  
800  
2.2  
2.2  
120  
120  
30  
30  
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”  
and “UC” capacitance is approximately 2x higher.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 36  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
LCAS Asymmetrical Multiport Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
Modified MS-013  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 37  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
LCAS Asymmetrical Discrete Device  
LCAS Asymmetrical Discrete Device  
These DO-214AA SIDACtor devices are intended for LCAS (Line Circuit Access Switch)  
applications that require asymmetrical protection in discrete (individual) packages. They  
enable the protected equipment to meet various regulatory requirements including  
GR 1089, ITU K.20, K.21, K.45, IEG 60950, UL 60950, and TIA-968.  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P1200S_  
P2000S_  
P2500S_  
100  
180  
230  
130  
220  
290  
4
4
4
5
5
5
800  
800  
800  
2.2  
2.2  
2.2  
120  
120  
120  
40  
30  
30  
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB”  
product. “SC” capacitance is approximately 10 pF higher.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 38  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
LCAS Asymmetrical Discrete Device  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
I
S  
I
H
Waveform = tr x td  
I
DRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
0
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 39  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Four-Port Balanced Three-chip Protector  
Four-Port Balanced Three-chip Protector  
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and  
overvoltage conditions. Comprised of twelve discrete DO-214AA SIDACtor devices and  
eight TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot  
afford PCB inefficiencies or the use of series power resistors. Surge current ratings up to  
500 A are available.  
F2  
Z3  
F4  
Z6  
F6  
Z9  
F8  
Tip  
Gnd  
Ring  
2
3
4
5
Tip  
Gnd  
Ring  
7
8
9
10  
Tip  
12  
15  
Tip  
17  
20  
Z12  
Z11  
Z2  
Z5  
Z8  
Gnd 13  
Ring 14  
Gnd 18  
Ring 19  
Z10  
F7  
Z7  
F5  
Z1  
F1  
Z4  
F3  
1
6
11  
16  
Electrical Parameters  
VDRM  
VS  
Volts  
VDRM  
Volts  
VS  
Volts  
CO  
pF  
Volts  
Part  
Pins 2-3, 4-3, 7-8, 9-8,  
Pins 2-4, 7-9,  
VT  
IDRM  
IS  
IT  
IH  
Number *  
12-13, 14-13, 17-18, 19-18  
12-14, 17-19  
Volts  
µAmps mAmps  
Amps  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
mAmps Pins 1-3  
P1553Z_  
P1803Z_  
P2103Z_  
P2353Z_  
P2703Z_  
P3203Z_  
P3403Z_  
A2106Z_ **  
A5030Z_ **  
130  
150  
170  
200  
230  
270  
300  
170  
400  
180  
210  
250  
270  
300  
350  
400  
250  
550  
130  
150  
170  
200  
230  
270  
300  
50  
180  
210  
250  
270  
300  
350  
400  
80  
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
800  
800  
800  
800  
800  
800  
800  
800  
800  
150  
150  
150  
150  
150  
150  
150  
120  
150  
40  
40  
40  
40  
30  
30  
30  
40  
30  
270  
350  
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.  
** Asymmetrical  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.  
“ZB” and “ZC” capacitance is approximately 10 pF higher.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 40  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Four-Port Balanced Three-chip Protector  
Thermal Considerations  
Package  
SIP  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
IS  
I
Waveform = tr x td  
H
I
DRM  
-V  
50  
0
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Waveform  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
-8  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 41  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Four-Port Longitudinal Two-chip Protector  
Four-Port Longitudinal Two-chip Protector  
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and  
overvoltage conditions. Comprised of eight discrete DO-214AA SIDACtor devices and eight  
TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot afford  
PCB inefficiencies or the use of series power resistors. Surge current ratings up to 500 A  
are available.  
F2  
F4  
Z4  
F6  
Z6  
F8  
Tip  
Gnd  
Ring  
2
3
4
5
Tip  
Gnd  
Ring  
7
8
9
10  
Tip  
12  
15  
Tip 17  
Gnd 18  
Ring 19  
20  
Z2  
Z8  
Gnd 13  
Ring 14  
Z1  
Z3  
Z5  
Z7  
1
6
11  
16  
F1  
F3  
F5  
F7  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
CO  
pF  
Volts  
Volts  
Volts  
Part  
Pins 2-3, 4-3, 7-8, 9-8,  
Pins 2-4, 7-9,  
VT  
IDRM  
IS  
IT  
IH  
Pins  
Number * 12-13, 14-13, 17-18, 19-18  
12-14, 17-19  
Volts  
µAmps  
mAmps  
800  
Amps  
mAmps 2-3, 3-4  
P0602Z_  
P1402Z_  
P1602Z_  
P2202Z_  
P2702Z_  
P3002Z_  
P3602Z_  
P4202Z_  
P4802Z_  
P6002Z_  
25  
58  
40  
77  
50  
80  
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
110  
50  
50  
40  
40  
40  
40  
30  
30  
30  
116  
130  
180  
240  
280  
320  
380  
440  
550  
154  
190  
260  
320  
360  
440  
500  
600  
700  
800  
800  
800  
800  
800  
800  
800  
800  
150  
150  
150  
150  
150  
150  
150  
150  
150  
65  
95  
90  
130  
160  
180  
220  
250  
300  
350  
120  
140  
160  
190  
220  
275  
800  
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.  
“ZB” and “ZC” capacitance is approximately 2x higher.  
Device is designed to meet balance requirements of GTS 8700 and GR 974.  
Lower capacitance MC versions may be available. Contact factory for further information.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 42  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Four-Port Longitudinal Two-chip Protector  
Thermal Considerations  
Package  
SIP  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
IS  
I
Waveform = tr x td  
H
I
DRM  
-V  
50  
0
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Waveform  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
-8  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 43  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Four-Port Metallic Line Protector  
Four-Port Metallic Line Protector  
The four-port hybrid Single In-line Package (SIP) line protector protects multiple twisted pair  
from overcurrent and overvoltage conditions. Based on a SIP, it is equivalent to four  
discrete DO-214AA SIDACtor devices and four surface mount fuses. Available in surge  
current ratings up to 500 A, this four-port SIP line protector is ideal for densely populated  
line cards that cannot afford PCB inefficiencies or the use of series power resistors.  
F2  
F3  
F4  
F1  
5
7
8
10  
11  
Tip  
1
2
Tip  
4
Tip  
Tip  
Z1  
Z2  
Z3  
Z4  
Ring  
3
Ring  
6
Ring  
9
Ring 12  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
Amps  
mAmps  
P0080Z_  
P0300Z_  
P0640Z_  
P0720Z_  
P0900Z_  
P1100Z_  
P1300Z_  
P1500Z_  
P1800Z_  
P2300Z_  
P2600Z_  
P3100Z_  
P3500Z_  
6
25  
58  
65  
75  
90  
120  
140  
170  
190  
220  
275  
320  
25  
40  
77  
88  
98  
130  
160  
180  
220  
260  
300  
350  
400  
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
2.2  
50  
50  
100  
110  
50  
50  
50  
40  
40  
40  
30  
30  
30  
30  
30  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
V
DRM is measured at IDRM  
.
S is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “ZA” and “ZB” product. “ZC” capacitance is  
approximately 2x the listed value.  
Lower capacitance MC versions may be available. Contact factory for further information.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
B
C
150  
250  
500  
150  
250  
400  
90  
150  
200  
50  
100  
150  
45  
80  
100  
20  
30  
50  
500  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 44  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Four-Port Metallic Line Protector  
Thermal Considerations  
Package  
SIP  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
IS  
I
Waveform = tr x td  
H
I
DRM  
-V  
50  
0
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Waveform  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
-8  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 45  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Fixed Voltage SLIC Protector  
Fixed Voltage SLIC Protector  
These DO-214AA unidirectional protectors are constructed with a SIDACtor device and an  
(T/R)  
integrated diode. They protect SLICs (Subscriber Line Interface Circuits) from damage  
during transient voltage activity and enable line cards to meet various regulatory  
requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-  
968 (formerly known as FCC Part 68).  
(G)  
For specific design criteria, see details in Figure 3.21.  
Cathode  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
VF  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P0641S_  
P0721S_  
P0901S_  
P1101S_  
58  
65  
75  
95  
77  
88  
98  
4
4
4
4
5
5
5
5
5
5
5
5
800  
800  
800  
800  
1
1
1
1
120  
120  
120  
120  
70  
70  
70  
70  
130  
* For individual “SA” and “SC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
V
DRM is measured at IDRM.  
VS and VF are measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is  
approximately 2x the listed value.  
Parallel capacitive loads may affect electrical parameters.  
Surge Ratings (Preliminary Data)  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
C
150  
500  
150  
400  
90  
200  
50  
120  
45  
100  
20  
50  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 46  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Fixed Voltage SLIC Protector  
Thermal Considerations  
Package  
DO-214AA  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
90  
Unit  
°C  
°C  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
+I  
tr = rise time to peak value  
td = decay time to half value  
VF  
Peak  
Value  
100  
Waveform = tr x td  
VDRM  
VS  
VT  
-V  
50  
0
+V  
Half Value  
IDRM  
IH  
IS  
tr  
td  
IT  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 47  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Twin SLIC Protector  
Twin SLIC Protector  
Subscriber Line Interface Circuits (SLIC) are highly susceptible to transient voltages, such  
as lightning and power cross conditions. To minimize this threat, Teccor provides this dual-  
chip, fixed-voltage SLIC protector device.  
1
(T)  
2
(G)  
3
For specific design criteria, see details in Figure 3.23.  
(R)  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Part  
VT  
VF  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Pins 1-2, 2-3  
Pins 1-3  
Volts  
Volts  
µAmps mAmps Amps mAmps  
P0641CA2  
P0721CA2  
P0901CA2  
P1101CA2  
58  
65  
75  
95  
77  
88  
98  
58  
65  
75  
95  
77  
88  
98  
4
4
4
4
5
5
5
5
5
5
5
5
800  
800  
800  
800  
1
1
1
1
120  
120  
120  
120  
60  
60  
60  
60  
130  
130  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
V
DRM is measured at IDRM.  
VS and VF are measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured across pins 1-2 or 2-3 at 1 MHz with a 2 V bias. Capacitance across pins 1-3 is approximately  
half.  
Parallel capacitive loads may affect electrical parameters.  
Compliance with GR 1089 or UL 60950 power cross tests may require special design considerations. Contact the factory for further  
information.  
Surge Ratings (Preliminary Data)  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
150  
150  
90  
50  
45  
20  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 48  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Twin SLIC Protector  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
Unit  
°C  
°C  
Modified DO-214AA  
-40 to +150  
-65 to +150  
85  
Pin 3  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
Pin 1  
Pin 2  
+I  
tr = rise time to peak value  
td = decay time to half value  
VF  
Peak  
Value  
100  
Waveform = tr x td  
VDRM  
VS  
VT  
-V  
+V  
50  
0
Half Value  
IDRM  
IH  
IS  
tr  
td  
IT  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 49  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Multiport SLIC Protector  
Multiport SLIC Protector  
This multiport line protector is designed as a single-package solution for protecting  
1
(T1)  
6
(T2)  
multiple twisted pair from overvoltage conditions. Based on a six-pin SOIC package, it  
is equivalent to four discrete DO-214AA packages. Available in surge current ratings  
up to 500 A for a 2x10 µs event, the multiport line protector is ideal for densely  
populated line cards that cannot afford PCB inefficiencies or the use of series power  
resistors.  
2
(G1)  
5
(G2)  
3
(R1)  
4
(R2)  
For specific design criteria, see details in Figure 3.24.  
Electrical Parameters  
VDRM  
VS  
VDRM  
Volts  
VS  
Volts  
Volts  
Volts  
Pins  
Part  
1-2, 2-3,  
Pins  
1-3, 4-6  
VT  
VF  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
4-5, 5-6  
Volts  
Volts  
µAmps mAmps Amps mAmps  
P0641U_  
P0721U_  
P0901U_  
P1101U_  
58  
77  
88  
98  
58  
65  
75  
95  
77  
88  
98  
4
4
4
4
5
5
5
5
5
5
5
5
800  
800  
800  
800  
1
1
1
1
120  
120  
120  
120  
70  
70  
70  
70  
65  
75  
95  
130  
130  
* For individual “UA” and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
V
DRM is measured at IDRM.  
VS and VF are measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured across pins 1-2, 2-3, 4-5, or 5-6 at 1 MHz with a 2 V bias and is a typical value. Capacitance  
across pins 1-3 or 4-6 is approximately half. “UC” capacitance is approximately 2x the listed value for “UA” product.  
Parallel capacitive loads may affect electrical parameters.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
C
150  
500  
150  
400  
90  
200  
50  
120  
45  
100  
20  
50  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 50  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Multiport SLIC Protector  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
60  
Unit  
°C  
°C  
Modified MS-013  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
VF  
Peak  
Value  
100  
Waveform = tr x td  
VDRM  
VS  
VT  
-V  
+V  
50  
0
Half Value  
IDRM  
IH  
IS  
tr  
td  
IT  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 51  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Battrax SLIC Protector  
Battrax SLIC Protector  
This solid state protection device can be referenced to either a positive or negative voltage  
source. The B1xx0C_ is for a -VREF and the B2050C_ is for a +VREF. Designed using an  
SCR and a gate diode, the B1xx0C_ Battrax begins to conduct at |-VREF| + |-1.2 V| while the  
B2050C_ Battrax begins to conduct at |+VREF| + |1.2 V|.  
For a diagram of a Battrax application, see Figure 3.29.  
Pin 3  
(+V  
Pin 2  
(Ground)  
)
Pin 1  
REF  
(Line)  
Pin 3  
(-V  
)
REF  
Gate  
Pin 1  
Pin 2  
(Ground)  
(Line)  
-Battrax  
B1xx0C_  
+Battrax  
B2050C_  
Electrical Parameters  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IGT  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
B1100C_  
B1160C_  
B1200C_  
B2050C_  
|-VREF| + |-1.2 V|  
|-VREF| + |-1.2 V|  
|-VREF| + |-1.2 V|  
|+VREF| + |1.2 V|  
|-VREF| + |-10 V|  
|-VREF| + |-10 V|  
|-VREF| + |-10 V|  
|+VREF| + |10 V|  
4
4
4
4
5
5
5
5
100  
100  
100  
50  
1
1
1
1
100  
160  
200  
5
50  
50  
50  
50  
* For individual “CA” and “CC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
PP ratings assume VREF = ±48 V.  
I
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “CC” product is approximately 2x the listed value.  
Positive Battrax information is preliminary data.  
V
V
REF maximum value for the negative Battrax is -200 V.  
REF maximum value for the positive Battrax is 110 V.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
Amps/µs  
A
C
150  
500  
150  
400  
90  
200  
60  
150  
50  
100  
40  
50  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 52  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Battrax SLIC Protector  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
Unit  
°C  
°C  
Modified DO-214AA  
-40 to +150  
-65 to +150  
85  
Pin 3  
(VREF  
)
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
Pin 1  
(Line)  
Pin 2  
(Ground)  
+I  
+I  
IT  
IS  
IH  
VDRM  
VS  
VT  
IDRM  
-V  
-V  
+V  
+V  
IDRM  
VS  
VDRM  
VT  
IH  
IS  
IT  
-I  
-I  
V-I Characteristics for Negative Battrax  
V-I Characteristics for Positive Battrax  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
6
25 ˚C  
25 ˚C  
1.2  
4
1.0  
0.8  
0.6  
0.4  
2
0
-4  
-6  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 53  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Battrax Dual Negative SLIC Protector  
Battrax Dual Negative SLIC Protector  
This solid state Battrax protection device is referenced to a negative voltage source. Its  
dual-chip package also includes internal diodes for transient protection from positive  
surge events.  
(G)  
5
For a diagram of a Battrax application, see Figure 3.27.  
1
2
3
(R)  
(T) (-VREF  
)
Electrical Parameters  
Part  
VDRM  
VS  
VT  
VF  
IDRM  
IGT  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
B1101U_  
B1161U_  
B1201U_  
|-VREF| + |-1.2V|  
|-VREF| + |-1.2V|  
|-VREF| + |-1.2V|  
|-VREF| + |-10V|  
|-VREF| + |-10V|  
|-VREF| + |-10V|  
4
4
4
5
5
5
5
5
5
100  
100  
100  
1
1
1
100  
160  
200  
50  
50  
50  
* For individual “UA” and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
PP ratings assume a VREF = -48 V.  
I
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.  
REF maximum value for the B1101, B1161, and/or B1201 is -200 V.  
V
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
A
C**  
Amps/µs  
150  
500  
150  
400  
90  
200  
50  
120  
45  
100  
20  
50  
500  
500  
** Call factory for release date.  
http://www.teccor.com  
+1 972-580-7777  
2 - 54  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Battrax Dual Negative SLIC Protector  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
Modified MS-013  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
VF  
Peak  
Value  
100  
Waveform = tr x td  
VDRM  
VS  
VT  
-V  
+V  
50  
0
Half Value  
IDRM  
IH  
IS  
tr  
td  
IT  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 55  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Battrax Dual Positive/Negative SLIC Protector  
Battrax Dual Positive/Negative SLIC Protector  
(+VREF  
)
This Battrax device protects Subscriber Line Interface Circuits (SLIC) that use both a  
5
positive and negative Ring voltage. It limits transient voltages with rise times of 100 V/  
µs to V  
±10 V.  
REF  
Ground  
4, 6  
Teccor’s six-pin Battrax devices are constructed using four SCRs and four gate diodes.  
The SCRs conduct when a voltage that is more negative than -V (and/or more  
REF  
positive than +V  
) is applied to the cathode (Pins 1 and 3) of the SCR. During  
REF  
conduction, the SCRs appear as a low-resistive path which forces all transients to be  
shorted to ground.  
2
3
(R)  
1
(T)  
(-VREF  
)
For a diagram of a Battrax application, see Figure 3.30.  
Electrical Parameters  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IGT  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
B3104U_  
B3164U_  
B3204U_  
|-VREF| + |±1.2V|  
|-VREF| + |±1.2V|  
|-VREF| + |±1.2V|  
|-VREF| + |±10V|  
|-VREF| + |±10V|  
|-VREF| + |±10V|  
4
4
4
5
5
5
100  
100  
100  
1
1
1
100  
160  
200  
50  
50  
50  
* For individual “UA” and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
PP ratings assume a VREF = ±48 V.  
I
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.  
Positive Battrax information is preliminary data.  
V
V
REF maximum value for the negative Battrax is -200 V.  
REF maximum value for the positive Battrax is 110 V.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
Amps  
8x20 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
di/dt  
Series  
A
C**  
Amps/µs  
150  
500  
150  
400  
90  
200  
50  
120  
45  
100  
20  
50  
500  
500  
** Call factory for release date.  
http://www.teccor.com  
+1 972-580-7777  
2 - 56  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Battrax Dual Positive/Negative SLIC Protector  
Thermal Considerations  
Package  
Modified MS-013  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
Positive Battrax  
Characteristics  
IT
Peak  
Value  
100  
IS
I
H  
Waveform = tr x td  
I
DRM  
-V  
+V  
50  
0
Half Value  
V
DRM  
V
T  
V
S  
Negative Battrax  
Characteristics  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 57  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Battrax Quad Negative SLIC Protector  
Battrax Quad Negative SLIC Protector  
This Battrax device is an integrated overvoltage protection solution for SLIC-based  
(Subscriber Line Interface Circuit) line cards. This six-pin device is constructed using  
four SCRs and four gate diodes.  
(T)  
6
Ground  
5
(R)  
4
The device is referenced to V  
and conducts when a voltage that is more negative  
BAT  
than -V  
is applied to the cathode (pins 1, 3, 4, or 6) of the SCR. During conduction,  
REF  
all negative transients are shorted to Ground. All positive transients are passed to  
Ground by steering diodes.  
1
2
3
(T)  
(-VREF  
)
(R)  
For specific diagrams showing these Battrax applications, see Figure 3.28.  
Electrical Parameters  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IGT  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
B1101U_4  
B1161U_4  
B1201U_4  
|-VREF| + |-1.2V|  
|-VREF| + |-1.2V|  
|-VREF| + |-1.2V|  
|-VREF| + |-10V|  
|-VREF| + |-10V|  
|-VREF| + |-10V|  
4
4
4
5
5
5
100  
100  
100  
1
1
1
100  
160  
200  
50  
50  
50  
* For individual “UA” and “UC” surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
PP ratings assume a VREF = ±48 V.  
I
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.  
REF maximum value for the negative Battrax is -200 V.  
V
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
2x10 µs  
8x20 µs  
10x160 µs  
10x560 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps  
Amps  
Amps  
Amps/µs  
A
C
150  
500  
150  
400  
90  
200  
50  
120  
45  
100  
20  
50  
500  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 58  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Battrax Quad Negative SLIC Protector  
Thermal Considerations  
Package  
Modified MS-013  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +125  
-65 to +150  
60  
Unit  
°C  
°C  
6
5
4
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
1
2
3
+I  
tr = rise time to peak value  
td = decay time to half value  
Positive Battrax  
Characteristics  
IT
Peak  
Value  
100  
IS
I
H  
Waveform = tr x td  
I
DRM  
-V  
+V  
50  
0
Half Value  
V
DRM  
V
T  
V
S  
Negative Battrax  
Characteristics  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 59  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
CATV and HFC SIDACtor Device  
CATV and HFC SIDACtor Device  
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.  
It protects equipment located in the severe surge environment of Community Antenna TV  
(CATV) applications.  
1
3
Used in Hybrid Fiber Coax (HFC) applications, this device replaces the gas tube  
traditionally used for station protection, because a SIDACtor device has a much tighter  
voltage tolerance.  
Electrical Parameters  
CO  
pF  
Pins 1-3  
200  
Part  
VDRM  
Volts  
120  
170  
VS  
VT  
IDRM  
IS  
IT  
IH  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P1400AD  
P1800AD  
160  
220  
3
5.5  
5
5
800  
800  
2.2  
2.2  
50  
50  
150  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.  
Surge Ratings  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
8x20 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps/µs  
D
1000  
250  
120  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 60  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
CATV and HFC SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
60  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
3
1
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
IS  
IH  
Waveform = tr x td  
IDRM  
-V  
50  
0
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
25 ˚C  
25 ˚C  
4
2
0
-4  
-6  
-8  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 61  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Surge Current SIDACtor Device  
High Surge Current SIDACtor Device  
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.  
1
(T)  
It protects equipment located in the severe surge environment of Community Antenna TV  
2
(G)  
(CATV) applications.  
3
(R)  
This device can replace the gas tubes traditionally used for station protection because  
SIDACtor devices have much tighter voltage tolerances.  
Electrical Parameters  
CO  
pF  
Pins 1-3  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IS  
IT  
IH  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P6002AD  
550  
700  
5.5  
5
800  
2.2  
50  
60  
* For surge ratings, see table below.  
Electrical Parameters  
CO  
pF  
Pins 1-3  
Part  
VDRM  
Volts  
VS  
VT  
IDRM  
IS  
IT  
IH  
Number *  
Volts  
Volts  
µAmps  
mAmps  
Amps  
mAmps  
P3100AD  
280  
360  
5.5  
5
800  
2.2  
120  
115  
* For surge ratings, see table below.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.  
Surge Ratings  
IPP  
IPP  
ITSM  
60 Hz  
Amps  
8x20 µs  
10x1000 µs  
di/dt  
Series  
Amps  
Amps  
Amps/µs  
D
1000  
250  
120  
1000  
http://www.teccor.com  
+1 972-580-7777  
2 - 62  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
High Surge Current SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
60  
Unit  
°C  
°C  
Modified  
TO-220  
R
Thermal Resistance: Junction to Ambient  
°C/W  
JA  
PIN 1  
PIN 3  
PIN 2  
Note: P6002AD is shown. P3100AD has no center lead.  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
0
IS  
IH  
Waveform = tr x td  
IDRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 63  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
CATV Line Amplifiers/Power Inserters SIDACtor Device  
CATV Line Amplifiers/Power Inserters  
SIDACtor Device  
This SIDACtor device is a 5000 A solid state protection device offered in a non-isolated  
TO-218 package. It protects equipment located in the severe surge environment of CATV  
(Community Antenna TV) applications.  
1
2
In CATV line amplifiers and power inserters, this device can replace the gas tubes  
traditionally used for station protection because SIDACtor devices have much tighter  
voltage tolerances.  
Electrical Parameters  
Part  
VDRM  
VS  
VT  
IDRM  
IS  
IT  
IH  
CO  
pF  
Number *  
Volts  
Volts  
Volts  
µAmps  
mAmps  
Amps **  
mAmps  
P1900ME  
P2300ME  
140  
180  
220  
260  
4
4
5
5
800  
800  
2.2/25  
2.2/25  
50  
50  
750  
750  
* For surge ratings, see table below.  
** IT is a free air rating; heat sink IT rating is 25 A.  
General Notes:  
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.  
I
PP is a repetitive surge rating and is guaranteed for the life of the product.  
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.  
V
DRM is measured at IDRM.  
VS is measured at 100 V/µs.  
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.  
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.  
Surge Ratings  
IPP  
ITSM  
60 Hz  
Amps  
8x20 µs  
di/dt  
Series  
Amps  
Amps/µs  
E
5000  
400  
500  
http://www.teccor.com  
+1 972-580-7777  
2 - 64  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
CATV Line Amplifiers/Power Inserters SIDACtor Device  
Thermal Considerations  
Package  
Symbol  
TJ  
TS  
Parameter  
Operating Junction Temperature Range  
Storage Temperature Range  
Value  
-40 to +150  
-65 to +150  
100  
Unit  
°C  
°C  
2
TO-218  
TC  
Maximum Case Temperature  
°C  
R
R
Thermal Resistance: Junction to Case  
Thermal Resistance: Junction to Ambient  
1.7  
56  
°C/W  
°C/W  
JC *  
JA  
3
(No  
2
1
Connection)  
* RJC rating assumes the use of a heat sink and on state mode for extended time at 25 A, with average power dissipation of 29.125 W.  
+I  
tr = rise time to peak value  
td = decay time to half value  
IT  
Peak  
Value  
100  
50  
0
IS  
IH  
Waveform = tr x td  
IDRM  
-V  
+V  
Half Value  
VDRM  
VT  
VS  
tr  
td  
0
t – Time (µs)  
-I  
V-I Characteristics  
tr x td Pulse Wave-form  
14  
12  
10  
8
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
6
4
25 ˚C  
25 ˚C  
2
0
-4  
-6  
0.4  
-40 -20  
0
20 40 60 80 100 120 140 160  
Case Temperature (TC) – ˚C  
-8  
-40 -20  
0
20 40 60 80 100 120 140 160  
Junction Temperature (TJ) – ˚C  
Normalized VS Change versus Junction Temperature  
Normalized DC Holding Current versus Case Temperature  
© 2002 Teccor Electronics  
2 - 65  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
TeleLink Fuse  
TeleLink Fuse  
The TeleLink Surface Mount (SM) surge resistant fuse offers circuit protection without  
requiring a series resistor. When used in conjunction with the SIDACtor Transient Voltage  
Suppressor (TVS), the TeleLink SM fuse and the SIDACtor TVS provide a complete  
regulatory-compliant solution for standards such as GR 1089, TIA-968 (formerly known as  
FCC Part 68), UL 60950, and ITU K.20 and K.21. No series resistor is required for the  
F1250T and F1251T to comply with these standards.  
Contact factory for enhanced K.20 and K.21 details.  
Surge Ratings  
IPP  
IPP  
IPP  
IPP  
2x10 µs  
Amps  
10x160 µs  
Amps  
10x560 µs  
Amps  
10x1000 µs  
Amps  
TeleLink SM Fuse  
F0500T  
F1250T  
F1251T  
not rated  
500  
500  
75  
160  
160  
45  
115  
115  
35  
100  
100  
Interrupting Values  
I2t Measured  
Interrupting Rating  
TeleLink SM  
Voltage  
Rating  
250 V  
250 V  
250 V  
Current  
Rating  
500 mA  
1.25 A  
2 A  
at DC Rated  
Voltage  
Fuse  
Voltage, Current  
600 V, 40 A  
600 V, 60 A *  
600 V, 60 A *  
MIN  
1 ms  
1 ms  
1 ms  
TYP  
MAX  
60 ms  
60 ms  
60 ms  
F0500T  
F1250T  
F1251T  
1.3 A2s  
22.2 A2s  
30 A2s  
2 ms  
2 ms  
2 ms  
* Interrupt test characterized at 50° to 70° phase angle. Phase angles approximating 90° may result in damage to the body of the fuse.  
Notes:  
The TeleLink SM fuse is designed to carry 100% of its rated current for four hours and 250% of its rated current for one second  
minimum and 120 seconds maximum. Typical time is four to 10 seconds. For optimal performance, an operating current of 80% or  
less is recommended.  
I2t is a non-repetitive RMS surge current rating for a period of 16.7 ms.  
Resistance Ratings  
DC Cold Resistance  
Typical Voltage Drop  
@ Rated Current  
TeleLink SM Fuse  
F0500T  
MIN  
MAX  
0.471 V  
0.205 V  
0.110 V  
0.420  
0.107 ꢁ  
0.050 ꢁ  
0.640 ꢁ  
0.150 ꢁ  
0.100 ꢁ  
F1250T  
F1251T  
Notes:  
Typical inductance 4 µH up to 500 MHz.  
Resistance changes 0.5% for every °C.  
Resistance is measured at 10% rated current.  
http://www.teccor.com  
+1 972-580-7777  
2 - 66  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
TeleLink Fuse  
Qualification Data  
The F1250T and F1251T meet the following test conditions per GR 1089 without additional series resistance.  
However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the  
Second Level AC Power Fault Test.  
First Level Lightning Surge Test  
Surge Voltage  
Wave-form  
µs  
Surge Current  
Amps  
Repetitions Each  
Polarity  
Test  
Volts  
1
2
3
4
5
±600  
±1000  
±1000  
±2500  
±1000  
10x1000  
10x360  
10x1000  
2x10  
100  
100  
100  
500  
25  
25  
25  
25  
10  
5
10x360  
Second Level Lightning Surge Test  
Surge Voltage  
Wave-form  
µs  
Surge Current  
Amps  
Repetitions Each  
Polarity  
Test  
Volts  
1
±5000  
2x10  
500  
1
First Level AC Power Fault Test  
Applied Voltage, 60 Hz  
VRMS  
Short Circuit Current  
Test  
1
Amps  
Duration  
15 min  
50  
0.33  
2
100  
0.17  
15 min  
3
4
5
6
7
8
9
200, 400, 600  
1 at 600 V  
60 applications, 1 s each  
60 applications, 1 s each  
60 applications, 5 s each  
30 s each  
1000  
*
600  
600  
600  
1000  
1
*
0.5  
2.2  
3
2 s each  
1 s each  
0.5 s each  
5
* Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.  
Second Level AC Power Fault Test for Non-Customer Premises Equipment  
Applied Voltage, 60 Hz  
Short Circuit Current  
Test  
VRMS  
Amps  
Duration  
30 min  
5 s  
5 s  
30 min  
1
2
3
4
120, 277  
600  
600  
30  
60  
7
100-600  
2.2 at 600 V  
Notes:  
Power fault tests equal or exceed the requirements of UL 60950 3rd edition.  
Test 4 is intended to produce a maximum heating effect. Temperature readings can exceed 150 °C.  
Test 2 may be dependent on the closing angle of the voltage source. Fuse is characterized at 50° to 70°. Closing angles  
approximating 90° may result in damage to the body of the fuse.  
Use caution when routing internal traces adjacent to the F1250T and F1251T.  
© 2002 Teccor Electronics  
2 - 67  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
TeleLink Fuse  
1000  
800  
700  
600  
500  
400  
300  
200  
100  
90  
80  
70  
60  
50  
40  
30  
20  
F0500T  
F1250T  
F1251T  
10  
9
8
7
6
5
4
3
2
1
.9  
.8  
.7  
.6  
.5  
.4  
.3  
.2  
.1  
.09  
.08  
.07  
.06  
.05  
.04  
.03  
.02  
.01  
.1  
.2  
.4  
.5  
.7 .8 .9  
1
5
10  
20  
30  
50 60 70 80 90100  
Current in Amperes  
Time Current Curve  
http://www.teccor.com  
+1 972-580-7777  
2 - 68  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
TeleLink Fuse  
Temperature Derating Curve  
Operating temperature is -55 °C to +125 °C with proper correction factor applied.  
150  
140  
130  
120  
110  
100  
90  
80  
70  
60  
Effect on  
Current Rating  
50  
40  
30  
-55 -60 -40 -20  
0
20 40 60 80 100 125  
Ambient ˚C  
Chart of Correction Factor  
Maximum Temperature Rise  
TeleLink Fuse  
F0500T  
Temperature Reading  
?75 °C (167 °F) *  
?75 °C (167 °F) *  
?75 °C (167 °F) *  
F1250T  
F1251T  
* Higher currents and PCB layout designs can affect this parameter.  
Notes:  
Readings are measured at rated current after temperature stabilizes  
The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambient  
temperature values can cause higher than expected rises in temperature. During UL testing, the typical  
recorded heat rise for the F1250T at 2.2 A was 120 °C.  
Package Symbolization  
Manufactured in  
USA  
Manufactured in  
Taiwan  
Marking  
FU  
FT  
JU  
JT  
F0500T  
F
F
F1250T  
F1251T  
U
U
U
T
T
T
J
J
NU  
NT  
N
N
© 2002 Teccor Electronics  
2 - 69  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
NOTES  
3 Reference Designs  
This section offers specific examples of how SIDACtor devices can be used to ensure long-  
term operability of protected equipment and uninterrupted service during transient electrical  
activity. For additional line interface protection circuits, see "Regulatory Compliant  
Solutions" on page 4-34.  
Customer Premises Equipment (CPE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3  
High Speed Transmission Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7  
ADSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7  
HDSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8  
ISDN Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10  
Pair Gain Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11  
T1/E1 Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14  
Additional T1 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16  
T3 Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16  
Analog Line Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17  
PBX Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25  
CATV Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26  
Primary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29  
Secondary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31  
Triac Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33  
Data Line Protectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34  
LAN / WAN Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35  
10Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35  
100Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36  
Note: The circuits referenced in this section represent typical interfaces used in  
telecommunications equipment. SIDACtor devices are not the sole components  
required to pass applicable regulatory requirements such as UL 60950, GR 1089, or  
TIA-968 (formerly known as FCC Part 68), nor are these requirements specifically  
directed at SIDACtor devices.  
© 2002 Teccor Electronics  
3-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Customer Premises Equipment (CPE)  
Customer Premises Equipment (CPE)  
CPE is defined as any telephone terminal equipment which resides at the customer’s site  
and is connected to the Public Switched Telephone Network (PSTN). Telephones, modems,  
caller ID adjunct boxes, PBXs, and answering machines are all considered CPE.  
Protection Requirements  
CPE should be protected against overvoltages that can exceed 800 V and against surge  
currents up to 100 A. In Figure 3.1 through Figure 3.6, SIDACtor devices were chosen  
because their associated peak pulse current (IPP) rating is sufficient to withstand the  
lightning immunity test of TIA-968 (formerly known as FCC Part 68) without the additional  
use of series line impedance. Likewise, the fuse shown in Figure 3.1 through Figure 3.6  
was chosen because the amps2time (I2t) rating is sufficient to withstand the lightning  
immunity tests of TIA-968 without opening, but low enough to pass UL power cross  
conditions.  
The following regulatory requirements apply:  
TIA-968 (formerly known as FCC Part 68)  
UL 60950  
All CPE intended for connection to the PSTN must be registered in compliance with  
TIA-968. Also, because the National Electric Code mandates that equipment intended for  
connection to the telephone network be listed for that purpose, consideration should be  
given to certifying equipment with an approved safety lab such as Underwriters  
Laboratories.  
CPE Reference Circuits  
Figure 3.1 through Figure 3.6 show examples of interface circuits which meet all applicable  
regulatory requirements for CPE. The P3100SB and P3100EB are used in these circuits  
because the peak off-state voltage (VDRM) is greater than the potential of a Type B ringer  
superimposed on a POTS (plain old telephone service) battery.  
150 VRMSꢀꢁ2 + 56.6 VPK = 268.8 VPK  
Note that the circuits shown in Figure 3.1 through Figure 3.6 provide an operational solution  
for TIA-968 (formerly known as FCC Part 68). However TIA-968 allows CPE designs to  
pass non-operationally as well.  
For a non-operational solution, coordinate the IPP rating of the SIDACtor device and the I2t  
rating of the fuse so that (1) both will withstand the Type B surge, and (2) during the Type A  
surge, the fuse will open. (See Table 5.1, Surge Rating Correlation to Fuse Rating on page  
5-8.)  
Note: For alternative line interface protection circuits, see "Regulatory Compliant Solutions"  
on page 4-34.  
© 2002 Teccor Electronics  
3 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Customer Premises Equipment (CPE)  
F1250T  
Tip  
P3100SB  
or  
P3100EB  
To Protected  
Components  
Ring  
Figure 3.1 Basic CPE Interface  
Transmit / Receive  
F1250T  
Tip  
+
-
P3100SB  
or  
P3100EB  
Ring  
-
+
Ring  
Detect  
Figure 3.2 Transformer Coupled Tip and Ring Interface  
F1250T  
Tip  
Relay  
Transmit/  
Receive  
Circuitry  
P3100SB  
or  
P3100EB  
Ring  
Ring  
Detect  
Figure 3.3 Modem Interface  
http://www.teccor.com  
+1 972-580-7777  
3 - 4  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Customer Premises Equipment (CPE)  
Transistor  
Network  
Interface  
Hook Switch  
F1250T  
Tip  
Ring  
Ringer  
Option 1  
P3100SB  
or  
P3100EB  
Speech  
Handset  
Dialer  
IC  
Network  
DTMF  
Figure 3.4 CPE Transistor Network Interface — Option 1  
Transistor  
Network  
Interface  
Hook Switch  
F1250T  
Tip  
Ring  
Option 2  
P1800SB  
or  
Ringer  
P1800EB  
Dialer  
IC  
Speech  
Network  
Handset  
DTMF  
Figure 3.5 CPE Transistor Network Interface — Option 2  
© 2002 Teccor Electronics  
3 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Customer Premises Equipment (CPE)  
F1250T  
Tip  
Transistor  
Network  
Interface  
P3100SB  
or  
P3100EB  
Ring  
Ring  
Detect  
Note: Different Ground References Shown.  
F1250T  
Tip  
Transistor  
Network  
Interface  
P3100SB  
or  
P3100EB  
Ring  
Ring  
Detect  
Figure 3.6 Two-line CPE Interface  
http://www.teccor.com  
+1 972-580-7777  
3 - 6  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
High Speed Transmission Equipment  
High speed transmission equipment encompasses a broad range of transmission protocols  
such as T1/E1, xDSL, and ISDN. Transmission equipment is located at the central office,  
customer premises, and remote locations.  
Protection Requirements  
Transmission equipment should be protected against overvoltages that can exceed 2500 V  
and surge currents up to 500 A. In Figure 3.7 through Figure 3.17, SIDACtor devices were  
chosen because their associated peak pulse current (IPP) rating is sufficient to withstand the  
lightning immunity tests of GR 1089 without the additional use of series line impedance.  
Likewise, the fuse shown in Figure 3.7 through Figure 3.17 was chosen because the  
amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of GR 1089, but  
low enough to pass GR 1089 current limiting protector test and power cross conditions  
(both first and second levels).  
The following regulatory requirements apply:  
TIA-968 (formerly known as FCC Part 68)  
GR 1089-CORE  
ITU-T K.20/K.21  
UL 60950  
Most transmission equipment sold in the US must adhere to GR 1089. For Europe and  
other regions, ITU-T K.20/K.21 is typically the recognized standard.  
ADSL Circuit Protection  
Asymmetric Digital Subscriber Lines (ADSLs) employ transmission rates up to 6.144 Mbps  
from the Central Office Terminal (COT) to the Remote Terminal (RT) and up to 640 kbps  
from the RT to the COT at distances up to 12,000 feet. (Figure 3.7)  
Central Office Site  
Local Loop  
Remote Site  
ADSL  
transceiver  
unit  
ADSL transceiver unit  
ATU-C  
video  
voice  
Digital  
Network  
ATU-R  
data  
Splitter  
PSTN  
POTS  
up to 12 kft  
Figure 3.7 ADSL Overview  
© 2002 Teccor Electronics  
3 - 7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
Protection Circuitry  
Longitudinal protection was not used at either the ADSL Transceiver Unit – Central Office  
(ATU-C) interface or the ADSL Transceiver Unit – Remote (ATU-R) interface due to the  
absence of earth ground connections. (Figure 3.8) In both instances, the P3500SC MC  
SIDACtor device and the F1250T TeleLink fuse provide metallic protection. For ATUs not  
isolated from earth ground, reference the HDSL protection topology.  
F1250T  
TIP  
ADSL  
chip set  
P3500SC MC  
RING  
Figure 3.8 ADSL Protection  
Component Selection  
The P3500SC MC SIDACtor device and F1250T TeleLink fuse were chosen to protect the  
ATUs because both components meet GR 1089 surge immunity requirements without the  
use of additional series resistance. Although the P3100 series SIDACtor device may be  
used to meet current ANSI specifications, Teccor recommends the P3500 series to avoid  
interference with the 20 VP-P x DSL signal on a 150 V rms ringing signal superimposed on a  
56.5 V battery.  
HDSL Circuit Protection  
HDSL (High-bit Digital Subscriber Line) is a digital line technology that uses a 1.544 Mbps  
(T1 equivalent) transmission rate for distances up to 12,000 feet, eliminating the need for  
repeaters. The signaling levels are a maximum of ±2.5 V while loop powering is typically  
under 190 V. (Figure 3.9)  
http://www.teccor.com  
+1 972-580-7777  
3 - 8  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
High Speed Transmission Equipment  
Central Office Site  
Remote Site  
HDSL transceiver unit  
HDSL transceiver unit  
DS-1 Rate  
DS-1 Rate  
Interface  
(1.544 Mbps)  
Interface  
(1.544 Mbps)  
784 kbps Full-Duplex loop  
HTU-C  
HTU-R  
784 kbps Full-Duplex loop  
< 12,000 ft, 200 kHz BW  
+2.5 V signal level  
2B1Q, ZO=135 W  
Figure 3.9 HDSL Overview  
Protection Circuitry  
Longitudinal protection is required at both the HDSL Transceiver Unit – Central Office  
(HTU-C) and HDSL Transceiver Unit – Remote (HTU-R) interfaces because of the ground  
connection used with loop powering. Two P2300SC MC SIDACtor devices provide  
overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide  
overcurrent protection. (Figure 3.10) For the transceiver side of the coupling transformer,  
additional overvoltage protection is provided by the P0080SA SIDACtor device. The  
longitudinal protection on the primary coil of the transformer is an additional design  
consideration for prevention of EMI coupling and ground loop issues.  
HTU-C/HTU-R Interface Protection  
F1250T  
Tip  
P2300SC MC  
P0080SA MC  
TX  
P2300SC MC  
Ring  
F1250T  
Power  
Sink  
HDSL  
Transceiver  
F1250T  
F1250T  
Tip  
P2300SC MC  
P2300SC MC  
P0080SA MC  
RX  
Ring  
Figure 3.10 HDSL Protection  
© 2002 Teccor Electronics  
3 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
Component Selection  
The P2300SC MC SIDACtor device and the F1250T TeleLink fuse were chosen because  
both components meet GR 1089 surge immunity requirements without the use of additional  
series resistance. The P2300SC MC voltage rating was selected to ensure loop powering  
up to 190 V. For loop powering greater than 190 V, consider the P2600SC MC. The  
P0080SA MC SIDACtor device was chosen to eliminate any sneak voltages that may  
appear below the voltage rating of the P2300SC MC.  
ISDN Circuit Protection  
Integrated Services Digital Network (ISDN) circuits require protection at the Network  
Termination Layer 1 (NT1) U-interface and at the Terminating Equipment (TE) or  
Terminating Adapter (TA) S/T interface. Signal levels at the U-interface are typically ±2.5 V;  
however, with sealing currents and maintenance loop test (MLT) procedures, voltages  
approaching 150 V rms can occur. (Figure 3.11)  
Terminal  
Adapter  
Terminal  
Non-ISDN  
T
ISDN Compliant  
Central Office Switching  
System  
Network  
Termination  
Layer 1  
POTS  
TA  
Terminal Equipment  
(ISDN  
NT1  
CO  
Compliant)  
B1  
T
T
B2  
U
TE  
ISDN DSL  
2-Wire,  
160 kbps  
2B1Q 2.5 V  
Reference  
D
B1  
S
B2  
TE  
TA  
D
NT2  
PBX  
ISDN Terminal  
S
T Reference  
4-Wire  
S Reference, 4-Wire  
Figure 3.11 ISDN Overview  
Protection Circuitry  
Longitudinal protection was not used at either the U- or the TA/TE-interface due to the  
absence of an earth-to-ground connection. (Figure 3.12) At the U-interface, the  
P2600SC MC SIDACtor device and F1250T TeleLink fuse provide metallic protection, while  
the TA/TE-interface uses the P0640SC MC SIDACtor device and F1250T TeleLink fuse.  
Figure 3.12 also shows interfaces not isolated from earth ground.  
http://www.teccor.com  
+1 972-580-7777  
3 - 10  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
High Speed Transmission Equipment  
ISDN U-Interface  
F1250T  
ISDN S/T Interface  
F1250T  
Tip  
RX  
P0640SC MC  
TX  
ISDN  
Transceiver  
ISDN  
Transceiver  
P2600SC MC  
F1250T  
Ring  
RX  
P0640SC MC  
TX  
Power  
Sink  
Power  
Source  
Figure 3.12 ISDN Protection  
Component Selection  
The “SC MC” SIDACtor devices and F1250T TeleLink fuse were chosen because these  
components meet GR 1089 surge immunity requirements without the use of additional  
series resistance. An MC is chosen to reduce degradation of data rates. The P2600SC MC  
voltage rating was selected to ensure coordination with MLT voltages that can approach  
150 V rms. The voltage rating of the P0640SC MC was selected to ensure coordination with  
varying signal voltages.  
Pair Gain Circuit Protection  
A digital pair gain system differs from an ISDN circuit in that ring detection, ring trip, ring  
forward, and off-hook detection are carried within the 64 kbps bit stream for each channel  
rather than using a separate D channel. The pair gain system also uses loop powering from  
10 V up to 145 V with a typical maximum current of 75 mA. (Figure 3.13)  
Remote Terminal (RT)  
building or pedestal  
mounted  
Customer  
Premises  
(CP)  
Central Office (CO)  
Remote  
Terminal  
MDF  
Central Office  
Terminal (COT)  
Switching  
System  
VF  
1
HF  
VF  
2
VF  
1
POTS  
POTS  
Line 1  
Line 2  
HF  
VF  
2
Line powered  
DSL 2-Wire,  
160 kbps  
2B1Q  
Figure 3.13 Pair Gain Overview  
© 2002 Teccor Electronics  
3 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
Protection Circuitry  
Longitudinal protection is required at the Central Office Terminal (COT) interface because of  
the ground connection used with loop powering. (Figure 3.14) Two P1800SC MC SIDACtor  
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on  
Ring) provide overcurrent protection. For the U-interface side of the coupling transformer,  
the illustration shows the P0080SA MC SIDACtor device used for additional overvoltage  
protection.  
Central Office Terminal (COT) Interface  
F1250T  
Tip  
Tip1  
P1800SC MC  
Ring1  
Tip2  
U-Interface  
P0080SA  
P1800SC MC  
Ring2  
Ring  
F1250T  
Power  
Source  
Figure 3.14 Pair Gain COT Protection  
For Customer Premises (CP) and Remote Terminal (RT) interfaces where an earth ground  
connection is not used, only metallic protection is required. Figure 3.15 shows metallic  
protection satisfied using a single P3100SC MC across Tip and Ring and a single F1250T  
on either Tip or Ring to satisfy metallic protection.  
http://www.teccor.com  
+1 972-580-7777  
3 - 12  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
High Speed Transmission Equipment  
CPE Interface  
Remote Terminal Interface  
F1250T  
Tip  
U-Interface  
P3100SC MC  
Ring  
CPE  
F1250T  
P3100SC MC  
Power  
Sink  
Line 1  
Ring Detect  
Ring Trip  
Ring Forward  
Off-Hook  
F1250T  
P3100SC MC  
Line 2  
Detection  
Figure 3.15 Pair Gain RT Protection  
Component Selection  
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because both  
components meet GR 1089 surge immunity requirements without the use of additional  
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating  
of the P1800SC MC was selected to ensure coordination with loop powering up to 150 V.  
The voltage rating of the P3100SC MC was selected to ensure coordination with POTS  
ringing and battery voltages.  
© 2002 Teccor Electronics  
3 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
T1/E1 Circuit Protection  
T1/E1 networks offer data rates up to 1.544 Mbps (2.058 for E1) on four-wire systems.  
Signal levels on the transmit (TX) pair are typically between 2.4 V and 3.6 V while the  
receive (RX) pair could go as high as 12 V. Loop powering is typically ±130 V at 60 mA,  
although some systems can go as high as 150 V. (Figure 3.16)  
Central Office  
T1 Transceiver  
Line Regenerator  
Line Regenerator  
3000 ft  
6000 ft  
TX Pair  
RX Pair  
Line powered DLC Four-wire,1.544 Mbps/2.048 Mbps  
Figure 3.16 T1/E1 Overview  
Protection Circuitry  
Longitudinal protection is required at the Central Office Terminal (COT) interface because of  
the ground connection used with loop powering. (Figure 3.17) Two P1800SC MC SIDACtor  
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on  
Ring) provide overcurrent protection. The P1800SC MC device is chosen because its VDRM  
is compliant with TIA-968 regulations, Section 4.4.5.2, “Connections with protection paths  
to ground.” These regulations state:  
Approved terminal equipment and protective circuitry having an  
intentional dc conducting path to earth ground for protection purposes at  
the leakage current test voltage that was removed during the leakage  
current test of section 4.3 shall, upon its replacement, have a 50 Hz or  
60 Hz voltage source applied between the following points:  
a. Simplexed telephone connections, including Tip and Ring, Tip-1  
and Ring-1, E&M leads and auxiliary leads  
b. Earth grounding connections  
The voltage shall be gradually increased from zero to 120 V rms for  
approved terminal equipment, or 300 V rms for protective circuitry, then  
maintained for one minute. The current between (a) and (b) shall not  
http://www.teccor.com  
+1 972-580-7777  
3 - 14  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
High Speed Transmission Equipment  
exceed 10 mAPK at any time. As an alternative to carrying out this test  
on the complete equipment or device, the test may be carried out  
separately on components, subassemblies, and simulated circuits,  
outside the unit, provided that the test results would be representative of  
the results of testing the complete unit.  
Regenerator  
COT  
F1250T  
P1800SC MC  
P1800SC MC  
F1250T  
F1250T  
RX  
TX  
P0300SA  
P0640SC MC  
T1  
Transceiver  
T1  
Transceiver  
Power  
Source  
F1250T  
P1800SC MC  
P1800SC MC  
F1250T  
F1250T  
P0640SC MC  
RX  
TX  
P0300SA  
Figure 3.17 T1/E1 Protection  
The peak voltage for 120 V rms is 169.7 V. The minimum stand-off voltage for the P1800 is  
170 V, therefore, the P1800SC MC will pass the test in Section 4.4.5.2 by not allowing  
10 mA of current to flow during the application of this test voltage.  
For the transceiver side of the coupling transformer, additional overvoltage protection is  
shown in Figure 3.17 using the P0300SA SIDACtor device. When an earth ground  
connection is not used, only metallic protection is required. Metallic protection is satisfied  
using a single P0640SC MC SIDACtor device across Tip and Ring and a single F1250T  
TeleLink fuse on either Tip or Ring.  
Component Selection  
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because these  
components meet GR 1089 surge immunity requirements without the use of additional  
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating  
of the P1800SC MC was selected to ensure loop powering up to 150 V. The voltage rating  
of the P0640SC MC was selected to ensure coordination with varying voltage signals.  
© 2002 Teccor Electronics  
3 - 15  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
High Speed Transmission Equipment  
Additional T1 Design Considerations  
A T1 application can be TIA-968 approved as two different possible device types. An XD  
device means an external CSU is used and the unit does not have to meet the  
TIA-968 environmental test conditions, but it must connect only behind a separately  
registered DE device. This XD equipment does not have to meet the T1 pulse template  
requirements. If not classified as an XD device, then typically the application must adhere to  
TIA-968 environmental test conditions.  
T3 Protection  
The capacitance across the pair of wires = (D1 || D2) + P0640EC/SC. The diode  
capacitance is approximately (10 pF || 10 pF) 20 pF. Then adding the capacitive effect of  
the P0640EC/SCMC, which is typically 60 pF, the total capacitance across the pair of wires  
is approximately 15 pF. The MUR 1100E diodes are fast-switching diodes that will exhibit  
this level of capacitance. MURS160T3 is a surface mount equivalent. (Figure 3.18)  
F1250T  
D1  
D2  
P0640EC/SC MC or  
P0720EC/SC MC  
Figure 3.18 T3 Protection  
Alternately, the advanced P0642SA exhibits very low capacitance and can be used as a  
stand-alone device.  
P0642SA  
Figure 3.19 Alternate T3 Protection  
http://www.teccor.com  
+1 972-580-7777  
3 - 16  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Analog Line Cards  
Analog Line Cards  
Given that line cards are highly susceptible to transient voltages, network hazards such as  
lightning and power cross conditions pose a serious threat to equipment deployed at the  
central office and in remote switching locations. To minimize this threat, adequate levels of  
protection must be incorporated to ensure reliable operation and regulatory compliance.  
Protection Requirements  
When designing overvoltage protection for analog line cards, it is often necessary to  
provide both on-hook (relay) and off-hook (SLIC) protection. This can be accomplished in  
two stages, as shown in Figure 3.20.  
F1250T  
R
E
L
A
Y
S
L
I
Off Hook  
Protection  
On Hook  
Protection  
C
F1250T  
Figure 3.20 SLIC Overview  
The following regulatory requirements may apply:  
GR 1089-CORE  
ITU-T K.20/K.21  
UL 60950  
TIA-968 (formerly known as FCC Part 68)  
On-Hook (Relay) Protection  
On-hook protection is accomplished by choosing a SIDACtor device that meets the  
following criteria to ensure proper coordination between the ring voltage and the maximum  
voltage rating of the relay to be protected.  
V
DRM > VBATT + VRING  
VSꢀ?ꢀVRelay Breakdown  
This criterion is typically accomplished using two P2600S_ SIDACtor devices (where _  
denotes the surge current rating) connected from Tip to Ground and Ring to Ground.  
However, for applications using relays such as an LCAS (Line Card Access Switch),  
consider the P1200S_ from Tip to Ground and the P2000S_ from Ring to Ground.  
© 2002 Teccor Electronics  
3 - 17  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Analog Line Cards  
Off-Hook (SLIC) Protection  
Off-hook protection is accomplished by choosing a SIDACtor device that meets the  
following criteria to ensure proper coordination between the supply voltage (VREF) and the  
maximum voltage rating of the SLIC to be protected.  
V
DRM > VREF  
VSꢀ?ꢀVSLIC Breakdown  
This criterion can be accomplished in a variety of different ways. For applications using an  
external ring generator and a fixed battery voltage, two P0641S_ SIDACtor devices  
(P0721S_, P0901S_, or P1101S_ depending on the value of VREF) are used — one Tip to  
Ground, one Ring to Ground. For applications using a ring-generating SLIC such as AMD’s  
Am79R79, the B1XX0C_ or B1XX1U_ can be used.  
IPP Selection  
The I of the SIDACtor device must be greater than or equal to the maximum available  
PP  
surge current (IPK(available)) of the applicable regulatory requirements. Calculate the maximum  
available surge current by dividing the peak surge voltage supplied by the voltage generator  
(VPK) by the total circuit resistance (RTOTAL). The total circuit resistance is determined by  
adding the source resistance (RS) of the surge generator to the series resistance in front of  
the SIDACtor device on Tip and Ring (RTIP and RRING).  
IPPꢀOꢀIPK(available)  
IPK(available) = VPK / RTOTAL  
For metallic surges:  
R
TOTAL = RS + RTIP + RRING  
For longitudinal surges:  
TOTAL = RS + RTIP  
R
RTOTAL = RS + RRING  
Reference Diagrams  
Figure 3.21 shows the use of Teccor’s “SC” rated SIDACtor devices and the F1250T  
TeleLink fuse to meet the surge immunity requirements of GR 1089. Teccor’s P1200SC and  
P2000SC, specifically designed to protect Agere Systems (formerly Lucent  
Microelectronics) Line Card Access Switch (LCAS), provide on-hook protection. Two  
P0641SCs provide off-hook protection. Any additional series resistance is absent because  
the “C” series SIDACtor device and F1250T TeleLink fuse are designed to withstand  
GR 1089 surges without the aid of additional components such as line feed resistors and  
PTCs.  
http://www.teccor.com  
+1 972-580-7777  
3 - 18  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Analog Line Cards  
F1250T  
Tip  
P1200SC  
P0641SC  
P0641SC  
L
C
A
S
S
L
I
C
P2000SC  
Ring  
F1250T  
Figure 3.21 SLIC Protection for LCAS  
Figure 3.22 illustrates uses of asymmetrical SIDACtor protection for overvoltage conditions  
and the F1250T for overcurrent conditions.  
F1250T  
Tip  
P1200SC  
P2500SC  
A
G
E
R
E
S
L
I
P2500SC  
C
Ring  
F1250T  
with internal  
protection  
Figure 3.22 SLIC Asymmetrical Protection  
© 2002 Teccor Electronics  
3 - 19  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Analog Line Cards  
Figure 3.23 illustrates the use of the P2600SA and P0721CA2 for overvoltage protection  
and the F0500T for overcurrent protection in addition to 20 of series resistance on both  
Tip and Ring. The series resistance is required to limit the transient surge currents to within  
the surge current rating of the “A” series SIDACtor devices and the F0500T TeleLink fuse.  
F0500T  
20  
P0721CA2  
Tip  
P2600SA  
R
E
L
A
S
L
I
C
Y
P2600SA  
Ring  
20 Ω  
F0500T  
Figure 3.23 SLIC Protection with Fixed Voltage SIDACtor Devices  
The illustration of SLIC protection in Figure 3.24 shows Teccor’s Battrax device protecting  
Legerity’s (formerly AMD’s) Am79R79 from overvoltages and uses a F1250T to protect  
against sustained power cross conditions. The Battrax product was designed specifically to  
protect SLICs that cannot withstand potential differences greater than VREF ± 10 V.  
-V  
REF  
0.1 µF  
F1250T  
Tip  
1N4935/  
MUR120  
B1XX0CC  
Legerity  
Am79R79  
B1XX0CC  
1N4935/  
MUR120  
Ring  
F1250T  
0.1µF  
-V  
REF  
Figure 3.24 SLIC Protection with Programmable Voltage SIDACtor Devices  
http://www.teccor.com  
+1 972-580-7777  
3 - 20  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Analog Line Cards  
Figure 3.25 shows protection of a SLIC using 20 series resistors on both Tip and Ring in  
addition to Teccor’s Battrax (B1100CC) and a diode bridge (General Semiconductor part  
number EDF1BS). However, the overshoot caused by the diode bridge must be considered.  
The series resistance (a minimum of 20 on Tip and 20 on Ring) limits the simultaneous  
surge currents of 100 A from Tip to Ground and 100 A from Ring to Ground (200 A total) to  
within the surge current rating of the SA-rated SIDACtor device and Battrax. The diode  
bridge shunts all positive voltages to Ground, and the B1100CC shunts all negative  
voltages greater than |-VREF -1.2 V| to Ground.  
-V  
REF  
0.1 µF  
F0500T  
20  
Tip  
P3100SA  
R
E
L
S
L
I
EDF1BS  
A
Y
B1100CC  
C
P3100SA  
Ring  
20 Ω  
F0500T  
Figure 3.25 SLIC Protection with a Single Battrax Device  
© 2002 Teccor Electronics  
3 - 21  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Analog Line Cards  
In Figure 3.26 an application that requires 50 Line Feed Resistors (LFR) uses one  
B1160CC and two EDF1BS diode bridges in place of multiple SLIC protectors. The  
overshoot caused by the diode bridge must be considered; however, with this approach it is  
imperative that the sum of the loop currents does not exceed the Battrax’s holding current.  
In the application shown in Figure 3.26, each loop current would have to be limited to  
80 mA. For applications requiring the protection of four twisted pair with one Battrax, use  
the B1200CC and limit each individual loop current to 50 mA.  
50 LFR  
Tip  
P3100SA  
R
S
L
I
C
E
L
A
EDF1BS  
Y
P3100SA  
Ring  
B1160CC  
50 LFR  
50 LFR  
-V  
REF  
0.1 µF  
Tip  
P3100SA  
P3100SA  
R
E
L
A
Y
S
L
I
EDF1BS  
C
Ring  
50 LFR  
Figure 3.26 SLIC Protection with a Single Battrax Device  
Figure 3.27 and Figure 3.28 show circuits that use negative Battrax devices containing an  
internal diode for positive surge protection. This obviates using the discrete diodes shown in  
Figure 3.24.  
http://www.teccor.com  
+1 972-580-7777  
3 - 22  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Analog Line Cards  
-V  
REF  
T
F1250T  
B1xx1U_  
Am79R79  
0.1 µF  
F1250T  
R
Figure 3.27 SLIC Protection with a Dual Battrax Device  
-V  
REF  
T
1
4
F1250T  
5
2
Am79R79  
0.1 µF  
6
R
1
F1250T  
F1250T  
B1XX1U_  
T
2
1
Am79R79  
3
R
2
F1250T  
Figure 3.28 SLIC Protection with a Single Battrax Quad Negative Device  
© 2002 Teccor Electronics  
3 - 23  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Analog Line Cards  
Figure 3.29 shows two negative Battrax discrete parts and two positive Battrax discrete  
parts. This arrangement is required for SLIC applications using both the positive and  
negative ringing signals. Figure 3.30 shows a similar application but with the two negative  
Battrax discrete parts and two positive Battrax discrete parts integrated into a single surface  
mount package.  
+V  
-V  
REF  
REF  
0.1 µF  
0.1 µF  
F1250T  
Tip  
B2050C_  
B2050C_  
B1xx0C_  
B1xx0C_  
SLIC  
Ring  
F1250T  
-V  
+V  
REF  
REF  
Figure 3.29 SLIC Protection with discrete positive and negative Battrax Devices  
+V  
-V  
REF  
REF  
0.1 µF  
0.1 µF  
F1250T  
Tip  
SLIC  
B3104UC  
Ring  
F1250T  
-V  
+V  
REF  
REF  
Figure 3.30 SLIC Protection with a Battrax Dual Positive/Negative device  
http://www.teccor.com  
+1 972-580-7777  
3 - 24  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
PBX Systems  
PBX Systems  
Branch Exchange Switches  
PBXs, KSUs, and PABXs contain line cards that support various transmission protocols  
such as ISDN, T1/E1, HDSL, and ADSL (Figure 3.31). PBXs also have features such as a  
POTS (plain old telephone service) pull-through which allows stations to have outside line  
access in the event of power failure. All incoming lines to the PBX are subject to  
environmental hazards such as lightning and power cross.  
To Network  
Station Primary  
Protection  
Logic  
POTS  
T1/E1  
ADSL  
HDSL  
ISDN  
PBX  
Stations  
Figure 3.31 PBX Overview  
Protection Requirements  
Branch exchange switches should be protected against overvoltages that can exceed  
800 V and surge currents up to 100 A.  
The following regulatory requirements apply:  
TIA-968 (formerly known as FCC Part 68)  
UL 60950  
Branch Exchange Reference Circuit  
See the following sections of this data book for interface circuits used to protect of PBX line  
cards:  
For POTS protection, see "Customer Premises Equipment (CPE)" on page 3-3.  
For ADSL protection, see "ADSL Circuit Protection" on page 3-7.  
For HDSL protection, see "HDSL Circuit Protection" on page 3-8.  
For ISDN protection, see "ISDN Circuit Protection" on page 3-10.  
For T1/E1 protection, see "T1/E1 Circuit Protection" on page 3-14.  
For Station Protection, see "Analog Line Cards" on page 3-17.  
© 2002 Teccor Electronics  
3 - 25  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
CATV Equipment  
CATV Equipment  
As cable providers enter the local exchange market, protection of CATV (Community  
Antenna TV) equipment becomes even more critical in order to ensure reliable operation of  
equipment and uninterrupted service.  
Protection Requirements  
CATV line equipment should be able to withstand overvoltages that exceed 6000 V and  
surge currents up to 5000 A. CATV station protectors should be able to withstand  
overvoltages that exceed 5000 V and surge currents up to 1000 A. The SIDACtor devices  
illustrated in Figure 3.32 through Figure 3.35 meet these requirements.  
The following regulatory requirements may apply:  
UL 497C  
SCTE IPS-SP-204  
SCTE Practices  
NEC Article 830  
Power Inserter and Line Amplifier Reference Circuit  
Figure 3.32 and Figure 3.33 show how the P1900ME SIDACtor device is used to protect  
line amplifiers and power supplies versus using two SCRs and one SIDACtor device  
(Figure 3.34). The P1900ME is used because the peak off-state voltage (VDRM) is well  
above the peak voltage of the CATV power supply (90 VRMS 2), and the peak pulse current  
rating (IPP) is 3000 A.  
CATV  
Amplifiers  
90 VAC  
Power  
Supply  
P1900ME  
Figure 3.32 CATV Amplifier Diagram  
http://www.teccor.com  
+1 972-580-7777  
3 - 26  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
CATV Equipment  
90 VAC RF  
To Line  
Amplifiers  
P1900ME  
Power  
Port  
Figure 3.33 CATV Amplifier Protection (incorporated into a power inserter module)  
90 VAC RF  
To Line  
Amplifiers  
A
K
G
P1800EC  
G
A
K
Figure 3.34 CATV Amplifier Protection  
Station Protection Reference Circuit  
Figure 3.35 shows a P1400AD SIDACtor device used in a CATV station protection  
application. Note that a compensation inductor may be required to meet insertion and  
reflection loss requirements for CATV networks. If so, the inductor should be designed to  
saturate quickly and withstand surges up to 200 V and 1000 A. An inductor with a core  
permeability of approximately 900 Wb/A·m and wound with 24-gauge wire to an inductance  
© 2002 Teccor Electronics  
3 - 27  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
CATV Equipment  
of 20 µH to 30 µH is an example of a suitable starting point, but the actual value depends on  
the design and must be verified through laboratory testing.  
To Protected  
UL Approved  
Compensating  
Inductor  
Equipment  
Coaxial Fuse Line  
P1400AD  
Figure 3.35 CATV Station Protection  
http://www.teccor.com  
+1 972-580-7777  
3 - 28  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Primary Protection  
Primary Protection  
Primary telecommunications protectors must be deployed at points where exposed twisted  
pairs enter an office building or residence. This requirement is mandated in North America  
by the National Electric Code (NEC) to protect end users from the hazards associated with  
lightning and power cross conditions.  
Primary protection is provided by the local exchange carrier and can be segregated into  
three distinct categories:  
Station protection — typically associated with a single twisted pair  
Building entrance protection — typically associated with multiple (25 or more) twisted  
pair  
Central office protection — typically associated with numerous twisted pair feeding into a  
switch  
Station protectors provide primary protection for a single-dwelling residence or office. The  
station protector is located at the Network Interface Unit (NIU), which acts as the point of  
demarcation, separating the operating company’s lines from the customer’s.  
Building entrance protection is accomplished by installing a multi-line distribution panel with  
integrated overvoltage protection. These panels are normally located where multiple twisted  
pairs enter a building.  
A five-pin protection module plugged into a Main Distribution Frame (MDF) provides Central  
and Remote Office protection. Like station and building entrance protection, the MDF is  
located where exposed cables enter the switching office.  
Teccor also offers a full line of five-pin protectors. For further details, contact factory at  
protectionsystems@teccor.com or +1 972-580-7777.  
Protection Requirements  
Station protectors must be able to withstand 300 A 10x1000 surge events. The building  
entrance protectors and CO protectors must be able to withstand 100 A 10x1000 surge  
events. Figure 3.36 shows building entrance protector and CO protector asymmetrical  
solutions. Figure 3.37 shows building entrance protector and CO protector balanced  
solutions.  
The following regulatory requirements apply:  
UL 497  
GR 974-CORE  
ITU K.28  
Primary Protection Reference Circuit  
Figure 3.36 and Figure 3.37 show different configurations used in primary protection. Note  
that the peak off-state voltage (VDRM) of any device intended for use in primary protection  
applications should be greater than the potential of a Type B ringer superimposed on a  
POTS (plain old telephone service) battery.  
150 VRMS 2 + 56.6 VPK = 268.8 VPK  
© 2002 Teccor Electronics  
3 - 29  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Primary Protection  
Thermal  
Overload  
P6002AC  
or  
P6002AD  
Voltage-only  
Protection  
P6002AC  
or  
P6002AD  
Voltage and  
Sneak Current  
Protection  
4 W Heat Coil  
Figure 3.36 Primary Protection  
Thermal  
Overload  
Voltage-only  
Protection  
P3203AC  
Voltage and  
Sneak Current  
Protection  
P3203AC  
4 W Heat Coil  
Figure 3.37 Balanced Primary Protection  
http://www.teccor.com  
+1 972-580-7777  
3 - 30  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Secondary Protection  
Secondary Protection  
Secondary protectors (stand alone units or integrated into strip protectors and UPSs) are  
adjunct devices used to enhance the protection level of customer premise equipment  
(CPE). Due to the inadequate level of protection designed into CPE, secondary protectors  
often are required to prevent premature failure of equipment exposed to environmental  
hazards (Figure 3.38).  
Customer  
Premise Equipment  
Primary  
Protector  
Line  
Impedance  
Phone  
Tip  
P
S
Ring  
Fax/Modem  
Network  
Interface  
Secondary  
Protector  
Figure 3.38 CPE Secondary Protection  
Protection Requirements  
Secondary protectors should be able to withstand overvoltages that can exceed 800 V and  
surge currents up to 100 A. Figure 3.39 illustrates a SIDACtor device selected because the  
associated peak pulse current (IPP) is sufficient to withstand the lightning immunity tests of  
TIA-968 (formerly known as FCC Part 68) without the additional use of series line  
impedance. Likewise, Figure 3.39 illustrates a fuse selected because the amps2time (I2t)  
rating is sufficient to withstand the lightning immunity tests of TIA-968, but low enough to  
pass UL power cross conditions.  
F1250T  
Tip  
P3203AB  
To CPE  
or  
Equipment  
P3203AC  
Ring  
F1250T  
Figure 3.39 CPE Protection  
© 2002 Teccor Electronics  
3 - 31  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Secondary Protection  
Secondary Protection Reference Circuit  
Figure 3.38 also shows an example of an interface design for a secondary protector. The  
P3203AB SIDACtor device is used because the peak off-state voltage (VDRM) is greater  
than the potential of a Type B ringer signal superimposed on the POTS (plain old telephone  
service) battery.  
150 VRMSꢀꢁ2 + 56.6 VPK = 268.8 VPK  
Coordination between the station protector and the secondary protector occurs due to the  
line impedance between the two devices. The line impedance helps ensure that the primary  
protector will begin to conduct while the secondary protector limits any of the let-through  
voltage to within the VS rating of the SIDACtor device.  
http://www.teccor.com  
+1 972-580-7777  
3 - 32  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Triac Protection  
Triac Protection  
Thyristors  
Damage can occur to a thyristor if the thyristor’s repetitive peak off-state voltage is  
exceeded. A thyristor’s repetitive peak off-state voltage may be exceeded due to dirty AC  
power mains, inductive spikes, motor latch up, and so on.  
Thyristor Reference Circuit  
Figure 3.40 and Figure 3.41 show two different methods of protecting a triac. In Figure 3.40,  
a SIDACtor device is connected from MT2 to the gate of the triac. When the voltage applied  
to the triac exceeds the SIDACtor device’s VDRM, the SIDACtor device turns on, producing a  
gate current which turns the triac on.  
Hot  
Load  
47  
MT2  
MT1  
Triac  
SIDACtor  
To  
Gating  
Circuitry  
Neutral  
Figure 3.40 TRIAC Protection  
The circuit in Figure 3.41 places a SIDACtor device across MT2 and MT1 of the triac. In this  
instance the SIDACtor device protects the triac by turning on and shunting the transient  
before it exceeds the VDRM rating of the triac.  
Hot  
Load  
MT2  
MT1  
Triac  
SIDACtor  
To  
Gating  
Circuitry  
Neutral  
Figure 3.41 TRIAC Protection  
With both methods, consider the following designs when using a SIDACtor device to protect  
a thyristor:  
VDRM of the SIDACtor device < VDRM of Triac  
SIDACtor device VDRM > 120% VPK(power supply)  
SIDACtor device must be placed behind the load  
© 2002 Teccor Electronics  
3 - 33  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Data Line Protectors  
Data Line Protectors  
In many office and industrial locations, data lines (such as RS-232 and ethernet) and AC  
power lines run in close proximity to each other, which often results in voltage spikes being  
induced onto the data line, causing damage to sensitive equipment.  
Protection Requirements  
Data lines should be protected against overvoltages that can exceed 1500 V and surge  
currents up to 50 A.  
Data Line Reference Circuit  
Figure 3.42 shows how a SIDACtor device is used to protect low voltage data line circuits.  
TXD  
P0080SA  
or  
P0300SA  
RXD  
P0080SA  
or  
RS-232  
I.C.  
P0300SA  
CTS  
P0080SA  
or  
P0300SA  
Figure 3.42 Data Line Protection  
http://www.teccor.com  
+1 972-580-7777  
3 - 34  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
LAN / WAN Protectors  
LAN / WAN Protectors  
10Base-T Protection  
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA  
The MUR 1100E diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then, adding  
the capacitive effect of the SIDACtor (typically 50 pF), the total capacitance across the pair  
of wires is approximately 14 pF. This provides a GR 1089 intra-building compliant design.  
(Figure 3.43)  
Note: MURS160T3 is an SMT equivalent of the MUR 1100E.  
F0500T  
D1  
D2  
Figure 3.43 10Base-T Metallic-only Protection  
Figure 3.44 shows an application requiring longitudinal protection.  
F0500T  
D1  
D2  
F0500T  
D3  
D4  
Figure 3.44 10Base-T Metallic and Longitudinal Protection  
© 2002 Teccor Electronics  
3 - 35  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
LAN / WAN Protectors  
100Base-T Protection  
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA + (D3 || D4)  
The MUR 1100E pair of diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then,  
adding the capacitive effect of the P0640EA/SA (typically 50pF), the total capacitance  
across the pair of wires is approximately 8 pF. This will provide a GR 1089 intra-building  
compliant design. (Figure 3.45)  
Note: MURS160T3 is a SMT equivalent of the MUR 1100E.  
D1  
D2  
P0640EA/SA  
D3  
D4  
Figure 3.45 100 Base-T Protection  
The P0642SA is a very low capacitance device that requires no compensating diodes.  
(Figure 3.46)  
P0642SA  
Figure 3.46 100 Base-T Protection Without External Compensation  
http://www.teccor.com  
+1 972-580-7777  
3 - 36  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
4 Regulatory  
Requirements  
Due to the enormous cost of interrupted service and failed network equipment, telephony  
service providers have adopted various specifications to help regulate the reliability and  
performance of the telecommunications products that they purchase. In Europe and much  
of the Far East, the most common standards are ITU-T K.20 and K.21. In North America,  
most operating companies base their requirements on GR 1089, TIA-968 (formerly known  
as FCC Part 68), and UL 60950.  
Note: This section is a paraphrase of existing documents and does not cover the listed  
regulatory requirements in their entirety. This information is intended to be used only  
as a reference. For exact specifications, obtain the referenced document from the  
appropriate source.  
GR 1089–Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3  
ITU-T K.20 and K.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10  
TIA/EIA-IS-968 (formerly known as FCC Part 68) . . . . . . . . . . . . . . . . . . . . . . . . . 4-14  
UL 60950 3rd Edition (formerly UL 1950, 3rd edition) . . . . . . . . . . . . . . . . . . . . . . 4-16  
UL 497 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24  
UL 497A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27  
UL 497B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30  
UL 497C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32  
Regulatory Compliant Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34  
Surge Waveforms for Various Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37  
© 2002 Teccor Electronics  
4-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
GR 1089–Core  
GR 1089–Core  
In the United States, the telecommunication network is primarily operated by the Regional  
Bell Operating Companies (RBOC) who follow the standards set by GR 1089 or a derivative  
thereof. GR 1089–Core (often referred to as GR 1089), “Electromagnetic Compatibility and  
Electrical Safety Generic Criteria for Network Telecommunications Equipment,” covers the  
requirements for telecommunications equipment connected to the outside world through  
twisted pair. It also addresses the criteria for protection from lightning and AC power cross  
disturbances.  
Because twisted pair are metallic conductors exposed to lightning and AC power faults,  
GR 1089 documents the requirements to be met by manufacturers of public switched  
telephone network (PSTN) equipment to ensure safe and reliable operation.  
The criteria for these standards are based on transient conditions at exposed sites, such as  
remote facilities, central offices, and customers’ premises where operating companies  
provide some type of primary voltage protection to limit transient voltages to 1000 V peak  
for surge conditions and 600 V rms for power cross conditions.  
All network equipment shall be listed by a Nationally Recognized Testing Laboratory  
(NRTL) if the equipment is directly powered by Commercial AC. Network equipment located  
on customer premises shall be listed by NRTL.  
In conjunction with primary voltage protectors, operating companies also may incorporate  
fuse links if there is the possibility of exposing the twisted pair to outside power lines. These  
fuse links are equivalent to 24- or 26-gauge copper wire and are coordinated with the  
current-carrying capacity of the voltage protector.  
The last element of protection that may be provided by the operating company are current  
limiters which, if provided, are found on the line side of the network equipment after the  
primary voltage protection device. These current limiters typically come in the form of heat  
coils and have a continuous rating of 350 mA.  
Requirements  
Equipment required to meet GR 1089 must be designed to pass:  
Both First and Second Level Lightning Surge and AC Power Fault Tests  
Current Limiter Test  
Short Circuit Test  
A minimum of three units are tested for each of the operating states in which the Equipment  
Under Test (EUT) may be expected to function — idle, transmit, receive, on-hook, off-hook,  
talking, dialing, ringing, and testing. Table 4.1 and Table 4.2 show test connections, and  
Figure 4.1 shows the connection appearances.  
© 2002 Teccor Electronics  
4 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
GR 1089–Core  
Table 4.1 Test Conditions  
Test  
Two-wire Interface  
Four-wire Interface  
A
1. Tip to Generator, Ring to Ground  
2. Ring to Generator, Tip to Ground  
3. Tip and Ring to Generator simultaneously  
1. Each lead (T, R, T1, R1) to the Generator with the other three  
leads grounded  
2. Tip and Ring to Generator, simultaneously; T1 and R1 to  
Ground  
3. T1 and R1 to Generator, simultaneously; Tip and Ring to  
Ground  
B
Tip and Ring to Generator simultaneously  
T, R, T1, R1 to Generator simultaneously  
Notes:  
When performing longitudinal tests, the test generator will have a dual output.  
Refer to Table 4.2 for switch positions for each test condition.  
Table 4.2 Connections to Test Generator  
Condition  
Condition A-1 of Table 4.1  
Condition A-2 of Table 4.1  
Condition A-3 of Table 4.1  
S1  
Closed  
Open  
S2  
S3  
Open  
Closed  
Closed  
S4  
Open  
Closed  
Open  
Closed  
Open  
Open  
Closed  
Note: Other outside plant leads associated with the unit should be grounded during the test and the test repeated with these leads  
terminated as in service. Leads that do not connect to outside plant should be terminated as appropriate for the operating  
mode(s) of the unit.  
S1  
S3  
T
Tip  
E
R
M
Limiting  
Resistance  
(If Specified)  
S2  
S4  
Switch Unit  
Under Test  
Ring  
T
E
R
M
Voltage  
Source  
Associated  
Outside  
Plant  
Leads  
Test Generator  
Figure 4.1 Connection Appearances  
Passing Criteria  
Passing criteria for the First Level Lightning Surge Test and the First Level AC Power Fault  
Test is that the EUT will not be damaged and that it will operate as intended after the stress  
is removed. Passing criteria for the Second Level Lightning Surge Test and Second Level  
http://www.teccor.com  
+1 972-580-7777  
4 - 4  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
GR 1089–Core  
AC Power Fault Test is that the EUT may be damaged, but it may not become a fire,  
fragmentation, or electrical safety hazard. Passing criteria for the Current Limiter Test is that  
the EUT may be damaged but it may not exceed the acceptable time/current criteria (that is,  
cannot cause the wiring simulator as shown in Figure 4.2 to open) nor become a fire,  
fragmentation, or electrical safety hazard.  
The indicator used in measuring fire, fragmentation, and electrical safety hazards is a  
bleached, untreated cotton cheesecloth wrapped around the EUT. Compliance with testing  
is determined by the absence of ignition, charring, and the ejection of molten material or  
fragments.  
First Level Lightning Surge Test  
To pass the First Level Lightning Surge Test, the EUT must be undamaged and continue to  
operate properly after the stress is applied. This is referred to as passing “operationally.”  
Table 4.3 presents the conditions for the First Level inter-building criteria. Applicants have  
the option to submit their equipment to meet surges 1, 2, 4, and 5 or surges 3, 4, and 5.  
Table 4.4 presents the conditions for the intra-building criteria.  
Table 4.3 First Level Lightning Surge Test  
Surge Current  
per Conductor  
(A)  
Test  
Test  
Surge Voltage  
(VPK  
Waveform  
(µs)  
Repetitions  
Connections  
(Notes 1 & 2)  
)
Each Polarity  
(Table 4.1, Figure 4.1)  
1
±600  
±1000  
±1000  
±2500  
±1000  
10x1000  
10x360  
10x1000  
2x10  
100  
100  
100  
500  
25  
25  
25  
25  
10  
5
A
A
A
B
B
2 (Note 3)  
3 (Note 3)  
4 (Note 4)  
5 (Note 5)  
10x360  
Notes:  
1. Primary protectors are removed for all tests.  
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)  
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.  
3. Test 1 and 2 can be replaced with Test 3 or vice versa.  
4. Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per  
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 3 resistor placed externally to the surge  
generator.  
5. This test is to be performed on up to 12 Tip and Ring pairs simultaneously.  
Table 4.4 Intra-Building Lightning Surge Test  
Surge Current  
Surge Voltage  
Wave-form  
per Conductor  
Repetitions Each  
Polarity  
Test Connections  
Test  
(VPK  
)
(µs)  
(A)  
(Table 4.1, Figure 4.1)  
1
2
±800  
±1500  
2x10  
2x10  
100  
100  
1
1
A1, A2  
B
Notes:  
For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)  
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.  
Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per  
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 6 resistor for Test 1 and a 12 resistor for  
Test 2, placed externally to the surge generator.  
© 2002 Teccor Electronics  
4 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
GR 1089–Core  
Second Level Lightning Surge Test  
The Second Level Lightning Surge Test, presented in Table 4.5, does not require the EUT  
to pass operationally, but GR 1089 does require that the EUT not become a fire,  
fragmentation, or electrical safety hazard. This is referred to as passing “non-operationally.”  
Table 4.5 Second Level Lightning Surge Test  
Surge  
Voltage  
(VPK  
Waveform  
(µs)  
Surge Current  
(A)  
Repetitions Each  
Polarity  
Test Connections  
Test  
)
(Table 4.1, Figure 4.1)  
1
±5000  
2x10  
500  
1
B
Notes:  
Primary protectors are removed.  
For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)  
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.  
Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per  
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 8 resistor placed externally to the surge  
generator.  
AC Power Fault Tests  
Power companies and telephone operating companies often share telephone poles and  
trenches; therefore, network equipment is often subjected to the voltages seen on power  
lines. If direct contact between the telephone line and the primary power line occurs, the  
operating company’s network equipment may see as much as 600 V rms for five seconds,  
by which time the power company’s power system should clear itself. If direct contact  
occurs with the secondary power line, voltages will be limited to 277 V rms; however, these  
voltages may be seen indefinitely because the resultant current may be within the operating  
range of the power system, and the power system will not reset itself.  
Another risk involved with power lines is indirect contact. Because of the large magnetic  
fields created by the currents in the power lines, large voltages may be induced upon phone  
lines via electro-magnetic coupling. In this instance voltages should be limited to  
1000 V peak and 600 V rms using primary protectors, while the current will be limited by the  
current-carrying capacity of the 24-gauge wire.  
http://www.teccor.com  
+1 972-580-7777  
4 - 6  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
GR 1089–Core  
First Level AC Power Fault Criteria  
Table 4.6 presents test conditions for the First Level AC Power Fault Test. The EUT is  
required to pass operationally.  
Table 4.6 First Level AC Power Fault Test  
Short Circuit  
Current per  
Conductor  
(A)  
0.33  
0.17  
1A at 600 V  
Applied Voltage,  
60 Hz  
Primary  
Test Connections  
Test  
1 (Note 1)  
2 (Note 1)  
3 (Note 1)  
(VRMS  
)
Duration  
15 min  
15 min  
Protectors  
(Table 4.1, Figure 4.1)  
50  
100  
200, 400, 600  
Removed  
Removed  
Removed  
A
A
A
60 applications,  
1 s each  
4 (Note 4)  
5 (Note 2)  
1000  
1
60 applications,  
1 s each  
In place  
B
N/A  
N/A  
60 applications,  
Removed  
N/A  
5 s each  
6 (Note 3)  
7 (Note 3)  
8 (Note 3)  
9 (Note 3)  
600  
600  
600  
0.5  
2.2  
3
30 s  
2 s  
1 s  
Removed  
Removed  
Removed  
In place  
A
A
A
B
1000  
5
0.5 s  
Notes:  
1. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)  
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.  
2. Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.  
3. Test conditions 6 through 9 are objective, not mandatory, requirements.  
4. Sufficient time may be allowed between applications to preclude thermal accumulation.  
Second Level AC Power Fault Criteria  
Test conditions for the Second Level AC Power Fault Test are dependent on whether the  
EUT is intended for customer premises equipment or non-customer premises equipment. In  
both instances, although the EUT is not required to pass operationally, it may not become a  
fire, fragmentation, or electrical safety hazard.  
Second Level AC Power Fault Criteria for Non-customer Premises  
Equipment  
Table 4.7 presents test conditions for non-customer premises equipment. (Note that test  
conditions 1, 3, and 4 may be omitted if the EUT has previously met UL 60950.) See  
Figure 4.1 for test connection appearances.  
© 2002 Teccor Electronics  
4 - 7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
GR 1089–Core  
Table 4.7 Second Level AC Power Fault Test for Non-Customer Premises Equipment  
Short Circuit Current  
per Conductor  
Test  
Applied Voltage, 60 Hz  
(VRMS  
(A)  
Test Connections  
(Notes 1, 2)  
)
(Note 5)  
25  
60  
Duration  
15 min  
5 s  
(Table 4.1, Figure 4.1)  
1
2
120, 277  
600  
A
A
3
600  
7
5 s  
A
4 (Note 3)  
5 (Note 4)  
100-600  
N/A  
2.2A at 600 V  
N/A  
15 min  
15 min  
A
N/A  
Notes:  
1. Primary protectors are removed for all tests.  
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)  
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.  
3. This test is to be performed between the ranges of 100 V to 600 V and is intended to produce the greatest heating affect.  
4. Test 5 simulates a high impedance induction fault. Specific information regarding this test is available upon request.  
5. These tests are repeated using a short-circuit value just below the operating threshold of the current limiting device, or, if the EUT  
uses a fuse as current limiting protection, the fuse may be bypassed and the short circuit current available adjusted to 135% of the  
fuse rating.  
6. Intra-building, second level lower fault test uses test condition 1 only. The applied voltage is at 120 V rms only.  
Second Level AC Power Fault for Customer Premises Equipment  
For customer premises equipment, the EUT is tested to the conditions presented in  
Table 4.8 and connected to a circuit equivalent to that shown in Figure 4.2. During this test,  
the wiring simulator cannot open. For equipment that uses premises type of wiring, the  
wiring simulator is a 1.6 A Type MDQ fuse from Bussman. For equipment that is connected  
by cable, the wiring simulator is a piece of 26-gauge copper wire.  
Table 4.8 Second Level AC Power Fault for Customer Premises Equipment  
Applied Voltage, 60 Hz  
(VRMS  
)
Source Impedance  
Test Connections  
Test  
1
2
(Notes 2, 3)  
300  
(Table 4.1, Figure 4.2)  
20  
20  
(Note 1)  
A
600  
Notes:  
1. Applied between exposed surfaces and Ground  
2. The 60 Hz signal is applied with an initial amplitude of 30 V rms and increased by 20% every 15 minutes until one of the following  
occurs:  
— Voltage reaches the maximum specified  
— Current reaches 20 A or the wiring simulator opens  
— EUT fails open circuit  
3. If the EUT fails open circuit, the test continues for an additional 15 minutes to ensure that another component of the EUT does not  
create a fire, fragmentation, or electrical safety hazard.  
http://www.teccor.com  
+1 972-580-7777  
4 - 8  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
GR 1089–Core  
Wiring  
Wiring  
Simulator  
Simulator  
20  
20  
20  
Tip  
Tip  
Equipment  
Equipment  
Ring  
Ring  
Variable  
60 Hz ac  
Voltage  
Wiring  
Simulator  
Chassis  
Ground  
Variable  
60 Hz ac  
Voltage  
Chassis  
Ground  
Source 0-600 V  
Source 0-600 V  
AC Equipment Ground  
(Green Wire Ground)  
(A) Metallic  
AC Equipment Ground  
(Green Wire Ground)  
(B) Longitudinal  
Figure 4.2 Second Level AC Power Fault and Current Limiter Connection  
Current Limiting Protector Test  
The purpose of the Current Limiting Protector Test, presented in Table 4.9, is to determine if  
the EUT allows an excessive amount of current flow under power fault conditions. During  
this test, the EUT is connected to a circuit equivalent to that shown in Figure 4.2 with a  
1.6 A Type MDQ fuse from Bussman used as the wiring simulator. If the EUT draws enough  
current to open the fuse, then the acceptable time/current criteria have not been met, and  
external current limiting protectors must be specified for use with that equipment in the  
manufacturer’s documentation.  
Table 4.9 Current Limiting Protector Test  
Applied Voltage, 60 Hz  
Source Impedance  
Test Connections  
Test  
1
(VRMS  
)
Duration  
15 min  
(Table 4.1, Figure 4.2  
600  
2
A
Short-circuit Test  
In addition to the AC Power Fault and Current Limiter Tests, equipment must also pass a  
Short-circuit Test to comply with GR 1089. During this test, a short-circuit condition is  
applied to the following Tip and Ring appearances for 30 minutes while the EUT is powered  
and under operating conditions:  
Tip-to-Ring, Tip-to-Ground with Ring open circuit  
Ring-to-Ground with Tip open circuit  
Tip- and Ring-to-Ground simultaneously for 30 minutes  
At no time will the short circuit exceed 1 . For equipment with more than one twisted pair,  
the short circuit is applied to all twisted pair simultaneously. To comply with the short circuit  
test, the EUT must function normally after the short-circuit condition is removed, and a fire  
hazard may not be present. The equipment shall not require manual intervention to restore  
service.  
© 2002 Teccor Electronics  
4 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
ITU-T K.20 and K.21  
ITU-T K.20 and K.21  
Although the International Telecommunication Union (ITU) does not have the authority to  
legislate that organizations follow their recommendations, their standards are recognized  
throughout Europe and the Far East.  
ITU-T, the Telecommunication Standardization Sector of the ITU, developed fundamental  
testing methods that cover various environmental conditions to help predict the survivability  
of network and customer-based switching equipment. The testing methods cover the  
following conditions:  
Surges due to lightning strikes on or near twisted pair and plant equipment (excluding a  
direct strike)  
Short-term induction of AC voltage from adjacent power lines or railway systems  
Direct contact between telecommunication lines and power lines (often referred to as  
AC power cross)  
Two ITU-T standards apply for most telecommunications equipment connected to the  
network:  
ITU-T K.20  
ITU-T K.21  
ITU-T K.20 is primarily for switching equipment powered by the central office; however, for  
complex subscriber equipment, test administrators may choose either K.20 or K.21,  
depending on which is deemed most appropriate.  
Note: Both standards are intended to address equipment reliability versus equipment  
safety. For specific concerns regarding equipment safety, research and follow  
national standards for each country in which the equipment is intended for use.  
K.21 covers telecommunication equipment installed in customer premises. Equipment  
submitted under these requirements must meet one of two levels: basic or enhanced.  
Guidelines for determining under which level the equipment under test (EUT) falls can be  
found in ITU-T K.11, but note that the final authority rests with the test administrator.  
ITU-T K.44 describes the test conditions used in K.20 and K.21.  
ITU-T defines the following acceptance criteria:  
Criterion A states that equipment shall withstand the test without damage and shall  
operate properly after the test. It is not required to operate correctly during the test.  
Criterion B states that a fire hazard shall not occur as a result of the tests. Any damage  
shall be confined to a small part of the equipment.  
Table 4.10 shows the lightning surge test conditions for ITU K.20. Figure 4.3 shows the  
connection schematic for the lightning surge tests. Table 4.11 shows the power cross test  
conditions for ITU K.20. Figure 4.4 shows the connection schematic for the power cross  
tests. Table 4.12 and Table 4.13 show the same test conditions respectively for ITU K.21.  
http://www.teccor.com  
+1 972-580-7777  
4 - 10  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
ITU-T K.20 and K.21  
Table 4.10 K.20 Lightning Test Conditions for Telecom Equipment in Central Office/Remote Terminal  
Voltage (10x700 µs)  
Single Port  
Metallic and  
Longitudinal  
Multiple Ports  
Longitudinal Only  
Basic/Enhanced  
Current (5x310 µs)  
Basic/Enhanced  
(A)  
Acceptance  
Criteria  
Basic/Enhanced  
Repetitions *  
Primary Protection  
None **  
Installed if used  
None  
1 kV/1.5 kV  
4 kV/4 kV  
25/37.5  
100/100  
37.5/37.5  
100/150  
±5  
±5  
±5  
±5  
A
A
A
A
1.5 kV/1.5 kV  
4 kV/6 kV  
Installed if used  
* One-minute rest between repetitions  
** This test is not conducted if primary protection is used.  
Equipment Under Test  
A
25 Ω  
Decoupling  
Elements  
Surge  
Generator  
E
B
a) Transversal test  
Equipment Under Test  
A
25 Ω  
Decoupling  
Elements  
Surge  
Generator  
E
B
R3 = 25 Ω  
b) Longitudinal test  
Figure 4.3 Connection Appearances  
© 2002 Teccor Electronics  
4 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
ITU-T K.20 and K.21  
Equipment  
Under Test  
R
R
A
U
a.c.  
E
B
Timing Circuit  
Generator  
Figure 4.4 Connection Appearances (R = 10 , 20 , 40 , 80 , 160 , 300 , 600 , and 1000 ꢀ  
for the various power cross tests)  
Table 4.11 K.20 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal  
Current (5x310 µs)  
Voltage  
Basic/Enhanced  
Duration  
Primary  
Acceptance Criteria  
Basic/Enhanced  
(A)  
Basic/Enhanced  
Repetitions *  
Protection  
Basic/Enhanced  
600 V/600 V  
1/1  
0.2 s  
1 s/2 s  
15 min  
5
None  
None  
None  
A/A  
A/A  
50 Hz or 60 Hz  
600/1.5 kV  
1/7.5  
5
1
50 Hz or 60 Hz  
230/230 V  
23/23  
11.5/11.5  
5.75/5.75  
2.875/2.875  
1.44/1.44  
0.77/0.77  
0.38/0.38  
0.23/0.23  
B/B  
B/B  
B/B  
B/B  
B/A  
B/A  
B/A  
B/B  
50 Hz or 60 Hz  
* One-minute rest between repetitions  
Table 4.12 K.21 Lightning Test Conditions for Telecom Equipment on Customer Premises  
Voltage (10x700 µs)  
Single Port  
Multiple Ports  
Longitudinal  
Metallic  
Longitudinal Only Current (5x310 µs)  
(kV)  
(kV)  
(kV)  
Basic/Enhanced  
(A)  
Primary  
Acceptance  
Criteria  
Basic/Enhanced Basic/Enhanced Basic/Enhanced  
Repetitions *  
Protection  
None  
1.5/6 **  
4/6  
37.5/150  
100/150  
37.5/37.5  
100/150  
±5  
±5  
±5  
±5  
A ***  
A
A ***  
A
Installed if used  
None  
Installed if used  
1.5/1.5  
4/6  
1.5/1.5  
4/6  
* One-minute rest between repetitions  
** Reduce to 1.5 kV if SPD connects to GRD.  
*** Does not apply if primary protectors are used.  
http://www.teccor.com  
+1 972-580-7777  
4 - 12  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
ITU-T K.20 and K.21  
Table 4.13 K.21 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal  
Current  
Basic/Enhanced  
(A)  
Voltage  
Duration  
Primary  
Acceptance Criteria  
Basic/Enhanced  
Basic/Enhanced  
Basic/Enhanced  
Repetitions *  
Protection  
600 V / 600 V  
1/1  
0.2 s  
1 s/2 s  
15 min  
5
None  
A/A  
50 Hz or 60 Hz  
600 V / 1.5 kV  
50 Hz or 60 Hz  
1/7.5  
5
1
Installed if  
used  
None  
A/A  
230 V / 230 V  
23/23  
11.5/11.5  
5.75/5.75  
2.875/2.875  
1.44/1.44  
0.77/0.77  
0.38/0.38  
0.23/0.23  
B/B  
B/B  
B/B  
B/B  
B/A  
B/A  
B/A  
B/B  
50 Hz or 60 Hz  
* One-minute rest between repetitions  
© 2002 Teccor Electronics  
4 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
TIA-968 (formerly known as FCC Part 68)  
TIA-968 (formerly known as FCC Part 68)  
TIA-968 applies to all terminal equipment connected to the Public Switched Telephone  
Network (PSTN) and holds the “rule of law” by congressional order.  
The purpose of TIA-968 is to provide a set of uniform standards to protect the telephone  
network from any damage or interference caused by the connection of terminal equipment.  
This standard includes environmental simulations such as vibration tests, temperature and  
humidity cycling, drop tests and tests for hazardous voltages and currents, as well as tests  
for signal power levels, line balance, on-hook impedance, and billing protection. All these  
standards must be met before and after the environmental tests are applied.  
Overvoltage Test  
TIA-968 compliant equipment must undergo an overvoltage test that includes a Type A and  
Type B Metallic Voltage Surge and a Type A and Type B Longitudinal Voltage Surge. These  
surges are part of the environmental simulation, and although a provision does allow the  
EUT to reach an open circuit failure mode during the Type A tests, failures must:  
1. Arise from an intentional design that will cause the phone to be either disconnected from  
the public network or repaired rapidly  
2. Be designed so that it is substantially apparent to the end user that the terminal  
equipment is not operable  
A common example of an acceptable failure would be an open circuit due to an open  
connection on either Tip or Ring.  
For Type B surges, equipment protection circuitry is not allowed to fail. The EUT must be  
designed to withstand Type B surges and continue to function in all operational states.  
Metallic Voltage Surge  
The Type A and Type B Metallic Voltage Surges are applied in both the positive and  
negative polarity across Tip and Ring during all operational states (on-hook, off-hook,  
ringing, and so on). The Type A surge is an 800 V, 100 A peak surge while the Type B  
surge is a 1000 V, 25 A peak surge, as presented in Table 4.14.  
Table 4.14 TIA-968 Voltage Surge  
Peak  
Rise &  
Peak  
Current  
(A)  
Rise &  
Surge  
Type  
Voltage  
Decay Time  
Decay Time  
Repetitions  
(VPK  
)
(Voltage Waveform)  
(Current Waveform)  
Each Polarity  
Metallic A  
Longitudinal A  
Metallic B  
±800  
±1500  
±1000  
±1500  
10x560 µs  
10x160 µs  
9x720 µs  
9x720 µs  
100  
200  
25  
10x560µs  
10x160µs  
5x320µs  
5x320µs  
1
1
1
1
Longitudinal B  
37.5  
Notes:  
For Type A surges, the EUT may pass either “operationally” or “non-operationally.”  
For Type B surges, the EUT must pass “operationally.”  
The peak current for the Type A longitudinal surge is the total available current from the surge generator.  
The peak current for the Type B longitudinal surge is the current supplied to each conductor.  
http://www.teccor.com  
+1 972-580-7777  
4 - 14  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
TIA-968 (formerly known as FCC Part 68)  
Longitudinal Voltage Surge  
The Type A and Type B Longitudinal Voltage Surges are applied in both positive and  
negative polarity during all operational states. The Type A surge is a 1500 V, 200 A peak  
surge applied to the EUT with Tip and Ring tied together with respect to Ground. The  
Type B Longitudinal Voltage Surge is a simultaneous surge in which 1500 V and 37.5 A are  
applied concurrently to Tip with respect to Ground and Ring with respect to Ground, as  
presented in Table 4.14.  
Note: Type B surge requirements guarantee only a minimum level of surge protection. For  
long term reliability of terminal equipment, consideration should be given to  
complying with Type A surges operationally.  
On-hook Impedance Limitations  
Another important aspect of TIA-968 is on-hook impedance, which is affected by transient  
protection. On-hook impedance is analogous to the leakage current between Tip and Ring,  
and Tip, Ring, and Ground conductors during various on-hook conditions. "On-hook  
Impedance Measurements" (next paragraph) outlines criteria for on-hook impedance and is  
listed as part of the Ringer Equivalent Number (REN). The REN is the largest of the unitless  
quotients not greater than five; the rating is specified as the actual quotient followed by the  
letter of the ringer classification (for example, 2B).  
On-hook Impedance Measurements  
On-hook impedance measurements are made between Tip and Ring and between Tip and  
Ground and Ring and Ground. For all DC voltages up to and including 100 V, the DC  
resistance measured must be greater than 5 M. For all DC voltages between 100 V and  
200 V, the DC resistance must be greater than 30 k. The REN values are then determined  
by dividing 25 Mby the minimum measured resistance up to 100 V and by dividing  
150 kby the minimum measured resistance between 100 V and 200 V.  
On-hook impedance is also measured during the application of a simulated ringing signal.  
This consists of a 40 V rms through 150 V rms ringer signal at frequencies ranging from  
15.3 Hz to 68 Hz superimposed on a 56.5 V dc for a class “B” ringer. During this test, the  
total DC current may not exceed 3 mA. In addition, the minimum DC resistance measured  
between Tip and Ring must be greater than 1600 , while the DC resistance measured  
between the Tip and Ring conductors and Ground must be greater than 100 k. The REN  
values for the simulated ringing test are determined by dividing the maximum DC current  
flowing between Tip and Ring by 0.6 mA, and by dividing 8000 by the minimum  
impedance value measured.  
© 2002 Teccor Electronics  
4 - 15  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
UL 60950 3rd Edition  
(formerly UL 1950, 3rd edition)  
After the divestiture of the AT&T/Bell system, the National Electric Code (NEC)  
implemented Article 800-4, which mandates that “all equipment intended for connection to  
the public telephone network be listed for that purpose” in order to ensure electrical safety.  
A manufacturer can meet this requirement by listing their product with Underwriters  
Laboratories under UL 60950 (based on IEC 60950, 3rd edition).  
NEC requires all telecommunication wiring that enters a building to pass through a primary  
protector, which is designed to limit AC transients in excess of 600 V rms. These transients  
are due to the fact that telephone lines run in close proximity to AC power lines. Most  
telecommunication equipment uses a secondary overvoltage protector such as the  
SIDACtor device. The secondary devices typically limit transients in excess of 350 V rms.  
Therefore, a potentially dangerous condition exists because of the voltage threshold  
difference of the primary protector and the secondary protector. To minimize this danger,  
compliance with UL 60950 overvoltage tests is required.  
UL 60950 covers equipment with a rated voltage (primary power voltage) not exceeding  
600 V and equipment designed to be installed in accordance with NEC NFPA 70. This  
standard does not apply to air-conditioning equipment, fire detection equipment, power  
supply systems, or transformers.  
The effective date of UL 60950 allows new products submitted through April 1, 2003 to be  
evaluated using the requirements of either UL 60950 or UL 1950, 3rd edition. After April 1,  
2003, all new product submittals must be evaluated using only UL 60950.  
Products certified by UL to requirements of UL 1459 prior to April 1, 2000 may continue to  
be certified without further reinvestigation until April 1, 2005, provided no significant  
changes or revisions are made to the products. Products certified by UL to requirements of  
UL 1950 3rd edition prior to April 1, 2003 may continue to be certified without further  
reinvestigation until April 1, 2005.  
In order to have the UL Mark applied after April 1, 2005, all products, including those  
previously certified by UL, must comply with UL 60950.  
UL 69050 is intended to prevent injury or harm due to electrical shock, energy hazards, fire,  
heat hazards, mechanical hazards, radiation hazards, and chemical hazards.  
It defines three classes of equipment:  
Class 1 — protection achieved by basic insulation  
Class 2 — protection achieved by double or reinforced insulation  
Class 3 — protection relying upon supply from SELV circuits (voltages up to 40 V peak  
or 60 V dc)  
UL 60950 also defines five categories of insulation:  
Functional  
Basic  
Supplementary  
Reinforced  
Double  
http://www.teccor.com  
+1 972-580-7777  
4 - 16  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
UL 60950 Terminology  
The following definitions assist in understanding UL 60950:  
SELV  
Secondary circuit whose voltage values do not exceed a safe value  
(voltage less than hazardous levels of 42.4 V peak or 60 V dc)  
TNV  
Telecommunication Network Voltage (a secondary circuit)  
O SELV but with exposure to surges  
TNV3  
TNV2  
TNV1  
O SELV but without exposure to surges  
? SELV with exposure to surges  
Creepage distance is the shortest distance between two conductors, measured along the  
surface of the insulation. DC voltages shall be included in determining the working voltage  
for creepage distances. (The peak value of any superimposed ripple or short disturbances,  
such as cadenced ringing signals, shall be ignored.)  
Clearance distance is the shortest distance between two conductive parts or between a  
conductive part and the outer surface of the enclosure measured through air. DC voltages  
and the peak value of any superimposed ripple shall be included in determining the working  
voltage for clearance distances.  
Creepage and clearance distances are also subject to the pollution degree of the  
equipment:  
Pollution degree 1 — components and assemblies that are sealed to prevent ingress of  
dust and moisture  
Pollution degree 2 — generally applicable to equipment covered by UL 60950  
Pollution degree 3 — equipment is subject to conductive pollution or to dry non-  
conductive pollution, which could become conductive due to expected condensation.  
To ensure safe operating conditions of the equipment, UL 60950 focuses on the insulation  
rating of the circuit(s) under consideration. Table 4.15 and Table 4.16 indicate the required  
creepage and clearance distances depending on material group, pollution degree, working  
voltage, and maximum transient voltage in the secondary circuit. For a typical  
telecommunication application with a working voltage of 200 V, pollution degree 2, material  
group IIIb, the creepage distance is 2 mm. The clearance distance is 2 mm for reinforced  
insulation.  
© 2002 Teccor Electronics  
4 - 17  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
Table 4.15 Minimum Clearances in Secondary Circuits (millimeters)  
Nominal AC  
Mains Supply  
voltage  
Working  
Voltage up  
to and  
Nominal AC Mains Supply voltage  
?ꢂ150 V  
Nominal AC Mains Supply voltage  
> 150 V ? 300 V  
> 300 V ? 600 V  
(transient rating  
for Secondary  
Circuit 2500 V)  
Circuit Not  
Subject to  
(transient rating for Secondary  
Circuit 800 V)  
(transient rating for Secondary  
Circuit 1500 V)  
Transient  
including  
Overvoltages  
Pollution  
Pollution  
Degrees 1 and 2  
only  
Pollution  
Pollution  
Degree 3  
Pollution  
Pollution  
Degree 3  
Degrees  
Degrees 1 and 2  
Degrees 1 and 2  
1, 2, and 3  
V * V **  
F
0.4  
B/S  
0.7  
0.7  
0.9  
R
F
1
1
1
B/S  
1.3  
1.3  
1.3  
R
F
B/S  
1
1
R
2
2
2
F
1
1
1
B/S  
1.3  
1.3  
1.3  
R
F
B/S  
2
2
2
2
R
4
4
4
4
4
F
B/S  
0.4  
0.7  
0.7  
1.1  
1.4  
R
71  
50  
1.4  
1.4  
1.8  
2.6  
2.6  
2.6  
0.7  
0.7  
0.7  
2.6  
2.6  
2.6  
1.7  
1.7  
1.7  
1.7  
1.7  
0.4  
0.6  
0.6  
1.1  
1.4  
0.8  
1.4  
1.4  
2.2  
2.8  
140 100 0.6  
210 150 0.6  
280 200  
1
F 1.1; B/S 1.4; R 2.8  
F 1.6; B/S 1.94; R 3.8  
420 300  
2
* Voltage peak or DC  
** Voltage rms (sinusoidal)  
Note: F = Functional  
B/S = Basic/Supplementary  
R = Reinforced  
Table 4.16 Minimum Creepage Distances (millimeters)  
Functional, Basic, and Supplementary Insulation  
Pollution Degree 2  
Working  
Voltage  
Pollution Degree 1  
Material Group  
I, II, IIIa, or IIIb  
Pollution Degree 3  
Material Group  
Material Group  
V
RMS or DC  
I
II  
0.9  
1
IIIa or IIIb  
I
1.5  
1.8  
1.9  
2
2.5  
3.2  
4
5
8
10  
12.5  
II  
1.7  
2
IIIa or IIIb  
1.9  
2.2  
2.4  
2.5  
3.2  
4
? 50  
100  
125  
150  
200  
250  
300  
400  
600  
800  
1000  
Use the Clearance from the  
0.6  
0.7  
0.8  
0.8  
1
1.3  
1.6  
2
1.2  
1.4  
1.5  
1.6  
2
2.5  
3.2  
4
appropriate table  
1.1  
1.1  
1.4  
1.8  
2.2  
2.8  
4.5  
5.6  
7.1  
2.1  
2.2  
2.8  
3.6  
4.5  
5.6  
9.6  
11  
5
6.3  
10  
12.5  
16  
3.2  
4
5
6.3  
8
10  
14  
Note: Linear interpolation is permitted between the nearest two points, the calculated spacing being rounded to the next higher 0.1 mm  
increment.  
The following separations require the specified insulation grade:  
TNV3 from TNV3 — functional insulation  
TNV3 from SELV — basic insulation  
TNV3 from TNV1 — basic insulation  
TNV3 from TNV2 — basic insulation  
http://www.teccor.com  
+1 972-580-7777  
4 - 18  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
The application must meet the creepage and clearance distances and electric strength of  
Section 5.3.2 of UL 60950 for functional insulation. The electric strength test (Table 5B of  
UL 60950) lists 1 kV to 1.5 kV as the test voltages for functional and supplementary grade  
of insulation and 2 kV to 3 kV for reinforced grade of insulation.  
Separation requirements are tested (Section 6.2.2.1 of UL 60950) by applying an impulse  
test and an electric strength test:  
Impulse test allows for the SIDACtor device to turn on (either a 10x700 2.5 kV 62.5 A or  
1 kV 37.5 A 10 times with 60-second rest period).  
Electric strength test allows the SIDACtor device to be removed (60 Hz at rated voltage  
for 60 seconds).  
These are applied between Ground and all Tip and Rings connected together, and/or  
between Ground and all conductors intended to be connected to other equipment  
connected together.  
Basic insulation is not required if all the following conditions are met:  
SELV, TNV1 circuit is connected to the protective earth.  
Installation procedures specify that protective earth terminal shall have a permanent  
connection to earth.  
Any TNV2 or TNV3 circuit with an external port connection intended to receive signals in  
excess of SELV (60 V dc or 50 V peak) will have the maximum normal expected  
operating voltage applied to it for up to 30 minutes without deterioration. (If no maximum  
normal specification exists then 120 V 100 mA 60 Hz is applied.)  
(In other words, if a permanent Ground connection is made, then creepage distances may  
not be required.)  
Any surge suppressor that bridges the insulation (connects to Ground) shall have a  
minimum DC turn on voltage of 1.6 times the rated voltage UNLESS one of the following  
occurs (Section 6.1.2.2 of UL 60950):  
Equipment is permanently connected or uses an industrial plug and socket-outlet.  
Equipment is installed by service personnel.  
Equipment has provision for a permanently connected protective earth.  
ANNEX C of UL 60950 covers transformers.  
The secondary side is loaded for maximum heating effect. The maximum working voltage is  
applied to the primary. The DC peak value of any superimposed ripple shall be included.  
The permitted temperature limits for the windings depend on the classification:  
Class A limit is 150 °C.  
Class B limit is 175 °C.  
Class E limit is 165 °C.  
Class F limit is 190 °C.  
Class H limit is 210 °C.  
© 2002 Teccor Electronics  
4 - 19  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
Overvoltage Flowchart  
The overvoltage flowchart in Figure 4.5 shows specific guidelines for determining  
overvoltage requirements applicable to specific designs.  
Connects to Outside Cable  
Yes  
No  
No Overvoltage Testing  
100 A2-S  
Limiting1  
26 AWG  
No  
No  
Pass 1  
Yes  
No  
Line Cord3  
Yes  
Yes  
No  
1.3 A  
Limiting2  
Pass 6.1.24  
Yes  
No  
No  
Pass 5  
Yes  
Yes  
Fire  
Enclosure  
No  
Pass 26  
No  
Fire Enclosure  
and Spacings5  
Yes  
No  
Pass 3, 47  
Yes  
Yes  
Not  
Acceptable  
Acceptable  
Notes:  
1. Current Limiting — Equipment that has a method for limiting current to an I2t rating of 100A2s  
2. Current Limiting — Equipment that has a method for limiting current to 1.3 A max steady state  
3. 26 AWG Line Cord — Minimum 26 American Wire Gauge (AWG) telecommunications line cord either supplied with the  
equipment or described in the safety instructions  
4. Clause 6.3.3 — The telephone line must be adequately isolated from earth for the operating mode being considered and  
at a voltage of 120 V rms. Refer to Section 6.1.2 of UL 60950.  
5. Fire Enclosure and Spacing — Fire enclosures minimize fire hazards by containing any emission of flame, molten metal,  
flaming drops, or glowing particles that could be emitted by the equipment under fault conditions. Fire enclosure  
construction is covered in Section 4.4.6 of UL 60950. Spacing applies to parts in the TNV circuits that might ignite under  
overvoltage conditions. Spacing requirements mandate that parts be separated from internal materials of flammability  
class V-2 or lower, by at least 25 mm of air or a barrier material of flammability class V-1 or better. Parts also should be  
separated from openings in the top or sides of the enclosure by at least 25 mm of air or a material barrier.  
6. Test Condition 2 is not required for equipment with 1.3 A limiting.  
7. Test Conditions 3 and 4 are not required for connections limited to outside cable less than 1,000 m.  
Figure 4.5 Overvoltage Flowchart  
http://www.teccor.com  
+1 972-580-7777  
4 - 20  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
Passes 1, 2, 3, 4, and 5 shown in Figure 4.5 refer respectively to Tests L1 and M1, L2 and  
M2, L3 and M3, L4 and M4, and L5 shown in Table 4.17.  
Equipment may be subject to the overvoltage tests shown in Table 4.17. The tests are  
designed to simulate the following:  
Contact with primary power  
Short-term induction as a result of a primary power fault to a multi-earth neutral  
Long duration power fault to Ground  
Direct contact between the power mains and a telecommunications cable  
Table 4.17 UL 60950 Overvoltage Test  
Voltage  
Current  
(A)  
40  
7
2.2  
2.2  
25  
40  
7
Test  
L1  
(VRMS  
)
Time  
1.5 s  
5 s  
30 min  
30 min  
30 min  
1.5 s  
5 s  
30 min  
30 min  
Comments  
600 V  
600 V  
600 V  
200 V  
120 V  
600 V  
600 V  
600 V  
600 V  
L2  
L3  
L4  
L5  
M1  
M2  
M3  
M4  
Reduce to 135% fuse rating  
Reduce to 135% fuse rating  
2.2  
2.2  
Reduce to 135% fuse rating  
Reduce to 135% fuse rating  
Notes:  
ISDN S/T interface only L1, L2, L5, M1, and M2.  
Reduce to 135% rated value of fuse if Test 3 resulted in open condition.  
L4 and M4 are conducted only if SIDACtor VS O 285 VS and then run at voltage level just below VS.  
For test conditions M1, L1, M5, and L5 a wiring simulator (MDL 2 A fuse) is used.  
Compliance means no ignition or charring of the cheesecloth, and/or the wiring simulator does not open.  
If the secondary protector simulator is used (MDQ 1.6), it is allowed to open.  
Tests 2, 3, and 4 are required only if the unit is not a fire enclosure.  
Figure 4.6 and Figure 4.7 show the M (metallic) and L (longitudinal) test connections.  
Current  
Limiting  
Resistor  
Secondary Protector  
Simulator or  
Wiring Station  
Telecommunication  
Network Connection  
Points  
Equipment  
Under Test  
Timed  
Switch  
Variable  
Voltage  
Source  
Equipment  
Earth  
Figure 4.6 Metallic Connection Appearances  
© 2002 Teccor Electronics  
4 - 21  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
Current  
Limiting  
Resistors  
Secondary Protector  
Simulators or  
Wiring Stations  
Equipment  
Under Test  
Timed  
Switch  
Variable  
AC Voltage  
Source  
Equipment  
Earth  
Figure 4.7 Longitudinal Connection Appearances  
Overvoltage Test Procedures  
Use the following criteria when applying the overvoltage tests presented in Table 4.17:  
1. Test Set-up — Equipment is to be mounted as it is intended to be used. Tests may be  
conducted on either the equipment as an assembly, individual subassemblies, or a  
partial assembly containing those components which may be exposed to an overvoltage  
condition.  
2. Indicators — Before testing, two single pieces of cheesecloth are to be wrapped tightly  
around the assembly, subassembly, or partial assembly. The cheesecloth acts as an  
indicator for conditions that may result in fire.  
3. Line Cords — Equipment with a removable telecommunications line cord is to be  
connected to the test circuit with a line cord having 0.4 mm (26 AWG) or larger copper  
wire conductors and not more than 1 total resistance.  
4. Functional Circuitry — UL mandates that functional circuitry must be used for each  
overvoltage test conducted. This allows repair or replacement of damaged circuitry  
before subsequent testing. Alternatively, separate samples may be used for each test.  
5. Wiring Simulators — A wiring simulator is used to indicate whether the maximum I2t  
imposed upon telecommunications wiring has been exceeded. For Tests 1 and 5, a  
wiring simulator is to be used unless the equipment is specified for use with a suitable  
secondary protector or a secondary protector simulator. The wiring simulator can consist  
of one of the following:  
a. 50mm length of 0.2 mm (32 AWG) bare or enameled solid copper wire (for test  
condition 1)  
b. Bussman Mfg. Co. Type MDL-2A fuse (for test condition 1)  
c. 300 mm length of 0.4 mm (26 AWG) solid copper wire which connects to a  
representative installation (includes wiring an connectors)  
[This option is used when the manufacturer specifies the complete installation from  
the network interface to the equipment.]  
d. Current probe used with a 300 mm length of 0.5 mm (24 AWG) copper wire (for test  
condition 1)  
http://www.teccor.com  
+1 972-580-7777  
4 - 22  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)  
Note: Test conditions 2, 3, and 4 do not require the use of a wiring simulator or a secondary  
protector simulator. Any secondary protection simulators used in Tests 1 and 5  
should be similar to the test fuse used in UL 497A, “Standard for Secondary  
Protectors for Communications Circuits.”  
Overvoltage Test Compliance  
Equipment is deemed compliant if each of the following conditions are met during test:  
Absence of ignition or charring of the cheesecloth indicator  
(Charring is deemed to have occurred when the threads are reduced to char by a  
glowing or flaming condition.)  
Wiring simulator does not open during test condition 1 or 5  
For test condition 1, presented in Table 4.17, the integral I2t measured with a current  
probe is less than 100 A2s.  
After completion of the overvoltage tests, equipment must comply with either the Dielectric  
Voltage-withstand Test requirements with all components in place or the Leakage Current  
Test requirements.  
Special Considerations Regarding the SIDACtor Device and UL 60950  
The epoxy used for SIDACtor devices is UL recognized and the encapsulated body passes  
UL 94V-0 requirements for flammability.  
The only specific requirements of UL 60950 that pertain to the SIDACtor device itself are  
the impulse test and the mandate that components be UL recognized. All other UL 60950  
requirements pertain to the equipment being evaluated.  
© 2002 Teccor Electronics  
4 - 23  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 497  
UL 497  
UL 497 Series of Safety Standards  
The UL 497 series is a family of three safety standards that provides requirements for  
protection devices used in low-voltage circuits.  
UL 497 addresses requirements for primary protectors used in paired communications  
circuits.  
UL 497A covers secondary protectors for use in single or multiple pair-type  
communications circuits.  
UL 497B addresses protectors used in data communication and fire alarm circuits.  
UL 497C addresses protectors for coaxial circuits.  
The focus of UL 497 is to ensure that paired communication circuit protectors do not  
become a fire or safety hazard. The requirements in UL 497 cover any protector that is  
designed for paired communications circuits and is employed in accordance with Article 800  
of the National Electric Code. The protectors covered in UL 497 include solid state primary  
and station protectors. These circuit protectors are intended to protect equipment, wiring,  
and service personnel against the effects of excessive voltage potential and currents in the  
telephone lines caused by lightning, power cross, power induction, and rises in Ground  
potential.  
UL 497 Construction and Performance Requirements  
The “Construction” section covers the following requirements:  
General  
Enclosures  
Protection Against Corrosion  
Field-wiring Connections  
Components  
Spacing  
The “Performance” section covers the following requirements:  
General  
Line Fuse Test  
Instrument Fuse Test  
Arrestor Test  
Polymeric Material Test  
Rubber Materials Test  
Corrosion Test, Outdoor Use Protector  
Jarring Test  
Water Spray Test  
Drop Test  
Cover Replacement Test  
Strain Relief Test  
Replacement Arrestors Installation Test  
Appliqué Assemblies Installation Test  
Dielectric Voltage-withstand Test  
Manufacturing and Production Tests  
Marking  
http://www.teccor.com  
+1 972-580-7777  
4 - 24  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 497  
Performance Tests  
Key performance tests which concern overvoltage protectors are detailed in the arrestor  
test section. Specific requirements are:  
Breakdown Voltage Measurement Arrestors are to be tested in the protector blocks or  
panels in which they are intended to be employed. Arrestors are required to break down  
within ±25% of the manufacturer’s specified breakdown rating. In no case shall the  
breakdown voltage exceed 750 V peak when subjected to the strike voltage test shown  
in Figure 4.8. At no time during this test will the supply voltage be increased at a rate  
greater than 2000 V/µs.  
Impulse Spark-over Voltage Measurement The arrestor must break down at less than  
1000 V peak when subjected to a single impulse potential. Arrestors are to be tested in  
each polarity with a rate of voltage rise of 100 V/µs, ±10%.  
Abnormal Operation Single pair fuseless arrestors must be able to simultaneously  
carry 30 A rms at 480 V rms for 15 minutes without becoming a fire hazard. A fire hazard  
is determined by mounting the arrestor on a vertical soft wood surface and covering the  
unit with cheesecloth. Any charring or burning of the cheesecloth results in test failure.  
During this test, although the arrestors may short, they must not have an impulse spark-  
overvoltage or DC breakdown voltage greater than 1500 V peak.  
Discharge Test — Protectors must comply with the strike voltage requirements after  
being subjected to five successive discharges from a 2 µF capacitor charged to  
1000 V dc. (Figure 4.9).  
Repeated Discharge Test The arrestor must continue to break down at or below its  
maximum rated breakdown voltage after being subjected to 500 discharges from a  
0.001 µF capacitor charged to a potential of 10,000 V dc. The interval between pulses is  
five seconds. Arrestors are to be tested in each polarity, and it is acceptable for the  
protector to short circuit following the discharge testing. (Figure 4.9)  
R1  
R2  
10 Ω  
5 W  
50,000 Ω  
25 W  
C1  
V
Test  
Specimen  
Variable DC Supply  
0-1000 V  
Figure 4.8 UL 497 Breakdown Voltage Measurement  
© 2002 Teccor Electronics  
4 - 25  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 497  
Variable  
DC Supply *  
0-12,000 V  
R2  
10  
5 W  
R1  
5 MΩ  
50 W  
Spot  
Switch  
C1  
V
Test  
Specimen  
*Or Voltage Capability Necessary to  
Develop 10,000 V Across Capacitor  
Figure 4.9 UL 497 Discharge Test  
http://www.teccor.com  
+1 972-580-7777  
4 - 26  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 497A  
UL 497A  
UL 497A addresses secondary protectors for use in single or multiple pair-type  
communication circuits intended to be installed in accordance with Article 800 of the  
National Electric Code and to have an operating voltage of less than 150 V rms with respect  
to Ground. The purpose of UL 497A is to help reduce the risk of fire, electric shock, or injury  
resulting from the deployment and use of these protectors. UL 497A requirements do not  
cover telephone equipment or key systems.  
UL 497A Construction, Risk of Injury, and Performance Requirements  
The “Construction” section covers the following requirements:  
General  
Product Assembly  
Enclosures  
Internal Material  
Accessibility and Electric Shock  
Protection Against Corrosion  
Cords  
Current-carrying Parts  
Internal Wiring  
Interconnecting Cords and Cables  
Insulating Material  
Printed Wiring  
Spacing  
The “Risk of Injury” section covers the following requirements:  
Modular Jacks  
Sharp Edges  
Stability  
Protection of Service Personnel  
The “Performance” section covers the following requirements:  
General  
Impulse Voltage Measurement  
Overvoltage Test  
Endurance Conditioning  
Component Temperature Test  
Drop Test  
Crush Test  
Leakage Current Test  
Dielectric Voltage-withstand Test  
Rain Test  
Maximum Moment Measurement Test  
Weather-o-meter and Micro Tensile Strength Test  
Thermal Aging and Flame Test  
Electric Shock Current Test  
Manufacturing and Production Line Test  
Marking, Installation, and Instructions  
© 2002 Teccor Electronics  
4 - 27  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 497A  
Performance Tests  
The following key performance tests relate to overvoltage protection of the secondary  
protectors:  
1. Impulse Voltage Measurement Test Secondary protectors must break down within  
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of  
voltage rise of 100 V/µs, ±10%. Note that the manufacturer may assign separate  
breakdown voltage ratings for the Breakdown Voltage Measurement Test. This  
requirement only applies to secondary protectors that connect between Tip and Ring of  
the telephone loop.  
2. Breakdown Voltage Measurement Test Secondary protectors must break down within  
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of  
voltage rise no greater than 2000 V/s. The secondary protector is to be mounted in  
accordance with the manufacturer’s installation instructions and then subjected to the  
test circuit shown in Figure 4.10. This requirement applies only to secondary protectors  
connected between Tip and Ring or Tip/Ring and Ground of the telephone loop.  
3. Overvoltage Test Secondary protectors must limit current and extinguish or open the  
telephone loop without loss of its overvoltage protector, indication of fire risk, or electric  
shock. Upon completion of this test, samples must comply with the Dielectric Voltage-  
withstand Test.  
The overvoltage test is used to determine the effects on secondary protectors and is shown  
in Table 4.18. Test connections are shown in Figure 4.11.  
Test Compliance  
Compliance with the overvoltage test is determined by meeting the following criteria:  
Cheesecloth indicator may not be either charred or ignited  
Wiring simulator (1.6 A Type MDQ fuse or 26 AWG line cord) may not be interrupted  
Protector meets the applicable dielectric voltage withstand requirements after the  
completion of the overvoltage tests  
Table 4.18 UL 497A Overvoltage Test  
Voltage  
Current  
(A)  
40  
Test  
L1  
(VRMS  
)
Time  
1.5 s  
5 s  
Connection  
600  
(Note 1, Figure 4.11)  
(Note 1, Figure 4.11)  
(Note 2, Figure 4.11)  
L2  
600  
7
L3  
600  
2.2, 1, 0.5, 0.25  
30 min at each  
current level  
L4  
200 V rms or just below  
the breakdown voltage of the  
overvoltage protection device  
2.2 A or just below the interrupt  
value of the current interrupting  
device  
30 min  
30 min  
(Note 2, Figure 4.11)  
(Note 1, Figure 4.11)  
L5  
240  
24  
Notes:  
1. Apply Tests L1, L2, and L5 between Tip and Ground or Ring and Ground.  
2. Apply Tests L3 and L4 simultaneously from both Tip and Ring to Ground.  
http://www.teccor.com  
+1 972-580-7777  
4 - 28  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 497A  
R1  
R2  
10 Ω  
5 W  
50,000 Ω  
25 W  
C1  
V
Test  
Specimen  
Variable DC Supply  
0-1000 V  
Figure 4.10 UL 497A Breakdown Voltage Measurement Test  
Circuit for Common Mode (Longitudinal)  
Overvoltage Tests  
Circuit for Differential Mode (Metallic)  
Overvoltage Tests  
Current  
Secondary Protector  
Simulator or  
Limiting  
Resistors  
Current  
Limiting  
Resistor  
Wiring Station  
Secondary Protector  
Simulator or  
Wiring Station  
Equipment  
Under Test  
Telecommunication  
Network Connection  
Points  
Equipment  
Under Test  
Timed  
Switch  
Timed  
Switch  
Variable  
Voltage  
Source  
Variable  
AC Voltage  
Source  
Equipment  
Ground  
Equipment  
Ground  
Equipment  
Ground  
Figure 4.11 UL 497A Overvoltage Test  
© 2002 Teccor Electronics  
4 - 29  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 497B  
UL 497B  
UL 497B provides requirements for protectors used in communication and fire alarm  
circuits. This standard does not cover devices for primary protection or protection devices  
used on telephone lines. SIDACtor devices are components recognized in accordance with  
UL 497B under UL file number E133083.  
Construction and Performance Requirements  
The “Construction” section covers the following requirements:  
General  
Corrosion Protection  
Field-wiring Connections  
Components  
Spacing  
Fuses  
The “Performance” section covers the following requirements:  
General  
Strike Voltage Breakdown  
Endurance Conditioning  
Temperature Test  
Dielectric Voltage-withstand Test  
Vibration Conditioning  
Jarring Test  
Discharge Test  
Repeated Discharge Test  
Polymeric Materials Test  
High Temperature Test  
Marking  
Performance Requirements Specific to SIDACtor Devices  
1. Strike Voltage Breakdown Test Protectors are required to break down within the  
manufacturer’s specified breakdown range or within 10% of a nominal single breakdown  
voltage rating. (Figure 4.12)  
2. Endurance Conditioning — Protectors are subjected to 50 impulse cycles. Each cycle is  
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second  
intervals and then repeated in the opposite polarity.  
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage  
requirements after being subjected to an ambient temperature of 0 °C for four hours and  
again after being subjected to an ambient temperature of 49 °C for an additional four  
hours.  
4. Discharge Test — Protectors must comply with strike voltage requirements after being  
subjected to five successive discharges from a 2 µF capacitor charged to 1000 V dc.  
(Figure 4.13)  
5. Repeated Discharge Test — Protectors must not break down at a voltage higher than the  
manufacturer’s maximum rated breakdown voltage nor lower than rated stand-off  
http://www.teccor.com  
+1 972-580-7777  
4 - 30  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 497B  
voltage after being subjected to 500 discharges from a 0.001 µF capacitor charged to  
10,000 V dc. The discharges are applied in five-second intervals between one side of the  
protector and Ground. Upon completion of the discharge tests, protectors are once again  
required to meet the strike voltage requirement. (Figure 4.13)  
Note: The epoxy used to construct a SIDACtor device body meets UL 94V-0 requirements  
for flammability.  
R1  
R2  
10 Ω  
5 W  
50,000 Ω  
25 W  
C1  
V
Test  
Specimen  
Variable DC Supply  
0-1000 V  
Figure 4.12 UL 497B Strike Voltage Breakdown Test  
Variable  
R2  
10 Ω  
5 W  
R1  
5 MΩ  
50 W  
DC Supply *  
Spot  
Switch  
0-12,000 V  
C1  
V
Test  
Specimen  
*Or Voltage Capability Necessary to  
Develop 10,000 V Across Capacitor  
Figure 4.13 UL 497B Discharge Test  
© 2002 Teccor Electronics  
4 - 31  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
UL 497C  
UL 497C  
UL 497C requirements cover protectors for use on coaxial cable circuits. This standard  
covers construction and performance requirements.  
UL 497C Construction and Performance Requirements  
The “Construction” section covers the following requirements:  
General  
Corrosion Protection  
Field-wiring Connections  
Components  
Spacing  
Enclosures  
The “Performance” section covers the following requirements:  
General  
I2t Limiting  
Abnormal Sustained Current  
Component Temperature Test  
Breakdown Voltage Measurement  
Impulse Spark-over Voltage Measurement  
Limited Short-circuit Test  
High Current Ground Path Test  
Cable Shield Fuse Test  
Endurance Conditioning Test  
Induced Low Current Test  
Distortion Test  
Flame Test  
Impact Test (Polymeric Enclosures)  
Jarring Test  
Water Spray Test  
Leakage Current Test  
Dielectric Voltage-withstand Test  
Ultraviolet Light and Water Exposure  
Tensile Strength and Elongation Tests  
Air Oven Aging  
Ozone Exposure  
Performance Requirements Specific to SIDACtor Devices  
1. Strike Voltage Breakdown Test Protectors are required to break down within ±25% of  
the manufacturer’s specified breakdown range but no higher than 750 V at ? 2 kV/s rise  
time.  
2. Endurance Conditioning — Protectors are subjected to 500 impulse cycles. Each cycle is  
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second  
intervals and then repeated in the opposite polarity. Then, 100 cycles of 1000 V peak,  
100 A, 10x1000 µs pulse are applied to three new protectors. Finally, two cycles of  
http://www.teccor.com  
+1 972-580-7777  
4 - 32  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
UL 497C  
1000 V peak, 5000 A, 8x20 µs pulse are applied to three new protectors, with a rest  
period of one minute between surges.  
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage  
requirements after being subjected to an ambient temperature of 25 °C for four hours  
and again after being subjected to an ambient temperature of 90 °C for an additional four  
hours.  
4. Discharge Test — Protectors must comply with strike voltage requirements after being  
subjected to a discharge of 1000 V, 100 ± 10 V/µs, 10 A impulse.  
© 2002 Teccor Electronics  
4 - 33  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Regulatory Compliant Solutions  
Regulatory Compliant Solutions  
When determining the most appropriate solution to meet the lightning and AC power fault  
conditions for regulatory requirements, coordination is essential between the SIDACtor  
device, fuse, and any series impedance that may be used.  
Figure 4.14 through Figure 4.19 show templates in which this coordination is considered for  
the most cost effective and reliable solutions available. For exact design criteria and  
information regarding the applicable regulatory requirements, refer to the SIDACtor device  
and fuse selection criteria in this Section 4, “Regulatory Requirements”, and in Section 5,  
Technical Notes”.  
GR 1089 and ITU-T K.20 and K.21  
Figure 4.14 and Figure 4.15 show line interface protection circuits to meet GR 1089 surge  
immunity requirements without the additional use of series resistance. Use the “C” series  
SIDACtor device and F1250T to meet GR 1089 surge immunity requirements. Use the  
“A” series SIDACtor device and F0500T to meet ITU-T K.20 and K.21 basic surge immunity  
requirements without the additional use of resistance.  
The enhanced surge immunity requirements of ITU K.20 and K.21 require the use of “C”  
rated SIDACtor devices if no series resistor is used.  
.
F1250T  
Tip  
To  
Protected  
Equipment  
Ring  
F1250T  
Figure 4.14 Balanced Line Protection using Teccor’s “AC” or “AA” series  
F1250T / F0500T  
Tip  
To  
Protected  
Equipment  
Ring  
Figure 4.15 Metallic-only Solution using Teccor’s “SC” or “SA” series.  
http://www.teccor.com  
+1 972-580-7777  
4 - 34  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Regulatory Compliant Solutions  
TIA-968 (formerly known as FCC Part 68) and UL 60950  
Because equipment that is tested to TIA-968 (formerly known as FCC Part 68)  
specifications is also generally tested to UL 60950 specifications, it is easiest to look at a  
solution that meets both FCC and UL requirements simultaneously.  
TIA-968 Operational Solution and UL 60950  
Figure 4.16 and Figure 4.17 show line interface protection circuits that meet UL 60950  
power cross requirements and pass TIA-968 Type A and Type B lightning immunity tests  
operationally.  
F1250T  
Tip  
To  
Protected  
Equipment  
Ring  
F1250T  
Figure 4.16 Balanced Line Protection using Teccor’s “AC” Series  
F1250T  
Tip  
To  
Protected  
Equipment  
Ring  
Figure 4.17 Metallic-only Solution using Teccor’s “SB” or “EB” Series  
TIA-968 Non-Operational Solution and UL 60950  
Although the circuits shown in Figure 4.16 and Figure 4.17 provide an operational solution  
for TIA-968, TIA-968 allows telecommunications equipment to pass Type A surges non-  
operationally as well. For non-operational TIA-968 solutions, coordinate the IPP rating of the  
SIDACtor device and the I2t rating of the fuse so that both will withstand the TIA-968 Type B  
surge, but that during the Type A surge the fuse will open.  
© 2002 Teccor Electronics  
4 - 35  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Regulatory Compliant Solutions  
Figure 4.18 and Figure 4.19 are line interface protection circuits that meet UL power cross  
requirements and pass TIA-968 lightning immunity surge A tests “non-operationally”.  
F0500T  
Tip  
To  
Protected  
Equipment  
Ring  
F1250T  
Figure 4.18 Balanced Line Protection using Teccor’s “AA” Series  
F0500T  
Tip  
To  
Protected  
Equipment  
Ring  
Figure 4.19 Metallic-only Solution using Teccor’s “SA” or “EA” Series  
http://www.teccor.com  
+1 972-580-7777  
4 - 36  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Surge Waveforms for Various Standards  
Surge Waveforms for Various Standards  
TIA-968 now replaces FCC Part 68, except for hearing aid compatibility (HAC), volume  
control, and indoor cabling. This has become harmonized with Canadian requirements.  
Various countries around the world have adopted this regulation.  
GR 1089 is a standard generally supported by the US Regional Bell Operating Companies  
(RBOC). It is updated by Telcordia Technology (formerly Bellcore). The RBOC typically  
requires compliance with GR 1089 for any of their telecom purchases.  
ITU is a specialized agency of the UN devoted to international harmonization. Most  
European countries recognize the ITU standards.  
CNET is the Centre National d’etudes de Telecommunications, a French organization.  
VDE is the Verband Deutsher Elektrotechniker, a Federation of German electrical  
engineers. VDE is very similar to the IEEE (Institute of Electrical and Electronics Engineers)  
but is national in scope rather than global.  
ANSI is the American National Standards Institute, which is a non-government organization.  
The British equivalent to this is BSI.  
IEC is the International Electrotechnical Commission, a result of Europe’s move toward a  
single market structure and its drive to formalize and harmonize member countries’  
requirements.  
FTZ R12 is a German specification.  
Table 4.19 and Table 4.20 show the recommended SIDACtor device surge rating for each  
standard.  
© 2002 Teccor Electronics  
4 - 37  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Surge Waveforms for Various Standards  
Table 4.19 Surge Waveforms for Various Standards  
Voltage  
Voltage  
Current  
SIDACtor  
Waveform  
Current  
Amps  
100  
Waveform  
Device  
Standard  
Volts  
µs  
10x560  
µs  
10x560  
w/o series R  
TIA-968 (formerly Surge A Metallic  
800  
B or C  
known  
as FCC Part 68)  
Surge A Longitudinal  
Surge B Metallic  
Surge B Longitudinal  
Test 1  
Test 2  
Test 3  
Test 4  
Test 5  
1500  
1000  
1500  
600  
10x160  
9x720  
9x720  
200  
25  
10x160  
5x320  
5x320  
10x1000  
10x360  
10x1000  
2x10  
10x360  
5x310  
0.2x310  
0.8x310  
5x310  
1x20  
C
A, B, or C  
A, B, or C  
C
B or C  
C
37.5  
100  
100  
100  
500  
25  
37.5  
38  
25  
50  
50  
50  
100  
50  
GR 1089  
10x1000  
10x360  
10x1000  
2x10  
10x360  
10x700  
0.5x700  
0.5x700  
10x700  
1.2x50  
10x700  
10x700  
10x700  
1000  
1000  
2500  
1000  
1500  
1500  
1000  
2000  
2000  
2 kV  
4 kV  
2000  
C
A, B, or C  
A, B, or C  
A, B, or C  
A, B, or C  
A, B, or C  
A, B, or C  
A, B, or C  
C
ITU K.17  
RLM 88, CNET  
CNET 131-24  
VDE 0433  
VDE 0878  
IEC 61000-4-5  
5x310  
8x20  
5x310  
FTZ R12  
A, B, or C  
Table 4.20 Surge Waveforms for Various Standards  
Voltage  
Voltage  
Current  
SIDACtor  
Waveform  
Current  
Waveform  
Device  
Volts  
Amps  
µs  
w/o series R  
Basic/  
Basic/  
Basic/  
Basic/  
Standard  
Basic single port  
Enhanced  
1 kV/4 kV  
1.5 kV/4 kV  
1.5 kV/4 kV  
1.5 kV/6 kV  
600  
600/1.5 kV  
1.5 kV/4 kV  
1.5 kV/6 kV  
1.5 kV/4 kV  
1.5 kV/6 kV  
600  
µs  
10x700  
10x700  
10x700  
Enhanced  
Enhanced  
Enhanced  
ITU K.20  
25/100  
37.5/100  
37.5/100  
37.5/100  
1
5x310  
5x310  
5x310  
5x310  
0.2 s  
0.2 s/2 s  
5x310  
5x310  
5x310  
5x310  
0.2 s  
A, B, C/B, C  
A, B, C/B, C  
A, B, C/B, C  
A, B, C/C  
F1250T  
Enhanced single  
Basic multiple ports  
Enhanced multiple  
Basic power cross  
Enhanced power cross  
Basic single port  
10x700  
50 Hz, 60 Hz  
50 Hz, 60 Hz  
10x700  
10x700  
10x700  
10x700  
50 Hz, 60Hz  
50 Hz, 60Hz  
1/7.5  
F1250T *  
ITU K.21  
37.5/100  
37.5/150  
37.5/100  
37.5/150  
1
A, B, C/B, C  
A, B, C/C  
A, B, C/B, C  
A, B, C/C  
F1250T  
Enhanced single  
Basic multiple ports  
Enhanced multiple  
Basic power cross  
Enhanced power cross  
600/1.5 kV  
1/7.5  
0.2 s/2 s  
F1250T *  
* At 7.5 A the F1250T will open, which is not allowed for enhanced requirements of ITU K.20 and K.21.  
http://www.teccor.com  
+1 972-580-7777  
4 - 38  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
5 Technical Notes  
This section is offered to help answer any questions not previously addressed in this data  
book regarding the SIDACtor device and its implementation.  
Construction and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3  
SIDACtor Device Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5  
Fuse Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8  
Overvoltage Protection Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10  
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14  
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18  
SIDACtor Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22  
TeleLink Fuse Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25  
Telecommunications Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26  
Lightning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27  
© 2002 Teccor Electronics  
5-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Construction and Operation  
Construction and Operation  
SIDACtor devices are thyristor devices used to protect sensitive circuits from electrical  
disturbances caused by lightning-induced surges, inductive-coupled spikes, and AC power  
cross conditions. The unique structure and characteristics of the thyristor are used to create  
an overvoltage protection device with precise and repeatable turn-on characteristics with  
low voltage overshoot and high surge current capabilities.  
Key Parameters  
Key parameters for SIDACtor devices are VDRM, IDRM, VS, IH, and VT, as shown in Figure 5.1.  
V
DRM is the repetitive peak off-state voltage rating of the device (also known as stand-off  
voltage) and is the continuous peak combination of AC and DC voltage that may be applied  
to the SIDACtor device in its off-state condition. IDRM is the maximum value of leakage  
current that results from the application of VDRM. Switching voltage (VS) is the maximum  
voltage that subsequent components may be subjected to during a fast-rising (100 V/µs)  
overvoltage condition. Holding current (IH) is the minimum current required to maintain the  
device in the on state. On-state voltage (VT) is the maximum voltage across the device  
during full conduction.  
+I  
IT  
IS  
IH  
IDRM  
-V  
+V  
VDRM  
VT  
VS  
-I  
Figure 5.1 V-I Characteristics  
Operation  
The SIDACtor device operates much like a switch. In the off state, the device exhibits  
leakage currents (IDRM) less than 5 µA, making it invisible to the circuit it is protecting. As a  
transient voltage exceeds the SIDACtor device’s VDRM, the device begins to enter its  
protective mode with characteristics similar to an avalanche diode. When supplied with  
enough current (IS), the SIDACtor device switches to an on state, shunting the surge from  
the circuit it is protecting. While in the on state, the SIDACtor device is able to sink large  
© 2002 Teccor Electronics  
5 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Construction and Operation  
amounts of current because of the low voltage drop (VT) across the device. Once the  
current flowing through the device is either interrupted or falls below a minimum holding  
current (IH), the SIDACtor resets, returning to its off state. If the IPP rating is exceeded, the  
SIDACtor device typically becomes a permanent short circuit.  
Physics  
The SIDACtor device is a semiconductor device which is characterized as having four  
layers of alternating conductivity: PNPN. (Figure 5.2) The four layers include an emitter  
layer, an upper base layer, a mid-region layer, and a lower base layer. The emitter is  
sometimes referred to as a cathode region, with the lower base layer being referred to as  
an anode region.  
As the voltage across the SIDACtor device increases and exceeds the device’s VDRM, the  
electric field across the center junction reaches a value sufficient to cause avalanche  
multiplication. As avalanche multiplication occurs, the impedance of the device begins to  
decrease, and current flow begins to increase until the SIDACtor device’s current gain  
exceeds unity. Once unity is exceeded, the SIDACtor device switches from a high  
impedance (measured at VS) to a low impedance (measured at VT) until the current flowing  
through the device is reduced below its holding current (IH).  
N
P
N
P
N
Figure 5.2 Geometric Structure of Bidirectional SIDACtor devices  
http://www.teccor.com  
+1 972-580-7777  
5 - 4  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
SIDACtor Device Selection Criteria  
SIDACtor Device Selection Criteria  
When selecting a SIDACtor device, the following criteria should be used:  
Off-state Voltage (VDRM  
)
The V  
of the SIDACtor device must be greater than the maximum operating voltage of  
DRM  
the circuit that the SIDACtor device is protecting.  
Example 1:  
For a POTS (Plain Old Telephone Service) application, convert the maximum operating  
Ring voltage (150 V rms) to a peak voltage, and add the maximum DC bias of the central  
office battery:  
150 VRMS 2 + 56.6 VPK = 268.8 VPK  
ꢃꢀVDRM > 268.8 V  
Example 2:  
For an ISDN application, add the maximum voltage of the DC power supply to the  
maximum voltage of the transmission signal (for U.S. applications, the U-interface will not  
have a DC voltage, but European ISDN applications may):  
150 VPK + 3 VPK = 153 VPK  
ꢃꢀVDRM > 153 V  
Switching Voltage (VS)  
The V of the SIDACtor device should be equal to or less than the instantaneous peak  
S
voltage rating of the component it is protecting.  
Example 1:  
VS ? VRelay Breakdown  
Example 2:  
VS ? SLIC VPK  
Peak Pulse Current (IPP)  
For circuits that do not require additional series resistance, the surge current rating (IPP) of  
the SIDACtor device should be greater than or equal to the surge currents associated with  
the lightning immunity tests of the applicable regulatory requirement (IPK):  
IPP O IPK  
For circuits that use additional series resistance, the surge current rating (IPP) of the  
SIDACtor device should be greater than or equal to the available surge currents associated  
with the lightning immunity tests of the applicable regulatory requirement (IPK(available)):  
IPP O IPK(available)  
© 2002 Teccor Electronics  
5 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Device Selection Criteria  
The maximum available surge current is calculated by dividing the peak surge voltage (VPK  
by the total circuit resistance (RTOTAL):  
)
IPK(available) = VPK/RTOTAL  
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and  
Ring:  
R
SOURCE = VPK/IPK  
RTOTAL = RTIP + RSOURCE  
RTOTAL = RRING + RSOURCE  
For metallic surges (Tip-Ring):  
RSOURCE = VPK/IPK  
RTOTAL = RTIP + RRING + RSOURCE  
Example 1:  
A modem manufacturer must pass the Type A surge requirement of TIA-968 (formerly  
known as FCC Part 68) without any series resistance.  
I
PK = 100 A, 10x560 µs  
IPP O 100 A, 10x560 µs  
Therefore, either a “B” rated or “C” rated SIDACtor device would be selected.  
Example 2:  
A line card manufacturer must pass the surge requirements of GR 1089 with 30 on Tip  
and 30 on Ring.  
I
PK = 100 A, 10x1000 µs  
PK = 1000 V  
SOURCE = VPK/IPK = 10 ꢂ  
V
R
RTOTAL = RSOURCE RTIP = 40 ꢂ  
+
IPK (available) = VPK/RTOTAL = 1000 V/40 ꢂ  
IPP O 25 A  
Holding Current (IH)  
Because TIA-968 4.4.1.7.3 specifies that registered terminal equipment not exceed  
140 mA dc per conductor under short-circuit conditions, the holding current of the SIDACtor  
device is set at 150 mA.  
For specific design criteria, the holding current (IH) of the SIDACtor device must be greater  
than the DC current that can be supplied during an operational and short circuit condition.  
http://www.teccor.com  
+1 972-580-7777  
5 - 6  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
SIDACtor Device Selection Criteria  
Off-State Capacitance (CO)  
Assuming that the critical point of insertion loss is 70% of the original signal value, the  
SIDACtor device can be used in most applications with transmission speeds up to 30 MHz.  
For transmission speeds greater than 30 MHz, the new MC series is highly recommended.  
© 2002 Teccor Electronics  
5 - 7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Fuse Selection Criteria  
Fuse Selection Criteria  
A fuse can be relied upon to operate safely at its rated current, at or below its rated voltage.  
This voltage rating is covered by the National Electric Code (NEC) regulations and is a  
requirement of UL as protection against fire risk. The standard voltage ratings used by fuse  
manufacturers for most small dimension fuses are 32 V, 63 V, 125 V, 250 V, and 600 V.  
Fuses are not sensitive to changes in voltage; however, they are sensitive to changes in  
current. The fuse will maintain “steady-state” operation from zero volts to the maximum  
voltage rating. It is not until the fuse element melts and internal arcing occurs, that circuit  
voltage and available power become an issue. The interrupt rating of the fuse addresses  
this issue. Specifically, the voltage rating determines the ability of the fuse to suppress  
internal arcing that occurs after the fuse link melts.  
For telecommunication applications, a voltage rating of 250 V is chosen because of the  
possibility of power line crosses. A three-phase voltage line will have voltage values up to  
220 V. It is desirable for the voltage rating of the fuse to exceed this possible power cross  
event.  
UL 60950 has a power cross test condition that requires a fuse to have an interrupt rating of  
40 A at 600 V. GR 1089 contains a power cross test condition that requires a fuse to have  
an interrupt rating of 60 A at 600 V. A 125 V-rated part will not meet this requirement.  
A 250 V part with special design consideration, such as Teccor’s F1250T TeleLink  
fuse, does meet this requirement.  
Because fuses are rated in terms of continuous voltage and current-carrying capacity, it is  
often difficult to translate this information in terms of peak pulse current ratings. To simplify  
this process, Table 5.1 shows the surge rating correlation to fuse rating.  
Table 5.1 Surge Rating Correlation to Fuse Rating  
Equivalent IPP Rating  
Fuse Rating  
(mA)  
10x160 µs  
(A)  
10x560 µs  
10x1000 µs  
(A)  
(A)  
250  
350  
400  
500  
600  
750  
1000  
1250  
30  
45  
50  
65  
75  
90  
130  
160  
15  
25  
30  
35  
45  
65  
85  
115  
10  
20  
25  
30  
35  
50  
65  
100  
Notes:  
The IPP ratings apply to a 2AG (glass body) slow blow fuse only.  
Because there is a high degree of variance in the fusing characteristics, the IPP ratings listed should only be used as approximations.  
http://www.teccor.com  
+1 972-580-7777  
5 - 8  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Fuse Selection Criteria  
Peak Pulse Current (IPP)  
For circuits that do not require additional series resistance, the surge current rating (I ) of  
PP  
the fuse should be greater than or equal to the surge currents associated with the lightning  
immunity tests of the applicable regulatory requirement (IPK):  
IPP O IPK  
For circuits that use additional series resistance, the surge current rating (IPP) of the fuse  
should be greater than or equal to the available surge currents associated with the lightning  
immunity tests of the applicable regulatory requirement (IPK(available)):  
IPP O IPK(available)  
The maximum available surge current is calculated by dividing the peak surge voltage (VPK  
by the total circuit resistance (RTOTAL):  
)
I
PK(available) = VPK/RTOTAL  
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and  
Ring:  
R
SOURCE = VPK/IPK  
RTOTAL = RTIP + RSOURCE  
RTOTAL = RRING + RSOURCE  
For metallic surges (Tip-Ring):  
R
SOURCE = VPK/IPK  
RTOTAL = RTIP + RRING + RSOURCE  
© 2002 Teccor Electronics  
5 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Overvoltage Protection Comparison  
Overvoltage Protection Comparison  
The four most commonly used technologies for overvoltage protection are:  
SIDACtor devices  
Gas Discharge Tubes (GDTs)  
Metal Oxide Varistors (MOVs)  
TVS diodes  
All four technologies are connected in parallel with the circuit being protected, and all exhibit  
a high off-state impedance when biased with a voltage less than their respective blocking  
voltages.  
SIDACtor devices  
A SIDACtor device is a PNPN device that can be thought of as a TVS diode with a gate.  
Upon exceeding its peak off-state voltage (VDRM), a SIDACtor device will clamp a transient  
voltage to within the device’s switching voltage (VS) rating. Then, once the current flowing  
through the SIDACtor device exceeds its switching current, the device will crowbar and  
simulate a short-circuit condition. When the current flowing through the SIDACtor device is  
less than the device’s holding current (IH), the SIDACtor device will reset and return to its  
high off-state impedance.  
Advantages  
Advantages of the SIDACtor device include its fast response time (Figure 5.3), stable  
electrical characteristics, long term reliability, and low capacitance. Also, because the  
SIDACtor device is a crowbar device, it cannot be damaged by voltage and it has extremely  
high surge current ratings.  
Restrictions  
Because the SIDACtor device is a crowbar device, it cannot be used directly across the  
AC line; it must be placed behind a load. Failing to do so will result in exceeding the  
SIDACtor device’s surge current rating, which may cause the device to enter a permanent  
short-circuit condition.  
Applications  
Although found in other applications, SIDACtor devices are primarily used as the principle  
overvoltage protector in telecommunications and data communications circuits. For  
applications outside this realm, follow the design criteria in "SIDACtor Device Selection  
Criteria" on page 5-5.  
Gas Discharge Tubes  
Gas tubes are either glass or ceramic packages filled with an inert gas and capped on each  
end with an electrode. When a transient voltage exceeds the DC breakdown rating of the  
device, the voltage differential causes the electrodes of the gas tube to fire, resulting in an  
arc, which in turn ionizes the gas within the tube and provides a low impedance path for the  
http://www.teccor.com  
+1 972-580-7777  
5 - 10  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Overvoltage Protection Comparison  
transient to follow. Once the transient drops below the DC holdover voltage and current, the  
gas tube returns to its off state.  
Advantages  
Gas tubes have high surge current and low capacitance ratings. Current ratings can be as  
high as 500 A for 200 impulses, and capacitance ratings can be as low as 1 pF with a zero-  
volt bias.  
Restrictions  
Gas tubes have a limited shelf life and their performance degrades with usage. Out of the  
four devices discussed, gas tubes exhibit the slowest response time and highest peak  
voltage measurement. (Figure 5.3)  
Applications  
Because gas tubes are large and require a substantial amount of time to reach full  
conduction, they are rarely used as board-level components. Consequently, gas tubes are  
not normally used in telecommunications applications other than station protection  
modules.  
Metal Oxide Varistors  
Metal Oxide Varistors (MOVs) are two-leaded, through-hole components typically shaped in  
the form of discs. Manufactured from sintered oxides and schematically equivalent to two  
back-to-back PN junctions, MOVs shunt transients by decreasing their resistance as  
voltage is applied.  
Advantages  
Since MOVs surge capabilities are determined by their physical dimensions, high surge  
current ratings are available. Also, because MOVs are clamping devices, they can be used  
as transient protectors in secondary AC power line applications.  
Restrictions  
Like gas tubes, MOVs have slow response times resulting in peak clamping voltages which  
can be greater than twice the device’s voltage rating. (Figure 5.3) MOVs also have long-  
term reliability and performance issues due to their tendency to fatigue, high capacitance,  
and limited packaging options.  
Applications  
Although MOVs are restricted from use in many telecom applications (other than disposable  
equipment), they are useful in AC applications where a clamping device is required and  
tight voltage tolerances are not.  
© 2002 Teccor Electronics  
5 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Overvoltage Protection Comparison  
TVS Diodes  
Transient Voltage Suppressor (TVS) diodes are clamping voltage suppressors that are  
constructed with back-to-back PN junctions. During conduction, TVS diodes create a low  
impedance path by varying their resistance as voltage is applied across their terminals.  
Once the voltage is removed, the diode will turn off and return to its high off-state  
impedance.  
Advantages  
Because TVS diodes are solid state devices, they do not fatigue nor do their electrical  
parameters change as long as they are operated within their specified limits. TVS diodes  
effectively clamp fast-rising transients and are well suited for low-voltage applications that  
do not require large amounts of energy to be shunted.  
Restrictions  
Because TVS diodes are clamping devices, they have two inherent weaknesses. First, TVS  
diodes are both voltage- and current-limited, so careful consideration should be given to  
using these in applications that require large amounts of energy to be shunted. Secondly,  
as the amount of current flowing through the device increases, so does its maximum  
clamping voltage.  
Applications  
Due to their low power ratings, TVS diodes are not used as primary interface protectors  
across Tip and Ring; they are used as secondary protectors that are embedded within a  
circuit.  
http://www.teccor.com  
+1 972-580-7777  
5 - 12  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Overvoltage Protection Comparison  
dv/dt Chart  
Figure 5.3 shows a peak voltage comparison between SIDACtor devices, gas discharge  
tubes, MOVs, and TVS diodes, all with a nominal stand-off voltage rating of 230 V. The  
X axis represents the dv/dt (rise in voltage with respect to time) applied to each protector,  
and the Y axis represents the maximum voltage drop across each protector.  
1000  
900  
800  
700  
600  
230 V Devices  
Gas Tube  
MOV  
500  
400  
300  
200  
Avalanche Diode  
SIDACtor  
100  
1000  
0.001  
0.01  
0.1  
1
10  
dv/dt – Volts/µs  
Figure 5.3 Overshoot Levels versus dv/dt  
© 2002 Teccor Electronics  
5 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Overcurrent Protection  
Overcurrent Protection  
In addition to protecting against overvoltage conditions, equipment should also be protected  
from overcurrent conditions using either PTCs, fuses, power/line feed resistors, or  
flameproof resistors. In all instances the overcurrent protector is a series element placed in  
front of the overvoltage protector on either Tip or Ring for metallic (closed loop)  
applications and on both Tip and Ring for longitudinal (grounded) applications.  
PTCs  
PTCs are positive temperature coefficient thermistors used to limit current. During a fault  
condition, heat is generated at a rate equal to I2R. When this heat becomes sufficient, the  
PTC increases its resistance asymptotically until the device simulates an open circuit,  
limiting the current flow to the rest of the circuit. As the fault condition drops below the  
PTC’s holding current, the device begins to reset, approximating its original off-state value  
of impedance.  
Advantages  
Because PTCs are resettable devices, they work well in a variety of industrial applications  
where electrical components cannot withstand multiple, low-current faults.  
Restrictions  
Although PTCs are well suited for the industrial environment and in many telecom  
applications, they exhibit some limitations that have prevented them from being endorsed  
by the entire telecommunications industry. Limitations include low surge current ratings,  
unstable resistance, and poor packaging options.  
Applications  
PTCs are used in a variety of applications. In addition to protecting telecommunications  
equipment, PTCs are also used to prevent damage to rechargeable battery packs, to  
interrupt the current flow during a motor lock condition, and to limit the sneak currents that  
may cause damage to a five-pin module.  
Fuses  
Due to their stability, fuses are one of the most popular solutions for meeting AC power  
cross requirements for telecommunications equipment. Similar to PTCs, fuses function by  
reacting to the heat generated due to excessive current flow. Once the fuses I2t rating is  
exceeded, the center conductor opens.  
Advantages  
Fuses are available in both surface mount and through-hole packages and are able to  
withstand the applicable regulatory requirements without the use of any additional series  
impedance. Chosen correctly, fuses only interrupt a circuit when extreme fault conditions  
exist and, when coordinated properly with an overvoltage protector, offer a very competitive  
and effective solution for transient immunity needs.  
http://www.teccor.com  
+1 972-580-7777  
5 - 14  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Overcurrent Protection  
Advantages include:  
Elimination of series line resistance enabling longer loop lengths  
Precise longitudinal balance allowing better transmission quality  
Robust surge performance which eliminates costly down time due to nuisance blows  
Greater surge ratings than resettable devices, ensuring regulatory compliance  
Non-degenerative performance  
Available in surface mount packaging which uses less Printed Circuit Board (PCB) real  
estate, eliminates mixed technologies, and reduces manufacturing costs  
Weaknesses  
Because a fuse does not reset, consideration should be given to its use in applications  
where multiple fault occurrences are likely. For example, AC strip protectors and ground  
fault interrupting circuits (GFIC) are applications in which an alternative solution might be  
more prudent.  
Applications  
Telecommunications equipment best suited for a fuse is equipment that requires surface  
mount technology, accurate longitudinal balance, and regulatory compliance without the  
use of additional series line impedance.  
Selection Criteria  
For circuits that do not require additional series resistance, the surge current rating (IPP) of  
the TeleLink SM fuse should be greater than or equal to the surge currents associated with  
the lightning immunity tests of the applicable regulatory requirement (IPK).  
IPP OꢀIPK  
For circuits that use additional series resistance, the surge current rating (IPP) of the  
TeleLink SM fuse should be greater than or equal to the available surge currents associated  
with the lightning immunity tests of the applicable regulatory requirement (IPK (available)).  
IPP OꢀIPK (available)  
The maximum available surge current is calculated by dividing the peak surge voltage (VPK  
by the total circuit resistance (RTOTAL).  
)
IPP OꢀIPK (available) = VPK/RTOTAL  
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and  
Ring.  
R
TOTAL = RTIP + RSOURCE  
RTOTAL = RRING + RSOURCE  
For metallic surges (Tip-Ring):  
R
TOTAL = RTIP + RRING + RSOURCE  
© 2002 Teccor Electronics  
5 - 15  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Overcurrent Protection  
To select the most appropriate combination of TeleLink SM fuse and SIDACtor device,  
decide the regulatory requirement your equipment must meet:  
Regulatory Requirement  
GR 1089  
TeleLink SM Fuse  
F1250T  
SIDACtor Device  
C Series  
B Series  
A Series  
A Series  
A Series  
All  
TIA-968, Type A  
TIA-968, Type B  
ITU K.20  
F1250T  
F0500T  
F1250T  
F1250T  
ITU K.21 Basic/Enhanced  
UL 60950  
All  
For applications that do not require agency approval or multiple listings, contact the factory.  
Power/Line Feed Resistors  
Typically manufactured with a ceramic case or substrate, power and line feed resistors  
have the ability to sink a great deal of energy and are capable of withstanding both lightning  
and power cross conditions.  
Advantages  
Power and line feed resistors are available with very tight resistive tolerances, making them  
appropriate for applications that require precise longitudinal balance.  
Restrictions  
Because power and line feed resistors are typically very large and are not available in a  
surface mount configuration, these devices are less than desirable from a manufacturing  
point of view. Also, because a thermal link is typically not provided, power and line feed  
resistors may require either a fuse or a PTC to act as the fusing element during a power  
cross condition.  
Applications  
Power and line feed resistors are typically found on line cards that use overvoltage  
protectors that cannot withstand the surge currents associated with applicable regulatory  
requirements.  
Flameproof Resistors  
For cost-sensitive designs, small (1/8 W - 1/4 W), flameproof metal film resistors are often  
used in lieu of PTCs, fuses, and power or line feed resistors. During a transient condition,  
flameproof resistors open when the resultant energy is great enough to melt the metal used  
in the device.  
Advantages  
Flameproof resistors are inexpensive and plentiful.  
http://www.teccor.com  
+1 972-580-7777  
5 - 16  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Overcurrent Protection  
Restrictions  
Flameproof resistors are not resistive to transient conditions and are susceptible to  
nuisance blows.  
Applications  
Outside of very inexpensive customer premise equipment, small resistors are rarely used  
as a means to protect telecommunications equipment during power fault conditions.  
© 2002 Teccor Electronics  
5 - 17  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
PCB Layout  
PCB Layout  
Because the interface portion of a Printed Circuit Board (PCB) is subjected to high voltages  
and surge currents, consideration should be given to the trace widths, trace separation, and  
grounding.  
Trace Widths  
Based on the Institute for Interconnecting and Packaging Electronic Currents, IPC D 275  
specifies the trace widths required for various current-carrying capacities. This is very  
important for grounding conditions to ensure the integrity of the trace during a surge event.  
The required width is dependent on the amount of copper used for the trace and the  
acceptable temperature rise which can be tolerated. Teccor recommends a 0.025 inch trace  
width with 1 ounce copper. (For example, a 38-AWG wire is approximately equal to 8 mils to  
10 mils. Therefore, the minimum trace width should be greater than 10 mils.)  
Allowable  
75 ˚C  
60 ˚C Temperature  
45 ˚C  
30 ˚C  
20 ˚C  
35  
30  
25  
Rise  
20  
15  
10 ˚C  
12  
10  
8
7
6
5
4
3
2
1.5  
1
.75  
.50  
.25  
.125  
0
30  
200  
250 300  
0
10 20  
600 700  
500  
1
5
50  
150  
70 100  
400  
Conductor Cross-Section Area (sq mils)  
Figure 5.4 Current versus Area  
The minimum width and thickness of conductors on a PCB is determined primarily by the  
current-carrying capacity required. This current-carrying capacity is limited by the allowable  
temperature rise of the etched copper conductor. An adjacent ground or power layer can  
significantly reduce this temperature rise. A single ground plane can generally raise the  
allowed current by 50%. An easy approximation can be generated by starting with the  
information in Figure 5.4 to calculate the conductor cross-sectional area required. Once this  
http://www.teccor.com  
+1 972-580-7777  
5 - 18  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
PCB Layout  
has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required  
conductor width, dependent on the copper foil thickness of the trace.  
0
.001  
.005  
.010  
.020  
.030  
.050  
.070  
.100  
.150  
.200  
.250  
.300  
.350  
0
1
5
10  
20 30 50 70 100 150 200 250 300 400  
Conductor Cross-Section Area (sq mils)  
500 600 700  
Figure 5.5 Conductor Width versus Area  
Trace Separation  
Tip and Ring traces are subjected to various transient and overvoltage conditions. To  
prevent arcing between traces, minimum trace separation should be maintained. UL 60950  
will provide additional information regarding creepage and clearance requirements, which  
are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage,  
and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd  
edition)" on page 4-16 of this data book.  
A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation.  
Route the Tip and Ring traces towards the edge of the PCB away from areas containing  
static sensitive devices.  
Grounding  
Although often overlooked, grounding is a very important design consideration when laying  
out a protection interface circuit. To optimize its effectiveness, several things should be  
considered in sequence:  
1. Provide a large copper plane with a grid pattern for the Ground reference point.  
2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point  
(also called centralized) grounding scheme is used for circuit dimensions smaller than  
one-tenth of a wavelength (= 300,000/frequency) and a multi-point (distributed)  
grounding scheme is used for circuit trace lengths greater than one-fourth of a  
wavelength.  
© 2002 Teccor Electronics  
5 - 19  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
PCB Layout  
3. Because traces exhibit a certain level of inductance, keep the length of the ground trace  
on the PCB as short as possible in order to minimize its voltage contribution during a  
transient condition. In order to determine the actual voltage contributed to trace  
inductance, use the following equations:  
V = L (di/dt)  
L = 0.0051 ꢅꢀ[loge 2 /(t+w) +½ - logeG] in µH  
where ꢅꢀ= length of trace  
G = function of thickness and width as provided in Table 5.3  
t = trace thickness  
w = trace width  
For example, assume circuit A is protected by a P3100SC with a VS equal to 300 V and a  
ground trace one inch in length and a self-inductance equal to 2.4 µH/inch. Assume  
circuit B has the identical characteristics as Circuit A, except the ground trace is five inches  
in length instead of one inch in length. If both circuits are surged with a 100 A, 10x1000 µs  
wave-form, the results would be as shown in Table 5.2:  
Table 5.2 Overshoot Caused by Trace Inductance  
Total protection level  
VL = L (di/dt)  
VL = 2.4 µH (100 A/10 µs) = 24 V  
VL = 12 µH (100 A/10 µs) = 120 V  
SIDACtor device VS  
(VL + VS)  
324 V  
420 V  
Circuit A  
Circuit B  
300 V  
300 V  
Other practices to ensure sound grounding techniques are:  
1. Cross signal grounds and earth grounds perpendicularly in order to minimize the field  
effects of “noisy” power supplies.  
2. Make sure that the ground fingers on any edge connector extend farther out than any  
power or signal leads in order to guarantee that the ground connection invariably is  
connected first.  
http://www.teccor.com  
+1 972-580-7777  
5 - 20  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
PCB Layout  
Table 5.3 Values of Constants for the Geometric Mean Distance of a Rectangle  
t/w or w/t  
0.000  
0.025  
0.050  
0.100  
0.150  
0.200  
0.250  
0.300  
0.350  
0.400  
0.450  
0.500  
0.500  
0.550  
0.600  
0.650  
0.700  
0.750  
0.800  
0.850  
0.900  
0.950  
1.000  
0.000  
K
LogeG  
0.0  
0.22313  
0.22333  
0.22346  
0.22360  
0.22366  
0.22369  
0.22369  
0.22368  
0.22366  
0.22364  
0.22362  
0.22360  
0.22360  
0.22358  
0.22357  
0.22356  
0.22355  
0.22354  
0.22353  
0.22353  
0.22353  
0.223525  
0.223525  
0.0  
0.00089  
0.00146  
0.00210  
0.00239  
0.00249  
0.00249  
0.00244  
0.00236  
0.00228  
0.00219  
0.00211  
0.00211  
0.00203  
0.00197  
0.00192  
0.00187  
0.00184  
0.00181  
0.00179  
0.00178  
0.00177  
0.00177  
0.0  
Note: Sides of the rectangle are t and w. The geometric mean distance R is given by:  
logeR = loge(t+w) - 1.5 + logeG. R = K(t+w), logeK = -1.5 + logeG.  
© 2002 Teccor Electronics  
5 - 21  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Soldering Recommendations  
SIDACtor Soldering Recommendations  
When placing surface mount components, a good solder bond is critical because:  
The solder provides a thermal path in which heat is dissipated from the packaged silicon  
to the rest of the board.  
A good bond is less subject to thermal fatiguing and results in improved component  
reliability.  
Reflow Soldering  
The preferred technique for mounting the DO-214AA package is to reflow-solder the device  
onto a PCB-printed circuit board, as shown in Figure 5.6.  
1. Screen print solder paste  
(or flux)  
2. Place component  
(allow flux to dry)  
3. Reflow solder  
Figure 5.6 Reflow Soldering Procedure  
For reliable connections, the PCB should first be screen printed with a solder paste or  
fluxed with an easily removable, reliable solution, such as Alpha 5003 diluted with benzyl  
alcohol. If using a flux, the PCB should be allowed to dry to touch at room temperature (or in  
a 70 °C oven) prior to placing the components on the solder pads.  
Relying on the adhesive nature of the solder paste or flux to prevent the devices from  
moving prior to reflow, components should be placed with either a vacuum pencil or  
automated pick and place machine.  
With the components in place, the PCB should be heated to a point where the solder on the  
pads begins to flow. This is typically done on a conveyor belt which first transports the PCB  
through a pre-heating zone. The pre-heating zone is necessary in order to reduce thermal  
shock and prevent damage to the devices being soldered, and should be limited to a  
maximum temperature of 165 °C for 10 seconds.  
After pre-heating, the PCB goes to a vapor zone, as shown in Figure 5.7. The vapor zone is  
obtained by heating an inactive fluid to its boiling point while using a vapor lock to regulate  
the chamber temperature. This temperature is typically 215 °C, but for temperatures in  
excess of 215 °C, care should be taken so that the maximum temperature of the leads does  
http://www.teccor.com  
+1 972-580-7777  
5 - 22  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
SIDACtor Soldering Recommendations  
not exceed 275 °C and the maximum temperature of the plastic body does not exceed  
250 °C. (Figure 5.8)  
Transport  
Vapor lock  
(secondary  
medium)  
Cooling pipes  
PC board  
Vapor phase  
zone  
Heating  
elements  
Boiling liquid (primary medium)  
Figure 5.7 Principle of Vapor Phase Soldering  
Pre-heat  
Soak  
Reflow  
Cool  
Down  
260  
240  
220  
Peak Temperature  
220 C - 245  
C
˚
˚
200  
180  
160  
140  
120  
100  
80  
1.3 - 1.6 C/s  
˚
<2.5 C/s  
˚
0.5 - 0.6 C/s  
˚
Soaking Zone  
Reflow Zone  
60 - 90 s typical  
( 2 min. MAX )  
30 - 60 s typical  
( 2 min. MAX )  
<2.5 C/s  
˚
Pre-heating Zone  
( 2-4 min MAX )  
60  
40  
20  
0
0
30  
60  
90  
120  
150  
180  
210  
240  
270  
300  
Time (Seconds)  
Figure 5.8 Reflow Soldering Profile  
During reflow, the surface tension of the liquid solder draws the leads of the device towards  
the center of the soldering area, correcting any misalignment that may have occurred  
during placement and allowing the device to set flush on the pad. If the footprints of the pad  
are not concentrically aligned, the same effect can result in undesirable shifts as well.  
Therefore, it is important to use a standard contact pattern which leaves sufficient room for  
self-positioning.  
After the solder cools, connections should be visually inspected and remnants of the flux  
removed using a vapor degreaser with an azeotrope solvent or equivalent.  
© 2002 Teccor Electronics  
5 - 23  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
SIDACtor Soldering Recommendations  
Wave Soldering  
Another common method for soldering components to a PCB is wave soldering. After  
fluxing the PCB, an adhesive is applied to the respective footprints so that components can  
be glued in place. Once the adhesive has cured, the board is pre-heated and then placed in  
contact with a molten wave of solder which has a temperature between 240 °C and 260 °C  
and permanently affixes the component to the PCB. (Figure 5.8 and Figure 5.10)  
Although a popular method of soldering, wave soldering does have drawbacks:  
A double pass is often required to remove excess solder.  
Solder bridging and shadows begin to occur as board density increases.  
Wave soldering uses the sharpest thermal gradient.  
Apply glue  
Place component  
Cure glue  
Wave solder  
Screen print glue  
Figure 5.9 Wave Soldering Surface Mount Components Only  
PC board  
Insert  
leaded  
components  
Turn over the  
PC board  
Apply  
glue  
Place  
SMDs  
Cure  
glue  
Turn over the  
PC board  
Wave solder  
Figure 5.10 Wave Soldering Surface Mount and Leaded Components  
http://www.teccor.com  
+1 972-580-7777  
5 - 24  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
TeleLink Fuse Soldering  
TeleLink Fuse Soldering  
For wave soldering a TeleLink fuse, the following temperature and time are recommended:  
Reservoir temperature of 260 °C (500 °F)  
Time in reservoir — three seconds maximum  
For infrared, the following temperature and time are recommended:  
Temperature of 240 °C (464 °F)  
Time — 30 seconds maximum  
Hand soldering is not recommended for this fuse because excessive heat can affect the  
fuse performance. Hand soldering should be used only for rework and low volume samples.  
Note the following recommendations for hand soldering:  
Maximum tip temperature of 240 °C (464 °F)  
Minimize the soldering time at temperature to achieve the solder joint. Measure the fuse  
resistance before and after soldering. Any fuse that shifts more than ±3% should be  
replaced. An increase in resistance above this amount increases the possibility of a  
surge failure, and a decrease in resistance may cause low overloads to exceed the  
maximum opening times.  
Inspect the solder joint to ensure an adequate solder fillet has been produced without  
any cracks or visible defects.  
© 2002 Teccor Electronics  
5 - 25  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Telecommunications Protection  
Telecommunications Protection  
Because early telecommunications equipment was constructed with components such as  
mechanical relays, coils, and vacuum tubes, it was somewhat immune to lightning and  
power cross conditions. But as cross bar and step-by-step switches have given way to more  
modern equipment such as digital loop carriers, repeater amplifiers, and multiplexers, an  
emphasis has been put on protecting this equipment against system transients caused by  
lightning and power cross conditions.  
Lightning  
During an electrical storm, transient voltages are induced onto the telecommunications  
system by lightning currents which enter the conductive shield of suspended cable or  
through buried cables via ground currents.  
As this occurs, the current traveling through the conductive shield of the cable produces an  
equal voltage on both the Tip and Ring conductors at the terminating ends. Known as a  
longitudinal voltage surge, the peak value and wave-form associated with this condition is  
dependent upon the distance the transient travels down the cable and the materials with  
which the cable is constructed.  
Although lightning-induced surges are always longitudinal in nature, imbalances resulting  
from terminating equipment and asymmetric operation of primary protectors can result in  
metallic transients as well. A Tip-to-Ring surge is normally seen in terminating equipment  
and is the primary reason most regulatory agencies require telecom equipment to have  
both longitudinal and metallic surge protection.  
Power Cross  
Another system transient that is a common occurrence for telecommunications cables is  
exposure to the AC power system. The common use of poles, trenches, and ground wires  
results in varying levels of exposure which can be categorized as direct power cross, power  
induction, and ground potential rise.  
Direct power cross occurs when a power line makes direct contact to telecommunications  
cables. Direct contact is commonly caused by falling trees, winter icing, severe  
thunderstorms, and vehicle accidents. Direct power cross can result in large currents being  
present on the line.  
Power induction is common where power cables and telecommunications cables are run in  
close proximity to one another. Electromagnetic coupling between the cables results in  
system transients being induced onto the telecommunications cables, which in turn can  
cause excessive heating and fires in terminal equipment located at the cable ends.  
Ground potential rise is a result of large fault currents flowing to Ground. Due to the varying  
soil resistivity and multiple grounding points, system potential differences may result.  
http://www.teccor.com  
+1 972-580-7777  
5 - 26  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Lightning  
Lightning  
Lightning is one of nature’s most common and dangerous phenomena. At any one time,  
approximately 2,000 thunderstorms are in progress around the globe, with lightning striking  
the earth over 100 times per second. According to IEEE C.62, during a single year in the  
United States lightning strikes an average of 52 times per square mile, resulting in 100  
deaths, 250 injuries, and over 100 million dollars in damage to equipment property.  
The Lightning Phenomenon  
Lightning is caused by the complex interaction of rain, ice, up drafts, and down drafts that  
occur during a typical thunderstorm. The movement of rain droplets and ice within the cloud  
results in a large build up of electrical charges at the top and bottom of the thunder cloud.  
Normally, positive charges are concentrated at the top of the thunderhead while negative  
charges accumulate near the bottom. Lightning itself does not occur until the potential  
difference between two charges is great enough to overcome the insulating resistance of air  
between them.  
Formation of Lightning  
Cloud-to-ground lightning begins forming as the level of negative charge contained in the  
lower cloud levels begins to increase and attract the positive charge located at Ground.  
When the formation of negative charge reaches its peak level, a surge of electrons called a  
stepped leader begins to head towards the earth. Moving in 50-meter increments, the  
stepped leader initiates the electrical path (channel) for the lightning strike. As the stepped  
leader moves closer to the ground, the mutual attraction between positive and negative  
charges results in a positive stream of electrons being pulled up from the ground to the  
stepped leader. The positively charged stream is known as a streamer. When the streamer  
and stepped leader make contact, it completes the electrical circuit between the cloud and  
ground. At that instant, an explosive flow of electrons travels to ground at half the speed of  
light and completes the formation of the lightning bolt.  
Lightning Bolt  
The initial flash of a lightning bolt results when the stepped leader and the streamer make  
connection resulting in the conduction of current to Ground. Subsequent strokes (3-4) occur  
as large amounts of negative charge move farther up the stepped leader. Known as return  
strokes, these subsequent bolts heat the air to temperatures in excess of 50,000 °F and  
cause the flickering flash that is associated with lightning. The total duration of most  
lightning bolts lasts between 500 ms and one second.  
During a lightning strike, the associated voltages range from 20,000 V to 1,000,000 V while  
currents average around 35,000 A. However, maximum currents associated with lightning  
have been measured as high as 300,000 A.  
© 2002 Teccor Electronics  
5 - 27  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
NOTES  
6 Mechanical Data  
The following section describes the mechanical specifications of SIDACtor products.  
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3  
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3  
Modified DO-214AA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4  
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5  
MS-013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6  
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7  
TO-218 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8  
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9  
Single In-line Protector (SIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10  
Summary of Packing Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12  
Packing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14  
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14  
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15  
Modified MS-013 Six-pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16  
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17  
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18  
Lead Form Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20  
Modified TO-220 Type 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20  
Modified TO-220 Type 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21  
Modified TO-220 Type 62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21  
© 2002 Teccor Electronics  
6-1  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Package Dimensions  
Package Dimensions  
DO-214AA  
The DO-214AA package is designed to meet mechanical standards as set forth in JEDEC  
publication number 95.  
CASE  
TEMPERATURE  
MEASUREMENT  
B
D
POINT  
A
C
H
F
L
E
J
K
G
.079  
(2.0)  
.110  
(2.8)  
.079  
(2.0)  
PAD OUTLINE  
(MM)  
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.  
Inches Millimeters  
Dimension  
MIN  
MAX  
0.155  
0.220  
0.083  
0.180  
0.056  
0.083  
0.008  
0.086  
0.053  
0.012  
0.049  
MIN  
3.56  
5.21  
1.96  
4.22  
0.91  
1.85  
0.10  
1.95  
1.09  
0.20  
0.99  
MAX  
3.94  
5.59  
2.11  
4.57  
1.42  
2.11  
0.20  
2.18  
1.35  
0.30  
1.24  
A
B
C
D
E
F
G
H
J
0.140  
0.205  
0.077  
0.166  
0.036  
0.073  
0.004  
0.077  
0.043  
0.008  
0.039  
K
L
Notes:  
Dimensions and tolerances per ASME Y14.5M-1994  
Mold flash shall not exceed 0.13 mm per side.  
Dimensions B and C apply to plated leads.  
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one  
minute from leads to case over the operating temperature range)  
Dimension “C” is measured on the flat section of the lead.  
© 2002 Teccor Electronics  
6 - 3  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Package Dimensions  
Modified DO-214AA  
The Modified DO-214AA package is a three-leaded surface mount (SM) package.  
TEMPERATURE  
MEASUREMENT  
POINT  
PIN 3  
P
B
D
M
N
A
C
PIN 1  
PIN 2  
H
F
L
E
J
K
G
.079  
(2.0)  
.079  
(2.0)  
.079  
(2.0)  
.040  
(1.0)  
.110  
(2.8)  
.030  
(.76)  
PAD OUTLINE  
(MM)  
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.  
Inches Millimeters  
Dimension  
MIN  
MAX  
0.155  
0.220  
0.083  
0.180  
0.056  
0.083  
0.008  
0.086  
0.053  
0.012  
0.049  
0.028  
0.033  
0.058  
MIN  
3.56  
5.21  
1.96  
4.22  
0.91  
1.85  
0.10  
1.95  
1.09  
0.20  
0.99  
0.56  
0.69  
1.32  
MAX  
3.94  
5.59  
2.11  
4.57  
1.42  
2.11  
0.20  
2.18  
1.35  
0.30  
1.24  
0.71  
0.84  
1.47  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.140  
0.205  
0.077  
0.166  
0.036  
0.073  
0.004  
0.077  
0.043  
0.008  
0.039  
0.022  
0.027  
0.052  
Notes:  
Dimensions and tolerancing per ASME Y14.5M-1994  
Mold flash shall not exceed 0.13 mm per side.  
Dimensions B and C apply to plated leads.  
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one  
minute from leads to case over the operating temperature range)  
http://www.teccor.com  
+1 972-580-7777  
6 - 4  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Package Dimensions  
TO-92  
The TO-92 is designed to meet mechanical standards as set forth in JEDEC publication  
number 95.  
TEMPERATURE  
MEASUREMENT POINT  
A
N
B
MT1/PIN 1  
MT2/PIN 3  
E
G
H
M
F
L
D
K
J
Inches  
Millimeters  
Dimension  
MIN  
MAX  
0.196  
MIN  
4.47  
12.70  
2.41  
3.81  
1.16  
3.43  
2.23  
4.47  
2.23  
0.33  
0.33  
MAX  
4.98  
A
B
D
E
F
G
H
J
K
L
M
N
0.176  
0.500  
0.095  
0.150  
0.046  
0.135  
0.088  
0.176  
0.088  
0.013  
0.013  
0.105  
2.67  
0.054  
0.145  
0.096  
0.186  
0.096  
0.019  
0.017  
0.060  
1.37  
3.68  
2.44  
4.73  
2.44  
0.48  
0.43  
1.52  
Notes:  
Type 70 lead form as shown is standard for the E package.  
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one  
minute from leads to case over the operating temperature range)  
Mold flash shall not exceed 0.13 mm per side.  
© 2002 Teccor Electronics  
6 - 5  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Package Dimensions  
MS-013  
The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication  
number 95.  
[.065]  
1.65  
J
K
PAD OUTLINE  
[.460]  
11.68  
E
X
[.138]  
3.50  
W
[.059]  
1.50  
BURR SIDE  
4 ˚  
96 ˚  
FH  
1
R
F
7 ˚ TYP  
G
P
7 ˚ TYP  
MIN LENGTH  
OF FLAT  
U
0.08  
A
B
DETAIL A  
SCALE 20:1  
M
L
N
T
A
MOLD SPLIT LINE  
D
A
7 ˚ TYP  
7 ˚ TYP  
C
Inches  
Millimeters  
Dimension  
MIN  
MAX  
MIN  
9.14  
8.84  
8.94  
3.51  
10.16  
MAX  
A
B
C
D
E
F
G
H
J
0.360  
0.348  
0.352  
0.138  
0.400  
0.364  
0.352  
0.356  
0.138  
0.412  
0.051  
0.043  
0.051  
0.118  
0.089  
0.293  
0.293  
0.093  
0.045  
0.036  
0.008  
0.036  
9.25  
8.94  
9.04  
3.51  
10.46  
1.30  
1.09  
1.30  
3.00  
2.26  
7.44  
7.44  
2.36  
1.14  
0.91  
0.20  
0.91  
K
L
0.293  
0.289  
0.089  
0.045  
0.034  
0.008  
0.036  
0.020  
0.010  
0.023  
0.30  
7.34  
2.26  
1.14  
0.86  
0.20  
0.91  
0.51  
0.25  
0.58  
M
N
P
R
S
T
U
W
X
0.010  
0.023  
0.25  
0.58  
Notes:  
Dimensions and tolerances per ASME Y14.5M-1982  
Mold flash shall not exceed 0.13 mm per side.  
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one  
minute from leads to case over the operating temperature range)  
http://www.teccor.com  
+1 972-580-7777  
6 - 6  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Package Dimensions  
Modified TO-220  
The Modified TO-220 package is designed to meet mechanical standards as set forth in  
JEDEC publication number 95.  
A
O
D
G
TEMPERATURE  
MEASUREMENT  
POINT  
F
P
PIN 3  
PIN 2  
PIN 1  
L
M
K
H
N
J
Inches  
Millimeters  
Dimension  
MIN  
MAX  
0.410  
0.375  
0.130  
0.575  
0.035  
0.205  
0.105  
0.085  
0.085  
0.024  
0.188  
0.310  
MIN  
MAX  
10.42  
9.53  
3.30  
14.61  
0.89  
5.21  
2.67  
2.16  
2.16  
0.61  
4.78  
7.87  
A
D
F
G
H
J
K
L
M
N
O
P
0.400  
0.360  
0.110  
0.540  
0.025  
0.195  
0.095  
0.075  
0.070  
0.018  
0.178  
0.290  
10.16  
9.14  
2.80  
13.71  
0.63  
4.95  
2.41  
1.90  
1.78  
0.46  
4.52  
7.37  
Notes:  
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one  
minute from leads to case over the operating temperature range)  
Mold flash shall not exceed 0.13 mm per side.  
© 2002 Teccor Electronics  
6 - 7  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Package Dimensions  
TO-218  
The TO-218 package is designed to meet mechanical standards as set forth in JEDEC  
publication number 95.  
T
C Measurement Point  
U DIA.  
Tab is  
C
B
D
connected to  
PIN 2  
A
F
E
W
PIN 3  
J
P
PIN 1  
H
M
Q
PIN 2  
R
G
N 3 Times  
Note: Maximum torque  
to be applied to mounting  
tab is 8 in-lbs. (0.904 Nm).  
K
L
Inches  
Millimeters  
Dimension  
MIN  
MAX  
MIN  
20.57  
15.49  
4.52  
1.40  
12.37  
16.13  
0.56  
1.91  
14.61  
5.36  
10.72  
2.54  
1.14  
2.41  
0.20  
0.97  
0.64  
4.04  
2.29  
MAX  
21.21  
16.00  
4.78  
1.78  
12.62  
16.64  
0.74  
2.41  
15.88  
5.56  
11.10  
2.79  
1.40  
2.92  
0.41  
1.22  
0.81  
4.14  
2.54  
A
B
C
D
E
F
G
H
J
0.810  
0.610  
0.178  
0.055  
0.487  
0.635  
0.022  
0.075  
0.575  
0.211  
0.422  
0.100  
0.045  
0.095  
0.008  
0.038  
0.025  
0.159  
0.090  
0.835  
0.630  
0.188  
0.070  
0.497  
0.655  
0.029  
0.095  
0.625  
0.219  
0.437  
0.110  
0.055  
0.115  
0.016  
0.048  
0.032  
0.163  
0.100  
K
L
M
N
P
R
S
T
U
V
Notes:  
Mold flash shall not exceed 0.13 mm per side.  
Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm).  
Pin 3 has no connection.  
Tab is non-isolated (connects to middle pin).  
http://www.teccor.com  
+1 972-580-7777  
6 - 8  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Package Dimensions  
TeleLink Surface Mount Fuse  
The following illustration shows the end view dimensions of a TeleLink fuse:  
.109 .006  
(2.77 0.15)  
.109 .006  
(2.77 0.15)  
Dimensions are in inches  
(and millimeters)  
The following illustration shows the top view or side view dimensions of a TeleLink fuse:  
.055 .010  
.055 .010  
(1.40 0.25)  
(1.40 0.25)  
.109 .006  
(2.77 0.15)  
.405 .008  
(10.29 0.20)  
Dimensions are in inches  
(and millimeters)  
The following illustration shows the footprint dimensions of a TeleLink fuse:  
.204  
(5.2)  
.145  
3.7  
.157  
(4.0)  
.496  
(12.6)  
Dimensions are in inches  
(and millimeters)  
© 2002 Teccor Electronics  
6 - 9  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Package Dimensions  
Single In-line Protector (SIP)  
The following illustration shows a balanced three-chip SIP protector:  
0.040 0.004  
(1.016 0.102)  
0.450 +0.010 / -0.002  
(11.430 +0.254 -0.051)  
0.010  
(0.025)  
2.250 +0.010 / -0.002  
(57.150 +0.254 -0.051)  
typ  
0.260  
(6.604)  
max  
0.500 (12.70) max  
Dimensions are in  
inches (millimeters).  
0.110 0.010  
(2.794 0.254)  
0.100 0.010 non-cumulative  
(2.540 0.254)  
The following illustration shows a longitudinal two-chip SIP protector:  
0.040 0.004  
(1.016 0.102)  
0.450 +0.010 / -0.002  
(11.430 +0.254 -0.051)  
0.010  
(0.025)  
2.250 +0.010 / -0.002  
(57.150 +0.254 -0.051)  
typ  
0.260  
(6.604)  
max  
0.500 (12.70) max  
Dimensions are in  
inches (millimeters).  
0.075 0.010  
0.020 (0.508) typ  
(1.905 0.254)  
0.110 0.010  
(2.794 0.254)  
0.100 0.010 non-cumulative  
(2.540 0.254)  
http://www.teccor.com  
+1 972-580-7777  
6 - 10  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Package Dimensions  
The following illustration shows a four-port metallic line SIP protector:  
0.040 0.004  
(1.02 0.10)  
Front  
0.500  
(12.70)  
0.450 +0.010 / -0.002  
(11.43 +0.25 / -0.05)  
max  
Front  
typ  
Back  
0.010  
(0.025)  
1.300 +0.010 / -0.002  
(33.02 +0.25 / -0/05)  
0.120 0.015  
(3.05 0.38)  
Back  
0.260  
(6.60)  
max  
Dimensions are in  
inches (millimeters).  
0.020  
(0.05)  
typ  
0.100 0.010  
(2.54 0.25)  
0.100 0.008  
(2.54 0.20)  
non-cumulative  
© 2002 Teccor Electronics  
6 - 11  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Summary of Packing Options  
Summary of Packing Options  
Packing  
Quantity  
2500  
1000  
Added  
Suffix  
RP  
BP  
Industry  
Standard  
EIA-481-1  
N/A  
Package Type  
Description  
Embossed Carrier Reel Pack  
Bulk Pack  
DO-214AA  
SA, SB, SC, SD, including MC  
3-lead  
TO-92  
Bulk Pack  
Tape and Reel Pack  
Ammo Pack  
2000  
2000  
2000  
N/A  
EIA-468-B  
EIA-468-B  
EA, EB, EC, including MC  
RP1, RP2  
AP  
Note: Standard lead spacing for TO-92  
reel pack is 0.200”.  
Modified MS-013  
Tape and Reel Pack  
Bulk Pack  
Tube Pack  
1500  
500  
RP  
BP  
TP  
EIA-481-1  
EIA-481-1  
50 per tube,  
50 tubes per container  
TO-220  
Bulk Pack  
Tape and Reel Pack  
500  
700  
700  
N/A  
EIA-468-B  
EIA-468-B  
AA, AB, AC, AD  
RP  
RP  
Tape and Reel Pack for  
Type 61 lead form  
Tube Pack  
Bulk Pack  
50 per tube,  
TP  
EIA-468-B  
10 tubes per container  
Type 61  
TO-218  
ME  
250  
N/A  
http://www.teccor.com  
+1 972-580-7777  
6 - 12  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Summary of Packing Options  
Packing  
Quantity  
2500  
5000  
Added  
Suffix  
RP  
BP  
Industry  
Standard  
EIA-481-B  
N/A  
Package Type  
Description  
Embossed Carrier Reel Pack  
Bulk Pack  
TeleLink Surface Mount Fuse  
Plastic trays  
Plastic trays  
150/tray  
300/tray  
None  
None  
None  
None  
Balanced Longitudinal SIP  
Metallic SIP  
© 2002 Teccor Electronics  
6 - 13  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Packing Options  
Packing Options  
DO-214AA  
Tape and reel packing options meet all specifications as set forth in EIA-481-1. Standard reel  
pack quantity is 2500. Bulk pack quantity is 500.  
0.157  
(4.0)  
3-lead  
0.472  
(12.0)  
0.36  
(9.2)  
0.315  
(8.0)  
0.059  
(1.5)  
DIA  
Cover tape  
12.99  
(330.0)  
0.512 (13.0) Arbor  
Hole Dia.  
Dimensions  
are in inches  
(and millimeters).  
0.49  
(12.4)  
Direction of Feed  
The following illustration shows the DO-214AA component orientation for P0641S, P0721S,  
P0901S, and P1101S:  
CATHODE  
The following illustration shows the modified DO-214 tape and reel:  
Pin 2  
0.157  
Anode  
(4.0)  
0.472  
0.374  
(12.0)  
(9.5)  
0.315  
http://www.teccor.com  
+1 972-580-7777  
6 - 14  
© 2002 Teccor Electronics  
SIDACtor Data Book and Design Guide  
®
Packing Options  
TO-92  
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel  
pack quantity is 2000.  
0.25  
0.50  
(6.35)  
(12.7)  
0.02  
(0.5)  
0.236  
(6.0)  
0.125 (3.2) MAX  
1.27  
(32.2)  
1.62  
(41.2)  
0.708  
(18.0)  
0.354  
(9.0)  
0.50  
0.20  
(12.7)  
(5.08)  
0.157  
(4.0)  
DIA  
14.17  
(360.0)  
Flat Down  
Dimensions  
are in inches  
(and millimeters).  
1.97  
(50.0)  
Notes:  
Part number suffix RP2 denotes 0.200” (5 mm) lead spacing and is Teccor’s default value.  
Part number suffix RP1 denotes 0.100” (2.54 mm) lead spacing and is available upon request.  
The following figure shows the TO-92 Ammo Pack option:  
0.25  
(6.35)  
0.50  
(12.7)  
0.02 (0.5)  
0.236  
(6.0)  
0.125 (3.2) MAX  
1.62  
(41.2)  
MAX  
1.27  
(32.2)  
0.708  
(18.0)  
0.354  
(9.0)  
0.50  
(12.7)  
0.157  
(4.0)  
DIA  
0.20 (5.08)  
Flat down  
d
f Fee  
irection o  
D
25 Devices per fold  
1.85  
(47.0)  
12.2  
(310.0)  
Dimensions  
are in inches  
(and millimeters).  
1.85  
(47.0)  
13.3  
(338.0)  
© 2002 Teccor Electronics  
6 - 15  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Packing Options  
6
5
4
Modified MS-013 Six-pin  
1
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel  
pack quantity is 1500.  
2
3
.157  
(4.0)  
.630  
(16.0)  
.472  
(12.0)  
Component/Tape Layout  
1,500 Devices per Reel  
14.173  
(360)  
.512 (13.0) Arbor  
Hole Dia.  
Dimensions are in inches  
(and millimeters)  
.646  
(16.4)  
Direction of Feed  
The following illustration shows the tube pack:  
Message Location  
.020  
(0.51 0.13)  
WALL TYP.  
.045  
(1.14)  
20.000 .030  
(508.00 0.76)  
.310  
(7.87)  
.108  
90  
.005  
A
.110  
(2.79)  
6
.165  
(4.19)  
Interior of the Tube  
A
.150  
(3.81)  
.225  
(5.72)  
.525  
Dimensions are in inches  
(and millimeters)  
(13.34)  
http://www.teccor.com  
+1 972-580-7777  
6 - 16  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Packing Options  
Modified TO-220  
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel  
pack quantity is 700.  
0.240  
(6.10)  
0.019  
(0.5)  
1.626  
(41.15)  
0.750 0.010  
(19.05 0.25)  
0.720  
(18.29)  
0.360  
(9.14)  
Type 61  
0.100  
(2.54)  
0.500  
(12.7)  
Component/Tape Layout  
Standard Reel Pack (RP)  
0.100  
(2.54)  
14.173  
(360.0)  
1.968  
(50.0)  
Dimensions are in inches  
(and millimeters).  
Direction of Feed  
The following illustration shows the tube pack:  
22.0 .2  
(559 5)  
.220  
(5.58)  
.160  
(4.06)  
1.250 .015  
(31.75)  
1.300  
REF  
(136.25)  
.630 .015  
(16.00 0.38)  
.025 .005  
(0.64 0.13)  
TYP. WALL  
Dimensions are in inches  
(and millimeters)  
.140  
(3.56)  
© 2002 Teccor Electronics  
6 - 17  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Packing Options  
TeleLink Surface Mount Fuse  
The following illustration shows the TeleLink embossed carrier tape:  
.157 .004  
(4.00 .10)  
.436 .004  
(3.15 .10)  
.059 .004  
(1.50 .10)  
Dia.  
.079 .004  
(2.00 .10)  
.124 .004  
'A'  
(1.75 .10)  
.453 .004  
(11.50 .10)  
'B'  
'B'  
.436 .004  
(11.07 .10)  
+.012  
.945 -.004  
(24.00) +.30  
-.10  
4˚ Max.  
.059 .010  
.0135 .0005  
(.343 .013)  
.315 .004  
(8.00 .10)  
Dia.  
'A'  
(1.50 .25)  
.129 .004  
(3.28 .10)  
24 mm Black  
Section 'A'-'A'  
Anti-static Carrier Tape  
Dimensions are in inches  
(and millimeters)  
8˚ Max.  
http://www.teccor.com  
+1 972-580-7777  
6 - 18  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Packing Options  
The following illustration shows the TeleLink 13-inch (330 mm), injection-molded, high-  
impact, anti-static, white, plastic reel. Material conforms to EIA-481-1. Surface resistivity is  
1011 /square. Materials comply with ASTM D-257.  
1.00 .069  
(25.65 1.75)  
Measured at  
outer edge  
.197 .020  
(5.00 .51)  
Tape starter slot  
Access hole  
greater than  
40.00 at slot  
1.575 location  
1.19  
(30.40)  
Measured  
at hub  
2.00  
.079  
(Drive Spokes)  
min.  
2.362 .039  
(60.00 1.00)  
Hub dia.  
.512 .008  
(13.00 .20)  
Arbor hole  
.795  
(20.20)  
min.  
Tape slot depth  
greater than .394 (10.00)  
+.079  
-.00  
+2.00  
-.00  
.960  
(24.40)  
12.992  
(330.00)  
Max dia.  
Measured  
at hub  
Dimensions are in inches  
(and millimeters)  
© 2002 Teccor Electronics  
6 - 19  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
Lead Form Options  
Lead Form Options  
Modified TO-220 Type 60  
.645 .025  
(16.38 0.64)  
0.047  
(1.19)  
Dia. ref.  
A
0.324  
(8.23)  
30˚  
C
0.177  
(4.50)  
B
Dimensions are in inches  
(and millimeters)  
Inches  
Millimeters  
Dimension  
Min  
Max  
Min  
12.32  
4.11  
Max  
A
B
C
0.485  
0.162  
0.162  
0.192  
0.192  
4.88  
4.88  
4.11  
http://www.teccor.com  
+1 972-580-7777  
6 - 20  
© 2002 Teccor Electronics  
®
SIDACtor Data Book and Design Guide  
Lead Form Options  
Modified TO-220 Type 61  
A
PIN 3  
PIN 1  
Inches  
Millimeters  
Dimension  
Min  
Max  
Min  
Max  
A
0.030  
0.060  
0.762  
1.52  
Modified TO-220 Type 62  
A
B
C
5˚ TYP.  
Inches  
Millimeters  
Dimension  
Min  
Max  
0.202  
0.460  
0.130  
Min  
4.37  
11.18  
3.05  
Max  
5.13  
11.68  
3.30  
A
B
C
0.172  
0.440  
0.120  
© 2002 Teccor Electronics  
6 - 21  
http://www.teccor.com  
+1 972-580-7777  
®
SIDACtor Data Book and Design Guide  
NOTES  

相关型号:

SI9130DB

5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY