MS583702BA01-50 [TE]
High-resolution module, 13 cm;
| 型号： | MS583702BA01-50 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | High-resolution module, 13 cm |
| 文件： | 总16页 (文件大小：631K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
SPECIFICATIONS
Ceramic - metal package, 3.3 x 3.3 x 2.75mm
High-resolution module, 13 cm
Supply voltage: 1.5 to 3.6 V
Fast conversion down to 0.5 ms
Low power, 0.6 µA (standby ≤ 0.1 µA at 25°C)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Operating range: 300 to 1200 mbar, -20 to +85 °C
I2C interface
No external components (internal oscillator)
Sealing designed for 1.8 x 0.8mm O-ring
The MS5837 is an ultra-compact micro altimeter. It is
optimized for altimeter and barometer applications. The altitude
resolution at sea level is 13 cm of air.
The sensor module includes a high-linearity pressure sensor and
an ultra-low power 24 bit ΔΣ ADC with internal factory-calibrated
coefficients. It provides a precise digital 24-bit pressure and
temperature value and different operation modes that allow the
user to optimize for conversion speed and current consumption.
A high-resolution temperature output allows the implementation
of an altimeter/thermometer function without any additional
sensor. The MS5837 can be interfaced to any microcontroller
with I2C-bus interface. The communication protocol is simple,
without the need of programming internal registers in the device.
This new sensor module generation is based on leading MEMS
technology and latest benefits from MEAS Switzerland proven
experience and know-how in high volume manufacturing of
altimeter modules, which has been widely used for over a
decade.
FIELD OF APPLICATION
Fitness trackers
Mobile altimeter / barometer systems
Bike computers
Personal navigation devices
SENSOR SOLUTIONS /// MS5837-02BA01
1
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol Conditions
Min.
-0.3
-40
Typ.
Max
+3.6
+85
10
Unit
V
Supply voltage
Storage temperature
Overpressure
VDD
TS
°C
Pmax
bar
Maximum Soldering
Temperature
Tmax
40 sec. max
250
+2
°C
Human Body
Model
ESD rating
Latch up
-2
kV
mA
JEDEC JESD78
standard
-100
+100
ELECTRICAL CHARACTERISTICS
Parameter
Symbol Conditions
Min.
1.5
Typ.
3.0
Max
3.6
Unit
V
Operating Supply voltage
Operating Temperature
VDD
T
-20
+25
+85
°C
8192
4096
2048
1024
512
20.09
10.05
5.02
2.51
1.26
0.63
Supply current
IDD
OSR
µA
(1 sample per sec.)
256
Peak supply current
Standby supply current
VDD Capacitor
during conversion
1.25
0.01
470
mA
µA
nF
at 25°C
0.1
(VDD = 3.0 V)
from VDD to GND
100
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol Conditions
Min.
Typ.
Max
Unit
Output Word
24
bit
8192
4096
16.44
8.22
4.13
2.08
1.06
0.54
17.2
8.61
4.32
2.17
1.10
0.56
2048
OSR
ADC Conversion time (1)
tc
ms
1024
512
256
(1) Maximum values must be applied to determine waiting times in I2C communication
SENSOR SOLUTIONS /// MS5837-02BA01
2
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
PERFORMANCE SPECIFICATIONS
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3.0 V, T = 25 °C, UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
300
1200
mbar
Linear Range of
ADC
Extended Pressure Range
Pext
10
2000
mbar
600...1000 mbar, at 20°C
300...1100 mbar, 0...60°C
-0.5
-2
+0.5
+2
(2)
Relative Accuracy
mbar
300...1100 mbar, -20...85°C (2)
-4
+4
8192
4096
0.016
0.021
0.028
0.039
0.062
0.11
2048
Resolution RMS
OSR
1024
mbar
512
256
Maximum error with supply
voltage
VDD = 1.5 V…3.6 V
2
2
4
mbar
Long-term stability
mbar/yr
mbar
IPC/JEDEC J-STD-020C
(Refer to application note AN808)
Reflow soldering impact
(2) Autozero at 850 mbar, ambient temperature
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3.0 V, T = 25 °C, UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Relative Accuracy
-20…85°C, 300…1100 mbar
-2
+2
°C
Maximum error with supply
voltage
VDD = 1.5 V…3.6 V
0.3
°C
8192
4096
2048
0.002
0.003
0.004
0.006
0.009
0.012
Resolution RMS
OSR
1024
°C
512
256
DIGITAL INPUTS (SDA, SCL)
Parameter
Symbol Conditions
Min.
Typ.
Max
400
Unit
kHz
V
Serial data clock
Input high voltage
Input low voltage
Input leakage current
SCL
VIH
80% VDD
0% VDD
100% VDD
20% VDD
0.1
VIL
V
Ileak
T = 25 °C
µA
DIGITAL OUTPUTS (SDA)
Parameter
Symbol Conditions
Min.
Typ.
Max
Unit
V
Output high voltage
Output low voltage
VOH
VOL
Isource = 1 mA
Isink = 1 mA
80% VDD
0% VDD
100% VDD
20% VDD
V
SENSOR SOLUTIONS /// MS5837-02BA01
3
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
TYPICAL PERFORMANCE CHARACTERISTICS
RELATIVE PRESSURE ERROR AND TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE
(TYPICAL VALUES)
SENSOR SOLUTIONS /// MS5837-02BA01
4
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
TYPICAL PERFORMANCE CHARACTERISTICS
RELATIVE PRESSURE AND TEMPERATURE ERROR VS TEMPERATURE
(1ST ORDER AND 2ND ORDER ALGORITHM, TYPICAL VALUES)
RELATIVE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
(TYPICAL VALUES)
SENSOR SOLUTIONS /// MS5837-02BA01
5
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
PRESSURE AND TEMPERATURE CALCULATION
GENERAL
The MS5837 consists of a piezo-resistive sensor and a sensor interface integrated circuit. The main function of the
MS5837 is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a
24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 112-
bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller software
and used in the program converting D1 and D2 into compensated pressure and temperature values.
COMMUNICATION INTERFACE
The MS5837 has been built with I2C serial interface.
Module ref
MS5837-02BA01
Mode
I2C
Pins used
SDA, SCL
The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select.
SENSOR SOLUTIONS /// MS5837-02BA01
6
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
PRESSURE AND TEMPERATURE CALCULATION
Start
Maximum values for calculation results:
PMIN = 10mbar PMAX = 2000mbar
TMIN = -40°C TMAX = 85°C TREF = 20°C
Readcalibrationdata(factorycalibrated) fromPROM
Size [1]
[bit]
Value
Recommended
variable type
Example /
Typical
Description | Equation
Variable
min
0
max
Pressure sensitivity | SENS T1
C1
C2
C3
C4
C5
C6
unsigned int 16
unsigned int 16
unsigned int 16
unsigned int 16
unsigned int 16
unsigned int 16
16
16
16
16
16
16
65535
65535
65535
65535
65535
65535
46372
43981
29059
27842
31553
28165
Pressure offset | OFF T1
0
Temperature coefficient of pressure sensitivity | TCS
Temperature coefficient of pressure offset | TCO
Reference temperature | T REF
0
0
0
Temperature coefficient of the temperature | TEMPSENS
0
Readdigitalpressureandtemperaturedata
D1
D2
Digital pressure value
unsigned int 32
unsigned int 32
24
24
0
0
16777216
16777216
6465444
8077636
Digital temperature value
Calculate temperature
[2]
Difference between actual and reference temperature
dT = D2 - TREF = D2 - C5 * 2 8
dT
signed int 32
25
41
-16776960
-4000
16777216
8500
68
2000
Actual temperature (-40…85°C with 0.01°C resolution)
signed int 32
TEMP
23
TEMP =20°C + dT *
TEMPSENS =2000 + dT * C6 /2
= 20.00 °C
Calculatetemperaturecompensatedpressure
[3]
Offset at actual temperature
OFF
signed int 64
signed int 64
41
41
-17179344900
25769410560
12884705280
5764707214
3039050829
OFF =OFFT1 + TCO *dT = C2 * 217 + (C4 *dT ) /26
[4]
Sensitivity at actual temperature
SENS
-8589672450
1000
SENS = SENST1 + TCS * dT = C1 * 2 16 + (C3 *dT ) /27
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
P = D1 * SENS - OFF = (D1 * SENS / 2 21 - OFF) / 2 15
110002
P
58
120000
signed int 32
= 1100.02 mbar
Pressure and temperature value first order
Notes
[1]
Maximal size of intermediate result during evaluation of variable
min and max have to be defined
min and max have to be defined
min and max have to be defined
[2]
[3]
[4]
Flow chart for pressure and temperature reading and software compensation
SENSOR SOLUTIONS /// MS5837-02BA01
7
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
SECOND ORDER TEMPERATURE COMPENSATION
The results of the last first order calculation are entered in the following chart to obtain the pressure and temperature
compensated with the 2nd order: P2 and TEMP2.
Flow chart for pressure and temperature to the optimum accuracy
SENSOR SOLUTIONS /// MS5837-02BA01
8
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
I2C INTERFACE
COMMANDS
The MS5837 has only five basic commands:
1. Reset
2. Read PROM (112 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Each I2C communication message starts with the start condition and it is ended with the stop condition. The MS5837
address is 1110110x (write: x=0, read: x=1).
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device will
return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of the
PROM read command using the a2, a1 and a0 bits.
Command byte
hex value
Bit number
Bit name
0
1
2
-
3
4
5
6
7
PRO CO
M
Typ Ad2/ Ad1/ Ad0/ Stop
Os2 Os1 Os0
NV
Command
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
1
0
0
0
0
1
1
0
0
0
0
1
1
0
1
0
0
1
1
0
0
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x1E
0x40
0x42
0x44
0x46
0x48
0x4A
0x50
0x52
0x54
0x56
0x58
0x5A
0x00
Convert D1 (OSR=256)
Convert D1 (OSR=512)
Convert D1 (OSR=1024)
Convert D1 (OSR=2048)
Convert D1 (OSR=4096)
Convert D1 (OSR=8192)
Convert D2 (OSR=256)
Convert D2 (OSR=512)
Convert D2 (OSR=1024)
Convert D2 (OSR=2048)
Convert D2 (OSR=4096)
Convert D2 (OSR=8192)
ADC Read
PROM Read
Ad2 Ad1 Ad0
0xA0 to
0xAE
Command structure
SENSOR SOLUTIONS /// MS5837-02BA01
9
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device PROM from an unknown condition.
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by
the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837 to function is to
send several SCLs followed by a reset sequence or to repeat power on reset.
1
1
1
0
1
1
0
0
0
A
0
0
0
1
1
1
1
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Reset Command
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the calibration
PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of 112
bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The command
sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The PROM Read command consists
of two parts. First command sets up the system into PROM read mode. The second part gets the data from the
system.
1
1
1
0
1
1
0
0
0
A
1
0
1
0
0
1
1
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Command to read memory address= 011
1
1
1
0
1
1
0
1
0
A
X
X
X
X
X
X
X
X
0
A
X
X
X
X
X
X
X
X
0
Device Address
Device Address
data
Memory bit 15 - 8
data
Memory bit 7 - 0
S
R
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledage
I2C answer from MS5837
SENSOR SOLUTIONS /// MS5837-02BA01
10
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the
conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as
the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not
stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will
yield incorrect result as well. A conversion can be started by sending the command to MS5837. When command is
sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by
sending a Read command, when an acknowledge is sent from the MS5837, 24 SCL cycles may be sent to receive
all result bits. Every 8 bits the system waits for an acknowledge signal.
1
1
1
0
1
1
0
0
0
A
0
1
0
0
1
0
0
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C command to initiate a pressure conversion (OSR=4096, typ=D1)
1
1
1
0
1
1
0
0
0
A
0
0
0
0
0
0
0
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C ADC read sequence
1
1
1
0
1
1
0
1
0
A
X
X
X
X
data
X
X
X
X
0
A
X
X
X
X
data
X
X
X
X
0
A
X
X
X
X
data
X
X
X
X
0
Device Address
Device Address
S
R
Data 23-16
Data 15 - 8
Data 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C answer from MS5837
SENSOR SOLUTIONS /// MS5837-02BA01
11
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
CYCLIC REDUNDANCY CHECK (CRC)
MS5837 contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data validity in
memory.
D D D D D D
B B B B B B
1 1 1 1 1 1
5 4 3 2 1 0
CRC
A
d
d
D D D D D D D D D D
B B B B B B B B B B
9 8 7 6 5 4 3 2 1 0
0
1
2
3
4
5
6
Factory defined
C1
C2
C3
C4
C5
C6
Memory PROM mapping
C Code example for CRC-4 calculation:
unsigned char crc4(unsigned int n_prom[])
// n_prom defined as 8x unsigned int (n_prom[8])
{
int cnt;
// simple counter
// crc remainder
unsigned int n_rem=0;
unsigned char n_bit;
n_prom[0]=((n_prom[0]) & 0x0FFF);
// CRC byte is replaced by 0
// Subsidiary value, set to 0
// operation is performed on bytes
// choose LSB or MSB
n_prom[7]=0;
for (cnt = 0; cnt < 16; cnt++)
{
if (cnt%2==1)
else
n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF);
n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);
for (n_bit = 8; n_bit > 0; n_bit--)
{
if (n_rem & (0x8000))
n_rem = (n_rem << 1) ^ 0x3000;
n_rem = (n_rem << 1);
else
}
}
n_rem= ((n_rem >> 12) & 0x000F);
return (n_rem ^ 0x00);
// final 4-bit remainder is CRC code
}
SENSOR SOLUTIONS /// MS5837-02BA01
12
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
APPLICATION CIRCUIT
The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Typical application circuit
PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE 0.1
ꢀ GND
ꢁ VDD
ꢂ SCL
GROUND
POSITIVE SUPPLY
IꢁC CLOCK
ꢃ SDA
IꢁC DATA
Pin configuration and package outlines
SENSOR SOLUTIONS /// MS5837-02BA01
13
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5837 soldered onto printed circuit board.
Recommended PCB footprint
SHIPPING PACKAGE
SENSOR SOLUTIONS /// MS5837-02BA01
14
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for soldering recommendations.
MOUNTING
The MS5837 can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged
by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important
to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In applications such as outdoor watches the electronics must be protected against direct water or humidity. For
such applications the MS5837 provides the possibility to seal with an O-ring. The O-ring shall be placed at the
groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are
recommended:
O-ring inner diameter
O-ring cross-section diameter
Housing bore diameter
1.8
0.8
0.05 mm
0.03 mm
3.07 0.03 mm
Please refer to the application note AN523 available on our website for O-ring mounting recommendations.
CLEANING
The MS5837 has been manufactured under clean-room conditions. It is therefore recommended to assemble the
sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor
opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-
clean” shall be used. Warning: cleaning might damage the sensor.
ESD PRECAUTIONS
The electrical contact pads are protected against ESD. It is therefore essential to ground machines and personnel
properly during assembly and handling of the device. The MS5837 is shipped in antistatic transport boxes. Any test
adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic
material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100nF minimum ceramic capacitor
must be placed as close as possible to the MS5837 VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
SENSOR SOLUTIONS /// MS5837-02BA01
15
MS5837-02BA01
Ultra-Small Gel Filled Pressure Sensor
ORDERING INFORMATION
Part Number / Art. Number Product
Delivery Form
Tape and Reel,
MS583702BA01-50
MS5837-02BA01 Ultra Small Gel Filled Pressure Sensor
(2500 parts per Reel)
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties, Inc.,
a TE Connectivity company
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
MEAS Switzerland Sarl,
a TE Connectivity company
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: +41 32 847 9569
customercare.bevx@te.com
Measurement Specialties (China) Ltd.,
a TE Connectivity company
No. 26 Langshan Road
Shenzhen High-Tech Park (North) Nanshan
District, Shenzhen, 518057
China
customercare.frmt@te.com
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
customercare.shzn@te.com
CDOC-DA-0012
8
SENSOR SOLUTIONS /// MS5837-02BA01
16
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